CN113945732A - Graphene double-shaft differential resonant accelerometer - Google Patents

Graphene double-shaft differential resonant accelerometer Download PDF

Info

Publication number
CN113945732A
CN113945732A CN202111211412.6A CN202111211412A CN113945732A CN 113945732 A CN113945732 A CN 113945732A CN 202111211412 A CN202111211412 A CN 202111211412A CN 113945732 A CN113945732 A CN 113945732A
Authority
CN
China
Prior art keywords
fixed frame
graphene
cross beam
connecting beam
axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111211412.6A
Other languages
Chinese (zh)
Inventor
肖暘
胡峰
秦石乔
张宇辰
郑佳兴
王省书
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National University of Defense Technology
Original Assignee
National University of Defense Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National University of Defense Technology filed Critical National University of Defense Technology
Priority to CN202111211412.6A priority Critical patent/CN113945732A/en
Publication of CN113945732A publication Critical patent/CN113945732A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/097Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by vibratory elements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0862Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)

Abstract

The application discloses graphite alkene biax difference formula resonant accelerometer, including the proof mass piece, the fixed frame of resonance subassembly and middle part fretwork, the proof mass piece sets up in fixed frame's fretwork area, set up resonance subassembly respectively along X axle and Y axle direction between proof mass piece and fixed frame, every resonance subassembly all includes H type roof beam, crossbeam and graphite alkene area, the crossbeam is located between proof mass piece and the fixed frame and perpendicular with the axle direction of place, the crossbeam both ends link firmly with fixed frame, proof mass piece and crossbeam are connected respectively to H type roof beam level setting and both ends, the both ends in graphite alkene area overlap joint respectively on crossbeam and fixed frame and correspond with the open end position of H type roof beam, upper and lower surface at graphite alkene area both ends is equallyd divide and is set up electrode and insulating layer respectively. This application utilizes the little lever structure transmission inertia force that H type roof beam and crossbeam are constituteed, avoids graphite alkene and sensitive mass piece lug connection, reduces tangential acceleration and gravity to graphite alkene resonant frequency's influence.

Description

Graphene double-shaft differential resonant accelerometer
Technical Field
The invention relates to the technical field of micro-nano electromechanical sensors, in particular to a graphene double-shaft differential resonant accelerometer.
Background
An accelerometer is a sensor that measures acceleration by calculating the inertial force of a proof mass under external acceleration. Accelerometers have wide and mature application in the scientific and industrial fields of inertial navigation, attitude measurement and the like. The accelerometer can be divided into a capacitance type, a piezoresistive type, a piezoelectric type, a resonance type and the like according to signal types, wherein the resonance type accelerometer utilizes the characteristic that the resonance frequency of the vibrator has high sensitivity response to stress, so that the force or displacement generated by the sensitive mass block under acceleration further changes the resonance frequency by changing the stress of the vibrator. The frequency signal output by the resonant accelerometer is not easy to distort, and the resonant accelerometer has the advantages of strong anti-jamming capability, good repeatability, high sensitivity and the like.
At present, resonant accelerometers developed more mature are usually made of materials such as silicon, quartz, and alloy to prepare resonant elements, and such resonant accelerometers cannot meet the requirements of faster response speed, higher measurement accuracy and wider measurement range which are increasingly developed. Reducing the size of the harmonic oscillator is of great significance to meet the above requirements, and therefore, further reduction in the size of the harmonic oscillator can be achieved by using a novel material.
The appearance of two-dimensional materials such as graphene brings new opportunities for the development of miniaturized accelerometers. Graphene refers to a flat monolayer of carbon atoms, consisting of sp, closely packed in a two-dimensional honeycomb lattice2The hybridized carbon atoms are covalently bonded and are the basic building blocks of graphitic materials of all other dimensions. Graphene has a series of excellent mechanical, electrical and optical properties, wherein the mechanical properties include high strength, high stiffness, low mass, high optical qualityThe characteristics of resonance frequency, large-range tuning capability and the like enable the graphene resonant accelerometer to become a high-quality material of a harmonic oscillator in the accelerometer, and the development of the graphene resonant accelerometer has bright prospect and important application value.
In 2007, the graphene harmonic oscillator was first prepared and measured by j.s.bunch et al, and thereafter, research on the graphene harmonic oscillator and its application was gradually developed. However, the current research on the graphene resonant accelerometer still stays at the stages of theoretical simulation calculation and laboratory prototype testing, the technical maturity is not high, and a space for further optimizing and perfecting the structure and the performance is provided.
Disclosure of Invention
The application aims to provide a double-shaft differential resonant accelerometer taking graphene as a vibrator, and sensitivity and accuracy of a detection result are improved. The technical scheme of the application is as follows:
a graphene double-shaft differential resonant accelerometer comprises a fixed frame, a sensitive mass block and resonant assemblies, wherein the middle of the fixed frame is hollowed, the sensitive mass block is arranged in the hollowed area of the fixed frame and shares a central axis with the fixed frame, the resonant assemblies are respectively arranged between the sensitive mass block and the fixed frame along the X-axis direction and the Y-axis direction, and each resonant assembly comprises a connecting beam, a cross beam, an insulating layer, a graphene strip and an electrode;
the cross beam is arranged between the sensitive mass block and the fixed frame and is vertical to the direction of the shaft, two ends of the cross beam are fixedly connected with the fixed frame, the connecting beam is horizontally arranged, two ends of the connecting beam are respectively connected with the sensitive mass block and the cross beam, insulating layers are respectively arranged on the cross beam and the fixed frame at positions corresponding to the end heads of the connecting beam, two ends of the graphene belt are respectively lapped on the two insulating layers to enable the middle part to be suspended in the air, and electrodes are respectively arranged on the upper surfaces of two ends of the graphene belt;
the thickness of the cross beam is larger than that of the connecting beam and the sensitive mass block, and the axial rigidity of the connecting beam is larger than the tangential rigidity.
For each connecting beam, the axial direction refers to the direction parallel to the axis of the connecting beam, and the tangential direction refers to the direction perpendicular to the axis of the connecting beam in the horizontal plane.
In some specific embodiments, the upper surfaces of the fixed frame, the connecting beam and the cross beam are flush.
In some specific embodiments, the thickness of the connecting beam is consistent with the thickness of the sensing mass.
In some specific embodiments, the insulating layer has a larger coverage area than the electrode.
In some specific embodiments, the graphene ribbon is a single-layer or multi-layer graphene ribbon.
In some embodiments, the fixed frame, the proof mass, the connecting beam and the cross beam are made of monocrystalline silicon, the insulating layer is made of silicon dioxide, and the electrodes are made of titanium-gold or platinum-gold.
In some specific embodiments, the fixed frame, the sensing mass, the connecting beam and the cross beam are formed by an integral molding process.
In some specific embodiments, the vacuum cover for packaging is further included, and the vacuum cover is made of a monocrystalline silicon material or a light-transmitting material.
In some specific embodiments, the connecting beam is an H-beam, wherein the length of both long beams is greater than the width.
The working principle of the accelerometer is as follows:
the sensitive mass block is subjected to inertia force under external acceleration, the inertia force is transmitted to the cross beam through the connecting beam, the center of the cross beam is subjected to small displacement, one end of a graphene band fixed on the cross beam is caused to generate small displacement, and further the stress and the resonant frequency of the graphene resonant beam are caused to change.
Because the tangential rigidity of the connecting beam is smaller than the axial rigidity, the tangential acceleration is rarely transmitted to the cross beam, and therefore the independent measurement of the biaxial acceleration is realized.
The technical scheme provided by the application has at least the following beneficial effects:
the accelerometer in the application has a simple structure, but can realize acceleration measurement with extremely high sensitivity. Firstly, a structure that graphene and a sensitive mass block are not directly connected is designed, displacement generated by the sensitive mass block under an inertia force cannot be directly transmitted to a graphene belt, the situation that the graphene belt is broken due to overlarge displacement is avoided, the pose level of the graphene belt in the working process is ensured, and measurement errors are reduced; and secondly, the inertia force is transmitted by utilizing a micro-lever structure consisting of the connecting beam and the cross beam, the acting force transmitted to the cross beam by the connecting beam under the tangential acceleration is small enough to be ignored, and the two ends of the cross beam are fixed on the fixed frame, so that the influence of the gravity on the cross beam and the tangential acceleration is very small, the stress change of the graphene resonance beam can be hardly caused, the cross crosstalk of the orthogonal axis is reduced, and the independent measurement of the acceleration in two orthogonal directions in a plane is realized.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that other drawings may be derived from those drawings without inventive effort for a person skilled in the art.
Fig. 1 is an overall structural diagram of a graphene biaxial differential resonant accelerometer provided in an embodiment of the present application (an upper package cover is not shown);
fig. 2 is a structural diagram of an upper package cover of a graphene dual-axis differential resonant accelerometer provided in an embodiment of the present application;
FIG. 3 is a top view of FIG. 1;
FIG. 4 is a sectional view taken along line A-A of FIG. 3;
FIG. 5 is an enlarged view of the structure at B in FIG. 1;
in the figure: 1. the device comprises a fixed frame, 2, a sensitive mass block, 3, a connecting beam, 4, a cross beam, 5, an insulating layer, 6, a graphene strip, 7, an electrode, 8, a lower packaging cover, 9 and an upper packaging cover.
Detailed Description
In order to facilitate understanding of the present application, the technical solutions in the present application will be described more fully and in detail with reference to the drawings and the preferred embodiments, but the scope of protection of the present application is not limited to the following specific embodiments, and all other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the scope of protection of the present application.
It will be understood that when an element is referred to as being "coupled" or "connected" to another element, it can be directly coupled, connected or communicated with the other element or indirectly coupled, connected or communicated with the other element via other intervening elements.
Unless otherwise defined, all terms of art used hereinafter have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the present application.
Examples
Referring to fig. 1 to 5, a graphene dual-axis differential resonant accelerometer includes a vacuum cover, and a fixed frame 1, a proof mass 2, and a resonant assembly packaged in the vacuum cover. The fixed frame 1 is square and hollow in the middle, the sensitive mass block 2 is square and is arranged in the hollow area of the fixed frame 1 in the middle, the number of the resonance assemblies is four, and every two of the resonance assemblies are symmetrically arranged at the gap between the sensitive mass block 2 and the fixed frame 1 along the X-axis direction and the Y-axis direction.
Each resonant assembly comprises a connecting beam 3, a cross beam 4, an insulating layer 5, a graphene strip 6 and an electrode 7.
The beam 4 is arranged between the sensitive mass block 2 and the fixed frame 1, the length direction of the beam 4 is perpendicular to the direction of the axis where the beam is located, and two ends of the beam 4 are fixedly connected with the fixed frame 1 respectively. The connecting beam 3 is horizontally arranged, two ends of the connecting beam are respectively connected with the center positions of the sensitive mass block 2 and the cross beam 4, and the axial rigidity of the connecting beam 3 is far greater than the tangential rigidity. Insulating layers 5 are respectively arranged at the positions, corresponding to the ends of the connecting beam 3, of the upper surfaces of the cross beam 4 and the fixed frame 1, two ends of the graphene belt 6 are respectively lapped on the two insulating layers, the middle of the graphene belt is suspended, and electrodes 7 are respectively arranged on the upper surfaces of two ends of the graphene belt 6.
The thickness of the cross beam 4 is larger than that of the connecting beam 3 and the sensing mass 2, so that the displacement of the cross beam 4 in the vertical direction due to the influence of the gravity of the sensing mass 2 and the connecting beam 3 is reduced.
In this embodiment, the connecting beam 3 is specifically an H-shaped beam, wherein the length of two long beams is at least 10 times of the width of the long beams, and the H-shaped beam has a characteristic that the axial stiffness is much greater than the tangential stiffness, so as to isolate the mutual influence between X, Y shafts. Researches show that the larger the difference between the axial rigidity and the tangential rigidity of the connecting beam 3 is, the better the orthogonal anti-interference effect is, and through finite element simulation calculation, when the length of the long beam is 15 times of the width, the axial rigidity of the H-shaped beam is about 200 times of the tangential rigidity, and when the axial acceleration is transmitted, the tangential acceleration is hardly transmitted to the cross beam. In other embodiments, other shaped beams characterized by axial stiffness much greater than tangential stiffness may be used as the connecting beam.
In this embodiment, the coverage area of the insulating layer 5 is larger than that of the electrode 7, the graphene strip 6 is a single-layer or multi-layer graphene strip, and other characteristic parameters, such as the length and width of the graphene strip, the structural dimensions of the sensing mass, the H-beam and the cross beam, and the like, can be actually selected according to the acceleration measurement range and the accuracy requirement.
In this embodiment, the insulating layer 5 is made of silicon dioxide, and the electrode 7 is made of titanium-gold or platinum-gold.
In this embodiment, the fixed frame 1, the sensing mass 2, the H-shaped beam, and the cross beam 4 are all made of single crystal silicon, so that the foregoing partial structures may adopt an integrated forming process, and in order to facilitate synchronous etching and simplify the process flow, the upper surfaces of the fixed frame 1, the H-shaped beam, and the cross beam 4 in this embodiment are flush, and the thickness of the H-shaped beam is consistent with the thickness of the sensing mass 2.
The processing procedure of the accelerometer in this embodiment is as follows:
performing double-sided etching on a double-sided polished silicon wafer, firstly performing primary etching from the front side of the silicon wafer, etching the upper surface outlines of the fixed frame 1, the cross beam 4, the H-shaped beam and the sensitive mass block 2, then performing secondary etching from the back side of the silicon wafer, etching the lower surface outlines of the fixed frame 1, the cross beam 4, the H-shaped beam and the sensitive mass block 2, performing tertiary etching from the back side of the silicon wafer, and performing thinning etching according to the required thicknesses of the sensitive mass block 2 and the H-shaped beam;
covering insulating layers 5 at corresponding positions of the center of the cross beam 4 and the fixed frame 1, transferring the graphene strips 6 to a corresponding group of insulating layers 5, forming electrode pairs at two ends of each graphene strip by sputtering metal, and fixing two ends of each graphene strip 6;
the upper packaging cover 9 is tightly adhered to the upper surface of the fixed frame 1, the lower packaging cover 8 is tightly adhered to the lower surface of the fixed frame 1, the upper packaging cover 9 is provided with a vacuumizing hole, and the accelerometer is in a vacuum environment through vacuumizing after packaging.
The vacuum cover is made of monocrystalline silicon materials or light-transmitting materials. Specifically, the resonant frequency may be driven and detected electrically or optically. When the electricity is used for excitation and detection, the electrodes at the two ends of the graphene strip are respectively used as a source electrode and a drain electrode, the cross beam is used as a grid electrode, the vacuum cover is made of monocrystalline silicon, and a signal lead is arranged on the upper packaging cover 9 and connected with a detection circuit. When light is used for excitation and detection, the upper package cover 9 is made of glass or other light-transmitting materials.
The above description is only a few examples of the present application and does not limit the scope of the claims of the present application, and it will be apparent to those skilled in the art that various modifications and variations can be made in the present application. Any improvement or equivalent replacement directly or indirectly applicable to other related technical fields within the spirit and principle of the present application by using the contents of the specification and the drawings of the present application shall be included in the protection scope of the present application.

Claims (9)

1. The graphene double-shaft differential resonant accelerometer is characterized by comprising a fixed frame (1), a sensitive mass block (2) and resonant assemblies, wherein the middle of the fixed frame (1) is hollowed, the sensitive mass block (2) is arranged in the hollowed area of the fixed frame (1) and shares a central axis with the hollowed area, the resonant assemblies are respectively arranged between the sensitive mass block (2) and the fixed frame (1) along the X-axis direction and the Y-axis direction, and each resonant assembly comprises a connecting beam (3), a cross beam (4), an insulating layer (5), a graphene strip (6) and an electrode (7);
the cross beam (4) is arranged between the sensitive mass block (2) and the fixed frame (1) and is vertical to the direction of the axis, two ends of the cross beam (4) are fixedly connected with the fixed frame (1), the connecting beam (3) is horizontally arranged, two ends of the connecting beam are respectively connected with the sensitive mass block (2) and the cross beam (4), insulating layers (5) are respectively arranged on the cross beam (4) and the fixed frame (1) corresponding to the end positions of the connecting beam (3), two ends of the graphene belt (6) are respectively lapped on the two insulating layers, the middle of the graphene belt is suspended, and electrodes (7) are respectively arranged on the upper surfaces of two ends of the graphene belt (5);
the thickness of the cross beam (4) is larger than that of the connecting beam (3) and the sensitive mass block (2), and the axial rigidity of the connecting beam (3) is larger than the tangential rigidity.
2. The graphene dual-axis differential resonant accelerometer according to claim 1, wherein the upper surfaces of the fixed frame (1), the connecting beam (3) and the cross beam (4) are flush.
3. The graphene dual-axis differential resonant accelerometer according to claim 2, wherein the thickness of the connecting beam (3) is the same as the thickness of the proof mass (2).
4. The graphene dual-axis differential resonant accelerometer according to claim 3, wherein the insulating layer (5) has a larger coverage area than the electrodes (7).
5. The graphene dual-axis differential resonant accelerometer according to claim 4, wherein the graphene strip (6) is a single-layer or multi-layer graphene strip.
6. The graphene dual-axis differential resonant accelerometer according to claim 5, wherein the fixed frame (1), the proof mass (2), the connecting beam (3) and the cross beam (4) are made of single crystal silicon, the insulating layer (5) is made of silicon dioxide, and the electrodes (7) are made of titanium-gold or platinum-gold.
7. The graphene dual-axis differential resonant accelerometer according to claim 6, wherein the fixed frame (1), the proof mass (2), the connecting beams (3) and the cross beams (4) are formed by an integral molding process.
8. The graphene dual-axis differential resonant accelerometer according to any one of claims 1 to 7, further comprising a vacuum enclosure for packaging, wherein the vacuum enclosure is made of a single crystal silicon material or a transparent material.
9. The graphene dual-axis differential resonant accelerometer according to claim 8, wherein the connecting beams (3) are H-shaped beams, and wherein the length of each of the two long beams is greater than the width of the beam.
CN202111211412.6A 2021-10-18 2021-10-18 Graphene double-shaft differential resonant accelerometer Pending CN113945732A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111211412.6A CN113945732A (en) 2021-10-18 2021-10-18 Graphene double-shaft differential resonant accelerometer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111211412.6A CN113945732A (en) 2021-10-18 2021-10-18 Graphene double-shaft differential resonant accelerometer

Publications (1)

Publication Number Publication Date
CN113945732A true CN113945732A (en) 2022-01-18

Family

ID=79331189

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111211412.6A Pending CN113945732A (en) 2021-10-18 2021-10-18 Graphene double-shaft differential resonant accelerometer

Country Status (1)

Country Link
CN (1) CN113945732A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115166297A (en) * 2022-02-21 2022-10-11 东南大学 Graphene-based MOEMS accelerometer and processing method thereof
CN116143062A (en) * 2023-04-21 2023-05-23 中北大学 H-shaped monocrystalline film piezoelectric vibration sensor and preparation method thereof

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102331513A (en) * 2011-06-16 2012-01-25 沈阳工业大学 Ultrathin sensitive beam piezoresistance acceleration transducer
CN102879609A (en) * 2012-10-26 2013-01-16 中国科学院上海微系统与信息技术研究所 Capacitive acceleration transducer for H-shaped beam and manufacturing method thereof
US20150226762A1 (en) * 2012-09-04 2015-08-13 Cambridge Enterprise Limited Dual and Triple Axis Inertial Sensors and Methods of Inertial Sensing
CN107255736A (en) * 2017-06-27 2017-10-17 北京航空航天大学 A kind of resonant mode graphene twin-axis accelerometer
CN107796955A (en) * 2017-09-30 2018-03-13 西安交通大学 Double-axel acceleration sensor chip and preparation method thereof in more beam type single mass faces
CN110389237A (en) * 2019-07-17 2019-10-29 西安交通大学 Double-shaft acceleration sensor chip and preparation method thereof in a kind of face
CN111796119A (en) * 2020-07-20 2020-10-20 合肥工业大学 Resonant acceleration sensor based on nano piezoelectric beam and preparation method thereof
CN112034203A (en) * 2020-07-17 2020-12-04 北京大学 High-precision tunnel type accelerometer and preparation method thereof
US20210140991A1 (en) * 2017-05-12 2021-05-13 Beihang University Acceleration sensor comprising differential graphene resonant beams

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102331513A (en) * 2011-06-16 2012-01-25 沈阳工业大学 Ultrathin sensitive beam piezoresistance acceleration transducer
US20150226762A1 (en) * 2012-09-04 2015-08-13 Cambridge Enterprise Limited Dual and Triple Axis Inertial Sensors and Methods of Inertial Sensing
CN102879609A (en) * 2012-10-26 2013-01-16 中国科学院上海微系统与信息技术研究所 Capacitive acceleration transducer for H-shaped beam and manufacturing method thereof
US20210140991A1 (en) * 2017-05-12 2021-05-13 Beihang University Acceleration sensor comprising differential graphene resonant beams
CN107255736A (en) * 2017-06-27 2017-10-17 北京航空航天大学 A kind of resonant mode graphene twin-axis accelerometer
CN107796955A (en) * 2017-09-30 2018-03-13 西安交通大学 Double-axel acceleration sensor chip and preparation method thereof in more beam type single mass faces
CN110389237A (en) * 2019-07-17 2019-10-29 西安交通大学 Double-shaft acceleration sensor chip and preparation method thereof in a kind of face
CN112034203A (en) * 2020-07-17 2020-12-04 北京大学 High-precision tunnel type accelerometer and preparation method thereof
CN111796119A (en) * 2020-07-20 2020-10-20 合肥工业大学 Resonant acceleration sensor based on nano piezoelectric beam and preparation method thereof

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JIE W等: "Acceleration sensing based on graphene resonator", SECOND INTERNATIONAL CONFERENCE ON PHOTONICS AND OPTICAL ENGINEERING, 31 December 2017 (2017-12-31), pages 461 - 468 *
SHI F.T等: "Modeling and Analysis of a Novel Ultrasensitive Differential Resonant Graphene Micro Accelerometer with Wide Measurement Kange", SENEORS, vol. 18, 31 December 2018 (2018-12-31), pages 1 - 6 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115166297A (en) * 2022-02-21 2022-10-11 东南大学 Graphene-based MOEMS accelerometer and processing method thereof
CN115166297B (en) * 2022-02-21 2024-02-23 东南大学 Graphene-based MOEMS accelerometer and processing method thereof
CN116143062A (en) * 2023-04-21 2023-05-23 中北大学 H-shaped monocrystalline film piezoelectric vibration sensor and preparation method thereof
CN116143062B (en) * 2023-04-21 2023-06-23 中北大学 H-shaped monocrystalline film piezoelectric vibration sensor and preparation method thereof

Similar Documents

Publication Publication Date Title
CN102608356B (en) A kind of double-shaft micromechanical resonant accelerometer structure and production method
CN102109534B (en) Two-axis resonant silicon micro-accelerometer
CN102759637B (en) MEMS (micro electro mechanical system) triaxial acceleration transducer and manufacture method thereof
US6311556B1 (en) Micro-accelerometer with capacitive resonator
CN111103073A (en) Multi-parameter cooperative sensitive resonant pressure sensor and preparation method thereof
CN109883602B (en) Self-compensating silicon micro-resonant pressure sensitive chip based on SOI
CN113945732A (en) Graphene double-shaft differential resonant accelerometer
CN101963624B (en) Silicon micro-resonant accelerometer
CN102494813A (en) Silicon micro-resonant mode pressure sensor based on differential motion structure with coupling beam
CN107478862B (en) Quartz vibrating beam accelerometer sensitive chip based on gold bonding
CN102608355A (en) Resonance-equilibrium tunnel current type three-axis acceleration transducer and manufacturing method thereof
CN102590555A (en) Resonance-force balance capacitance type three-axis acceleration transducer and manufacture method
CN101271124B (en) L-beam piezoresistance type micro-accelerometer and production method thereof
CN105021846A (en) Six-axis integrated miniature acceleration sensor and manufacturing method therefor
CN102798732A (en) Acceleration sensor and acceleration detection apparatus
CN103439529B (en) Based on the silicon vibrating beam accelerometer of the integrated high precision measuring temperature structure of chip
KR20110084843A (en) Acceleration sensor and acceleration detecting apparatus
CN111812355B (en) Low stress sensitivity silicon micro resonant accelerometer structure
CN101298987B (en) Robustness tuning fork vibrating type micromechanical gyroscope
CN109883581B (en) Cantilever beam type differential resonance pressure sensor chip
CN201796049U (en) Silicon micro resonant accelerometer
CN112881753B (en) Damping-adjustable silicon tuning fork resonant accelerometer structure
CN201984082U (en) Biaxial resonant silicon micro- accelerometer
CN109579811B (en) Butterfly wing type micro gyroscope adopting polygonal vibrating beam and preparation method thereof
CN102602879A (en) Two-step corrosion manufacturing method for resonant beam and support beam of resonance type accelerometer

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination