CN113939105A - Method for preparing circuit board by composite jet printing process and prepared circuit board - Google Patents

Method for preparing circuit board by composite jet printing process and prepared circuit board Download PDF

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Publication number
CN113939105A
CN113939105A CN202111102637.8A CN202111102637A CN113939105A CN 113939105 A CN113939105 A CN 113939105A CN 202111102637 A CN202111102637 A CN 202111102637A CN 113939105 A CN113939105 A CN 113939105A
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CN
China
Prior art keywords
circuit board
material layer
ink
steps
copper
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111102637.8A
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Chinese (zh)
Inventor
张兴业
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Beijing Dahua Boke Intelligent Technology Co ltd
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Beijing Dahua Boke Intelligent Technology Co ltd
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Application filed by Beijing Dahua Boke Intelligent Technology Co ltd filed Critical Beijing Dahua Boke Intelligent Technology Co ltd
Priority to CN202111102637.8A priority Critical patent/CN113939105A/en
Publication of CN113939105A publication Critical patent/CN113939105A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

The invention discloses a method for preparing a circuit board by a composite jet printing process. The method of the invention comprises the following steps: s1, spraying and printing the ink A on the surface of the copper-clad plate, wherein the ink A is cured to form a material layer A, and the material layer A becomes a circuit protection covering area; s2, spraying and printing the ink B on the surface of the copper-clad plate, wherein the ink B forms a material layer B after being cured, and the material layer B becomes a pad protection covering area; s3, etching the area without ink coverage; s4: removing the material layer in the bonding pad area B to expose the bonding pad; s5: and (4) spray-printing C ink, wherein the C ink forms a C material layer after being cured, and the C material layer fills the part which is not coated with copper except the welding pad area. Besides the steps, the method also comprises the steps of character printing, cutting and tin immersion in the conventional process of the back section of the circuit board preparation. The technical scheme of the invention can not only avoid exposure and development, but also avoid the stripping process of the anti-corrosion layer, and can obviously simplify the manufacturing process of the circuit board.

Description

Method for preparing circuit board by composite jet printing process and prepared circuit board
Technical Field
The invention relates to the technical field of circuit board preparation, in particular to a method for preparing a circuit board by a composite jet printing process.
Background
Circuit boards, also known as printed circuit boards, are important electronic components, support bodies for electronic components, and carriers for electrical connection of electronic components. The circuit board is one of indispensable accessories in various modern electronic devices, but all electronic devices, whether large machines or personal computers, communication base stations or mobile phones, household appliances or electronic toys, are all used as printed circuit boards.
Printed circuit boards are of critical importance in the electronics industry, and circuit board insulating inks include etch resistant inks and solder resist inks. The etching-resistant ink is used as a barrier layer when the circuit is corroded, the circuit is protected when the etching is carried out, and the ink is stripped after the circuit is corroded. The solder resist ink is coated on the circuit after the circuit is made to protect the circuit, and plays a role in insulation and oxidation resistance. At present, for the mass production of the traditional copper-based circuit board, the traditional copper-based circuit board is generally manufactured by adopting methods of exposure, development and chemical etching, but the method has the disadvantages of large material loss, serious environmental pollution, complex equipment and process and low production yield. With the continuous progress of the technology, the etching-resistant ink capable of being printed by ink jet printing is provided, the processes of exposure and development can be omitted, but the alkali liquor is still required to remove the film.
During the course of research and practice on this method, the inventors of the present invention found that: based on a composite jet printing process, the printed anti-etching ink has a solder resist characteristic, and after a naked copper layer is etched, the anti-etching ink layer takes the purpose of the solder resist layer, so that an alkali liquor stripping process is omitted, and the production procedures of a circuit board can be obviously reduced.
Disclosure of Invention
The invention provides a circuit board preparation method, which can avoid the traditional exposure and development process and the alkali liquor stripping process of an anti-corrosion layer, and remarkably simplifies the circuit board preparation process.
A method for preparing a circuit board by a composite jet printing process comprises the following steps of S1, printing ink A on the surface of a copper-clad plate, forming a material layer A after the ink A is solidified, and enabling the material layer A to become a circuit protection covering area; s2, spraying and printing the ink B on the surface of the copper-clad plate, wherein the ink B forms a material layer B after being cured, and the material layer B becomes a pad protection covering area; s3, etching the area without ink coverage; s4: removing the material layer in the bonding pad area B to expose the bonding pad; s5: and (4) spray-printing C ink, wherein the C ink forms a C material layer after being cured, and the C material layer fills the part which is not coated with copper except the welding pad area.
The material layer A in the step S1 can meet the requirement of the circuit board industry on the etching resistance of the circuit and meet the standard requirement of the etching resistance layer of the circuit; after the A material layer is subjected to an etching process, the requirement of the existing circuit board on the resistance welding performance can still be met, and the standard requirement of the resistance welding layer is met.
The material layer B in the step S2 can meet the requirement of the circuit board industry on the etching resistance of the circuit and meet the standard requirement of the etching resistance layer of the circuit.
The copper foil covered by the material layer A in the step S1 and the material layer B in the step S2 is a circuit board conductive circuit part.
The method for removing the material layer in the pad area B in step S4 includes, but is not limited to, one of physical engraving, laser etching, and wet development account, and the exposed pad position may be used for mounting components and soldering silver wires.
The C material layer in step S5 can meet the requirement of the existing circuit board for solder mask performance, and meets the standard requirement of the solder mask layer.
The copper-free part in the step S5 is the copper-clad plate region except the copper-clad plate region covered by the material layer a and the copper foil region covered by the material layer B.
The a material layer described in the above step S1 and the C material layer described in the step S5 together constitute a solder resist layer portion of the circuit board.
The method for preparing the circuit board by the composite jet printing process comprises the steps of finishing the circuit board in the steps S1-S5 and conventional post-stage processes of circuit board preparation, such as character printing, slitting, tin dipping and the like.
The circuit board prepared by the technical scheme.
The invention has the beneficial effects that: the technical scheme of the invention can not only avoid exposure and development, but also avoid the stripping process of the anti-corrosion layer, thereby obviously simplifying the circuit board manufacturing process.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a circuit board fabrication process;
FIG. 2 is a copper-clad plate in an embodiment;
FIG. 3 is a cross-sectional view of a copper-clad plate in an embodiment;
FIG. 4 shows a layer of material A obtained by curing the printing ink A in the example;
FIG. 5 shows a layer of B material obtained by curing the printing ink B in the example;
FIG. 6 illustrates an embodiment in which the area not covered by ink is etched;
FIG. 7 is a view showing the example in which the material layer B in the pad region is removed to expose the pad copper foil;
fig. 8 shows an embodiment in which the printed C ink fills the portion not coated with copper except the pad region.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
A method for preparing a circuit board by a composite jet printing process comprises the following steps, and figure 1 is a schematic diagram of a circuit board preparation process. Fig. 2 is a cross-sectional view of the copper-clad plate in the embodiment of fig. 3, and it can be seen from fig. 3 that the copper-clad plate is divided into two layers, the upper layer is a thin copper foil layer, and the lower layer is a substrate.
And S1, printing the ink A on the surface of the copper-clad plate, wherein the ink A is cured to form a material layer A, and the material layer A becomes a circuit protection coverage area. Fig. 4 shows a layer of a material obtained by curing the printing ink a in the example. And S2, spraying and printing the ink B on the surface of the copper-clad plate, and curing the ink B to form a material layer B which becomes a pad protection covering area. Fig. 5 shows a layer of B material obtained by curing the print B ink in the example. And S3, etching the area without ink coverage. Fig. 6 illustrates an embodiment in which the area not covered by ink is etched. S4: and removing the material layer B in the bonding pad area by adopting laser etching to expose the bonding pad. Fig. 7 shows the embodiment where the B material layer in the pad area is removed to expose the pad copper foil. The exposed pad position can be used for mounting components and welding silver wires; s5: and (4) spray-printing C ink, wherein the C ink forms a C material layer after being cured, and the C material layer fills the part which is not coated with copper except the welding pad area. Fig. 8 shows an embodiment in which the printed C ink fills the portion not coated with copper except the pad region.
The material layer A in the step S1 can meet the requirement of the circuit board industry on the etching resistance of the circuit and meet the standard requirement of the etching resistance layer of the circuit; after the A material layer is subjected to an etching process, the requirement of the existing circuit board on the resistance welding performance can still be met, and the standard requirement of the resistance welding layer is met.
The material layer B in the step S2 can meet the requirement of the circuit board industry on the etching resistance of the circuit and meet the standard requirement of the etching resistance layer of the circuit.
The copper foil covered by the material layer A in the step S1 and the material layer B in the step S2 is a circuit board conductive circuit part.
The C material layer in the step S5 can meet the requirement of the existing circuit board on the solder resistance performance and meet the standard requirement of the solder resistance layer.
And (S5) removing the copper-clad plate, namely removing the area of the copper-clad plate covered by the material layer A and the area of the copper foil covered by the material layer B, and remaining the area of the copper-clad plate.
The layer of material a of step S1 and the layer of material C of step S5 together form a solder mask portion of the circuit board.
Besides the steps S1-S5, the method further comprises the steps of character printing, slitting and tin immersion in the conventional process of the later stage, and finally the circuit board is prepared.
The circuit board can be prepared by the steps.
In another embodiment, the material layer of the pad region B may also be removed using a physical engraving method or a wet developing method.
The method for preparing the circuit board by the composite jet printing process and the prepared circuit board provided by the embodiment of the invention are introduced in detail, a specific example is applied in the text to explain the principle and the implementation mode of the invention, and the description of the embodiment is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims (10)

1. A method for preparing a circuit board by a composite jet printing process is characterized by comprising the following steps: printing ink A on the surface of a copper-clad plate, wherein the ink A is solidified to form a material layer A, and the material layer A becomes a circuit protection coverage area; s2, spraying and printing the ink B on the surface of the copper-clad plate, wherein the ink B forms a material layer B after being cured, and the material layer B becomes a pad protection covering area; s3, etching the area without ink coverage; s4: removing the material layer in the bonding pad area B to expose the bonding pad; s5: and (4) spray-printing C ink, wherein the C ink forms a C material layer after being cured, and the C material layer fills the part which is not coated with copper except the welding pad area.
2. The method for preparing a circuit board by the composite jet printing process according to claim 1, wherein the method comprises the following steps: the material layer A in the step S1 can meet the requirement of the circuit board industry on the etching resistance of the circuit and meet the standard requirement of the etching resistance layer of the circuit; after the A material layer is subjected to an etching process, the requirement of the existing circuit board on the resistance welding performance can still be met, and the standard requirement of the resistance welding layer is met.
3. The method for preparing a circuit board by the composite jet printing process according to claim 1, wherein the method comprises the following steps: the material layer B in the step S2 can meet the requirement of the circuit board industry on the etching resistance of the circuit and meet the standard requirement of the etching resistance layer of the circuit.
4. The method for preparing a circuit board by the composite jet printing process according to claim 1, wherein the method comprises the following steps: the copper foil covered by the material layer A in the step S1 and the material layer B in the step S2 is a circuit board conductive circuit part.
5. The method for preparing a circuit board by the composite jet printing process according to claim 1, wherein the method comprises the following steps: the method for removing the material layer in the pad region B in step S4 includes, but is not limited to, one of physical engraving, laser etching, and wet development, and the exposed pad position may be used for mounting components and soldering silver wires.
6. The method for preparing a circuit board by the composite jet printing process according to claim 1, wherein the method comprises the following steps: the C material layer in the step S5 can meet the requirement of the existing circuit board on the solder resistance performance and meet the standard requirement of the solder resistance layer.
7. The method for preparing a circuit board by the composite jet printing process according to claim 1, wherein the method comprises the following steps: and (S5) removing the copper-clad plate, namely removing the area of the copper-clad plate covered by the material layer A and the area of the copper foil covered by the material layer B, and remaining the area of the copper-clad plate.
8. The method for preparing a circuit board by the composite jet printing process according to claim 1, wherein the method comprises the following steps: the layer of material a of step S1 and the layer of material C of step S5 together form a solder mask portion of the circuit board.
9. The method for preparing a circuit board by the composite jet printing process according to claim 1, wherein the method comprises the following steps: besides the steps S1-S5, the method further comprises the steps of character printing, cutting and tin immersion in the conventional process of the later stage of circuit board preparation.
10. A circuit board prepared according to the method of any one of claims 1 to 9.
CN202111102637.8A 2021-09-21 2021-09-21 Method for preparing circuit board by composite jet printing process and prepared circuit board Pending CN113939105A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111102637.8A CN113939105A (en) 2021-09-21 2021-09-21 Method for preparing circuit board by composite jet printing process and prepared circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111102637.8A CN113939105A (en) 2021-09-21 2021-09-21 Method for preparing circuit board by composite jet printing process and prepared circuit board

Publications (1)

Publication Number Publication Date
CN113939105A true CN113939105A (en) 2022-01-14

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ID=79276219

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111102637.8A Pending CN113939105A (en) 2021-09-21 2021-09-21 Method for preparing circuit board by composite jet printing process and prepared circuit board

Country Status (1)

Country Link
CN (1) CN113939105A (en)

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