CN113935960A

CN113935960A - Defect overhauling method, device and equipment

Info

Publication number: CN113935960A
Application number: CN202111146442.3A
Authority: CN
Inventors: 刘亚东; 李勇; 张泽明
Original assignee: Jingwang Electronic Technology Zhuhai Co ltd
Current assignee: Jingwang Electronic Technology Zhuhai Co ltd
Priority date: 2021-09-28
Filing date: 2021-09-28
Publication date: 2022-01-14

Abstract

The application discloses a defect overhauling method, device and equipment, and belongs to the technical field of circuit board overhauling. The method comprises the following steps: the method comprises the steps that a first device obtains a scanning image of a circuit board; acquiring a plurality of defect information of the circuit board according to the scanning image; setting the maintenance authority of each piece of defect information in the plurality of pieces of defect information, wherein when the maintenance authority of each piece of defect information is not released, the next defect information defect maintenance flow is not allowed to enter, the maintenance authority of each piece of defect information can be released after the indicated defect is maintained, and when the maintenance authority of each piece of defect information is released, the next defect information defect maintenance flow is allowed to enter; and sending the plurality of defect information to a server to instruct second equipment to repair the defects of the circuit board according to the plurality of defect information. This application can guarantee that all defects of circuit board can both obtain overhauing through setting up the maintenance authority for a plurality of defect information of circuit board to avoided the defect to overhaul the leakage, thereby guaranteed the quality of circuit board.

Description

Defect overhauling method, device and equipment

Technical Field

The application relates to the technical field of circuit board maintenance, in particular to a defect maintenance method, device and equipment.

Background

With the spread of electronic products, the demand for Circuit boards such as PCBs (Printed Circuit boards), FPCs (Flexible Printed circuits), and the like has rapidly increased. The manufacture of the circuit board is usually completed by a machine, which easily causes the defects of residual copper, multiple holes, few holes and the like in the manufacture process of the circuit board, so the defect inspection of the circuit board is generally required before the circuit board leaves a factory.

In the related art, when a circuit board is inspected for defects, an Automatic Optical Inspection (AOI) device optically scans the circuit board to obtain a scanned image, compares the scanned image with a standard image to detect the defects, and then a technician repairs the defects detected by the AOI device in a Virtual Reality Station (VRS).

However, when the technician repairs the defect in the VRS, the technician may miss the repair of the defect on the circuit board or skip the repair of the defect due to an operation error, thereby causing the defect on the circuit board to be repaired.

Disclosure of Invention

The application provides a defect overhauling method, a defect overhauling device and defect overhauling equipment, which can guarantee that defects on a circuit board can be overhauled. The technical scheme is as follows:

in a first aspect, a defect repair method is provided, which is applied to a first device, and comprises the following steps:

acquiring a scanning image of the circuit board;

acquiring a plurality of defect information of the circuit board according to the scanning image, wherein each defect information in the plurality of defect information comprises a defect position in the circuit board and a corresponding defect type;

setting the maintenance authority of each piece of defect information in the plurality of pieces of defect information, wherein when the maintenance authority of each piece of defect information is not released, the next defect information defect maintenance flow is not allowed to enter, the maintenance authority of each piece of defect information can be released after the indicated defect is maintained, and when the maintenance authority of each piece of defect information is released, the next defect information defect maintenance flow is allowed to enter;

and sending the plurality of defect information to a server to instruct second equipment to carry out defect repair on the circuit board according to the plurality of defect information.

In this application, through setting up the maintenance authority for every defect information in a plurality of defect information of circuit board, make in this a plurality of defect information when the maintenance authority of defect information is not relieved the maintenance of the defect that next defect information instructs can not carry out, need to accomplish the maintenance of the defect that this defect information instructs, and relieve behind this defect information's the maintenance authority, just can trigger and confirm the operation and carry out the maintenance of the defect that next defect information instructs, so, can guarantee when carrying out the defect maintenance, the defect that every defect information in a plurality of defect information of circuit board instructs can both be overhauled, thereby defect maintenance leakage loss has been avoided, and then the quality of circuit board has been guaranteed.

Optionally, the acquiring, according to the scan image, a plurality of defect information of the circuit board includes:

determining a plurality of defect positions according to the difference between the scanned image and the standard circuit board image;

for any one of the plurality of defect positions, determining a defect type corresponding to the one defect position according to the similarity between the local image at the one defect position in the scanned image and each of a plurality of standard defect images, wherein the plurality of standard defect images correspond to the plurality of defect types one by one, and each of the plurality of standard defect images is an image of a defect of the corresponding one defect type;

and taking the defect position and the corresponding defect type as defect information of the circuit board.

Optionally, each of the plurality of defect information further includes a partial image at a defect position in the scanned image, and before the setting of the repair authority for each of the plurality of defect information, the method further includes:

determining whether the defect indicated by the one defect information is a functional defect or a non-functional defect according to the defect type in the one defect information for any one of the plurality of defect information;

and if the defect indicated by the defect information is a non-functional defect, screening the defect information according to the local image in the defect information.

Optionally, the screening the one piece of defect information according to the local image in the one piece of defect information includes:

and if the similarity between the local image in the defect information and at least one of the plurality of false point defect images is greater than or equal to a similarity threshold, determining that the defect indicated by the defect information is a false point defect, and deleting the defect information.

Optionally, the method further comprises:

if the similarity between the local image in the defect information and each of the plurality of false point defect images is smaller than the similarity threshold, displaying a defect filtering prompting message, wherein the defect filtering prompting message carries the local image in the defect information, and is used for prompting a user to confirm whether the defect contained in the displayed local image is a false point defect;

and if the confirmation operation aiming at the defect filtering reminding message is detected, determining that the defect indicated by the defect information is a false point defect, and deleting the defect information.

In a second aspect, a defect repair method is provided, which is applied to a second device, and comprises the following steps:

acquiring a plurality of pieces of defect information of a circuit board from a server, wherein each piece of defect information comprises a defect position in the circuit board and a corresponding defect type, and each piece of defect information is provided with an overhaul authority;

repairing the defect indicated by each piece of defect information in the plurality of pieces of defect information in sequence;

in the process of repairing the defect indicated by each piece of defect information in the plurality of pieces of defect information in sequence, if a defect repairing process of the piece of defect information is entered, indicating a user to repair the defect indicated by the piece of defect information according to the piece of defect information;

if the unlocking operation aiming at the defect information is detected, the overhauling authority of the defect information is removed, and the unlocking operation is triggered after the defect indicated by the defect information is overhauled;

and if the confirmation operation aiming at the defect information is detected, entering a defect overhauling flow of the next defect information under the condition that the overhauling authority of the defect information is released.

In the method, in the defect repairing process, after a defect indicated by defect information is repaired, the repairing authority of the defect information is released by executing unlocking operation, then, after the confirmation operation aiming at the defect information is detected, the next defect information can be skipped to carry out defect repairing on the defect indicated by the next defect information, and if the repairing authority of the defect information is not released, even if the confirmation operation aiming at the defect information is detected, the defect indicated by the next defect information cannot be repaired. So, can guarantee to overhaul the defect that every defect information in this a plurality of defect information instructs in proper order, just also can guarantee that the defect that every defect information in this a plurality of defect information instructs can both be overhauld, avoid appearing the problem that the defect that certain defect information instructs is overhauld by the hourglass to can guarantee that the defect on the circuit board can both be overhauld, and then guarantee the quality of circuit board.

Optionally, before the removing the maintenance authority of the one piece of defect information if the unlocking operation for the one piece of defect information is detected, the method further includes:

after entering the defect overhauling flow of the defect information, if the induction information is acquired through the sensor, the unlocking operation aiming at the defect information is determined to be detected.

In a third aspect, a defect inspection apparatus is provided, the apparatus comprising:

the first acquisition module is used for acquiring a scanning image of the circuit board;

the second acquisition module is used for acquiring a plurality of pieces of defect information of the circuit board according to the scanning image, wherein each piece of defect information in the plurality of pieces of defect information comprises a defect position in the circuit board and a corresponding defect type;

the setting module is used for setting the overhaul permission of each piece of defect information in the plurality of pieces of defect information, when the overhaul permission of each piece of defect information is not released, the next defect information defect overhaul flow is not allowed to enter, the overhaul permission of each piece of defect information can be released after the indicated defect is overhauled, and when the overhaul permission of each piece of defect information is released, the next defect information defect overhaul flow is allowed to enter;

and the sending module is used for sending the plurality of defect information to a server so as to instruct second equipment to carry out defect maintenance on the circuit board according to the plurality of defect information.

Optionally, the second obtaining module is configured to:

Optionally, each of the plurality of defect information further includes a partial image at a defect position in the scanned image, the apparatus further includes:

a determining module, configured to determine, for any one of the plurality of pieces of defect information, whether a defect indicated by the one piece of defect information is a functional defect or a non-functional defect according to a defect type in the one piece of defect information;

and the screening module is used for screening the defect information according to the local image in the defect information if the defect indicated by the defect information is a non-functional defect.

Optionally, the screening module is configured to:

Optionally, the screening module is further configured to:

In a fourth aspect, there is provided a defect inspection apparatus, the apparatus comprising:

the circuit board inspection device comprises an acquisition module, a processing module and a processing module, wherein the acquisition module is used for acquiring a plurality of defect information of a circuit board from a server, each piece of defect information in the plurality of defect information comprises a defect position in the circuit board and a corresponding defect type, and each piece of defect information in the plurality of defect information is provided with an inspection authority;

the maintenance module is used for maintaining the defects indicated by each piece of defect information in the plurality of pieces of defect information in sequence, and in the process of maintaining the defects indicated by each piece of defect information in the plurality of pieces of defect information in sequence, if the defect maintenance flow of one piece of defect information is entered, a user is instructed to maintain the defects indicated by the one piece of defect information according to the one piece of defect information;

the permission removing module is used for removing the maintenance permission of the defect information if the unlocking operation aiming at the defect information is detected, and the unlocking operation is triggered after the defect indicated by the defect information is maintained;

and the confirming module is used for entering a defect repairing process of the next defect information under the condition that the repairing authority of the defect information is already released if the confirming operation aiming at the defect information is detected.

Optionally, the apparatus further comprises:

and the determining module is used for determining that the unlocking operation aiming at the defect information is detected if the induction information is acquired through the sensor after the defect overhauling process of the defect information is started.

In a fifth aspect, a computer device is provided, the computer device comprising a memory, a processor and a computer program stored in the memory and executable on the processor, the computer program, when executed by the processor, implementing the defect repair method of the first aspect.

In a sixth aspect, a computer device is provided, the computer device comprising a memory, a processor and a computer program stored in the memory and executable on the processor, the computer program, when executed by the processor, implementing the defect repair method of the second aspect.

In a seventh aspect, a computer-readable storage medium is provided, which stores a computer program, and the computer program is executed by a processor to implement the defect repairing method of the first aspect.

In an eighth aspect, a computer-readable storage medium is provided, which stores a computer program that, when executed by a processor, implements the defect repair method of the second aspect described above.

In a ninth aspect, there is provided a computer program product containing instructions which, when run on a computer, cause the computer to perform the steps of the defect repair method of the first aspect described above.

In a tenth aspect, a computer program product is provided comprising instructions which, when run on a computer, cause the computer to perform the steps of the defect repair method of the second aspect described above.

It is understood that, for the beneficial effects of the third aspect, the fifth aspect, the seventh aspect and the ninth aspect, reference may be made to the description of the first aspect, and details are not described herein again. For the beneficial effects of the fourth aspect, the sixth aspect, the eighth aspect and the tenth aspect, reference may be made to the description related to the second aspect, and details are not repeated here.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic illustration of an implementation environment provided by an embodiment of the present application;

FIG. 2 is a flow chart of a defect repair method provided by an embodiment of the present application;

FIG. 3 is a schematic diagram of a defect repair method provided in an embodiment of the present application;

FIG. 4 is a schematic structural diagram of a defect inspection apparatus provided in an embodiment of the present application;

FIG. 5 is a schematic structural diagram of another defect inspection apparatus provided in the embodiments of the present application;

fig. 6 is a schematic structural diagram of a computer device according to an embodiment of the present application;

fig. 7 is a schematic structural diagram of another computer device according to an embodiment of the present application.

Detailed Description

To make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

It should be understood that reference to "a plurality" in this application means two or more. In the description of the present application, "/" means "or" unless otherwise stated, for example, a/B may mean a or B; "and/or" herein is only an association relationship describing an associated object, and means that there may be three relationships, for example, a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, for the convenience of clearly describing the technical solutions of the present application, the terms "first", "second", and the like are used to distinguish the same items or similar items having substantially the same functions and actions. Those skilled in the art will appreciate that the terms "first," "second," etc. do not denote any order or quantity, nor do the terms "first," "second," etc. denote any order or importance.

Before explaining the embodiments of the present application in detail, an application scenario of the embodiments of the present application will be described.

The circuit board is generally manufactured by at least 10 processes, and is manufactured by a machine, so that it is necessary to check whether there is a defect on the circuit board before shipping.

The defect overhauling method provided by the embodiment of the application is applied to the scene of carrying out defect overhauling on the circuit board, and can avoid that a technician misses a certain defect when overhauling the defect of the circuit board by setting the overhauling permission for the defect information obtained by detection. The circuit board suitable for the defect repairing method provided by the embodiment of the application comprises but is not limited to a PCB, an FPC and the like.

The following describes an implementation environment related to embodiments of the present application.

Fig. 1 is a schematic diagram of an implementation environment provided by an embodiment of the present application. Referring to fig. 1, the implementation environment includes: a first device 101, a server 102, a second device 103.

The first device 101 is configured to detect a defect on a circuit board and obtain a plurality of pieces of defect information of the circuit board, for example, the first device 101 may be an AOI device, or may be another device capable of detecting a defect of the circuit board, which is not limited in this embodiment of the present application.

The server 102 may be an independent server, or may be a server cluster composed of a plurality of servers, where the servers are used to store a plurality of defect information of the circuit board.

The second device 103 is configured to repair the circuit board according to a plurality of defect information of the circuit board, for example, the second device 103 may be a VRS device, or another device capable of repairing the defect of the circuit board, which is not limited in this embodiment of the present invention.

The first device 101 may communicate with the server 102 through a wired or wireless connection, and the second device 103 may also communicate with the server 102 through a wired or wireless connection.

After obtaining the plurality of defect information of the circuit board, the first device 101 transmits it to the server 102. The server 102 receives the plurality of defect information of the circuit board and stores the defect information. When the circuit board defect needs to be repaired, the second device 103 acquires a plurality of defect information of the circuit board from the server 102, and repairs the circuit board defect according to the acquired plurality of defect information.

The first device 101, the server 102, and the second device 103 may perform a defect repair method described in the embodiment of fig. 2 below to repair defects of the circuit board.

The defect inspection method provided in the embodiments of the present application is explained in detail below.

Fig. 2 is a flowchart of a defect repairing method according to an embodiment of the present application. Referring to fig. 2, the method includes the following steps.

Step 201: the first device acquires a scan image of the circuit board.

The scan image is an image that reflects the basic information on the circuit board, such as copper, holes, lines, pad area, and substrate. The scanned image may reflect a defective condition of the circuit board.

Specifically, the operation of step 201 may be: the first device optically scans the circuit board to obtain a scanned image of the circuit board.

The optical scanning is to scan the circuit board by irradiating the circuit board with a light source and utilizing the characteristic that different parts (such as copper, base material, etc.) on the circuit board have different light reflecting capabilities.

Optionally, the first device may comprise a scanning apparatus. In this case, the first device optically scans the circuit board, and the operation of obtaining the scanned image of the circuit board may be: the scanning device optically scans the circuit board to obtain an optical image, and then performs binarization processing on the optical image to obtain a scanned image of the circuit board.

The scanning Device is a Device for performing optical scanning, and may include a linear CCD (Charge coupled Device) camera, a light source, a motion console, and the like. For example, when detecting a defect of a circuit board, the circuit board to be detected is placed on a motion console, light emitted by a light source is irradiated on the circuit board, and the linear array CCD camera scans the circuit board irradiated by the light source to obtain an optical image of the circuit board.

The binarization processing is to convert an image having pixel values of 0 to 255 into a black-and-white image having pixel values of only 0 and 1.

Step 202: the first device acquires a plurality of defect information of the circuit board according to the scanning image.

Each defect information of the plurality of defect information includes a defect location in the circuit board, a corresponding defect type. That is, each defect information may indicate a defect on the circuit board. Further, each defect information may also include a partial image of the scanned image at the defect location, i.e., the partial image is an image of a defect on the circuit board at the defect location.

The plurality of defect information is used to indicate which locations on the circuit board have defects and to indicate what type of defect the defect at each location is. The defect position refers to the position coordinates of the defect on the circuit board. The defect types can include circuit board conductor open circuit, short circuit, pad missing, multi-hole, few-hole, hole deviation, residual copper, line burr or line width smaller and other defect types.

Specifically, the operation of step 202 may be: the first equipment determines a plurality of defect positions according to the difference between the scanned image and the standard circuit board image; for any defect position in the plurality of defect positions, determining a defect type corresponding to the defect position according to a local image at the defect position in the scanned image; the defect position, the corresponding defect type are taken as defect information of the circuit board, or the defect position, the corresponding defect type and the local image of the scanned image at the defect position are taken as defect information of the circuit board.

When the first device compares the scanned image with the standard circuit board image, the scanned image and the standard circuit board image can be converted into a Gerber file and then compared. The Gerber file is typically created by a circuit board designer using either a professional EDA (Electronic Design Automation) or CAD (Computer Aided Design) software fabrication.

The standard circuit board image is an image of a non-defective circuit board. For example, the standard circuit board image may be obtained by the first device performing binarization processing on an optical image obtained by optically scanning a circuit board without any defects.

The operation of the first device determining the plurality of defect positions according to the difference between the scanned image and the standard circuit board image may be: the first device compares the scanned image with a standard circuit board image to determine a plurality of locations in the scanned image that are different from the standard circuit board image, the plurality of locations being determined as a plurality of defect locations.

The first device determines the defect type corresponding to the defect position according to the partial image at the defect position in the scanned image, and the operation can be implemented in the following two possible ways.

In a first possible manner, the first device determines the defect type corresponding to the defect position according to the similarity between the local image at the defect position in the scanned image and each of the plurality of standard defect images.

The plurality of standard defect images are in one-to-one correspondence with a plurality of defect types, and each standard defect image in the plurality of standard defect images is an image of a defect of a corresponding one of the defect types. For example, each of the plurality of standard defect images is an image of a defect of various defect types present on the circuit board collected in a past circuit board defect inspection process.

Wherein, the operation of the first device determining the defect type corresponding to the defect position according to the similarity between the local image at the defect position in the scanned image and each of the plurality of standard defect images may be: the first device determines the similarity between a partial image at the defect position in the scanned image and each standard defect image in the plurality of standard defect images, and takes the defect type corresponding to the standard defect image with the highest similarity between the partial images as the defect type corresponding to the defect position.

For example: the plurality of standard defect images comprise a standard defect image 1 with a defect type of short circuit of a conductor of the circuit board, a standard defect image 2 with a defect type of missing a pad of the circuit board, a standard defect image 3 with a defect type of multiple holes of the circuit board, a standard defect image 4 with a defect type of few holes of the circuit board and a standard defect image 5 with a defect type of hole deviation of the circuit board. Assuming that the first device determines that the local image at the defect position in the scanned image has 30% similarity to the standard defect image 1, 20% similarity to the standard defect image 2, 90% similarity to the standard defect image 3, 40% similarity to the standard defect image 4, and 50% similarity to the standard defect image 5, it is known that the local image has the highest similarity to the standard defect image 3, and thus the defect type corresponding to the defect position can be determined to be board porosity.

In a second possible manner, the first device inputs the local image at the defect position in the scanned image into the defect identification model, and takes the defect type output by the defect identification model as the defect type corresponding to the defect position.

The defect identification model is a neural network model used for identifying the type of the circuit board defect. That is, after a certain circuit board image is input into the defect identification model, the defect identification model can identify the type of the defect included in the circuit board image and output the defect. In this way, the first device inputs the local image at the defect position in the scanned image into the defect identification model for identification, so as to automatically identify the type of the defect at the defect position, i.e. the type of the defect corresponding to the defect position.

Before the first device uses the defect recognition model to recognize the defect type corresponding to the defect position, the defect recognition model needs to be trained. Optionally, the first device may obtain a plurality of training samples, and train the neural network model using the plurality of training samples to obtain the defect identification model.

The plurality of training samples may be preset. Each of the plurality of training samples includes a sample image and a sample label, the sample image is a circuit board image containing defects, and the sample label is a type of the defects contained in the sample image. The input data in each of the plurality of training samples is a sample image containing a defect, the sample being labeled as a type of defect that the sample image contains.

The neural network model may include a plurality of network layers including an input layer, a plurality of hidden layers, and an output layer. The input layer is responsible for receiving input data; the output layer is responsible for outputting the processed data; the plurality of hidden layers are positioned between the input layer and the output layer and are responsible for processing data, and the plurality of hidden layers are invisible to the outside. For example, the neural network model may be a deep neural network or the like, and may be a convolutional neural network or the like in the deep neural network.

When the first device trains the neural network model by using a plurality of training samples, for each training sample in the plurality of training samples, the input data in the training sample can be input into the neural network model to obtain output data; determining a loss value between the output data and the sample marker in the training sample by a loss function; and adjusting parameters in the neural network model according to the loss value. After parameters in the neural network model are adjusted based on each training sample in the plurality of training samples, the neural network model with the adjusted parameters is the defect identification model.

The operation of the first device to adjust the parameters in the neural network model according to the loss value may refer to related technologies, which are not described in detail in this application.

For example, the first device may pass a formula

To adjust any one of the parameters in the neural network model. Wherein the content of the first and second substances,

is the adjusted parameter. W is a parameter before adjustment. α is a learning rate, α may be preset, for example, α may be 0.001, 0.000001, and the like, which is not limited in this embodiment of the application. dw is the partial derivative of W with respect to the loss function, which can be found from the loss value.

Further, after acquiring the plurality of defect information of the circuit board, the first device may further determine, for any one of the plurality of defect information, whether the defect indicated by the defect information is a functional defect or a non-functional defect according to a defect type in the defect information. If the defect indicated by the defect information is a non-functional defect, the defect information is screened according to the local image in the defect information.

The functional defects are defects that must be repaired during the circuit board repair phase, which may cause electrical anomalies or other undesirable points in the circuit board if not repaired.

The non-functional defect is a false point defect that does not require repair. Or, the non-functional defect is a defect that the electrical property of the circuit board is not abnormal in the circuit board maintenance stage, but the electrical property of the circuit board is abnormal or the reliability of the circuit board is abnormal due to other factors in the subsequent manufacturing process, and at this time, the non-functional defect is a defect needing to be repaired.

The defects indicated by the plurality of defect information are divided into functional defects and non-functional defects, so that the effect of accurate maintenance can be achieved, and the maintenance accuracy is improved.

Wherein, the operation of the first device determining whether the defect indicated by the defect information is a functional defect or a non-functional defect according to the defect type in the defect information may be: the first device obtains a defect degree corresponding to the defect type in the defect information from the correspondence between the defect type and the defect degree, determines that the defect indicated by the defect information is a functional defect if the defect degree is functional, and determines that the defect indicated by the defect information is a non-functional defect if the defect degree is non-functional.

Functional defects generally comprise defects of circuit board conductor open circuit, short circuit, pad missing exceeding a certain area, multiple holes, few holes, hole deviation and the like; the non-functional defects generally include defects of residual copper on the circuit board, circuit burrs, small line width, non-metallic impurities, dust and the like. The determination criteria of the functional defects and the non-functional defects may be specifically adjusted according to actual execution criteria of various manufacturers, which is not limited in the embodiment of the present application.

For example, if the defect type in the defect information is an open circuit of a conductor of a circuit board, the defect level corresponding to the open circuit of the conductor of the circuit board can be obtained as a functional level from the correspondence between the defect type and the defect level shown in table 1 below, and it can be determined that the defect indicated by the defect information is a functional defect.

TABLE 1

Type of defect	Degree of defect
		Open circuit of circuit board conductor	Functionality
Short circuit of circuit board conductor	Functionality
		Residual copper of circuit board	Non-functional
Circuit rough edge of circuit board	Non-functional
		……	……

In the embodiment of the present application, the correspondence between the defect type and the defect degree is described by taking the above table 1 as an example, and the above table 1 does not limit the embodiment of the present application.

If the defect indicated by the defect information is a non-functional defect, the first device may perform the screening operation on the defect information according to the local image in the defect information in the following two possible ways.

In a first possible manner, the first device determines whether the defect indicated by the defect information is a false point defect according to the similarity between the local image in the defect information and the multiple false point defect images; if the defect indicated by the defect information is a false point defect, the defect information is deleted.

The false point defect mainly refers to a defect that dust, non-metallic impurities and the like exist on a circuit surface and do not affect the use of a circuit board, or a defect that the circuit has residual copper but does not affect the original line width and the line distance by 20%, or a defect that the line width is small but does not affect the original line width by 20%, and a point that equipment is falsely reported as a defect.

Each false point defect image in the plurality of false point defect images is an image of each corresponding false point defect. For example, each of the plurality of false point defect images is an image of various false point defects collected during a past circuit board defect inspection process.

The operation of the first device determining whether the defect indicated by the defect information is a false point defect according to the similarity between the local image in the defect information and the plurality of false point defect images may be: and if the similarity between the local image in the defect information and at least one of the plurality of false point defect images is greater than or equal to a similarity threshold, determining that the defect indicated by the defect information is a false point defect.

The similarity threshold may be set in advance, and the similarity threshold may be set to be larger. If the similarity between the local image in the defect information and at least one of the plurality of false point defect images is greater than or equal to the similarity threshold, it indicates that the local image in the defect information is very similar to the at least one of the false point defect images, and thus it can be determined that the local image in the defect information is likely to contain false point defects, and it can be determined that the defect indicated by the defect information is a false point defect.

Further, if the similarity between the local image in the defect information and each of the plurality of false point defect images is smaller than the similarity threshold, the first device displays a defect filtering prompting message, wherein the defect filtering prompting message carries the local image in the defect information, and is used for prompting a user to confirm whether the defect included in the displayed local image is a false point defect. Then, the user judges whether the local image in the defect information contains the false point defect; if the user determines that the defect is a false point defect, the user executes a confirmation operation on the defect filtering reminding message; and if the user determines that the defect is not a false point defect, performing denial operation on the defect filtering reminding message. If the first device detects the confirmation operation aiming at the defect filtering reminding message, determining that the defect indicated by the defect information is a false point defect, and deleting the defect information; if the first device detects a denial operation for the defect filtering reminding message, determining that the defect indicated by the defect information is not a false point defect.

It should be noted that, in the embodiment of the present application, if the first device determines that the defect indicated by the defect information is a non-functional defect, all non-functional defects are automatically screened according to the similarity between the local image in the defect information and the plurality of false point defect images; and if the system has non-functional defects after automatic screening, displaying a defect filtering reminding message for manual secondary screening.

During manual secondary screening, the first device can project local images of defect information carried in the defect filtering reminding message to the display screen for screening and confirmation of a user. If the user observes that the local image of the defect information displayed on the display screen contains the false point defect, the user clicks a confirmation option on the display screen to indicate that the defect indicated by the defect information is the false point defect, and at this moment, the first device deletes the defect information. If the user observes that the local image of the defect information displayed on the display screen contains the defect which is not the false point defect, the user clicks a denial option on the display screen to indicate that the defect indicated by the defect information is not the false point defect, and the first device retains the defect information.

In a second possible manner, the first device inputs the local image in the defect information into the false point defect identification model, and determines whether the defect indicated by the defect information is a false point defect according to the identification result output by the false point defect identification model.

The false point defect identification model is a neural network model used for identifying false point defects on a circuit board. That is, after a certain circuit board image is input into the false point defect identification model, the false point defect identification model can identify whether the circuit board image contains false point defects or not and output an identification result. Thus, the first device inputs the local image in the defect information into the false point defect identification model for identification, and can automatically identify whether the defect indicated by the defect information is a false point defect.

Before the first device uses the false point defect identification model, the false point defect identification model needs to be trained. Optionally, the first device may obtain a plurality of training samples, and train the neural network model using the plurality of training samples to obtain the false point defect recognition model.

The plurality of training samples may be preset. Each training sample in the plurality of training samples comprises a sample image and a sample mark, the sample image is a circuit board image containing a false point defect, and the sample mark indicates that the sample image contains the false point defect. The input data in each of the plurality of training samples is a sample image containing a false point defect, and the sample mark indicates that the sample image contains the false point defect.

The operation of the first device for training the neural network model by using the multiple training samples to obtain the false point defect identification model is similar to the operation of the first device for training the neural network model by using the multiple training samples to obtain the defect identification model, which is not repeated herein.

It should be noted that, in the embodiment of the present application, after acquiring the plurality of pieces of defect information of the circuit board, the first device may identify whether a defect indicated by the plurality of pieces of defect information is a functional defect or a non-functional defect. If the defects indicated by the plurality of defect information include non-functional defects, screening the defect information indicating the non-functional defects, and then performing the following step 203 to set the repair authority for each defect information in the screened plurality of defect information. If all the defects indicated by the defect information are functional defects, the following step 203 is directly executed to set the repair authority for each of the defect information without screening the defect information.

Step 203: the first device sets a repair authority for each of the plurality of defect information.

And when the overhaul authority of each piece of defect information is not released, the next defect information defect overhaul flow is not allowed to enter, the overhaul authority of each piece of defect information can be released after the indicated defect is overhauled, and when the overhaul authority of each piece of defect information is released, the next defect information defect overhaul flow is allowed to enter.

For a certain defect information, the defect repair process of the defect information means that a user is instructed to repair the defect indicated by the defect information according to the defect information. After the defect indicated by the defect information is repaired, the repair authority of the defect information can be released, and then the defect information can be confirmed to be deleted or skipped, so as to enter the defect repair process of the next defect information. When the defect indicated by the defect information is not repaired, the repair authority of the defect information cannot be released, and the defect repair process of the next defect information cannot be entered.

So, through setting up the maintenance permission for every defect information in these a plurality of defect information, can guarantee to overhaul the defect that every defect information in these a plurality of defect information instructed in proper order, just also can guarantee that the defect that every defect information in these a plurality of defect information instructed can both be overhauld, avoid appearing the problem that the defect that certain defect information instructed is overhauld by the hourglass to can guarantee that the defect on the circuit board can both be overhauld, and then guarantee the quality of circuit board.

Specifically, the operation of step 203 may be: the first device labels each of the plurality of defect information to set a repair authority for each of the plurality of defect information, and the labeling may be implemented by computer program code.

Step 204: the first device transmits the plurality of defect information to the server.

Further, after receiving the plurality of defect information, the server correspondingly stores the circuit board identifier of the circuit board and the plurality of defect information, and then the circuit board indicated by the circuit board identifier can be repaired according to the plurality of defect information. The circuit board identifier is used for uniquely identifying the circuit board, and for example, the circuit board identifier may be a factory serial number, or the like of the circuit board.

Step 205: the second device acquires a plurality of defect information of the circuit board from the server.

Optionally, when the defective circuit board needs to be repaired, the circuit board is first placed on the repair table, then the second device obtains the circuit board identifier of the circuit board, and sends a defect information obtaining request carrying the circuit board identifier to the server. And after receiving a defect information acquisition request sent by the second equipment, the server acquires a plurality of pieces of defect information stored corresponding to the circuit board identifiers carried in the defect information acquisition request and sends the defect information to the second equipment.

When the second device obtains the circuit board identifier of the circuit board, the second device may obtain the circuit board identifier manually input by the user, or obtain the circuit board identifier by automatically scanning the circuit board. Of course, the second device may also obtain the circuit board identifier of the circuit board in other manners, which is not limited in this embodiment of the application.

Step 206: the second device repairs the defects indicated by each of the plurality of defect information in order.

That is, the plurality of pieces of defect information acquired by the second device from the server are sequential, and after the second device acquires the plurality of pieces of defect information, each piece of defect information can be sequentially extracted from the plurality of pieces of defect information, and the defect indicated by each piece of defect information can be repaired.

Step 207: in the process that the second device overhauls the defects indicated by each piece of defect information in the plurality of pieces of defect information in sequence, if a defect overhauling flow of the defect information is started for any piece of defect information in the plurality of pieces of defect information, a user is instructed to overhaul the defects indicated by the defect information according to the defect information.

If the defect repair process of the defect information is entered, the operation of the second device for instructing the user to repair the defect indicated by the defect information according to the defect information may be: if the defect inspection flow of the defect information is entered, the second equipment drives the camera device to be positioned at the defect position on the circuit board according to the defect position in the defect information so as to shoot the defect at the defect position on the circuit board, the shot image is amplified and then displayed on the display screen, and the user confirms and inspects the defect of the circuit board according to the shot image displayed by the display screen.

If the shot image at the defect position displayed by the display screen is not clear, the user can also confirm and repair the defect indicated by the defect information by looking at the partial image in the defect information.

When a user confirms and overhauls the defects of the circuit board according to the shot image displayed by the display screen, the user judges whether the defects at the position of the defects on the circuit board can be repaired or not according to the shot image displayed by the display screen, if the defects can not be repaired, the circuit board is placed in a scrapped area, namely, the overhaul of the circuit board is abandoned; if the defect can be repaired, the user repairs the defect according to the type of the defect.

In the actual maintenance process, some defects can not be immediately repaired, such as: the parts such as residual copper removal, short circuit repair, open circuit wire repair and the like are time-consuming repair work, at the moment, a user can find the defects on the circuit board and use a pen to circle the defects, the circuit boards which cannot be repaired immediately are placed in a centralized mode, and the user performs centralized repair or repair through a machine.

For example, if a defect at the position Of the defect on the circuit board occurs, the defect cannot be repaired, for example, the defect has multiple holes, fewer holes, a hole deviation degree exceeding a customer acceptance standard or an IPC (Printed circuit board association) standard, a length Of a line open exceeding a standard allowing repair, a missing pad area exceeding a standard allowing repair, and the like, and the specific defect that cannot be repaired may be determined according to actual conditions, which is not limited in the embodiment Of the present application.

Step 208: and if the second equipment detects the unlocking operation aiming at the defect information, the overhauling authority of the defect information is released, and the unlocking operation is triggered after the defect indicated by the defect information is overhauled.

The unlocking operation is used for releasing the maintenance authority of the defect information of the defect maintenance flow currently being carried out. After entering the defect repairing process of the defect information, if the defect indicated by the defect information is repaired, the repairing authority of the defect information can be released, so that the defect information can be deleted or skipped to enter the defect repairing process of the next defect information.

In the embodiment of the application, in order to avoid defect repair loss, after the defect indicated by the defect information is repaired, a user needs to complete the unlocking operation to transfer to the defect repair flow of the next defect information, and if the unlocking operation is not completed, the user cannot transfer to the defect repair flow of the next defect information. That is, the second device can allow the user to enter the defect repair process of the next defect information by pressing a key to confirm that the defect information is deleted or skipped only after detecting the unlocking operation of the user and releasing the repair authority of the defect information. If the second device does not detect the unlocking operation of the user, the defect information is not allowed to be deleted or skipped if the overhauling authority of the defect information exists, and the defect overhauling flow of the next defect information cannot be entered.

After completing the repair of the defect indicated by the defect information, the user may trigger the unlocking operation of the defect information in various ways. Such as by a sensor. Specifically, if the second device acquires the induction information through the sensor, determining that the unlocking operation aiming at the defect information is detected, and removing the maintenance authority of the defect information; and if the second equipment does not acquire the induction information through the sensor, determining that the unlocking operation aiming at the defect information is not detected, and not removing the overhauling authority of the defect information.

For example, a sensor may be provided, after completing the maintenance of the defect indicated by the defect information, the user may shield the sensor with a hand, the sensor generates sensing information after the user shields the sensor and feeds the sensing information back to the second device, and the second device removes the maintenance right of the defect information after receiving the sensing information. In this case, the sensor may be an optical sensor, and the user may shield the sensor with a hand, so as to block the propagation path of the sensor, and the sensor senses the shielding action of the user, thereby feeding back the sensing signal to the second device.

Step 209: if the second device detects the confirmation operation aiming at the defect information, the defect repairing process of the next defect information is entered under the condition that the repairing authority of the defect information is released.

The confirm operation is used to indicate to delete the defect information or skip the defect information. And entering a defect repairing process of next defect information only by detecting the confirmation operation, and repairing the defect indicated by the next defect information. The user may trigger the validation of the defect information in a variety of ways, for example, the user may trigger the validation of the defect information by clicking a service validation button.

In the embodiment of the present application, if the defect information is released from the defect information, the defect inspection process of the next defect information is allowed to be performed. If the defect information has the defect information maintenance authority and is not released, the defect information is not allowed to enter the defect maintenance flow of the next defect information. That is, if the second device detects the confirmation operation for the defect information, it is first necessary to confirm whether the maintenance authority for the defect information is released, and if the maintenance authority for the defect information is released, the defect maintenance flow for the next defect information is entered, whereas if the maintenance authority for the defect information is not released, the defect maintenance flow for the next defect information cannot be entered even if the confirmation operation for the defect information is detected.

That is, after entering the defect repair process of a certain piece of defect information, the user can release the repair authority of the defect information after completing the repair of the defect indicated by the defect information, and then can confirm to delete or skip the defect information, so as to enter the defect repair process of the next piece of defect information. And when the defect indicated by the defect information is not repaired, and the defect repairing process of the next defect information is not entered. So, can guarantee to overhaul the defect that every defect information in this a plurality of defect information instructs in proper order, just also can guarantee that the defect that every defect information in this a plurality of defect information instructs can both be overhauld, avoid appearing the problem that the defect that certain defect information instructs is overhauld by the hourglass to can guarantee that the defect on the circuit board can both be overhauld, and then guarantee the quality of circuit board.

It should be noted that the defect repairing method provided by the embodiment of the present application is used when there is a defect on the circuit board. If the scanned image of the circuit board is compared with the standard circuit board image in step 202, and it is determined that the scanned image is consistent with the standard circuit board image, it indicates that there is no defect on the circuit board, and the circuit board is directly transferred to the next process of circuit board manufacturing without performing defect repair on the circuit board.

For ease of understanding, the defect repair method described above is exemplified below with reference to fig. 3. The first device is an AOI device, the second device is a VRS device, and the circuit board is a PCB. Referring to fig. 3, the defect repair method includes the following steps (1) to (11).

(1) The AOI device acquires a scanned image of the PCB.

Specifically, the AOI device includes a scanning device, and performs optical scanning on the PCB by the scanning device to obtain an optical image, and then performs binarization processing on the optical image to obtain a scanned image of the PCB.

(2) And the AOI equipment acquires a plurality of pieces of defect information of the PCB according to the scanning image of the PCB.

Specifically, the AOI device converts the scanned image of the PCB and the standard circuit board image into Gerber files, compares the two converted Gerber files, determines which positions on the PCB have defects and what defect types the defects at the positions belong to, and then uses the defect positions and the corresponding defect types as a plurality of defect information of the PCB, where the plurality of defect information may also include a local image at each defect position, which is not limited in the embodiment of the present application.

(3) The AOI apparatus classifies defects indicated by the plurality of defect information into functional defects and non-functional defects.

(4) And for functional defects, the AOI equipment directly sets the maintenance authority without rechecking the functional defects.

(5) And for the non-functional defects, the AOI equipment automatically screens the non-functional defects firstly and then manually screens the non-functional defects for the second time so as to delete the false point defects and set the maintenance authority for the rest non-functional defects.

The AOI equipment automatically screens the non-functional defects. And if the non-functional defects exist after the AOI equipment automatically screens the non-functional defects and deletes the false point defects, manually secondarily screening all the non-functional defects. And if the non-functional defects exist after the manual secondary screening, setting maintenance permission for the rest non-functional defects.

The residual non-functional defects mainly refer to residual copper which does not affect the electrical performance and circuit burrs which exceed the original line width by 20%, the residual copper specifically comprises the residual copper at the edge of a line side or a bonding pad which exceeds the original line width, line spacing and 20% of the area of the bonding pad, the residual copper in an independent substrate area and the like.

(6) And the AOI equipment sends a plurality of pieces of defect information with the set overhauling authority to the server, and the server correspondingly stores the circuit board identification of the PCB and the plurality of pieces of defect information after receiving the plurality of pieces of defect information.

(7) And the VRS equipment acquires a plurality of pieces of defect information of the PCB from the server according to the circuit board identification of the PCB to be overhauled.

(8) The VRS device manually overhauls the defect indicated by each of the plurality of defect information.

Specifically, the VRS device takes out one piece of defect information from the obtained plurality of pieces of defect information, firstly, the VRS device drives the camera device to be positioned at the position of the defect on the PCB according to the position of the defect in the defect information, shoots the defect at the position of the defect on the PCB, enlarges and displays the shot image on the display screen, and the maintainer checks and repairs the defect according to the shot image displayed on the display screen.

When repairing the defect, firstly, the maintainer judges whether the defect at the position of the defect can be repaired according to the shot image displayed on the display screen, if the defect is porous, less porous, the hole deviation degree exceeds the customer acceptance standard or the IPC standard, the length of the open circuit of the circuit exceeds the standard of allowing repair, the missing area of the pad exceeds the standard of allowing repair, and the like, the circuit board cannot be repaired, and is directly placed in a scrapped area; if the defect at this defect location can be repaired, the service personnel repair it according to the type of defect, for example: and a welding spot on the circuit board is short-circuited due to the residual copper, and then the maintenance personnel can finish the repair by removing the residual copper.

When defect maintenance is carried out, if functional defects and non-functional defects exist on the circuit board at the same time, the functional defects can be maintained firstly, then the non-functional defects can be maintained, the non-functional defects can be maintained firstly, then the functional defects can be maintained, and the maintenance can also be carried out according to other sequences according to actual requirements.

(9) After the defect repair indicated by the defect information is completed, the VRS device releases the access authority of the defect information.

After the repair of the defect indicated by the defect information is finished, a maintainer shields the sensor of the VRS equipment by hand, the sensor generates sensing information after the maintainer shields the sensor and feeds the sensing information back to the VRS equipment, the VRS equipment receives the sensing information and then removes the maintenance authority of the defect information, and the maintenance authority of the defect information can be removed before triggering the confirmation operation to maintain the defect indicated by the next defect information.

(10) After the VRS device detects the confirmation operation for this defect information, the defect indicated by the next defect information is repaired.

After the maintenance authority of the defect information is released, the maintenance personnel trigger the confirmation operation through a key to delete or skip the defect information, so that the defect indicated by the next defect information is maintained.

It should be noted that, if the repair authority of the defect information is released, the defect information may be deleted or skipped after the confirmation operation is triggered, so as to repair the defect indicated by the next defect information; if the defect information is not released from the inspection authority, even if the confirmation operation for the defect information is detected, the defect information cannot be deleted or skipped, and the defect indicated by the next defect information cannot be inspected.

(11) And the VRS equipment carries out the overhauling operation on the defects indicated by all the defect information of the PCB in sequence until the overhauling of all the defects on the PCB is completed.

It should be noted that the defect inspection method provided in the embodiment of the present application is used when there is a defect on the PCB, and if the scanned image of the PCB is compared with the standard circuit board image, and it is found that there is no defect on the PCB, the inspection of the PCB is not required, and the process is directly transferred to the next process of manufacturing the PCB, for example: and (5) solder resist.

In the embodiment of the application, each piece of defect information in the plurality of pieces of defect information of the circuit board is provided with the overhauling authority, so that the overhauling of the defect indicated by the next piece of defect information cannot be carried out when the overhauling authority of one piece of defect information in the plurality of pieces of defect information is not released, the overhauling of the defect indicated by the piece of defect information needs to be completed, and after the overhauling authority of the piece of defect information is released, the confirming operation can be triggered to carry out the overhauling of the defect indicated by the next piece of defect information. In addition, defects indicated by the defect information are divided into functional defects and non-functional defects, screening operation is carried out on the non-functional defects, and false point defects are screened out, so that the defects of the circuit board can be accurately overhauled by maintainers when the maintainers overhaul the defects, and the accuracy of defect overhaul is improved.

The defect inspection apparatus provided in the embodiments of the present application will be explained in detail below.

Fig. 4 is a schematic structural diagram of a defect inspection apparatus provided in an embodiment of the present application, which may be used in a first device. The defect inspection apparatus may be implemented by software, hardware or a combination of the two as part or all of a computer device, which may be the computer device shown in fig. 6 below. Referring to fig. 4, the apparatus includes: a first obtaining module 401, a second obtaining module 402, a setting module 403, and a sending module 404.

A first obtaining module 401, configured to obtain a scanned image of the circuit board;

a second obtaining module 402, configured to obtain a plurality of defect information of the circuit board according to the scanned image, where each of the plurality of defect information includes a defect position and a corresponding defect type in the circuit board;

a setting module 403, configured to set an overhaul permission of each piece of defect information in the plurality of pieces of defect information, where the access to a defect overhaul flow of the next piece of defect information is not allowed when the overhaul permission of each piece of defect information is not released, the overhaul permission of each piece of defect information can be released after the indicated defect is completed to be overhauled, and the access to the defect overhaul flow of the next piece of defect information is allowed when the overhaul permission of each piece of defect information is released;

a sending module 404, configured to send the defect information to a server, so as to instruct a second device to perform defect repair on the circuit board according to the defect information.

Optionally, the second obtaining module 402 is configured to:

for any one of the plurality of defect positions, determining a defect type corresponding to the defect position according to the similarity between the local image at the defect position in the scanned image and each of a plurality of standard defect images, wherein the plurality of standard defect images correspond to a plurality of defect types one by one, and each of the plurality of standard defect images is an image of a defect of the corresponding one defect type;

a determining module, configured to determine, for any one of the plurality of defect information, whether a defect indicated by the defect information is a functional defect or a non-functional defect according to a defect type in the defect information;

Optionally, the screening module is configured to:

if the similarity between the local image in the defect information and at least one of the plurality of false point defect images is greater than or equal to the similarity threshold, determining that the defect indicated by the defect information is a false point defect, and deleting the defect information.

Optionally, the screening module is further configured to:

if the similarity between the local image in the defect information and each of the plurality of false point defect images is smaller than the similarity threshold, displaying a defect filtering reminding message, wherein the defect filtering reminding message carries the local image in the defect information and is used for reminding a user to confirm whether the defect contained in the displayed local image is a false point defect;

In the embodiment of the application, each defect information in a plurality of defect information of the circuit board is provided with the maintenance authority, so that the maintenance of the defect indicated by the next defect information cannot be carried out when the maintenance authority of one defect information in the plurality of defect information is not released, the maintenance of the defect indicated by the defect information needs to be completed, and after the maintenance authority of the defect information is released, the confirmation operation can be triggered to carry out the maintenance of the defect indicated by the next defect information.

Fig. 5 is a schematic structural diagram of a defect inspection apparatus provided in an embodiment of the present application, which may be used in a second device. The defect inspection apparatus may be implemented by software, hardware or a combination of the two as part or all of a computer device, which may be the computer device shown in fig. 7 below. Referring to fig. 5, the apparatus includes: the system comprises an acquisition module 501, a maintenance module 502, a permission release module 503 and a confirmation module 504.

An obtaining module 501, configured to obtain multiple pieces of defect information of a circuit board from a server, where each piece of defect information in the multiple pieces of defect information includes a defect position in the circuit board and a corresponding defect type, and each piece of defect information in the multiple pieces of defect information has an overhaul permission;

an overhaul module 502, configured to overhaul the defect indicated by each piece of defect information in the plurality of pieces of defect information in sequence, and in the process of overhauling the defect indicated by each piece of defect information in the plurality of pieces of defect information in sequence, if a defect overhauling flow of the defect information is entered, instruct a user to overhaul the defect indicated by the defect information according to the defect information;

a permission removing module 503, configured to remove the maintenance permission of the defect information if an unlocking operation for the defect information is detected, where the unlocking operation is triggered after the defect indicated by the defect information is completed;

a confirming module 504, configured to, if a confirming operation for the defect information is detected, enter a defect repairing process of next defect information if the repairing authority of the defect information is released.

Optionally, the apparatus further comprises:

In the embodiment of the application, in the process of defect repair, after a defect indicated by one piece of defect information is repaired, the repair authority of the piece of defect information is released by executing unlocking operation, then, after a confirmation operation for the piece of defect information is detected, the next piece of defect information can be skipped to for defect repair of the defect indicated by the next piece of defect information, and if the repair authority of the piece of defect information is not released, the defect indicated by the next piece of defect information cannot be repaired even if the confirmation operation for the piece of defect information is detected. So, can guarantee to overhaul the defect that every defect information in this a plurality of defect information instructs in proper order, just also can guarantee that the defect that every defect information in this a plurality of defect information instructs can both be overhauld, avoid appearing the problem that the defect that certain defect information instructs is overhauld by the hourglass to can guarantee that the defect on the circuit board can both be overhauld, and then guarantee the quality of circuit board.

It should be noted that: in the defect inspection apparatus provided in the above embodiment, only the division of the functional modules is exemplified in defect inspection, and in practical applications, the function distribution may be completed by different functional modules according to needs, that is, the internal structure of the apparatus may be divided into different functional modules to complete all or part of the functions described above.

Each functional unit and module in the above embodiments may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit, and the integrated unit may be implemented in a form of hardware, or in a form of software functional unit. In addition, specific names of the functional units and modules are only for convenience of distinguishing from each other, and are not used to limit the protection scope of the embodiments of the present application.

The defect inspection device and the defect inspection method provided by the embodiment belong to the same concept, and the specific working process and the brought technical effects of the units and the modules in the embodiment can be referred to the embodiment part of the method, and are not described again here.

The computer device provided by the embodiments of the present application is explained in detail below.

Fig. 6 is a schematic structural diagram of a computer device according to an embodiment of the present application. As shown in fig. 6, the computer device 6 includes: a processor 60, a memory 61 and a computer program 62 stored in the memory 61 and executable on the processor 60, the processor 60 when executing the computer program 62 implements the operations performed by the first device in the defect repair method in the above embodiments.

The computer device 6 may be a general purpose computer device or a special purpose computer device. In a specific implementation, the computer device 6 may be a desktop computer, a laptop computer, a palmtop computer, a mobile phone, a tablet computer, a wireless terminal device, an AOI device, or the like, and the embodiment of the present application does not limit the type of the computer device 6. Those skilled in the art will appreciate that fig. 6 is merely an example of the computer device 6 and does not constitute a limitation of the computer device 6, and may include more or less components than those shown, or combine certain components, or different components, such as input output devices, network access devices, etc.

The Processor 60 may be a Central Processing Unit (CPU), and the Processor 60 may also be other general purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), an off-the-shelf Programmable Gate Array (FPGA) or other Programmable logic device, discrete Gate or transistor logic, discrete hardware components, etc. A general purpose processor may be a microprocessor or any conventional processor.

The memory 61 may in some embodiments be an internal storage unit of the computer device 6, such as a hard disk or a memory of the computer device 6. The memory 61 may also be an external storage device of the computer device 6 in other embodiments, such as a plug-in hard disk, a Smart Media Card (SMC), a Secure Digital (SD) Card, a Flash memory Card (Flash Card), etc. provided on the computer device 6. Further, the memory 61 may also include both an internal storage unit of the computer device 6 and an external storage device. The memory 61 is used for storing an operating system, an application program, a Boot Loader (Boot Loader), data, and other programs, such as program codes of computer programs. The memory 61 may also be used to temporarily store data that has been output or is to be output.

Fig. 7 is a schematic structural diagram of a computer device according to an embodiment of the present application. As shown in fig. 7, the computer device 7 includes: a processor 70, a memory 71 and a computer program 72 stored in the memory 71 and executable on the processor 70, the processor 70 implementing the operations performed by the second device in the defect repair method in the above embodiments when executing the computer program 72.

The computer device 7 may be a general purpose computer device or a special purpose computer device. In a specific implementation, the computer device 7 may be a desktop computer, a laptop computer, a palmtop computer, a mobile phone, a tablet computer, a wireless terminal device, a VRS device, and the like, and the embodiment of the present application does not limit the type of the computer device 7. Those skilled in the art will appreciate that fig. 7 is only an example of the computer device 7, and does not constitute a limitation to the computer device 7, and may include more or less components than those shown, or combine some components, or different components, such as input and output devices, network access devices, etc.

The processor 70 may be a CPU, and the processor 70 may also be other general purpose processors, DSPs, ASICs, FPGAs, or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or the like. A general purpose processor may be a microprocessor or any conventional processor.

The storage 71 may in some embodiments be an internal storage unit of the computer device 7, such as a hard disk or a memory of the computer device 7. The memory 71 may also be an external storage device of the computer device 7 in other embodiments, such as a plug-in hard disk, SMC, SD card, flash memory card, etc. provided on the computer device 7. Further, the memory 71 may also include both an internal storage unit of the computer device 7 and an external storage device. The memory 71 is used for storing an operating system, application programs, a boot loader, data, and other programs, such as program codes of computer programs, and the like. The memory 71 may also be used to temporarily store data that has been output or is to be output.

An embodiment of the present application further provides a computer device, where the computer device includes: at least one processor, a memory, and a computer program stored in the memory and executable on the at least one processor, the processor implementing the steps of any of the various method embodiments described above when executing the computer program.

The embodiments of the present application also provide a computer-readable storage medium, where a computer program is stored, and when the computer program is executed by a processor, the steps in the above-mentioned method embodiments can be implemented.

The embodiments of the present application provide a computer program product, which when run on a computer causes the computer to perform the steps of the above-described method embodiments.

The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, all or part of the processes in the above method embodiments may be implemented by a computer program, which may be stored in a computer readable storage medium and used by a processor to implement the steps of the above method embodiments. Wherein the computer program comprises computer program code, which may be in the form of source code, object code, an executable file or some intermediate form, etc. The computer readable medium may include at least: any entity or apparatus capable of carrying computer program code to a photographing apparatus/terminal device, a recording medium, computer Memory, ROM (Read-Only Memory), RAM (Random Access Memory), CD-ROM (Compact Disc Read-Only Memory), magnetic tape, floppy disk, optical data storage device, etc. The computer-readable storage medium referred to herein may be a non-volatile storage medium, in other words, a non-transitory storage medium.

It should be understood that all or part of the steps for implementing the above embodiments may be implemented by software, hardware, firmware or any combination thereof. When implemented in software, may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. The computer instructions may be stored in the computer-readable storage medium described above.

In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and reference may be made to the related descriptions of other embodiments for parts that are not described or illustrated in a certain embodiment.

Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

In the embodiments provided in the present application, it should be understood that the disclosed apparatus/computer device and method may be implemented in other ways. For example, the above-described apparatus/computer device embodiments are merely illustrative, and for example, a module or a unit may be divided into only one logical function, and may be implemented in other ways, for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not implemented. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.

Units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.

The above-mentioned embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.

Claims

1. A defect repair method is applied to a first device and comprises the following steps:

acquiring a scanning image of the circuit board;

2. The method of claim 1, wherein the obtaining a plurality of defect information of the circuit board from the scan image comprises:

3. The method of claim 1 or 2, wherein each of the plurality of defect information further comprises a partial image at a defect location in the scanned image, and wherein before setting the repair authority for each of the plurality of defect information, further comprising:

4. The method of claim 3, wherein the screening the one defect information according to the local image of the one defect information comprises:

5. The method of claim 4, wherein the method further comprises:

6. A defect repair method is applied to a second device and comprises the following steps:

7. The method according to claim 6, wherein before the releasing the repair authority of the one defect information if the unlocking operation for the one defect information is detected, further comprises:

8. A defect inspection apparatus, comprising:

9. A defect inspection apparatus, comprising:

10. A computer device, characterized in that the computer device comprises a memory, a processor and a computer program stored in the memory and executable on the processor, which computer program, when executed by the processor, implements the method according to any of claims 1 to 7.