JP2002042112A - Part mounting inspecting method for circuit board and its system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve a problem that the correlating work of images of parts by a worker for the correlating process of the images of the parts mounted on a circuit board with the master data of the reference images of the parts requires a long work time on the circuit board having a large number of part items and a considerable time until a mounting inspection. SOLUTION: In this part mounting inspecting method for the circuit board, the color image of the whole circuit board mounted with parts is generated, and a color process is applied to the generated color image of the whole circuit board to extract the shape and position of the image of a part. The color image of the part located at the position corresponding to the extracted position of the color image of the whole circuit board is compared with the color reference image based on the shape and position of the image of the extracted part to specify the part corresponding to the color image of the part, and the shape and position of the color image of the specified part are stored.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting inspection method for inspecting a mounting state of an electronic component including a chip component mounted on a circuit board, and a system therefor.

[0002]

2. Description of the Related Art In recent years, with the rapid spread of electronic devices such as personal computers, various types of circuit boards on which electronic components called chip components including small resistors and capacitors are mounted have been mass-produced. Conventionally, inspection of whether or not mounted electronic components are correctly mounted on such a circuit board has been a visual inspection by an operator. In some cases, the inspection accuracy has been lowered, so that the inspection system has been shifted to an inspection device using a CCD camera, for example, in order to automate the inspection and improve the accuracy.

[0003] Such an inspection apparatus basically has a CC
The image of the electronic component mounted on the circuit board captured by the D camera is compared with the image of the electronic component captured by the electronic component alone, that is, the reference image, using a pattern matching method. The specified electronic component is specified, and the mounting state, that is, the position shift of the specified electronic component is inspected. In this type of inspection apparatus, an operator operates a CCD camera to photograph an electronic component, and converts the position of the electronic component into data from the captured image of the electronic component. Next, the operator searched the electronic component image (master data) stored in advance to find out which electronic component the captured electronic component corresponds to, and obtained the image of the electronic component by the search. The electronic component image is associated with the electronic component to identify and register that the captured electronic component corresponds to the electronic component stored in advance. After the electronic component can be identified, an inspection range is set to determine whether or not the electronic component is correctly mounted, and the electronic component is searched within the inspection range to determine the mounting state of the electronic component.

[0004]

By the way, in recent circuit boards, due to the complexity of printed electronic circuits, the sophistication of mounting density, and the miniaturization of electronic parts, etc., a single circuit board is required. Since the number of electronic components to be inspected has increased, it has been desired to increase the speed. In the inspection device having the above-described configuration, the operator must individually perform photographing, searching, and associating electronic components with respect to all electronic components.
For a circuit board having a large number of parts, considerable work time was required.

In the positioning process for determining the mounting state of the electronic component, the relative position between the photographed image and the master data is moved in the inspection range, that is, the search area, and the master data is moved by a predetermined amount in the search area. Then, the position of the mounted electronic component is determined at a position where the captured image matches the master data. However, even in this operation, when there is an image of the electronic component to be inspected at a position near the search start position in the search area, the number of searches is small, and although the time required to determine the position is short, When the same image is located at a position close to the search end position, the number of searches increases, the time required to determine the position increases, and the overall processing becomes longer.

An object of the present invention is to solve such a problem.

[0007]

The invention of the present application employs the following means in order to achieve such an object. That is, the invention according to claim 1 of the present application is a component board mounting inspection method for inspecting a component mounting state based on an image obtained by imaging a circuit board on which a component is mounted, wherein the component is mounted on the circuit board. An all-image producing step of producing a color image of the entire mounted circuit board, an extracting step of performing color processing of the produced color image of the entire circuit board to extract the shape and position of the part image, and an extracted part image Specifying a component corresponding to the color image of the component by comparing the color image of the component at the position corresponding to the extracted position of the color image of the entire circuit board with the color reference image based on the shape and position of the component And a storage step for storing a shape and a position of a color image of the specified component, and a component mounting inspection method for a circuit board.

With such a configuration, the shape and position of the mounted component image are extracted by performing color processing from a color image of the circuit board on which the component is mounted, and the extracted component image and Since the parts and the positions of the parts are specified by comparing them with the color reference image stored in advance, and the shape and position of the color image of the specified parts are stored, the specification of the parts mounted on the circuit board is automated. It becomes possible to do. Therefore, when inspecting the mounting state of the components mounted on the circuit board, the time required for specifying the components can be reduced, and the time required for the inspection can be significantly reduced.

In order to increase the extraction accuracy of each component, the extraction step includes changing a color process based on component information indicating a characteristic of each component set in advance and converting the component image into a binary image for each component. Is preferred.

[0010] In the whole image production step, it is preferable to produce the composite image by combining the respective color images taken for each of the imaging areas of a predetermined size on the circuit board. In addition, the step of producing an entire image includes producing a color image by imaging the entire circuit board.

According to a fifth aspect of the present invention, there is provided a method for inspecting a component mounting of a circuit board based on an image obtained by imaging a circuit board on which the component is mounted. An image storing step of storing a color reference image and component type data of a component that may be mounted; and storing the component type data of the stored color reference image with the mounting position data and the component of the circuit board on which the component is mounted. A specifying step of specifying the position of the color reference image by associating the mounting position data with the color reference image by searching from the component type data in the drafting data including at least the type data, and storing the specified color reference image together with the mounting position data And a component mounting inspection method for a circuit board.

[0012] The invention according to claim 6 of the present application is a circuit board component mounting inspection system for inspecting the mounting state of components based on an image obtained by imaging a circuit board on which components are mounted. Image storage means for storing a color reference image of a component that may be performed, all image production means for producing a color image of the entire circuit board on which the component is mounted, and color processing of the color image of the produced circuit board as a whole Extracting means for extracting the shape and position of the component image, and a color image of the component at a position corresponding to the extracted position of the color image of the entire circuit board based on the shape and position of the extracted component image. A component for comparing the color reference image with the color reference image to specify a component corresponding to the component; and a component information storage unit for storing a shape and a position of the color image of the component specifying the component. A circuit board component mounting inspection system according to claim.

As the extracting means, it is preferable that the color processing is changed based on component information indicating characteristics of each component set in advance to obtain a binary component image of a different color for each component.

[0014] As the all-image producing means, it is preferable to use an image-capturing device for capturing an image for each image-capturing area of a predetermined size on the circuit board, and an image compositing processing circuit for composing each image captured by the image-capturing device. Also, as an imaging device,
One provided with a CCD camera is exemplified.

Further, it is preferable that the all-image producing means has an image pickup device for taking an image of the entire circuit board at one time. An example of such an imaging device includes a device provided with a color image scanner. Note that the imaging in each invention of the present application means that a mounted circuit board which is a subject is photographed using a film, an image recorded on a film is recorded as electronic data, and a digital still camera is used. This includes photographing and recording on a recording medium such as a semiconductor, and scanning and mounting light on a mounted circuit board using a scanner to generate and record image data based on reflected light.

According to a twelfth aspect of the present invention, there is provided a circuit board component mounting inspection system for inspecting a component mounting state based on an image obtained by imaging a circuit board on which components are mounted. Image storage means for storing a color reference image and component type data of a component that may be mounted, and storing the component type data of the stored color reference image with the mounting position data and the component of the circuit board on which the component is mounted. Specifying means for specifying the position of the color reference image by associating the mounting position data with the color reference image by searching from the component type data in the drafting data including at least the type data, and storing the specified color reference image together with the mounting position data And a component mounting inspection system for a circuit board.

Further, according to a thirteenth aspect of the present invention, there is provided a circuit board component mounting inspection method for inspecting a component mounting state based on an image obtained by photographing a circuit board on which a component is mounted. A color component imaging step of capturing a color component image including a mounted circuit board component and a color image in the vicinity thereof, and positioning for setting a positioning region having a size including the captured color component image in correspondence with the color component image In the region setting step, the color reference image of the component is moved to the determined position in the position detection result up to the previous time in the positioning region, and if the color component image and the color reference image in the positioning region match, the position of the color component image A position determining step of determining a position of a component corresponding to the color component image. It is.

According to such a configuration, when the position of the component is determined from the color component image, it is not necessary to compare the color component image with the color reference image in the entire positioning area for each position detection. It is possible to reduce the work time required to determine the position of the component corresponding to the component image.

In the position determination step, the coincidence between the color component image and the color reference image is set in a positioning region movably in a determination region having a shape matching the shape of the color component image, and the determination region is divided. In addition to setting a plurality of determination sections, a reference section corresponding to the determination section is set for the color reference image, and the comparison result is determined in advance in the determination section in which the respective colors of the determination section and the reference section are sequentially compared. When the determined criterion is not satisfied, it is preferable that the determination area is moved to the next determination position and the comparison is performed, and the determination is made based on all the determination sections satisfying the criterion.

According to a fifteenth aspect of the present invention, there is provided a method of inspecting a component mounting state of a circuit board for inspecting a mounting state of the component based on an image obtained by imaging a circuit board on which the component is mounted. A color component image capturing step of capturing a color component image composed of a component of a circuit board on which is mounted and a color image in the vicinity thereof, and a positioning region having a size including the captured color component image is set corresponding to the color component image. In the positioning area setting step, a determination area having a shape that matches the shape of the color component image is movably set in the positioning area, the determination area is divided to set a plurality of determination sections, and the color reference image is set. The reference section corresponding to the judgment section is set by using the judgment section, and the respective colors of the judgment section and the reference section are sequentially compared. If the criterion is not satisfied, the determination area is moved to the next determination position and the comparison is performed. If all the determination sections satisfy the criterion, the mounting position of the corresponding component of the color component image is determined. And a component mounting inspection method for a circuit board.

According to such a configuration, in the positioning area, the colors of the determination section set in the determination area and the reference section in the color reference image are sequentially compared, and the comparison result is determined in advance. If the criterion is not satisfied, the judgment area is moved to the next judgment position, and the respective colors of the judgment section and the color reference section are compared again. It is possible to move to the next determination position before the comparison result is obtained. Therefore, the time required for comparing all the determination sections in a certain determination section is not required, and the time required for determining the position can be reduced.

According to a sixteenth aspect of the present invention, there is provided a circuit board component mounting inspection system for inspecting a component mounting state based on an image obtained by imaging a circuit board on which a component is mounted. Image storage means for storing a color reference image of a part which is likely to be performed, color part imaging means for taking a color part image comprising a part of a circuit board on which the part is mounted and a color image in the vicinity thereof, and Positioning area setting means for setting a positioning area having a size including the color part image corresponding to the color part image; and a positioning area by moving the color reference image of the part to a fixed position in the position detection result up to the previous time in the positioning area. Position of the component corresponding to the color component image according to the position of the color component image when the color component image matches the color reference image A circuit board component mounting inspection system, characterized in that it comprises a position determining means for determining.

As the position determining means, the coincidence between the color component image and the color reference image is set within a positioning region movably in a determination region having a shape matching the shape of the color component image, and the determination region is divided. In addition to setting a plurality of determination sections, a reference section corresponding to the determination section is set for the color reference image, and the comparison result is determined in advance in the determination section in which the respective colors of the determination section and the reference section are sequentially compared. If the determined criterion is not satisfied, it is preferable that the determination area is moved to the next determination position and the comparison is performed, and the determination is made based on all the determination sections satisfying the criterion.

The invention according to claim 18 of the present application is a circuit board component mounting inspection system for inspecting the mounting state of components based on an image obtained by imaging a circuit board on which components are mounted, Image storage means for storing a color reference image of a part which is likely to be performed, color part imaging means for taking a color part image comprising a part of a circuit board on which the part is mounted and a color image in the vicinity thereof, and A positioning area setting means for setting a positioning area having a size including the color part image corresponding to the color part image, and a determination area having a shape corresponding to the shape of the color part image movably set in the positioning area; A plurality of judgment sections are set by dividing the judgment area, and a reference section corresponding to the judgment section is set for the color reference image, and each of the judgment section and the reference section is set. If the comparison result does not satisfy the predetermined criterion in one of the determination sections in which the colors are sequentially compared, the determination area is moved to the next determination position and the comparison is performed. A component mounting inspection system for a circuit board, comprising: a position determination unit that determines a mounting position of a component corresponding to a color component image when the condition is satisfied.

[0025]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an embodiment of the present invention will be described.
This will be described with reference to the drawings.

The component mounting inspection apparatus shown in FIG. 1 includes an inspection table 3 on which a mounted circuit board (hereinafter abbreviated as a mounting board) 2 on which a large number of electronic components 1 are to be inspected, An XY controller 4 for moving the inspection table 3 in two axis directions, that is, an X-axis and a Y-axis direction, a CCD camera 5 constituting an imaging device for imaging the mounting board 2 on the inspection table, and an output from the CCD camera 5 The electronic processing device 6 converts a color image captured based on the color image signal into color image data and performs a mounting inspection of the electronic component 1 described later. In the following, the term “image” refers to image data unless otherwise specified. The CCD camera 5 has a limited imaging area, and captures a portion of the mounting substrate 2 in one imaging. Therefore, as described later, in order to produce a color whole image of the mounting board 2, it is necessary to take a plurality of times of imaging, and by connecting the captured images, a color whole image of the mounting board 2 is produced. It is. Therefore, the CCD camera 5 and the electronic processing device 6 constitute an entire image producing means. In this embodiment, the inspection table 3 is moved, but the inspection table 3 may be fixed and the CCD camera 5 may be moved by the XY controller 4.

The electronic processing unit 6 is a computer system having a built-in microprocessor as a central processing unit. Basic hardware is equivalent to a personal computer. Specifically, the electronic processing device 6 includes a microprocessor 6aa, a RAM 6ab, a ROM 6a
c, an input / output interface 6ad, a device main body 6a including a storage device 6ae such as a hard disk, a keyboard 6b and a mouse 6c as input devices, a display device 6d such as a CRT as a display device, and an image captured by the CCD camera 5. Is provided with a video capture circuit 6af that constitutes an image synthesis processing circuit that converts the image data into image data. The storage device 6ae stores an inspection program described below, and stores color reference images of all the electronic components 1 that may be used on the mounting board 2 to be inspected, with their component names and the like. A database of a color reference image including a color image of the electronic component 1 is constructed. The color reference image shows the shape of the electronic component 1 and also shows characters such as the model of the component printed on the surface. The storage device 6ae constitutes an image storage unit.

In inspecting the mounting state of the electronic component 1 on the mounting board 2, first, the shape and the position of the electronic component 1 on the mounting board 2 are specified, and the shape and the position of the electronic component 1 are stored. When the position of the electronic component 1 is determined thereafter, the work of the operator who specifies the individual shapes and positions of the plurality of electronic components 1 for each mounting board 2 is omitted. The automatic teaching process of the shape and the position of the electronic component 1 is performed according to the following procedure.

Referring to FIG. 2, a schematic procedure of the teaching process will be described. First, in step S1, a color image of the entire mounting substrate 2, that is, a full color image is prepared. Specifically, the mounting board 2 on which the electronic component 1 is normally mounted is placed on an inspection table, and at each imaging point between the imaging start point and the imaging end point set for each mounting board 2 , The mounting board 2 is partially imaged. The relative movement of the CCD camera 5 to each of the imaging points is determined by setting the inspection table 3 in XY
The predetermined distance to be moved in the X direction and the Y direction after imaging at the imaging point is controlled by the controller 4.
-Set to the Y controller 4. The partial image of the mounting board 2 at each imaging point output from the video capture circuit 6af is stored in the device main body 6a of the electronic processing device 6.
(Combined) by the storage device 6a
e.

Next, in step S2, a color process is executed from the entire color image of the mounting board 2 thus manufactured.
The shape and position of the component image for each component of the mounted electronic component 1 are extracted. In step S3, a color image of the component in the overall color image is selected based on the shape and position of the extracted component image, and the electronic component 1 corresponding to the color component image is compared with the color reference image stored in the storage device 6ae. To identify. Then, in step S4,
The shape and position of the color image of the component corresponding to the extracted component image are stored in the storage device 6ae.

Next, details of the processing in steps S2 to S3 will be described with reference to FIG. First, when extracting a component image, color processing of the entire color image is performed. The color processing is a process of converting each component into an image having a color different from the color of the mounting board 2 in the entire color image, and causing each component image to emerge from the mounting board 2. That is, a color model which is a color model in which color information is digitized
In the (red, green, and blue primary colors) data, by changing the RGB data of the pixels constituting the entire color image individually and in combination of R, G, and B,
The component image is binarized.

More specifically, in step S21, a color other than white is removed using the shape, that is, the size and color information of the component image, to extract an image of a large white component such as a socket or a connector. Processing 1). The image obtained by this processing is an image of the entire mounting board 2 in which the image of the large component becomes white and the board portion of the mounting board becomes black.
For the images obtained in the processing described below,
The same is true. Next, a description will be given of a case of extracting an electronic component 1 having wiring terminals at both ends of a component body, that is, a so-called chip component. In step S22, RGB data necessary for binarizing the color image of the component is set based on the area, major axis, outline, and bulge information of the terminal portion, and an image of the terminal portion of the chip component is extracted ( Preprocessing 2). In step S23,
The image of the character of the chip component is extracted by erasing the image corresponding to the mounting board 2 from the entire color image using the color information of the mounting board 2 (preprocessing 3). Step S24
Then, using the color information of the mounting board 2, the color information of the mounting board 2 is removed from the entire color image to extract the image of the body part of the chip component (preprocessing 4). Pre-processing 1-4
Are extracted and temporarily stored in the storage device 6ae until the next processing is performed.

In step S25, the images obtained by the pre-processing 2 to 4 are superimposed (combined) to produce an image in which the component image of the chip component emerges.
In step S26, the image obtained in preprocessing 1 and the image obtained in step S25 are superimposed (combined). In step S27, the noise of the superimposed image is eliminated to clear the image. The image from which the noise has been eliminated is a binarized color image in which the respective electronic components 1 have turned white with respect to the black substrate portion.

Next, in step S28, step S2
In the image obtained in step 7, the position from the base point (fiducial point) set on the mounting board 2 is extracted. In other words, the position of each component image is determined based on the base point and the X-axis direction and Y, for example, to a corner or center of the component image.
The distance in the axial direction is obtained by counting the number of pixels. A point or pixel serving as a reference for position extraction on the component image side may be set as appropriate. The position data of the component image is associated with the component image in the form of the number of pixels in the X-axis direction and the number of pixels in the Y-axis direction, and is stored in the storage device 6ae.
Is to be stored. The position data of the component image may be data converted into a numerical value of another unit, for example, a unit in the metric system, based on the number of pixels. In step S29, the mounting board 2 is determined from the position of the extracted component image obtained in step S28.
A color image of the electronic component 1 in the entire color image, that is, a color component image is extracted, and a color reference image that matches the color component image is retrieved and retrieved from the storage device 6ae. This search is performed based on the shape of the color component image. Then, the color reference image obtained by the search is compared with the color component image to be inspected, and when both images match, that is, when all the pixels are substantially the same, the component corresponding to the color component image is specified. I do. In this case, since the color part image is compared with the color reference image, character information such as a model name written on the surface of the part can also be compared. Is not performed. After specifying the component in this way, the shape and position of the color image of the component are stored in the storage device 6ae in association with the color image of the component.

Steps S3 and S4 in the above processing are executed for the component images corresponding to all the components mounted on the mounting board 2, and the shape and position of the color image of the component corresponding to each component are determined. It is stored in the storage device 6ae.

As described above, the whole color image of the mounting board 2 is picked up, the component image of the electronic component 1 is extracted from the whole color image, and the component image is compared with the color reference image stored in the storage means. Since the operation of specifying the electronic component 1 to be performed and automatically storing the shape and position of the component image in the storage device 6ae together with the color component image is automatically performed, the time required for teaching the component image to correspond to the component is greatly reduced. Is what you can do.

Thereafter, when inspecting the mounting position of the electronic component 1 on the mounting board 2 of the same standard as the mounting board 2 described above, the inspection is performed on the basis of the shape and position of the color image stored in the storage device 6ae in the teaching process. Then, the components of the mounting board 2 to be inspected are individually imaged, and the positions of the mounted components are determined based on the imaged component images and the color reference images. This is to determine the position.

FIG. 4 shows a schematic procedure for positioning the mounted electronic component 1. First, in step SS1, the XY controller 4 is controlled to capture a color component image so that the position of the color image of the component obtained by the teaching process can be captured. That is, the XY controller 4 is controlled so that the center of the imaging area of the CCD camera 5 is located at a position corresponding to the position of the color image stored in the storage device 6ae, and the inspection table 3 is moved to color the parts. An image of a color component including the image and its vicinity is captured. Next, in step SS2, a positioning area having a size including the color component image is set for each component in the captured color component image, and the position of the color component image is moved by moving the color reference image within the positioning area. Is searched based on the determined mounting position data determined when the same color component image was executed before the current search. Then, in step SS3, the mounting position of the electronic component 1 corresponding to the color component image is determined at the position where the color component image matches the color reference image. According to this method, when an electronic component 1 is mounted on an identical type of circuit board using an automatic mounting apparatus called a so-called chip mounter, the mounting position has a small error, and the mounting may be performed at the same position. Take advantage of the high. Therefore, by searching the same electronic component 1 for the mounting position of the component corresponding to the color component image based on the mounting position determined in the past, it is possible to eliminate the need to search the entire positioning area. That is, the search time can be reduced.

The details of step SS2 and step SS3 will be described with reference to FIG. First, in step SS31, the position data in which the position of the mounted component is determined in the previous positioning operation performed before performing the current positioning operation is read. Here, the position data in the previous positioning operation may be data in a production lot before this time in addition to data in the same production lot of the mounting board 2. To this end, the position data may be stored for one color component image in the determined order, and the latest one may be read. In step SS32, the color reference image is moved to the determined position indicated by the position data based on the read position data. In this case, the position data is indicated by the distance in the X-axis direction and the Y-axis direction from the base point, as in the case of the teaching processing.

In step SS33, it is determined whether or not the moved color reference image matches, ie, overlaps, the color component image at the read determined position. If they match, the process proceeds to step SS34. Proceed to SS35. If the combined image obtained by superimposition is substantially the same as the color reference image, that is, if the colors of the pixels constituting each image are substantially the same, it is determined that they match, and the color is determined within a predetermined range set in advance. If they differ, it is determined that they do not match. That is, the determination of the match is made based on the color determination for each pixel and the number of pixels determined to be different in the color determination. Specifically, the color determination is performed by setting a predetermined range for determining that the color data of each pixel constituting the color reference image, that is, the RGB data, matches each pixel, and setting the predetermined range of the pixel to be determined. If the color is within this predetermined range, it is determined that the colors are substantially the same,
If the number of pixels determined to have different colors in this color determination exceeds a threshold value described later, it is determined that they do not match.

In step SS36, the position where the moved color reference image exists is determined as the component mounting position. On the other hand, if it is determined that the positions do not match, in step SS35, the position data at the time of determining the position one time before is read. That is, in this step, when this routine is executed and it is determined that there is a mismatch, the position data determined so far is traced back each time the mismatch is determined, and the position data which was determined at the time of the immediately preceding execution is determined. This is for reading data. In this routine, for example, if the position determined four times before and the position of the component whose current position is to be determined match, the process proceeds from step SS31 to step S31.
S33 is executed, and thereafter, steps SS35 → SS32 →
SS33 → SS35 are repeated three times, and the mounting position is determined in step SS34. Then, in step SS36, when it is determined that there is a match, that is, the position of the component for which the mounting position has been determined is stored in the storage device 6ae together with the position data of the component so far as the position data of the component. In this way, by storing the newly determined mounting position, the position data is learned, and the subsequent search accuracy can be increased.

As described above, when the position of the electronic component 1 is determined by searching in the positioning area, a search is executed based on the determined position obtained by executing the current search and the position determination processing. Therefore, it is possible to shorten the time required for the determination as compared with the case where the search is performed over the entire positioning area and the position is determined.

In the operation of searching and determining the position of the electronic component, it is determined whether the color reference image matches the color component image. This determination operation may be as described below. That is, in this matching determination method, as shown in FIG. 6, a determination region R2 having a shape that matches the shape of the color component image, that is, a size, is set to be movable within the positioning region R1, and the determination region R2 is divided. In addition to setting a plurality of determination sections B, a reference section C corresponding to the determination section B is set for the color reference image CG, and respective colors of the determination section B and the reference section C are sequentially compared.
When the comparison result is less than a predetermined criterion in a certain determination section B, the color is compared by moving the determination area R2 to the next determination position, and all the determination sections B satisfy the determination criterion. Thus, a match is determined. The determination position may use the positioning position in the above-described positioning process.

The outline of the program for this match determination will be described with reference to FIGS. When executing this program, as described above, in the positioning area R1, the determination area R2 matching the size of the color component image is set.
Is set, and the determination area R2 is divided into a plurality of determination sections B1 to B72, for example, 72 sections (hereinafter, referred to as determination blocks). Correspondingly, a plurality of sections, that is, reference sections (hereinafter, referred to as reference blocks) C1 to C72 are also determined for the color reference image in the determination sections B1 to B7.
2 is set in advance. These decision blocks B1
To B72 and reference blocks C1 to C72 are numbered in accordance with the scanning order. The number of the determination blocks C1C to 72 is not limited to this number, and may be appropriately set.

In this matching judgment processing, a predetermined range for judging that the color data of each pixel constituting the color reference image, that is, the RGB data coincides with each other is set for each pixel, and the judgment target pixel is determined. If the color is within the predetermined range, it is determined that the colors are substantially the same. Conversely, if the color of the pixel to be determined is out of the predetermined range, the color is determined to be different, and the number of pixels determined to be different. Is counted, and it is determined whether the number of pixels exceeds the threshold value described later. The predetermined range is individually set for, for example, R data, G data, and B data, and may be set by setting positive and negative values, that is, an upper limit and a lower limit with respect to a central value.

First, in step SS101, the first
The pixels of the image of the determination block B1 and the image of the first reference block C1 are compared with each other to determine a match (pattern matching). In this match determination, of the pixels forming the first determination block B1, the first reference block C1
Is counted, and the counted number is stored as the first difference of the current first determination block. The calculation of the difference is always performed when the determination block B and the reference block C are compared. Further, when the determination area R2 is moved, the stored first difference and each difference described below are deleted.
In step SS102, the first difference is set as a total difference for determining the quality of the determination block B.

In step SS103, it is determined whether or not the total difference is equal to or smaller than a threshold value for determining whether the determination block B matches the reference block C. That is, when the total difference is larger than the threshold value, pixels having different colors are
Clearly in the first decision block B
Since the color of the first reference block C1 is different from the color of the first reference block C1, it indicates that the component image is not located at the position of the determination area R2. Therefore, the determination area R2 is moved to the search position for the next position determination. . On the other hand, when the total difference is equal to or smaller than the threshold, although there is a slight color difference due to the influence of light at the time of imaging, the color of the electronic component 1 itself, etc., the colors are substantially the same. The next second determination block B2 is compared with the second reference block C2. Then, in step SS105, step SS104
Is added to the total difference at this time to make a new total difference. Next, step SS106
In, it is determined whether or not the total difference is equal to or less than a threshold.

If the total difference is equal to or smaller than the threshold value, then the above-mentioned steps SS104 and S104 are executed.
Processing equivalent to S105 and step SS106, that is, comparison between the n-th determination block Bn and the n-th reference block Cn, addition of the n-th difference obtained by the comparison to the total difference, and determination whether the total difference is equal to or smaller than the threshold value Is similarly executed up to the 72nd determination block B72. On the other hand, when the total difference exceeds the threshold value, the determination area R2 is moved to the next search position as in step SS103.

As is apparent from the above, since the difference counted in each judgment block B is added to the total difference that has been added up to that time, a certain judgment block B
When the difference is counted and the total difference is calculated, if the total difference exceeds the threshold value, the match determination processing at that position ends. Then, this coincidence determination processing is executed at the next positioning position.

Thereafter, in step SS10m and step SS10n, after the determination for the 72nd determination block B72 is completed, if the total difference is equal to or smaller than the threshold, it is determined in step SS111 whether the total difference is a non-defective product. It is determined whether or not it is equal to or less than the determination value for performing. That is, after the determination of all the determination blocks B is performed, it is determined whether or not the color of the entire determination area substantially matches the color of the color reference image. The judgment value is set to a value smaller than the threshold value. For example, when the threshold value is set to 200, the judgment value is set to 30. These values are not limited to the above values, and may be set as appropriate. If it is determined in step SS111 that the total difference is equal to or smaller than the determination value, it is determined that the component is mounted at the position of the determination region R2, and the color component image at that position is determined to be non-defective. On the other hand, if it is determined that the total difference exceeds the determination value, that is, if it is determined that the product is not a non-defective product, in step SS112, in order to reduce the time required for the match determination process, all the determination blocks B up to this point are determined. If the total difference is lower than the threshold value among the total differences determined to be non-defective at the time of the determination, the total difference is set as the threshold value and the threshold value is updated. In order to update the threshold value, the total differences obtained when all the determination blocks B are determined are stored. Then, in order to promptly perform the match determination processing from the next time, if the total difference is lower than a preset threshold in the results so far, the threshold value is set to the total difference value at that time in order to update the threshold value quickly Things. Therefore, by updating the threshold, the criterion for the position search is reduced, and the match can be quickly determined. Thereafter, in step SS113, the determination area R2 is moved to the next search position. This step SS
The processing from 101 to step SS113 is repeatedly executed until it is determined that the product is non-defective.

As described above, the determination block B and the reference block C are compared to determine whether or not the color difference is equal to or smaller than the threshold value. Since the process for determining the position, that is, the match determination process, is performed, it is not necessary to perform a search over the entire determination region R2 for each search, and the processing time required for determining the position can be reduced.

In the coincidence determination of the component images described above, if a good product is not determined even after searching the entire determination region R2, a composite image of the determination region B and the color reference image at the time of the match determination. Remove the obstacles caused by the noise of
The judgment is to be redone.

Specifically, first, in step SS201, it is determined whether or not the threshold has been updated. That is, the threshold value is updated when the entire determination region R2 is searched. Therefore, the determination of the threshold value update is not made in the determination region R2 even in this case. Is specified. If the threshold value has not been updated, the position has not been determined, and the mounting of the electronic component 1 corresponding to the color component image determines that the position is incorrect.

On the other hand, if the threshold value has been updated, in step SS202, at the updated threshold value, that is, at the search position where the total difference becomes minimum when all the determination blocks B are determined, the determination area R2 and the color reference All pixels are compared with the image at once, that is, not in units of determination blocks. In this process, a pixel having a color different from that of the color reference image in the determination region R2 is extracted. Next, in step SS203, labeling is performed on the composite image obtained by the comparison. The labeling is for detecting, in the determination region R2, a portion in which adjacent pixels are continuously different among pixels different from the color of the pixel of the color reference image. That is, in the above-described image matching determination processing, the determination region R2 determined to be not a non-defective product
Are detected by this labeling. By executing this labeling, pixels with different colors due to noise are removed from the pixels with different colors in the non-defective product judgment, and the defective product judgment based on the difference in color based on the difference in imaging conditions and the like is again verified. Is what you do.

Then, in step SS204, an image occupying the largest area of the group of pixels detected by the labeling is acquired. Thereafter, in step SS205, it is determined whether the number of pixels constituting the acquired maximum area image is equal to or smaller than a determination value. That is, if the number of adjacent and consecutive pixels having different colors is equal to or less than the determination value in a state where pixels having different colors due to noise are excluded, the pixels having different colors have increased due to noise or the like. However, if the number of pixels is equal to or smaller than the determination value in this determination, a non-defective product is determined. Therefore, if the determination result indicates that the color component image corresponding to the determination region R2 is equal to or smaller than the determination value, the color component image is determined to be non-defective, and if the color component image exceeds the determination value, it is determined to be defective.

As described above, the judgment block B of the judgment area set corresponding to the color component image is compared with the corresponding reference block C of the color reference image. Since the search is executed by moving the determination area to the search position, the time required for pattern matching can be reduced, and thus the position of the electronic component 1 can be quickly determined.

The present invention is not limited to the embodiment described above.

The imaging apparatus may be configured so that the entire image of the mounting board 2 can be captured by devising an optical system up to the CCD, ie, a lens. Alternatively, the whole image of the mounting substrate 2 may be produced by a color image scanner. By using such an imaging device or a color image scanner, the time required to produce an entire image of the mounting substrate 2 can be reduced.

In the above embodiment, the inspection table 3 is moved with respect to the CCD camera 5 by the XY controller 4.
The CD camera 5 may be controlled and moved by the XY controller 4.

Further, in specifying the part image, drawing data obtained by digitizing the drawing, that is, CAD (computer-aided design) data may be used.
The CAD data is data in a state where the electronic component 1 is mounted on the circuit board, and includes mounting position data and component type (component type) data. The mounting position data may include a distance in the X-axis direction from the base point of the mounting board, a distance in the Y-axis direction, and a mounting angle of the component. Such a CA
If the D data is used, differently from the above-described teaching processing, a whole color image of the mounting board is captured, and a color processing is performed on the whole color image to produce a component image, and the position is determined from the component image. Processing such as extraction can be omitted. In this process, component information corresponding to the color reference image, that is, component type (component type) data is added to the color reference image for each electronic component, and the storage device 6ae is used as master data constituting a database. It is saved in.

The teaching process using the CAD data is achieved by associating the mounting position data of the CAD data with the color reference image. That is, first, component type data in CAD data corresponding to a certain component is read, and a color reference image having component type data that matches the read component type data is searched. That is, the component type data in the CAD data is compared with the component type data of the stored color reference image, and a search is made as to which CAD data the color reference image corresponds to. Then, when the component type data matches, the mounting position data corresponding to the component type data in the CAD data is read, and the position of the color reference image is specified by associating the mounting position data with the color reference image. Thereafter, the specified color reference image is stored together with the mounting position data, and the teaching process is completed.

As described above, since the color reference image is specified based on the CAD data, the accuracy in the teaching processing can be improved. In addition, the teaching process can be automated, and it is not necessary to capture all images of the circuit board on which components are mounted, so that the time required for identification can be further reduced.

In addition, the configuration of each unit is not limited to the illustrated example, and various modifications can be made without departing from the spirit of the present invention.

[0064]

As described above, according to the present invention, the shape and position of the mounted component image are extracted from the color image of the circuit board on which the component is mounted by performing color processing, and the extracted shape and position are extracted. The part image is compared with the color reference image stored in advance to specify the part and the position of the part, and the shape and position of the color image of the specified part are stored. Identification can be automated. Therefore, when inspecting the mounting state of the components mounted on the circuit board, the time required for identifying the components can be reduced, the time required for the inspection can be significantly reduced, and the work of the operator can be greatly increased. Inspection costs can be reduced, and inspection costs can be reduced.

When the position of the component is determined by searching in the positioning area, the search is performed based on the determined position obtained by executing the current search and the position determining operation. It is not necessary to compare the color component image with the color reference image in the entire positioning area for each detection, and the work time required to determine the position of the component corresponding to the color component image can be reduced.

Further, in the positioning area, the respective colors of the judgment section set in the judgment area and the reference section in the color reference image are sequentially compared, and when the comparison result does not satisfy the predetermined judgment criterion. Since the judgment area is moved to the next judgment position and the respective colors of the judgment section and the color reference section are compared again, before the comparison result of all the judgment sections in the judgment area is obtained at the position where the judgment area has moved. Can be moved to the next determination position.
Therefore, the time required for comparing all the determination sections in a certain determination section is not required, and the time required for determining the position can be reduced.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a schematic configuration of a component mounting inspection apparatus according to an embodiment of the present invention.

FIG. 2 is a flowchart showing a schematic procedure of a teaching operation of the same embodiment.

FIG. 3 is a step S in the teaching operation of the same embodiment.
2 is a flowchart showing a detailed procedure of step S3.

FIG. 4 is a flowchart showing a schematic procedure of a position search operation of the embodiment.

FIG. 5 is a step SS2 in the position search operation of the same embodiment.
And a flowchart showing a detailed procedure of step SS3.

FIG. 6 is a configuration explanatory view schematically showing a relationship among a positioning area, a determination area, a determination section, a color reference image, and a reference section in the position matching determination of the embodiment.

FIG. 7 is a flowchart showing a schematic procedure in a match determination operation of the embodiment.

FIG. 8 is a flowchart showing a schematic procedure in a match determination operation of the same embodiment.

FIG. 9 is a flowchart showing a schematic procedure in a match determination operation of the embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Electronic component 2 ... Mounting board (mounted circuit board) 6 ... Electronic processing apparatus 6a ... Device main body 6aa ... Microprocessor 6ae ... Storage device 6af ... Video capture circuit

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Masao Kawasaki, Inventor 232 Kamitoyama, Kurito-cho, Kurita-gun, Shiga Pref. AA03 BA02 CA01 CA08 CA12 CA16 CB01 CB08 CB12 CB16 CC01 CE17 DB02 DB06 DB09 DC02 DC33

Claims (18)

[Claims] 1. A method for inspecting a mounted state of a component on a circuit board based on an image obtained by imaging a circuit board on which the component is mounted. Based on the entire image production stage for producing a color image, an extraction stage for performing color processing of the color image of the entire produced circuit board to extract the shape and position of the part image, and based on the shape and position of the extracted part image Identifying the component corresponding to the color image of the component by comparing the color image of the component at the position corresponding to the extracted position of the color image of the entire circuit board with the color reference image, and the component identifying the component. And storing a shape and a position of the color image. 2. The component image according to claim 1, wherein, in the extracting step, color processing is changed based on component information indicating characteristics of each component set in advance, and the component image is binarized for each component. Circuit board component mounting inspection method. 3. The circuit board according to claim 1, wherein in the whole image forming step, each color image picked up for each predetermined size image pickup area of the circuit board is synthesized. Component mounting inspection method. 4. The method according to claim 1, wherein in the step of producing the whole image, a color image is produced by photographing the entire circuit board. 5. A method for inspecting a component mounting state of a circuit board based on an image obtained by imaging a circuit board on which the component is mounted, the method comprising: An image storing step of storing the color reference image and the component type data; and storing the component type data of the stored color reference image in the drawing data including at least the mounting position data and the component type data of the circuit board on which the component is mounted. A circuit for identifying a position of a color reference image by associating mounting position data with a color reference image by searching data, and a storage step of storing the specified color reference image together with mounting position data Board component mounting inspection method. 6. A component mounting inspection system for a circuit board for inspecting a component mounting state based on an image obtained by imaging a circuit board on which a component is mounted, the system comprising: An image storage means for storing a color reference image; an entire image producing means for producing a color image of the entire circuit board on which the components are mounted; and a color processing of the produced color image of the entire circuit board to obtain the shape of the component image. Extracting means for extracting the position, and comparing the color image of the component at the position corresponding to the extracted position of the color image of the entire circuit board with the color reference image based on the shape and position of the extracted component image. A circuit board unit comprising: a specifying unit that specifies a component corresponding to a color image of the component; and a component information storage unit that stores a shape and a position of the color image of the component that specifies the component. Mounting inspection system. 7. The component image according to claim 6, wherein the extraction means changes color processing based on component information indicating characteristics of each component set in advance and binarizes each component. Circuit board component mounting inspection system. 8. The image forming apparatus according to claim 1, wherein the whole image forming means includes an image pickup device for picking up an image of each predetermined size of the circuit board, and an image synthesizing circuit for synthesizing each image picked up by the image pickup device. The circuit board component mounting inspection system according to claim 6 or 7, wherein 9. The system according to claim 8, wherein the imaging device includes a CCD camera. 10. The apparatus according to claim 6, wherein said all image producing means comprises an image pickup device for picking up an image of the entire circuit board at one time.
Or a circuit board component mounting inspection system according to 7. 11. The system according to claim 10, wherein the imaging device includes a color image scanner. 12. A circuit board component mounting inspection system for inspecting a component mounting state based on an image obtained by imaging a circuit board on which a component is mounted, wherein the component mounting inspection system comprises: An image storage means for storing the color reference image and the component type data; and a component type in the drawing data including at least the mounting position data and the component type data of the circuit board on which the component is mounted, the component type data of the stored color reference image. A circuit for identifying a position of a color reference image by associating mounting position data with a color reference image by searching from data, and a storage step of storing the specified color reference image together with the mounting position data Board component mounting inspection system. 13. A circuit board component mounting inspection method for inspecting a mounted state of a component based on an image obtained by photographing a circuit board on which the component is mounted, comprising: A color component imaging step of capturing a color component image composed of a color image in the vicinity thereof; a positioning area setting step of setting a positioning area having a size including the captured color component image corresponding to the color component image; The color reference image of the component is moved to the determined position in the previous position detection result, and when the color component image matches the color reference image in the positioning area, the position of the color component image is used to determine the component corresponding to the color component image. And a position determining step of determining a position. 14. The position determining step sets a match between the color component image and the color reference image within a positioning region so as to move a determination region having a shape matching the shape of the color component image, and divides the determination region. In addition to setting a plurality of determination sections, a reference section corresponding to the determination section is set for the color reference image, and the comparison result is sequentially determined for each of the determination section and the reference section. 14. The method according to claim 13, wherein when the predetermined criterion is not satisfied, the determination area is moved to the next determination position and the comparison is performed. The method for inspecting a component mounted on a circuit board as described in the above. 15. A circuit board component mounting inspection method for inspecting a component mounting state based on an image obtained by imaging a circuit board on which components are mounted, the component mounting inspection method comprising: A color component image capturing step of capturing a color component image including a color image in the vicinity thereof, a positioning area setting step of setting a positioning area having a size including the captured color component image corresponding to the color component image, and a color component. A determination area having a shape that matches the shape of the image is set in the positioning area so as to be movable, the determination area is divided to set a plurality of determination sections, and a reference section corresponding to the determination section for the color reference image. Is set, and the respective colors of the judgment section and the reference section are sequentially compared. If the comparison result does not satisfy the predetermined judgment criterion in the judgment section, the next step is performed. Moving the determination area to the determination position, performing the comparison, and determining the mounting position of the corresponding component of the color component image when all the determination sections satisfy the determination criterion. Circuit board component mounting inspection method. 16. A circuit board component mounting inspection system for inspecting a component mounting state based on an image obtained by imaging a circuit board on which a component is mounted, wherein the component mounting inspection system includes: Image storage means for storing a color reference image; color component imaging means for capturing a color component image comprising a component on a circuit board on which the component is mounted and a color image in the vicinity thereof; Positioning area setting means for setting a positioning area corresponding to a color part image; a color part image and a color reference within the positioning area by moving a color reference image of the part to a fixed position in a previous position detection result in the positioning area Position determining means for determining the position of the component corresponding to the color component image based on the position of the color component image when the image matches. A component mounting inspection system for a circuit board, comprising: 17. A position determining means for setting a match between a color component image and a color reference image in a positioning region movably in a determination region having a shape matching the shape of the color component image, and dividing the determination region. In addition to setting a plurality of determination sections, a reference section corresponding to the determination section is set for the color reference image, and the comparison result is sequentially determined for each of the determination section and the reference section. 17. The method according to claim 16, wherein when the predetermined criterion is not satisfied, the determination area is moved to the next determination position and the comparison is performed, and the determination is made based on that all the determination sections satisfy the criterion. Circuit board component mounting inspection system as described in the above. 18. A circuit board component mounting inspection system for inspecting a component mounting state based on an image obtained by capturing an image of a circuit board on which a component is mounted, the component mounting inspection system comprising: Image storage means for storing a color reference image; color component imaging means for capturing a color component image comprising a component on a circuit board on which the component is mounted and a color image in the vicinity thereof; Positioning area setting means for setting the positioning area corresponding to the color component image; and a determination area having a shape corresponding to the shape of the color component image is movably set in the positioning area, and the determination area is divided into a plurality of areas. The determination section is set, a reference section corresponding to the determination section is set for the color reference image, and the respective colors of the determination section and the reference section are sequentially compared. If the comparison result in the fixed section does not satisfy the predetermined criterion, the judgment area is moved to the next judgment position and the comparison is performed.If all the judgment sections satisfy the judgment criterion, the color component image A component mounting inspection system for a circuit board, comprising: a position determining means for determining a mounting position of a corresponding component.