JPH0669700A - Visual inspection system for printed board unit - Google Patents

Abstract

PURPOSE:To provide a visual inspection system to achieve the rationalization and efficiency elevation in the inspection of a printed board unit with mounted parts and also, materialize the quality improvement of the printed board unit. CONSTITUTION:A visual inspection system is equipped with an optical device 1 which mainly inspects the appearance of visible areas of a printed board unit where a plurality of parts are mounted, an X-ray device 2 which mainly inspects the appearance of hidden areas of the printed board unit, a diagnostic device 3 which recognizes the section being judged inferior by the optical device 1 and the X-ray device 2 again, and a server 4 which integrally manages the data obtained from the optical device 1, the X-ray device 2, and the diagnostic device 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed board unit visual inspection system for visual inspection of a printed board unit having a plurality of components mounted thereon.

[0002]

2. Description of the Related Art As a conventional printed circuit board inspection apparatus,
For example, a "printed circuit board inspection device" described in JP-A-2-31144 and a "printed circuit board pattern inspection device" described in JP-A-62-169040 can be mentioned. In the former "printed circuit board inspection apparatus" described in Japanese Patent Laid-Open No. 31144/1993, in order to inspect a double-sided printed circuit board unit and a board, an X-ray type and an optical type light source and a camera are inspected. It is configured to be built in the device. With such a configuration, X
The line image and the optical image are taken in from the same field of view, the image feature amounts of each are extracted, they are compared and compared, the image of the front surface or the back surface is recognized, and finally the quality judgment is performed. In this way, the front and back of the mounting surface of the component image shown in the X-ray image are automatically determined, and accurate and highly reliable inspection becomes possible.

The latter "printed circuit board pattern inspection device" disclosed in Japanese Patent Laid-Open No. 62-169040 detects a pattern defect and means for imaging the appearance of the printed circuit board in order to inspect the wiring pattern of the printed circuit board. In a pattern inspection apparatus equipped with an image processing means for controlling and a means for determining whether a defect is true or false, a means for counting false determination, a false detection monitoring means for detecting a certain value or more, and an alarm means for issuing an alarm based on the false detection It is configured to have.
With such a configuration, after the circuit pattern is imaged as a two-dimensional image, image processing is performed and a defect is determined by comparing with the image of the master substrate. If defective, total 3
The inspection is performed once at the detection location, and the defect determination means automatically determines whether the defect is a true defect or a false defect. When the number of false reports exceeds a set value, an alarm is issued. In this way, the increase in false detections due to accidental causes such as mechanical vibrations, noise, and dust can be immediately detected automatically and notified to the operator, so that the inspection device and the printed circuit board can be managed well. At the same time, the reliability of the inspection result is improved.

[0004]

However, when the mounting state or soldering inspection of a printed board unit (SMT unit) which is generally mounted in high density is performed by taking the above-mentioned two conventional techniques as examples, the conventional technique is not used. Although a visual inspection using a magnifying glass and an automatic inspection device are used, it is difficult to automatically inspect all inspection items with only one type of inspection device using the current technology.

That is, in the former printed circuit board inspecting apparatus disclosed in Japanese Patent Laid-Open No. 2-31144, the image of the optical system is used to determine the front / back side, and all inspections are based on the X-ray system. Therefore, there is a problem that it takes a lot of time for inspection, and the number of man-hours is large because the defect determination location is manually checked by looking at the data. Further, in the latter "printed circuit board pattern inspection device" disclosed in Japanese Patent Laid-Open No. 62-169040, when applied to a printed board unit mounting inspection, it is difficult to produce a master unit, so that the master image is There is a problem that it is not uniform and is difficult to apply.

In general, when performing a mounting inspection of a printed circuit board unit, it is difficult to automatically inspect all inspection items with only one type of inspection apparatus, and the reliability of the inspection apparatus is a true failure. In order to make erroneous determination (defect determination) 10 times or more (0.1% or more of all inspection points), it is necessary to visually check the defect determination portion of the inspection device again and perform failure diagnosis.

The test data creation of the inspection device requires many parameters depending on the performance of the light source / camera and requires teaching by an actual machine, and the data creation man-hour is 8 to 10.
Many with time / drawing number. As described above, there are many problems in terms of man-hours and quality. The present invention was devised in view of the above problems, and an inspection device of different optical type and X-ray type, and a defect diagnosis device for confirming / determining a defective portion,
By combining with a server that manages the obtained data collectively, it is possible to rationalize and improve the appearance inspection of the printed board unit and to improve the quality of the printed board unit. The purpose is to provide.

[0008]

FIG. 1 is a block diagram of the principle of the present invention. In FIG. 1, reference numeral 1 is an optical appearance inspection apparatus, and this optical appearance inspection apparatus 1 is mounted with a plurality of parts. The visual inspection is mainly performed in the visible area of the printed board unit. Reference numeral 2 is an X-ray type visual inspection apparatus, and this X-ray type visual inspection apparatus 2 mainly performs visual inspection of the invisible area portion of the printed board unit.

Reference numeral 3 is a defect diagnosing device. The defect diagnosing device 3 includes an optical visual inspection device 1 and an X-ray visual inspection device 2.
This is to reconfirm the part determined to be defective. 4 is a server, and this server 4 is an optical visual inspection apparatus 1,
This is to collectively manage the measurement data obtained by the X-ray type visual inspection device 2 and the defect diagnosis device 3. More specifically,
The server 4 stores the data corrected by the result of the defect diagnosis device 3 confirming the part determined to be defective by the optical appearance inspection device 1 and the X-ray appearance inspection device 2. The X-ray appearance inspection device 2 re-inspects a portion determined to be defective by the optical appearance inspection device 1.

Reference numerals 5-1, 5-2 and 5-3 are data processing devices, and the data processing devices 5-1 5-2 and 5-3.
Are attached to the optical appearance inspection device 1, the X-ray appearance inspection device 2, and the defect diagnosis device 3, respectively, and are connected to the server 4 via a local area network (LAN) 6. Reference numeral 7 is a design data supply device, which supplies design data regarding the inspection printed circuit board unit, and is connected to the local area network 6.

The optical appearance inspection device 1 and the X-ray appearance inspection device 2 are each configured as an automatic inspection device, and the defect diagnosis device 3 is configured as a manual inspection device.

[0012]

In the printed board unit visual inspection system of the present invention described above, in the visual inspection of the printed board unit on which a plurality of components are mounted, the X-ray type visual inspection method 2 is the visual inspection mainly in the invisible area portion of the printed board unit. Do. The optical visual inspection method 1 mainly carries out visual inspection of the visible region of the printed board unit.
Then, the portion determined to be defective by the optical appearance inspection apparatus 1 is re-inspected by the X-ray appearance inspection apparatus 2. The defect diagnosing device 3 reconfirms the part determined to be defective by the optical visual inspection device 1 and the X-ray visual inspection device 2.

The server 4 is an optical visual inspection apparatus 1,
The measurement data obtained by the X-ray appearance inspection device 2 and the defect diagnosis device 3 are collectively managed. More specifically, the server 4 stores data corrected by the result of confirmation by the defect diagnosis device 3 of the portion determined to be defective by the optical appearance inspection device 1 and the X-ray appearance inspection device 2. Further, data processing devices 5-1, 5-2, 5-attached to the optical visual inspection device 1, the X-ray visual inspection device 2, and the defect diagnosis device 3, respectively.
Since the server 3 and the server 4 are connected via the local area network 6, the design data supply device 7 supplies data concerning the inspection printed board unit via the local area network 6.

The optical appearance inspection apparatus 1 and the X-ray appearance inspection apparatus 2 each function as an automatic inspection apparatus,
The defect diagnosis device 3 functions as a manual inspection device.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 2 is a block diagram showing an embodiment of the present invention. The printed board unit visual inspection system shown in FIG. 2 includes an optical visual inspection apparatus 11 and an X-ray visual inspection apparatus 1.
2, defect diagnosis device (stereoscope) 13, server (personal computer) 14, data processing device (personal computer) 15-
1-15-3, D as a local area network
It comprises a SLINK 16, a CAD / CAM machine 17, and a data supply device (personal computer) 18.

Here, the optical inspection device 11 mainly performs the visual inspection of the visible area portion of the printed board unit, and the X-ray inspection device 12 mainly performs the visual inspection of the invisible area portion of the printed board unit. It is something to do. The defect diagnosis device 13 is for reconfirming a portion determined to be defective by the optical inspection device 11 and the X-ray inspection device 12.

A personal computer is used as the server 14, and the server 14 collectively manages the measurement data obtained by the optical inspection device 11, the X-ray inspection device 12, and the defect diagnosis device 13. Is. Data processor 15
A personal computer is also used as -1, 15-2, 15-3, and this data processing device 15-1, 15-2, 1
5-3 are attached to an optical inspection device 11, an X-ray inspection device 12, and a failure diagnosis device 13, respectively. The data processing devices 15-1, 15-2, 15-3 and the server 14 are local. They are interconnected via a DSLLINK 16 configured as an area network (LAN).

A personal computer is also used as the design data conversion device 18, and the design data conversion device 18 creates a test program (data conversion) for the printed board unit to be inspected and supplies it to each inspection device. Thus, the design information from the CAD / CAM machine 17 and the inspection device data are combined to create and manage test data. The design data converter 18 is also connected to the DSLLINK 16.

The optical inspection device 11 and the X-ray inspection device 12 are configured as an automatic inspection device, and
The defect diagnosis device 13 is configured as a manual inspection device. With the configuration described above, in the embodiment of the present invention, the inspection is performed according to the appearance inspection flowchart of the SMT unit as shown in FIG. First, step S1
Then, the Ln surface (n is a natural number of 2 or more) of the SMT unit (where the L1 surface is the back surface of the SMT unit, the Ln surface is S
Parts (which means the surface of the MT unit) are mounted and reflow soldering is performed.

Then, in step S2, automatic inspection is performed by the X-ray type inspection apparatus 12. The X-ray type inspection device 12 mainly inspects the appearance of the invisible region. In detail, QFP and J lead parts are targeted as inspection parts, and there are solder amount, solder bridge, and lead float as inspection items, and the feature is the soldering inspection under the fine lead parts.

Further, in step S3, automatic inspection is performed by the optical inspection device 11. Optical inspection device 11
Is a high-speed inspection of 0.05 Sec / part, and mainly performs mounting and soldering inspection in the visible region. At this time, chips C, R (capacitors, resistance components), minitransistors, and SOPs are targeted as inspection components, and inspection items include presence / absence of components, positional deviation, component floating, polarity, solder amount, and solder bridge.

The order of applying the X-ray inspection apparatus at step S2 and the optical inspection apparatus 11 at step S3 is arbitrary. This is because the measurement data is centrally managed by the personal computer as the server 14 based on the board identification code. For example, when the operation sequence is determined such that the inspection by the X-ray inspection apparatus 12 is performed after the inspection by the optical inspection apparatus 11, the portion determined to be defective by the optical inspection apparatus 11 is also inspected by the X-ray inspection. Since the inspection can be performed by the device 12, it is possible to reduce false alarms of the optical inspection device 11.

Next, in step S4, it is determined whether the inspection results in steps S2 and S3 are good or bad. If the defect is found in step S4, a visual inspection by the defect diagnostic device (stereoscope) 13 is performed in step S5. The defect diagnosing device 13 reconfirms the part determined to be defective by the optical inspection device 11 and the X-ray inspection device 12. Above, steps S2 to S5 are the processing flow of the Ln surface inspection of the printed board unit.

Next, in step S6, the lead component is inserted, the component is mounted on the L1 surface and flow soldering is performed, and then the L1 surface is inspected in steps S7 and S8. That is, in step S7, the optical inspection device 11 performs automatic inspection. The contents of the inspection at this time are the same as in step S3 described above. Also, step S8
Then, visual inspection is performed by the defect diagnosis device (stereoscope) 13. The content of the inspection at this time is step S5.
It is almost the same as the above, but in addition, dirt and cracks on the whole board,
In addition, if the parts are incorrect, the parts are checked for removal, etc., and the areas where automated inspection is difficult are inspected.

Next, the data flow in this embodiment is shown in FIG. 4. In this case, the unit 41 to be inspected is read by a bar code to recognize the drawing number and the manufacturing number. Then, the test program (T
P) is the TP management file 44 of the server (personal computer) 14
-1, 44-2, 44-3 to each inspection device 11, 12,
13 loads and inspects. The inspection result is stored in the inspection result storage files 45-1 and 45-2 of the server 14, respectively.

The defect diagnosis device 13 is an X-ray type inspection device 12.
The inspection result storage file 45-2 and the result file 45-1 of the optical inspection apparatus 11 are read out to check the defective portion, and only the true defect is stored in the diagnostic result storage file 46 of the server 14. The result data is composed of a drawing number, a drawing number, good / bad, defective parts, defective position coordinates, and defective contents. In FIG. 4, 42 is an operation management file and 43 is a progress management file.

Next, the relationship between the data contents and the file is shown in FIG. As shown in FIG. 5, the file names of the X-ray inspection result and the optical inspection result are shown in the test result management table (RDB) 51, and the respective result files are projectors 13-1 to 13-N (N is A natural number). Further, the teaching data file 54 is similarly transferred from the drawing number master (RDB) 52. Further, the diagnosis result by the projectors 13-1 to 13-N is stored in the failure management table (RDB) 53 via the data processing devices 15-3-1 to 15-3-N.

In the present embodiment, the test program and the test result data are stored in the same personal computer as the server 14, but they may be stored in different servers. All data is transmitted and received via the DSLLINK 16, and the system is managed by the operation management file 42 and the progress management file 43. As mentioned above,
According to the present embodiment, the roles are divided between the automatic inspection and the visual inspection, and the efficiency of the inspection is realized by the complementary work of both, so the inspection man-hour can be reduced and the defective portion in the optical inspection device can be reduced. Since it is inspected again by the X-ray inspection apparatus, it is possible to reduce false reports that are erroneous determinations.

Further, since the data of the defect / confirmation point is transmitted and received between the respective inspection devices, the confirmation point can be automatically instructed, and the defect confirmation work can be carried out in a paperless manner. Furthermore, since the respective inspection methods are optimally combined, the quality of mounting and soldering of the printed board unit is improved. Next, the difference from the above-mentioned conventional technique will be briefly described.

First, the conventional technique (Japanese Patent Laid-Open No. 2-31144).
However, in this embodiment, the light source of the optical system and the X-ray system and the camera are built in one inspection device, while the present embodiment is The inspection system is composed of individual devices, defect diagnosis devices, and servers, and the former does not have a failure diagnosis function. Further, the determination method by the former technique is to compare and collate both optical and X-ray images to recognize whether the image is the front surface or the back surface, and finally perform the quality determination. Equipment is shared, and each device inspects at different times to make a pass / fail judgment, and sends the result to the server.

Next, the prior art (Japanese Patent Laid-Open No. 62-1690).
However, this conventional technique prevents the inspection device from making an erroneous determination due to an external factor such as noise because it reinspects the error location and improves the yield. It provides a highly reliable inspection method. On the other hand, in the present embodiment, erroneous determination of the inspection device itself is out of scope, and whether the defect is a true defect or a false defect is manually determined using a defect diagnostic device with respect to the determination results of the X-ray and optical inspection devices. Deciding. In addition, the present embodiment is an inspection system including four devices including an optical inspection device, an X-ray inspection device, a defect diagnosis device, and a server, and is intended to reduce the total inspection man-hours and improve reliability. Is.

[0032]

As described above in detail, according to the printed board unit of the present invention, the optical visual inspection, the X-ray visual inspection, and the defect diagnosis are divided into roles depending on the characteristics of the respective inspections. By complementing each other, the efficiency of the visual inspection is realized, which has the advantage of reducing the inspection man-hours.

Further, by re-inspecting the portion judged to be defective by the optical visual inspection apparatus by the X-ray visual inspection apparatus, false alarms which are erroneous judgments can be reduced and the respective inspections are optimally combined. There is also an advantage that the quality of mounting and soldering of the printed board unit is improved.

[Brief description of drawings]

FIG. 1 is a principle block diagram of the present invention.

FIG. 2 is a block diagram showing an embodiment of the present invention.

FIG. 3 is a flowchart for explaining a visual inspection of an SMT unit.

FIG. 4 is a data flow diagram according to an embodiment of the present invention.

FIG. 5 is a related diagram of files.

[Explanation of symbols]

1, 11 Optical type appearance inspection device 2, 12 X-ray type appearance inspection device 3, 13 Failure diagnosis device 4, 14 Server 5-1-5-3, 15-1-15-3, 15-1-1-1
15-3-N Data processing device 6 Local area network 7,18 Design data supply device 13-1 to 13-N Projector 15-1 to 3,18 Personal computer 16 DSLLINK 17 CAD / CAM machine 41 Inspected unit 42 Operation management File 43 Progress management file 44-1 to 44-3 Test program management file 45-1, 45-2 Inspection result storage file 46 Diagnostic result storage file 51 Test result management table 52 Drawing number master 53 Failure management table 54 Teaching data file

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Shuzo Igarashi 1015 Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Fujitsu Limited

Claims (6)

[Claims] 1. An optical appearance inspection apparatus (1) for mainly performing appearance inspection of a visible area portion of a printed board unit having a plurality of components mounted thereon, and an X for mainly performing appearance inspection of an invisible area portion of the printed board unit. A line type visual inspection device (2), an optical type visual inspection device (1), and a defect diagnosis device (3) for reconfirming a portion determined to be defective by the X-ray type visual inspection device (2) are provided. And a server (4) for collectively managing the measurement data obtained by the optical appearance inspection device (1), the X-ray appearance inspection device (2), and the defect diagnosis device (3). A visual inspection system for printed circuit board units. 2. The result of confirming, in the defect diagnosis device (3), a portion of the server (4) that has been determined to be defective by the optical appearance inspection device (1) and the X-ray appearance inspection device (2). 2. The printed board unit visual inspection system according to claim 1, wherein the data corrected by 1. is stored. 3. The printed board unit according to claim 1, wherein a portion determined to be defective by the optical appearance inspection device (1) is re-inspected by the X-ray appearance inspection device (2). Appearance inspection system. 4. A data processing device (5-1 to 5-3) is attached to each of the optical type visual inspection device (1), the X-ray type visual inspection device (2) and the defect diagnosis device (3). The printed board unit according to claim 1, wherein the data processing devices (5-1 to 5-3) and the server (4) are connected via a local area network (6). Inspection system. 5. A design data supply device (7) for supplying design data regarding the printed board unit to be inspected,
The printed board unit visual inspection system according to claim 4, wherein the visual inspection system is connected to the local area network (6). 6. The optical visual inspection apparatus (1) and the X
The printed board unit visual inspection according to claim 1, wherein the line type visual inspection device (2) is configured as an automatic inspection device, respectively, and the defect diagnosis device (3) is configured as a manual inspection device. system.