CN113909501B - Thickness monitoring device and adjusting method of laser deposition layer and laser deposition equipment - Google Patents
Thickness monitoring device and adjusting method of laser deposition layer and laser deposition equipment Download PDFInfo
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- CN113909501B CN113909501B CN202111115414.5A CN202111115414A CN113909501B CN 113909501 B CN113909501 B CN 113909501B CN 202111115414 A CN202111115414 A CN 202111115414A CN 113909501 B CN113909501 B CN 113909501B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/31—Calibration of process steps or apparatus settings, e.g. before or during manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/37—Process control of powder bed aspects, e.g. density
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/80—Data acquisition or data processing
- B22F10/85—Data acquisition or data processing for controlling or regulating additive manufacturing processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/90—Means for process control, e.g. cameras or sensors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Abstract
The invention discloses a thickness monitoring device and an adjusting method of a laser deposition layer and laser deposition equipment, and relates to the technical field of laser deposition manufacturing. The thickness monitoring device comprises an emission lifting assembly, a receiving lifting assembly, a light emission unit, a light receiving unit and a controller, wherein the light emission unit is arranged on the emission lifting assembly and is used for emitting detection light beams with preset sizes in the thickness direction of a deposition layer; the light receiving unit is arranged on the receiving lifting assembly and is used for receiving the detection light beam and detecting the size of the received detection light beam in the thickness direction of the deposition layer; the transmitting lifting assembly and the receiving lifting assembly are respectively positioned at two opposite sides of a forming platform of the laser deposition equipment; the transmitting lifting assembly and the receiving lifting assembly are respectively used for driving the light transmitting unit and the light receiving unit to lift along the thickness direction of the deposition layer; the emission lifting component, the receiving lifting component, the light emission unit and the light receiving unit are all electrically connected with the controller.
Description
Technical Field
The invention relates to the technical field of laser deposition manufacturing, in particular to a thickness monitoring device and an adjusting method of a laser deposition layer and laser deposition equipment.
Background
In laser deposition fabrication, the laser deposition fabrication is non-contact, i.e., with a gap between the powder feed head and the deposited layer. The formed thickness of each deposited layer will affect the thickness and quality of the overall deposited layer and thus the quality of the deposited manufactured article.
The thickness of the deposited layer is affected by a number of factors, including the amount of powder delivered, the distance between the powder delivery head and the currently deposited layer, and the warp deformation of the deposited layer itself. In actual production, the floating of the powder feeding amount can influence the forming thickness of the current deposition layer; when the distance between the powder feeding head and the current deposition layer is larger, the forming thickness of the current deposition layer is also larger, otherwise, the forming thickness of the current deposition layer is smaller; warping after formation of the deposited layer may result in an increase in the thickness of the deposited layer, thereby affecting the overall deposited layer thickness. Thus, the formed thickness of each deposited layer needs to be monitored and adjusted in time.
In the prior art, the forming thickness of the deposition layer can be adjusted by adjusting the distance between the powder feeding head and the current deposition layer (namely, adjusting the height of the powder feeding head), so as to offset the variation of the thickness of the deposition layer caused by the floating of the powder feeding amount and the warping of the deposition layer, and further obtain the integral deposition layer with qualified thickness. However, in the prior art, the distance between the powder feeding head and the current deposition layer is judged by human eyes, and the error is large.
Disclosure of Invention
The invention aims to provide a thickness monitoring device, an adjusting method and laser deposition equipment for a laser deposition layer, wherein the thickness monitoring device can be used for judging the actual forming thickness of the current deposition layer so as to adjust the forming thickness of the subsequent deposition layer.
The invention provides a thickness monitoring device of a laser deposition layer, which comprises an emission lifting assembly, a receiving lifting assembly, a light emission unit, a light receiving unit and a controller, wherein the light emission unit is arranged on the emission lifting assembly and is used for emitting detection light beams with preset sizes in the thickness direction of the deposition layer; the light receiving unit is arranged on the receiving lifting assembly and is used for receiving the detection light beam and detecting the size of the received detection light beam in the thickness direction of the deposition layer; the transmitting lifting assembly and the receiving lifting assembly are respectively positioned at two opposite sides of a forming platform of the laser deposition equipment; the emission lifting assembly is used for driving the light emission unit to lift along the thickness direction of the deposition layer; the receiving lifting assembly is used for driving the light receiving unit to lift along the thickness direction of the deposition layer; the emission lifting component, the receiving lifting component, the light emission unit and the light receiving unit are all electrically connected with the controller.
Through the technical scheme, the light ray transmitting unit and the light ray receiving unit can synchronously rise along with accumulation of the deposition layers under the action of the controller by utilizing the linear propagation principle of light rays, the deposition layers can shield part of detection light beams, and then the actual forming thickness of the current deposition layer is judged according to the difference value between the actual size of the detection light beams received by the light ray receiving unit in the thickness direction of the deposition layers and the shielded theoretical size (namely, the shielded size obtained under the condition that the current deposition layer is a preset thickness value, namely, the calibration size described below).
Specifically, when the thickness monitoring device is adopted, in the first step, the emission window of the light emission unit and the receiving window of the light receiving unit are aligned, so that the size of the detection light beam received by the light receiving unit in the thickness direction of the deposition layer is equal to a preset size; the second step, the light emitting unit and the light receiving unit are synchronously lowered to a calibration position, in the calibration position, a part of the detection light beam is shielded by the forming platform, the size of the detection light beam received by the light receiving unit in the thickness direction of the deposition layer is a calibration size, and the calibration size is smaller than a preset size; thirdly, starting laser deposition, and after forming a current deposition layer, enabling the light emitting unit and the light receiving unit to synchronously ascend for a preset distance, wherein the preset distance is a preset thickness value of the current deposition layer; or, the third step is to make the light emitting unit and the light receiving unit rise synchronously for a preset distance, and then form a current deposition layer; and fourthly, enabling the light emitting unit to emit the detection light beam, and enabling the light receiving unit to send the real-time size of the received detection light beam to the controller. The controller calculates the difference between the real-time size and the calibration size, and compares the difference with the preset thickness value of the current deposited layer to convert the actual thickness value of the current deposited layer, thereby realizing the thickness monitoring of the laser deposited layer.
In summary, the thickness monitoring device for the laser deposited layer provided by the invention can accurately monitor the thickness variation condition of each deposited layer.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and do not constitute a limitation on the invention. In the drawings:
FIG. 1 is a schematic diagram of a laser deposition apparatus according to an embodiment of the present invention;
fig. 2 is a flowchart of a method for adjusting thickness of a laser deposited layer according to an embodiment of the present invention.
Reference numerals:
1-transmitting lifting assembly, 2-receiving lifting assembly, 3-light transmitting unit, 4-light receiving unit,
5-forming platform, 6-deposit layer, 71-first fixing base, 72-second fixing base, 81-first plug-in block, 82-second plug-in block.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise. The meaning of "a number" is one or more than one unless specifically defined otherwise.
In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "front", "rear", "left", "right", etc., are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In laser deposition fabrication, the formed thickness of each deposited layer 6 is related to the quality of the deposited fabricated article. Each deposited layer 6 has a preset thickness value, which is a theoretical design value. In practice, there are a number of variables directly related to the formed thickness, and therefore, the thickness of the deposited layer 6 may be less than or greater than a predetermined thickness value. The thickness variation of the deposited layer 6 is found in time and adjusted accordingly, which is one of the important conditions for forming a good deposited manufactured article. Accordingly, in a first aspect, the present invention provides a thickness monitoring device for a laser deposition apparatus for accurately monitoring thickness variations of each deposited layer 6.
The invention provides a thickness monitoring device of a laser deposition layer 6, which comprises an emission lifting assembly 1, a receiving lifting assembly 2, a light emission unit 3, a light receiving unit 4 and a controller, wherein the light emission unit 3 is arranged on the emission lifting assembly 1 and is used for emitting detection light beams with preset sizes in the thickness direction of the deposition layer 6; the light receiving unit 4 is mounted on the receiving lifting assembly 2 and is used for receiving the detection light beam and detecting the size of the received detection light beam in the thickness direction of the deposition layer 6; the transmitting lifting assembly 1 and the receiving lifting assembly 2 are respectively positioned on two opposite sides of a forming platform 5 of the laser deposition equipment; the emission lifting assembly 1 is used for driving the light emission unit 3 to lift along the thickness direction of the deposition layer 6; the receiving lifting assembly 2 is used for driving the light receiving unit 4 to lift along the thickness direction of the deposition layer 6; the transmitting lifting assembly 1, the receiving lifting assembly 2, the light transmitting unit 3 and the light receiving unit 4 are all electrically connected with the controller.
Through the above technical solution, the light emitting unit 3 and the light receiving unit 4 can be raised synchronously following accumulation of the deposition layer 6 by using the principle of linear propagation of light under the action of the controller, and the deposition layer 6 can shield part of the detection beam, and then the actual forming thickness of the current deposition layer 6 is judged according to the difference between the actual size of the detection beam received by the light receiving unit 4 in the thickness direction of the deposition layer 6 and the shielded theoretical size (i.e. the shielded size obtained in the case that the current deposition layer 6 is a preset thickness value, i.e. the calibration size described below).
Specifically, when the thickness monitoring device is adopted, in the first step, the emission window of the light emission unit 3 and the receiving window of the light receiving unit 4 are aligned, so that the size of the detection light beam received by the light receiving unit 4 in the thickness direction of the deposition layer 6 is equal to a preset size; the second step, the light emitting unit 3 and the light receiving unit 4 are synchronously lowered to a calibration position, wherein, in the calibration position, a part of the detection light beam is blocked by the forming platform 5, the size of the detection light beam received by the light receiving unit 4 in the thickness direction of the deposition layer 6 is a calibration size, and the calibration size is smaller than a preset size; thirdly, starting laser deposition, and after forming one current deposition layer 6, enabling the light emitting unit 3 and the light receiving unit 4 to synchronously ascend for a preset distance, wherein the preset distance is a preset thickness value of the current deposition layer 6; or, the third step is to make the light emitting unit 3 and the light receiving unit 4 rise synchronously for a preset distance, and then form a current deposition layer 6; fourth, the light emitting unit 3 is caused to emit a detection light beam, and the light receiving unit 4 transmits the real-time size of the received detection light beam to the controller. The controller calculates the difference between the real-time dimension and the calibration dimension, compares the difference with the preset thickness value of the current deposited layer 6, and can convert the actual thickness value of the current deposited layer 6, thereby realizing the thickness monitoring of the laser deposited layer 6.
Wherein the difference between the real-time dimension and the calibration dimension may be negative, positive or zero. When the difference is negative, it indicates that the real-time size is small, and the current deposition layer 6 is larger than the preset thickness value, so that more detection beams are blocked, and adjustment is needed to make the thickness of the next deposition layer 6 smaller than that of the current deposition layer 6. On the contrary, when the difference is positive, it indicates that the real-time dimension is large, and the current deposition layer 6 is smaller than the preset thickness value. When the difference is zero, it is indicated that the thickness of the currently deposited layer 6 is a preset thickness value.
In summary, the thickness monitoring device for the laser deposited layers 6 provided by the invention can accurately monitor the thickness variation condition of each deposited layer 6.
In one possible implementation, the detection beam may be a laser or infrared. The aim that the detection light beam can be accurately received by the light receiving unit 4 can be realized by utilizing the advantages of good collimation and strong penetrability of laser and infrared rays. Accordingly, the light emitting unit 3 may be a laser emitter or an infrared emitter, and the light receiving unit 4 may be a laser receiver or an infrared receiver, respectively.
In one possible embodiment, the emission lift assembly 1 may include a first cylinder and a first piston rod on which the light emission unit 3 is mounted. The light emitting unit 3 is raised or lowered following the first piston rod.
In one possible embodiment, the receiving elevation assembly 2 may include a second cylinder and a second piston rod, on which the light receiving unit 4 is mounted.
Wherein, the controller needs to precisely control the movement stroke of the first piston rod and the movement stroke of the second piston rod each time so as to reduce the error of the obtained real-time dimension, and further, the actual thickness value of the current deposition layer 6 can be accurately obtained.
In one possible embodiment, the launch lifting assembly 1 may be an electric putter and the receive lifting assembly 2 may also be an electric putter. The electric push rod is a linear actuating mechanism, has good linear motion capability, can control motion travel more accurately, is beneficial to reducing the obtained error of real-time size, and can further accurately obtain the actual thickness value of the current deposition layer 6. When the emission lifting component 1 and the receiving lifting component 2 are both electric push rods, the emission lifting component 1 and the receiving lifting component 2 can respectively drive the light emission unit 3 and the light receiving unit 4 to synchronously move along the thickness direction of the deposition layer 6, so that the light receiving unit 4 can accurately receive the detection light beam.
In one possible implementation, the firing lift assembly 1 is removably mounted to the laser deposition apparatus to facilitate installation or removal from the laser deposition apparatus as desired. The firing lift assembly 1 may be mounted on opposite sides of a forming table 5 of the laser deposition apparatus.
In one example, the thickness monitoring device further comprises a first plug block 81 and a first fixing seat 71, the first fixing seat 71 is provided with a first plug groove matched with the first plug block 81, the first plug block 81 is connected to the bottom of the emission lifting assembly 1, and the first fixing seat 71 is installed on the laser deposition device. Wherein, first fixing base 71 can install on forming platform 5, utilizes matched first grafting piece 81 and first jack groove, realizes quick assembly disassembly between first grafting piece 81 and the first fixing base 71 to realize that emission lifting assembly 1 detachably installs on laser deposition equipment.
In one possible implementation, the receiving lift assembly 2 is removably mounted on or removed from the laser deposition apparatus as desired. The receiving lift assembly 2 may be mounted on a forming table 5 of a laser deposition apparatus.
In one example, the thickness monitoring device further includes a second plugging block 82 and a second fixing base 72, the second fixing base 72 has a second plugging slot matched with the second plugging block 82, the second plugging block 82 is connected to the bottom of the receiving lifting assembly 2, and the second fixing base 72 is mounted on the laser deposition modeling apparatus. Wherein, the second fixing base 72 can be installed on the forming platform 5, and the second plug-in block 82 and the second plug-in groove which are matched are utilized to realize the quick disassembly and assembly between the second plug-in block 82 and the second fixing base 72, thereby realizing the detachable installation of the receiving lifting assembly 2 on the laser deposition equipment.
Wherein the forming platform 5 has a forming region, the transmitting lift assembly 1 and the receiving lift assembly 2 may be located on opposite sides of the forming region, respectively, in order to accurately monitor the forming thickness of the deposited layer 6.
In a second aspect, the present invention further provides a laser deposition apparatus, which includes a forming platform 5, a powder feeding head, and the thickness monitoring device for the laser deposition layer 6, where the laser deposition layer 6 is formed on the forming platform 5, and the powder feeding head can be lifted or lowered along the thickness direction of the deposition layer 6, and is electrically connected to the controller.
Based on the beneficial effects of the thickness monitoring device, the laser deposition equipment provided by the invention not only can monitor the actual forming thickness of each deposition layer 6 in real time in the production process, but also can adjust corresponding parameters in time according to the monitored thickness information, such as the powder feeding height of the powder feeding head (namely the distance between the powder feeding head and the current deposition layer 6), so as to be convenient for adjusting the forming thickness of the subsequent deposition layer 6.
In order to adjust the forming thickness of the subsequent deposited layer 6, the present invention also provides a thickness adjusting method of the laser deposited layer 6 based on the above-mentioned laser deposition apparatus, the thickness adjusting method comprising:
step S1: the emission window of the light emitting unit 3 and the receiving window of the light receiving unit 4 are aligned such that the size of the detection beam received by the light receiving unit 4 in the thickness direction of the deposited layer 6 is equal to a preset size. That is, before the laser deposition apparatus is turned on to perform deposition, the light emitting unit 3 and the light receiving unit 4 are aligned so as to perform the calibration in step S2.
Step S2: the light emitting unit 3 and the light receiving unit 4 are lowered synchronously to a calibration position where a part of the detection beam is blocked by the shaping stage 5, and the size of the detection beam received by the light receiving unit 4 in the thickness direction of the deposition layer 6 is a calibration size which is smaller than a preset size. By this step, the relative positions of the light emitting unit 3 and the shaping stage 5, and the relative positions of the light receiving unit 4 and the shaping stage 5 are determined, so that the ascending or descending distance of the light emitting unit 3 and the light receiving unit 4 with respect to the shaping stage 5 can be precisely controlled so that the light emitting unit 3 and the light receiving unit 4 are gradually ascended from the calibration position following the accumulation of the deposition layer 6 in the next step S3.
It should be noted that the minimum and maximum values of the actual thickness values of the deposited layer 6 can be obtained from production experience to set the calibration dimensions and the preset dimensions so as to avoid two extreme cases when the light emitting unit 3 and the light receiving unit 4 follow the simultaneous rise of the deposited layer 6. The first extreme case is that the detection beam is completely blocked by the deposited layer 6 and the light receiving unit 4 does not receive the detection beam. The second extreme is that the deposited layer 6 cannot block part of the detection beam, and the real-time size of the detection beam received by the light receiving unit 4 is equal to the preset size. Thus, in one example, the calibrated dimension may be greater than or equal to one third of the preset dimension and less than or equal to two thirds of the preset dimension. That is, at least one third of the detection beam, and at most two thirds of the detection beam, can be blocked by the shaping platform 5.
Step S3: starting the powder feeding head to perform laser deposition, forming a layer of deposition layer 6 on the forming platform 5 every time the powder feeding head finishes one time of powder feeding, forming the deposition layer 6 as the current deposition layer 6, and stopping the powder feeding head for a preset time before the next powder feeding, wherein the light emitting unit 3 and the light receiving unit 4 can be synchronously lifted by a preset distance within the preset time, wherein the preset distance is a preset thickness value of the current deposition layer 6 (namely, a thickness value of the current deposition layer 6 designed in theory).
Alternatively, the light emitting unit 3 and the light receiving unit 4 may be raised synchronously by a predetermined distance before each feeding of the powder by the powder feeding head. In this way, the light emitting unit 3 and the light receiving unit 4 are both made to follow the current deposition layer 6 upward so as to detect the difference between the actual thickness value currently deposited and the preset thickness value in step S4.
Step S4: the light receiving unit 4 sends the real-time size of the received detection light beam to the controller, and the controller calculates the difference between the real-time size and the calibration size and obtains the actual rising distance of the powder feeding head before the next powder feeding according to the difference. If the actual thickness value of the current deposited layer 6 is smaller than the preset thickness value, the real-time dimension obtained after the light emitting unit 3 and the light receiving unit 4 are both raised according to the preset thickness value is larger than the calibration dimension. Otherwise, if the actual thickness value of the currently deposited layer 6 is greater than the preset thickness value, the obtained real-time dimension is smaller than the calibration dimension. The thickness of the next deposited layer 6 can be affected by the spacing between the powder feed head and the currently deposited layer 6. Therefore, the actual rising distance of the powder feeding head before the next powder feeding can be obtained according to the difference between the real-time size and the calibration size, so that the actual forming thickness of the next deposition layer 6 is as same as the preset thickness value as possible.
Then, before the powder feeding head carries out the next powder feeding, the powder feeding head is lifted according to the actual lifting distance. Thereby achieving adjustment of the forming thickness of the deposited layer 6. For convenience of description, it is set herein that one deposition layer 6 is formed every time the powder feeding head feeds powder.
It should be noted that, before performing the laser deposition, a preset thickness value of each deposition layer 6 may be designed (here, the preset thickness value of each deposition layer 6 may be different), and when the forming thickness of the previous deposition layer 6 is the preset thickness value, the original design is installed to raise the powder feeding head for next powder feeding. When the forming thickness of the current deposition layer 6 is different from the preset thickness value, the preset thickness value of the next deposition layer 6 can be adjusted according to the difference value, so that the final formed product meets the requirement. That is, throughout the deposition process, the thickness of the deposited layer 6 is constantly monitored and adjusted to ensure that the final shaped product meets the requirements.
In addition, the light emitting unit 3 may emit interval light beams throughout the monitoring process, or the light emitting unit 3 emits detection light beams for detecting the actual thickness of the currently deposited layer 6 when the powder feeding head is stopped after one powder feeding. However, the controller may acquire a signal of the feedback real-time size from the light receiving unit 4 only when detecting the actual thickness of the currently deposited layer 6.
In the description of the above embodiments, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A thickness monitoring device of a laser deposition layer is used for laser deposition equipment and is characterized by comprising an emission lifting component, a receiving lifting component, a light emission unit, a light receiving unit and a controller, wherein,
the light emission unit is arranged on the emission lifting assembly and is used for emitting detection light beams with preset sizes in the thickness direction of the deposition layer;
the light receiving unit is arranged on the receiving lifting assembly and is used for receiving the detection light beam, detecting the size of the received detection light beam in the thickness direction of the deposition layer, and when the emission window of the light emitting unit is aligned with the receiving window of the light receiving unit and the detection light beam is not blocked, the size of the detection light beam received by the light receiving unit in the thickness direction of the deposition layer is equal to a preset size;
the transmitting lifting assembly and the receiving lifting assembly are respectively positioned at two opposite sides of the forming platform of the laser deposition equipment;
the emission lifting assembly is used for driving the light emission unit to lift along the thickness direction of the deposition layer;
the receiving lifting assembly is used for driving the light receiving unit to lift along the thickness direction of the deposition layer;
the emission lifting assembly, the receiving lifting assembly, the light emission unit and the light receiving unit are all electrically connected with the controller.
2. The apparatus according to claim 1, wherein the detection beam is laser or infrared.
3. The laser deposition layer thickness monitoring device according to claim 1, wherein the emission elevation assembly includes a first cylinder and a first piston rod, the light emission unit is mounted on the first piston rod, and/or the reception elevation assembly includes a second cylinder and a second piston rod, and the light receiving unit is mounted on the second piston rod.
4. The device of claim 1, wherein the firing lift assembly is an electric putter and/or the receiving lift assembly is an electric putter.
5. The apparatus according to any one of claims 1 to 4, wherein the emission elevating assembly is detachably mounted on the laser deposition apparatus, and/or the receiving elevating assembly is detachably mounted on the laser deposition apparatus.
6. The device for monitoring the thickness of a laser deposited layer according to claim 5, further comprising a first plug and a first fixing seat, wherein the first fixing seat is provided with a first plug groove matched with the first plug, the first plug is connected to the bottom of the emission lifting assembly, and the first fixing seat is installed on the laser deposition equipment;
and/or, the thickness monitoring device further comprises a second plug block and a second fixing seat, the second fixing seat is provided with a second plug groove matched with the second plug block, the second plug block is connected to the bottom of the receiving lifting assembly, and the second fixing seat is installed on the laser deposition forming equipment.
7. A laser deposition apparatus comprising a shaping platform, a powder feeding head and a thickness monitoring device for a laser deposition layer according to any one of claims 1 to 6, wherein the laser deposition layer is formed on the shaping platform, the powder feeding head can be lifted or lowered along the thickness direction of the deposition layer, and the powder feeding head is electrically connected with the controller.
8. A thickness adjustment method of a laser deposition layer, characterized in that it is applied to the laser deposition apparatus according to claim 7, comprising:
step S1: aligning the emitting window of the light emitting unit and the receiving window of the light receiving unit, so that the size of the detection light beam received by the light receiving unit in the thickness direction of the deposition layer is equal to the preset size;
step S2: synchronously descending the light emitting unit and the light receiving unit to a calibration position, wherein in the calibration position, a part of the detection light beam is blocked by the forming platform, the size of the detection light beam received by the light receiving unit in the thickness direction of the deposition layer is a calibration size, and the calibration size is smaller than the preset size;
step S3: starting the powder feeding head to perform laser deposition, stopping preset time after the powder feeding head finishes powder feeding once, and synchronously lifting the light emitting unit and the light receiving unit by a preset distance within the preset time, wherein the preset distance is a preset thickness value of a current deposition layer;
or before the powder feeding head feeds powder each time, the light emitting unit and the light receiving unit are synchronously lifted by the preset distance, and the preset distance is a preset thickness value of a current deposition layer;
step S4: the light receiving unit sends the received real-time size of the detection light beam to the controller, and the controller calculates a difference value between the real-time size and the calibration size and obtains an actual rising distance of the powder feeding head before next powder feeding according to the difference value.
9. The method of claim 8, wherein the calibration dimension is greater than or equal to one third of the preset dimension and less than or equal to two thirds of the preset dimension.
10. The method of claim 8, further comprising raising the powder delivery head by the actual raising distance before the next powder delivery.
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| WO2003042895A1 (en) * | 2001-11-17 | 2003-05-22 | Insstek Inc. | Method and system for real-time monitoring and controlling height of deposit by using image photographing and image processing technology in laser cladding and laser-aided direct metal manufacturing process |
| CN102506732A (en) * | 2011-10-28 | 2012-06-20 | 江苏豪然喷射成形合金有限公司 | Online detection system and detection method for cylindrical ingots in spray forming |
| CN103785952B (en) * | 2012-10-31 | 2016-08-31 | 鸿富锦精密工业（深圳）有限公司 | Mold cavity processing apparatus |
| EP3063497A1 (en) * | 2013-12-02 | 2016-09-07 | Halliburton Energy Services, Inc. | Integrated computational element fabrication methods and systems |
| CN108247059B (en) * | 2018-04-23 | 2020-12-22 | 广东省智能制造研究所 | Layer height control system and method for coaxial powder feeding laser melting forming equipment |
| CN109291432A (en) * | 2018-10-30 | 2019-02-01 | 华侨大学 | A kind of measurement method for increasing material manufacturing powder bed powder layer thickness |
| CN109778182B (en) * | 2019-03-11 | 2020-06-19 | 西安交通大学 | Laser cladding additive forming height online monitoring device and closed-loop control method |
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| DE102019132192A1 (en) * | 2019-11-27 | 2021-05-27 | HPL Technologies GmbH | Device and method for optimizing the layer thickness distribution during laser deposition welding |
| CN112643058A (en) * | 2020-12-01 | 2021-04-13 | 上海航天设备制造总厂有限公司 | Laser deposition forming process monitoring device and double closed-loop control method |
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Application publication date: 20220111 Assignee: Military Standard Quality Testing (Shenyang) Co.,Ltd. Assignor: SHENYANG JINGHE CNC TECHNOLOGY DEVELOPMENT CO.,LTD. Contract record no.: X2023210000076 Denomination of invention: Thickness monitoring device, adjustment method, and laser deposition equipment for laser deposition layers Granted publication date: 20230725 License type: Common License Record date: 20230901 |