CN113909501A - Thickness monitoring device and adjusting method of laser deposition layer and laser deposition equipment - Google Patents
Thickness monitoring device and adjusting method of laser deposition layer and laser deposition equipment Download PDFInfo
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- CN113909501A CN113909501A CN202111115414.5A CN202111115414A CN113909501A CN 113909501 A CN113909501 A CN 113909501A CN 202111115414 A CN202111115414 A CN 202111115414A CN 113909501 A CN113909501 A CN 113909501A
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- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
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- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
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- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
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- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
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- B22F10/31—Calibration of process steps or apparatus settings, e.g. before or during manufacturing
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- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/37—Process control of powder bed aspects, e.g. density
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
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- B22F10/85—Data acquisition or data processing for controlling or regulating additive manufacturing processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/90—Means for process control, e.g. cameras or sensors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The invention discloses a thickness monitoring device and an adjusting method of a laser deposition layer and laser deposition equipment, and relates to the technical field of laser deposition manufacturing. The thickness monitoring device comprises an emission lifting assembly, a receiving lifting assembly, a light ray emission unit, a light ray receiving unit and a controller, wherein the light ray emission unit is arranged on the emission lifting assembly and is used for emitting a detection light beam with a preset size in the thickness direction of a deposition layer; the light receiving unit is arranged on the receiving lifting assembly and used for receiving the detection light beam and detecting the size of the received detection light beam in the thickness direction of the deposition layer; the transmitting lifting assembly and the receiving lifting assembly are respectively positioned on two opposite sides of a forming platform of the laser deposition equipment; the transmitting lifting assembly and the receiving lifting assembly are respectively used for driving the light ray transmitting unit and the light ray receiving unit to lift along the thickness direction of the deposition layer; the transmitting lifting assembly, the receiving lifting assembly, the light transmitting unit and the light receiving unit are electrically connected with the controller.
Description
Technical Field
The invention relates to the technical field of laser deposition manufacturing, in particular to a thickness monitoring device and an adjusting method of a laser deposition layer and laser deposition equipment.
Background
In laser deposition manufacturing, laser deposition manufacturing is non-contact, i.e., there is a gap between the powder feeding head and the deposition layer. The formed thickness of each deposited layer will affect the thickness and quality of the overall deposited layer and thus the quality of the deposited article.
The forming thickness of the deposition layer is influenced by various factors, including the powder feeding amount, the distance between the powder feeding head and the current deposition layer, the warping deformation of the deposition layer, and the like. In actual production, the floating of the powder feeding amount can affect the forming thickness of the current deposition layer; when the distance between the powder feeding head and the current deposition layer is larger, the forming thickness of the current deposition layer is larger, otherwise, the forming thickness of the current deposition layer is smaller; the warping of the deposited layer after forming can cause the thickness of the deposited layer to be increased, thereby affecting the thickness of the overall deposited layer. Therefore, the formed thickness of each deposited layer needs to be monitored and adjusted in time.
In the prior art, the forming thickness of the deposition layer can be adjusted by adjusting the distance between the powder feeding head and the current deposition layer (namely, adjusting the height of the powder feeding head), so that the variation of the thickness of the deposition layer caused by the floating of the powder feeding amount and the warping of the deposition layer is offset, and the integral deposition layer with qualified thickness is obtained. However, in the prior art, the distance between the powder feeding head and the current deposition layer is judged by human eyes, and the error is large.
Disclosure of Invention
The invention aims to provide a thickness monitoring device, an adjusting method and laser deposition equipment of a laser deposition layer.
The invention provides a thickness monitoring device of a laser deposition layer, which comprises an emission lifting assembly, a receiving lifting assembly, a light ray emission unit, a light ray receiving unit and a controller, wherein the light ray emission unit is arranged on the emission lifting assembly and is used for emitting a detection light beam with a preset size in the thickness direction of the deposition layer; the light receiving unit is arranged on the receiving lifting assembly and used for receiving the detection light beam and detecting the size of the received detection light beam in the thickness direction of the deposition layer; the transmitting lifting assembly and the receiving lifting assembly are respectively positioned on two opposite sides of a forming platform of the laser deposition equipment; the emission lifting component is used for driving the light emission unit to lift along the thickness direction of the deposition layer; the receiving lifting assembly is used for driving the light receiving unit to lift along the thickness direction of the deposition layer; the transmitting lifting assembly, the receiving lifting assembly, the light transmitting unit and the light receiving unit are electrically connected with the controller.
Through the technical scheme, can utilize the straight line propagation principle of light, under the effect of controller, make light emission unit and light receiving element follow the accumulation of sedimentary deposit and rise in step, and make the sedimentary deposit can shelter from partial measuring beam, then according to the measuring beam actual size of light receiving element receipt in the sedimentary deposit thickness direction, with the theoretical size after being sheltered from (promptly the size after being sheltered from that obtains under the condition that current sedimentary deposit is preset thickness value, also be the calibration size of following description), judge the actual thickness that takes shape of current sedimentary deposit.
Specifically, when the thickness monitoring device is adopted, in a first step, an emission window of a light emission unit and a receiving window of a light receiving unit are aligned, so that the size of a detection light beam received by the light receiving unit in the thickness direction of a deposition layer is equal to a preset size; the second step, synchronously lowering the light emitting unit and the light receiving unit to a calibration position, wherein at the calibration position, one part of the detection light beam is shielded by the forming platform, the size of the detection light beam received by the light receiving unit in the thickness direction of the deposition layer is a calibration size, and the calibration size is smaller than a preset size; thirdly, starting laser deposition, and synchronously raising the light emitting unit and the light receiving unit by a preset distance after a current deposition layer is formed, wherein the preset distance is a preset thickness value of the current deposition layer; or, the third step is that the light emitting unit and the light receiving unit are synchronously lifted for a preset distance, and then a current deposition layer is formed; and fourthly, enabling the light emitting unit to emit the detection light beam, and enabling the light receiving unit to send the real-time size of the received detection light beam to the controller. The controller calculates the difference between the real-time size and the calibration size, and compares the difference with the preset thickness value of the current deposition layer, so that the actual thickness value of the current deposition layer can be converted, and the thickness monitoring of the laser deposition layer is realized.
In conclusion, the thickness monitoring device for the laser deposition layer provided by the invention can accurately monitor the thickness change condition of each deposition layer.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic diagram of a laser deposition apparatus according to an embodiment of the present invention;
fig. 2 is a flowchart of a method for adjusting the thickness of a laser deposition layer according to an embodiment of the present invention.
Reference numerals:
1-an emission lifting component, 2-a receiving lifting component, 3-a light emitting unit, 4-a light receiving unit,
5-forming platform, 6-deposition layer, 71-first fixing seat, 72-second fixing seat, 81-first plug-in block and 82-second plug-in block.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In laser deposition fabrication, the formed thickness of each deposited layer 6 is related to the quality of the article being fabricated by deposition. Each deposited layer 6 has a preset thickness value, which is a theoretical design value. In actual production, there are a number of variables directly related to the formed thickness, and therefore, the thickness of the deposited layer 6 may be less than or greater than a preset thickness value. The timely detection of the thickness variation of the deposited layer 6 and the corresponding adjustment are one of the important conditions for forming a good deposited manufactured product. Therefore, in a first aspect, the present invention provides a thickness monitoring device for laser deposition layers 6, which is used in a laser deposition apparatus to accurately monitor the thickness variation of each deposition layer 6.
The thickness monitoring device of the laser deposition layer 6 comprises an emission lifting component 1, a receiving lifting component 2, a light emission unit 3, a light receiving unit 4 and a controller, wherein the light emission unit 3 is installed on the emission lifting component 1 and is used for emitting a detection light beam with a preset size in the thickness direction of the deposition layer 6; the light receiving unit 4 is arranged on the receiving lifting assembly 2 and used for receiving the detection light beam and detecting the size of the received detection light beam in the thickness direction of the deposition layer 6; the transmitting lifting component 1 and the receiving lifting component 2 are respectively positioned at two opposite sides of a forming platform 5 of the laser deposition equipment; the emission lifting component 1 is used for driving the light emission unit 3 to lift along the thickness direction of the deposition layer 6; the receiving lifting component 2 is used for driving the light receiving unit 4 to lift along the thickness direction of the deposition layer 6; the transmitting lifting component 1, the receiving lifting component 2, the light transmitting unit 3 and the light receiving unit 4 are all electrically connected with the controller.
Through the technical scheme, can utilize the straight line propagation principle of light, under the effect of controller, make light emission unit 3 and light receiving element 4 follow the accumulation of sedimentary deposit 6 and rise in step, and make sedimentary deposit 6 can shelter from partial measuring beam, then according to the actual size of measuring beam in sedimentary deposit 6 thickness direction that light receiving element 4 received, with the theoretical size after being sheltered (promptly at the current sedimentary deposit 6 obtain under the condition of predetermineeing the thickness value after sheltering from the size, also be the calibration size of following description), judge the actual thickness that takes shape of current sedimentary deposit 6.
Specifically, when the thickness monitoring device is used, in a first step, an emission window of the light emitting unit 3 and a receiving window of the light receiving unit 4 are aligned, so that the size of the detection beam received by the light receiving unit 4 in the thickness direction of the deposition layer 6 is equal to a preset size; step two, synchronously lowering the light emitting unit 3 and the light receiving unit 4 to a calibration position, wherein at the calibration position, a part of the detection light beam is shielded by the forming platform 5, the size of the detection light beam received by the light receiving unit 4 in the thickness direction of the deposition layer 6 is a calibration size, and the calibration size is smaller than a preset size; thirdly, starting laser deposition, and synchronously raising the light emitting unit 3 and the light receiving unit 4 by a preset distance after a current deposition layer 6 is formed, wherein the preset distance is a preset thickness value of the current deposition layer 6; or, the third step is that the light emitting unit 3 and the light receiving unit 4 are synchronously raised by a preset distance, and then a current deposition layer 6 is formed; and fourthly, enabling the light emitting unit 3 to emit the detection light beam, and enabling the light receiving unit 4 to send the real-time size of the received detection light beam to the controller. The controller calculates the difference between the real-time size and the calibration size, and compares the difference with the preset thickness value of the current deposition layer 6 to convert the actual thickness value of the current deposition layer 6, so that the thickness monitoring of the laser deposition layer 6 is realized.
Wherein the difference between the real-time size and the calibration size may be negative, positive or zero. When the difference is negative, it indicates that the real-time size is small, and the current deposition layer 6 is larger than the preset thickness value, so that more detection light beams are shielded, and adjustment is needed to make the thickness of the next deposition layer 6 smaller than that of the current deposition layer 6. On the contrary, when the difference is positive, it indicates that the real-time dimension is large, and the current deposition layer 6 is smaller than the preset thickness value. When the difference is zero, it indicates that the thickness of the currently deposited layer 6 is the preset thickness value.
In conclusion, the thickness monitoring device for the laser deposition layer 6 provided by the invention can accurately monitor the thickness change condition of each deposition layer 6.
In one possible implementation, the detection beam may be a laser or infrared. The advantages of good collimation and strong penetrability of laser and infrared rays can be utilized to realize the purpose that the detection light beam can be accurately received by the light receiving unit 4. Accordingly, the light emitting unit 3 may be a laser emitter or an infrared emitter, and the light receiving unit 4 may be a laser receiver or an infrared receiver.
In a possible embodiment, the launching elevator assembly 1 may comprise a first cylinder and a first piston rod on which the light emitting unit 3 is mounted. The light emitting unit 3 ascends or descends following the first piston rod.
In a possible embodiment, the receiving lift assembly 2 may include a second cylinder and a second piston rod on which the light receiving unit 4 is mounted.
Wherein, the controller is required to accurately control each movement stroke of the first piston rod and each movement stroke of the second piston rod, so as to reduce the error of the obtained real-time dimension, and further accurately obtain the actual thickness value of the current deposition layer 6.
In one possible embodiment, the launching lifting assembly 1 may be an electric push rod, and the receiving lifting assembly 2 may also be an electric push rod. The electric push rod is a linear actuating mechanism, has good linear motion capability, can more accurately control the motion stroke, is beneficial to reducing the error of the obtained real-time size, and can further accurately obtain the actual thickness value of the current deposition layer 6. When transmission lifting subassembly 1 and receipt lifting subassembly 2 were electric putter, transmission lifting subassembly 1 can drive light emission unit 3, light receiving unit 4 along sedimentary deposit 6's thickness direction synchronous motion respectively with receipt lifting subassembly 2 for light receiving unit 4 can accurately receive the measuring beam.
In one possible implementation, the launching elevator assembly 1 is removably mounted on the laser deposition apparatus so as to be mounted or removed from the laser deposition apparatus as required. The launching elevator assembly 1 may be mounted on opposite sides of a forming table 5 of the laser deposition apparatus.
In one example, the thickness monitoring device further comprises a first insertion block 81 and a first fixed seat 71, the first fixed seat 71 is provided with a first insertion groove matched with the first insertion block 81, the first insertion block 81 is connected to the bottom of the launching lifting assembly 1, and the first fixed seat 71 is installed on the laser deposition equipment. Wherein, first fixing base 71 can be installed on forming platform 5, utilizes the first grafting piece 81 of matched with and first inserting groove, realizes quick assembly disassembly between first grafting piece 81 and the first fixing base 71 to it installs on laser deposition equipment to have realized launching lifting unit 1 detachably.
In one possible implementation, the receiving lift assembly 2 is removably mounted on the laser deposition apparatus so as to be mounted on or removed from the laser deposition apparatus as desired. The receiving lift assembly 2 may be mounted on a forming table 5 of the laser deposition apparatus.
In one example, the thickness monitoring device further includes a second insertion block 82 and a second fixed seat 72, the second fixed seat 72 has a second insertion groove matched with the second insertion block 82, the first insertion block 81 is connected to the bottom of the receiving lifting assembly 2, and the second fixed seat 72 is installed on the laser deposition forming equipment. Wherein, second fixing base 72 can install on shaping platform 5, utilizes matched with second grafting piece 82 and second inserting groove, realizes the quick assembly disassembly between second grafting piece 82 and the second fixing base 72 to realized receiving lifting unit 2 detachably and installed on laser deposition equipment.
Wherein, the forming platform 5 has a forming area, and the launching lifting assembly 1 and the receiving lifting assembly 2 can be respectively positioned at two opposite sides of the forming area so as to accurately monitor the forming thickness of the deposition layer 6.
In a second aspect, the invention further provides a laser deposition apparatus, which includes a forming platform 5, a powder feeding head and the above-mentioned thickness monitoring device for the laser deposition layer 6, wherein the laser deposition layer 6 is formed on the forming platform 5, the powder feeding head can ascend or descend along the thickness direction of the deposition layer 6, and the powder feeding head is electrically connected with the controller.
Based on the beneficial effects of the thickness monitoring device, the laser deposition equipment provided by the invention not only can monitor the actual forming thickness of each deposition layer 6 in real time in the production process, but also can adjust corresponding parameters in time according to the monitored thickness information, such as the powder feeding height of the powder feeding head (namely the distance between the powder feeding head and the current deposition layer 6) so as to adjust the forming thickness of the subsequent deposition layer 6.
In a third aspect, in order to adjust the formed thickness of the subsequent deposition layer 6, based on the above laser deposition apparatus, the present invention further provides a thickness adjustment method of the laser deposition layer 6, the thickness adjustment method including:
step S1: the emission window of the light emission unit 3 and the reception window of the light reception unit 4 are aligned so that the size of the detection beam received by the light reception unit 4 in the thickness direction of the deposition layer 6 is equal to a preset size. That is, before the laser deposition apparatus is turned on for deposition, the light emitting unit 3 and the light receiving unit 4 are aligned so as to perform the calibration in step S2.
Step S2: the light emitting unit 3 and the light receiving unit 4 are synchronously lowered to a calibration position, at the calibration position, a part of the detection light beam is shielded by the forming platform 5, the size of the detection light beam received by the light receiving unit 4 in the thickness direction of the deposition layer 6 is a calibration size, and the calibration size is smaller than a preset size. By this step, the relative positions of the light emitting unit 3 and the shaping stage 5 and the relative positions of the light receiving unit 4 and the shaping stage 5 are determined, so that the ascending or descending distance of the light emitting unit 3 and the light receiving unit 4 with respect to the shaping stage 5 can be precisely controlled, so that the light emitting unit 3 and the light receiving unit 4 are gradually ascended from the calibration position following the accumulation of the deposition layer 6 in the next step S3.
It is noted that the calibration and preset dimensions can be set based on the minimum and maximum values of the actual thickness values of the deposited layer 6 obtained from production experience to avoid two extremes when the light emitting unit 3 and the light receiving unit 4 are raised synchronously with the deposited layer 6. The first extreme is that the detection beam is completely blocked by the deposited layer 6 and is not received by the light receiving unit 4. The second extreme case is the case where the deposition layer 6 cannot block part of the detection beam, and the real-time size of the detection beam received by the light receiving unit 4 is equal to the preset size. Thus, in one example, the calibration size may be greater than or equal to one-third of the preset size, and less than or equal to two-thirds of the preset size. That is, at least one third of the detection beam, and at most two thirds of the detection beam, can be blocked by the shaping platform 5.
Step S3: the start send the powder head to carry out laser deposition, send the powder head to accomplish once and send the powder whenever, form and just form one deck sedimentary deposit 6 on the platform 5, can become this sedimentary deposit 6 and be current sedimentary deposit 6, before carrying out next time powder sending, send the powder head pause preset time, in this preset time, can make and make light emission unit 3 and light receiving element 4 rise in step and predetermine the distance, predetermine the distance and be the thickness value (also be the thickness value of the current sedimentary deposit 6 of theoretical design) of predetermineeing of current sedimentary deposit 6.
Alternatively, the light emitting unit 3 and the light receiving unit 4 may be raised synchronously by a predetermined distance before each powder feeding of the powder feeding head. In this way, both the light emitting unit 3 and the light receiving unit 4 are made to ascend following the currently deposited layer 6 so as to detect the difference between the currently deposited actual thickness value and the preset thickness value in step S4.
Step S4: the light receiving unit 4 sends the real-time size of the received detection light beam to the controller, the controller calculates the difference between the real-time size and the calibration size, and the actual ascending distance of the powder feeding head before the next powder feeding is carried out is obtained according to the difference. If the actual thickness value of the current deposition layer 6 is smaller than the preset thickness value, the real-time size obtained after the light emitting unit 3 and the light receiving unit 4 are raised according to the preset thickness value is larger than the calibration size. On the contrary, if the actual thickness value of the current deposition layer 6 is larger than the preset thickness value, the obtained real-time dimension is smaller than the calibration dimension. Since the distance between the powder feeding head and the current deposit 6 can influence the formed thickness of the next deposit 6. Therefore, the actual ascending distance of the powder feeding head before the next powder feeding can be obtained according to the difference value between the real-time size and the calibration size, so that the actual forming thickness of the next deposition layer 6 is as same as the preset thickness value as possible.
Then, before the powder feeding head carries out the next powder feeding, the powder feeding head is lifted according to the actual lifting distance. Thereby achieving an adjustment of the formed thickness of the deposited layer 6. For convenience of description, it is assumed herein that one deposition layer 6 is formed per powder feeding of the powder feeding head.
It should be noted here that, before performing laser deposition, a preset thickness value of each deposition layer 6 may be designed (here, the preset thickness value of each deposition layer 6 may be different), and when the forming thickness of the previous deposition layer 6 is the preset thickness value, the original design is installed to raise the powder feeding head for the next powder feeding. When the formed thickness of the current deposition layer 6 is different from the preset thickness value, the preset thickness value of the next deposition layer 6 can be adjusted according to the difference value, so that the final formed product meets the requirement. That is, the formed thickness of the deposited layer 6 needs to be continuously monitored and adjusted throughout the deposition manufacturing process to ensure that the final formed product meets the requirements.
In addition, the light emitting unit 3 may emit interval beams throughout the monitoring process, or the light emitting unit 3 emits a detection beam for detecting the actual thickness of the currently deposited layer 6 when the powder feeding head completes one powder feeding and stops. However, the controller may acquire a signal from the light receiving unit 4 for feeding back the real-time size only when detecting the actual thickness of the currently deposited layer 6.
In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A thickness monitoring device of a laser deposition layer is used for laser deposition equipment and is characterized by comprising an emission lifting component, a receiving lifting component, a light emission unit, a light receiving unit and a controller, wherein,
the light emitting unit is mounted on the emission lifting assembly and used for emitting a detection light beam with a preset size in the thickness direction of the deposition layer;
the light receiving unit is arranged on the receiving lifting assembly and used for receiving the detection light beam and detecting the size of the received detection light beam in the thickness direction of the deposition layer;
the transmitting lifting assembly and the receiving lifting assembly are respectively positioned on two opposite sides of a forming platform of the laser deposition equipment;
the emission lifting assembly is used for driving the light emission unit to lift along the thickness direction of the deposition layer;
the receiving lifting assembly is used for driving the light receiving unit to lift along the thickness direction of the deposition layer;
the transmitting lifting assembly, the receiving lifting assembly, the light transmitting unit and the light receiving unit are electrically connected with the controller.
2. The apparatus for monitoring the thickness of a laser deposited layer according to claim 1, wherein the detection beam is a laser or an infrared ray.
3. The laser deposition layer thickness monitoring device according to claim 1, wherein the emission lifting assembly comprises a first cylinder and a first piston rod, the light emitting unit is mounted on the first piston rod, and/or the reception lifting assembly comprises a second cylinder and a second piston rod, and the light receiving unit is mounted on the second piston rod.
4. The device for monitoring the thickness of the laser deposition layer according to claim 1, wherein the transmitting lifting component is an electric push rod, and/or the receiving lifting component is an electric push rod.
5. The laser deposition layer thickness monitoring device according to any one of claims 1 to 4, wherein the emission lifting assembly is detachably mounted on the laser deposition apparatus, and/or the receiving lifting assembly is detachably mounted on the laser deposition apparatus.
6. The laser deposition layer thickness monitoring device according to claim 5, further comprising a first insertion block and a first fixing seat, wherein the first fixing seat is provided with a first insertion groove matched with the first insertion block, the first insertion block is connected to the bottom of the emission lifting assembly, and the first fixing seat is installed on the laser deposition device;
and/or, the thickness monitoring device further comprises a second inserting block and a second fixed seat, the second fixed seat is provided with a second inserting groove matched with the second inserting block, the first inserting block is connected to the bottom of the receiving lifting assembly, and the second fixed seat is installed on the laser deposition forming equipment.
7. A laser deposition apparatus comprising a forming platform on which a laser deposition layer is formed, a powder feeding head capable of ascending or descending in a thickness direction of the deposition layer, and the thickness monitoring device of the laser deposition layer of any one of claims 1 to 6, wherein the powder feeding head is electrically connected to the controller.
8. A thickness adjusting method of a laser deposition layer, which is applied to the laser deposition apparatus of claim 7, the thickness adjusting method comprising:
step S1: aligning an emission window of the light emitting unit with a receiving window of the light receiving unit, so that the size of the detection light beam received by the light receiving unit in the thickness direction of the deposition layer is equal to the preset size;
step S2: synchronously descending the light emitting unit and the light receiving unit to a calibration position, wherein at the calibration position, a part of the detection light beam is shielded by the forming platform, the size of the detection light beam received by the light receiving unit in the thickness direction of the deposition layer is a calibration size, and the calibration size is smaller than the preset size;
step S3: starting the powder feeding head to carry out laser deposition, stopping for a preset time every time after the powder feeding head finishes one-time powder feeding, and enabling the light emitting unit and the light receiving unit to synchronously rise for a preset distance within the preset time, wherein the preset distance is a preset thickness value of a current deposition layer;
or before the powder feeding head feeds powder each time, the light ray emitting unit and the light ray receiving unit are synchronously lifted for a preset distance;
step S4: the light receiving unit sends the real-time size of the received detection light beam to the controller, the controller calculates the difference between the real-time size and the calibration size, and the actual ascending distance of the powder feeding head before the next powder feeding is carried out is obtained according to the difference.
9. The method of claim 8, wherein the calibration size is greater than or equal to one-third of the preset size and less than or equal to two-thirds of the preset size.
10. The method of adjusting the thickness of a laser deposited layer according to claim 8, further comprising raising the powder feeding head by the actual rising distance before the powder feeding head performs the next powder feeding.
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