CN113829016B - Intelligent assembling system and method for aging of electronic components - Google Patents

Intelligent assembling system and method for aging of electronic components Download PDF

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Publication number
CN113829016B
CN113829016B CN202110913529.2A CN202110913529A CN113829016B CN 113829016 B CN113829016 B CN 113829016B CN 202110913529 A CN202110913529 A CN 202110913529A CN 113829016 B CN113829016 B CN 113829016B
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Prior art keywords
electronic components
electronic component
suction nozzle
aging
platform
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CN202110913529.2A
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CN113829016A (en
Inventor
苗志坤
杨露佳
崔学龙
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CASIC Defense Technology Research and Test Center
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CASIC Defense Technology Research and Test Center
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
    • B23P19/001—Article feeders for assembling machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34—Sorting according to other particular properties
    • B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
    • B07C5/3422—Sorting according to other particular properties according to optical properties, e.g. colour using video scanning devices, e.g. TV-cameras
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/02—Devices for feeding articles or materials to conveyors
    • B65G47/04—Devices for feeding articles or materials to conveyors for feeding articles
    • B65G47/12—Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles
    • B65G47/14—Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles arranging or orientating the articles by mechanical or pneumatic means during feeding
    • B65G47/1407—Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles arranging or orientating the articles by mechanical or pneumatic means during feeding the articles being fed from a container, e.g. a bowl
    • B65G47/1414—Devices for feeding articles or materials to conveyors for feeding articles from disorderly-arranged article piles or from loose assemblages of articles arranging or orientating the articles by mechanical or pneumatic means during feeding the articles being fed from a container, e.g. a bowl by means of movement of at least the whole wall of the container
    • B65G47/1421—Vibratory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/912—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems with rectilinear movements only

Abstract

The disclosure provides an intelligent assembling system and an assembling method for aging of electronic components. The system comprises: the vibrating disc mechanism for bearing and separating the electronic components comprises a frame disc, a vibrating disc and a vibrating disc mechanism, wherein the frame disc is provided with a disc body and a fixing frame for fixing the disc body; the straight vibration track and the material taking platform are connected with the fixing frame; the first picking device is used for picking the electronic components and comprises a picking suction nozzle; the carrying mechanism is connected with the picking suction nozzle and is used for driving the picking suction nozzle to move; the jig transferring platform for fixing the electronic components comprises a supporting platform and a positioning jig arranged on the supporting platform, wherein the positioning jig is provided with a clamping groove; the transverse moving module is connected with the positioning jig; the visual detection mechanism is used for detecting the appearance of the electronic component; a second pick-up device for assembling electronic components into a burn-in device includes a drive mechanism and a nozzle burn-in device. The intelligent assembly of electronic components can be realized, and the assembly efficiency is good.

Description

Intelligent assembling system and method for aging of electronic components
Technical Field
The disclosure relates to the technical field of electronic component assembly, in particular to an intelligent assembling system and an assembling method for electronic component aging.
Background
Aging is also called aging, and means that a certain electrical stress is continuously applied to the components at a certain environmental temperature for a long time, various physical and chemical reaction processes inside the components are accelerated through the comprehensive action of the electrical stress and the thermal stress, and various potential defects hidden inside the components are promoted to be exposed early, so that the aim of removing early failure products is fulfilled. Therefore, the power aging test is a key link for eliminating the early failure of the electronic components, and has important significance for the detection of the electronic components.
At present, the power aging test assembly process mostly depends on manual operation, the devices need to be manually assembled one by one, the labor intensity is high, the efficiency is low, the reliability is insufficient, the phenomena of false detection, missing detection and false detection are easy to occur, and a larger bottleneck exists in the aspect of efficiency improvement under the condition that the inspection task amount is sharply increased. Aiming at the problems of low automation degree, intelligent analysis and decision insufficiency of the current power aging test assembly, in order to adapt to new forms and task requirements, the intelligent modification of the key process of power aging needs to be started from the aspects of process flow, process layout optimization and the like.
Disclosure of Invention
In view of the above, the present disclosure is directed to an electronic component aging intelligent assembling system and an assembling method.
Based on above-mentioned purpose, this disclosure provides an electronic components smelts intelligent assembly system always, includes:
the vibration disc mechanism comprises a frame disc and a disc body, wherein the frame disc comprises a disc body used for bearing and separating electronic components to be assembled through circular vibration; the fixing frame is used for fixing the disc body; the direct vibration track is connected with the fixing frame and is used for conveying separated electronic components through direct vibration; the straight vibration rail comprises a rail and a supporting seat for fixing the rail; the material taking platform is respectively connected with the direct vibration track and the rack disc; the material taking platform is used for loading the conveyed electronic components;
the first pickup device is connected with the vibration disc mechanism; the picking device comprises a picking suction nozzle for picking or releasing the separated electronic component; the carrying mechanism is connected with the picking suction nozzle and comprises a cam driver and a cam matching structure connected with the cam driver, and the cam matching structure is used for driving the picking suction nozzle to move;
the jig transferring platform is connected with the picking device; the jig transferring platform comprises a supporting platform and a positioning jig arranged on the supporting platform, and the positioning jig is provided with a clamping groove and used for bearing the released electronic components; the transverse moving module is connected with the positioning jig and is used for moving the positioning jig; the transverse moving module comprises a moving part, a power mechanism connected with the moving part and a track arranged on the supporting platform; the moving piece can move along the track under the driving of the power mechanism;
the visual detection mechanism is connected with the jig transfer platform and the aging device; the visual detection mechanism comprises a first industrial camera electrically connected with the upper computer and a bracket for fixing the first industrial camera; the first industrial camera is used for shooting an image of the electronic component, transmitting the image to the upper computer and identifying the appearance of the electronic component in the image;
the aging device is connected with the jig transfer platform; the aging device comprises an aging plate and an aging plate fixing device; the aging plate is arranged on the aging fixing device and used for assembling electronic components;
the second pickup device comprises a driving mechanism and a suction nozzle; the suction nozzle with actuating mechanism connects, and pick up the electronic components in the draw-in groove under actuating mechanism's drive, and remove electronic components to the top of first industry camera is shot and is detected, will detect qualified electronic components assembly extremely in the burn-in board.
The present disclosure also provides an electronic component aging intelligent assembly method, which is assembled by using the electronic component aging intelligent assembly system as described in any one of the previous items, and the method includes:
controlling the fixed frame to vibrate, and separating the electronic components in the disc body into the direct vibration track; controlling the straight vibration track to vibrate, and conveying the electronic components in the track to a material taking platform;
the control cam is matched with the structure to drive the pickup nozzle to pick up the electronic component of the material taking platform;
simultaneously controlling the pickup suction nozzle and the transverse moving module to move so that the clamping groove corresponds to the pickup suction nozzle, and controlling the pickup suction nozzle to release the electronic component to the clamping groove of the positioning jig;
controlling a driving mechanism to drive a suction nozzle to pick up the electronic component in the clamping groove and moving the electronic component to the position above the first industrial camera;
controlling a first industrial camera to shoot the image of the electronic component picked up by the suction nozzle and transmitting the image to an upper computer;
the upper computer identifies the appearance of the electronic components in the image and detects whether the appearance of the electronic components in the image has defects;
in response to the fact that the defect exists, the suction nozzle is controlled to throw the electronic component into the material throwing box through controlling the driving mechanism; or in response to determining that no defect exists, controlling the suction nozzle to assemble the electronic component into the burn-in board by controlling the driving mechanism.
From the above, the intelligent assembling system for aging of electronic components provided by the present disclosure is provided with the vibration disk mechanism, wherein the vibration disk mechanism comprises a rack disk and a disk body, wherein the disk body is used for bearing and separating the electronic components to be assembled through circular vibration; the fixing frame is used for fixing the disc body; the direct vibration track is connected with the fixing frame and is used for conveying separated electronic components through direct vibration; the straight vibration rail comprises a rail and a supporting seat for fixing the rail; the material taking platform is respectively connected with the direct vibration track and the rack disc; the material taking platform is used for loading the conveyed electronic components; a first picking device connected with the vibration disc mechanism is arranged; arranging the picking device to comprise a picking suction nozzle for picking or releasing the separated electronic component; the carrying mechanism is connected with the picking suction nozzle and comprises a cam driver and a cam matching structure connected with the cam driver, and the cam matching structure is used for driving the picking suction nozzle to move; arranging a jig transferring platform connected with the pickup device; the jig transferring platform comprises a supporting platform and a positioning jig arranged on the supporting platform, and the positioning jig is provided with a clamping groove and used for bearing the released electronic components; the transverse moving module is connected with the positioning jig and is used for moving the positioning jig; the transverse moving module comprises a moving part, a power mechanism connected with the moving part and a track arranged on the supporting platform; the moving piece can move along the track under the driving of the power mechanism; arranging a visual detection mechanism connected with the jig transfer platform and the aging device; the visual detection mechanism comprises a first industrial camera electrically connected with the upper computer and a bracket for fixing the first industrial camera; the first industrial camera is used for shooting an image of the electronic component, transmitting the image to the upper computer and identifying the appearance of the electronic component in the image; arranging an aging device connected with the jig transfer platform; the aging device comprises an aging plate and an aging plate fixing device; the aging plate is arranged on the aging fixing device and used for assembling electronic components; providing a second pick-up device comprising a drive mechanism and a suction nozzle; the suction nozzle with actuating mechanism connects, and pick up the electronic components in the draw-in groove under actuating mechanism's drive, and remove electronic components to the top of first industry camera is shot and is detected, will detect qualified electronic components assembly extremely in the burn-in board. The intelligent assembling device can be used for intelligently assembling electronic components, effectively overcomes the bottleneck that the existing test guarantee capability cannot meet the production requirement in the key process of the electronic component reliability test in the aging test of the electronic components, meets the requirements on the production progress and the quality reliability of the electronic components, and has good assembling efficiency.
Drawings
In order to more clearly illustrate the technical solutions in the present disclosure or related technologies, the drawings needed to be used in the description of the embodiments or related technologies are briefly introduced below, and it is obvious that the drawings in the following description are only embodiments of the present disclosure, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an electronic component aging intelligent assembly system according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural diagram of a vibratory pan mechanism according to an embodiment of the disclosure;
fig. 3 is a partial structural schematic view of a first pickup device according to an embodiment of the disclosure;
fig. 4 is a schematic diagram of a complete structure of a first pickup device according to an embodiment of the disclosure;
fig. 5 is a schematic view of an overall structure of a jig transfer platform according to an embodiment of the present disclosure;
fig. 6 is a schematic structural view of a part of a jig transfer platform according to an embodiment of the present disclosure;
FIG. 7 is a schematic structural diagram of a visual inspection mechanism according to an embodiment of the disclosure;
FIG. 8 is a schematic diagram of a configuration of a burn-in apparatus of an embodiment of the present disclosure;
fig. 9 is a schematic structural diagram of a second pickup device according to an embodiment of the disclosure;
fig. 10 is another schematic structural view of a part of the jig transfer platform according to the embodiment of the present disclosure;
FIG. 11 is a schematic view of an outer frame of an embodiment of the present disclosure;
FIG. 12 is a schematic diagram of a configuration of a pod according to an embodiment of the disclosure;
FIG. 13 is a schematic structural view of a waste recovery box according to an embodiment of the disclosure;
fig. 14 is a flowchart of an electronic component burn-in intelligent assembly method according to an embodiment of the present disclosure;
fig. 15 is yet another flow chart of an electronic component burn-in intelligent assembly method of an embodiment of the present disclosure;
FIG. 16 is a schematic diagram of calculating a first focal length and a first field of view for a first industrial camera taking a picture according to an embodiment of the disclosure;
FIG. 17 is a schematic diagram of calculating a second focal length and a second field of view for a second industrial camera taking a picture according to an embodiment of the present disclosure;
wherein, the vibration plate mechanism 100, the plate body 111; a mount body 1121; a fixed platform 1122; the rail 121, the supporting seat 122 and the cover plate 123; a take-off platform 130; a first pickup 200, a pickup nozzle 210, a cam driver 221, a cam engagement structure 222, a third sensor 230; the jig transferring platform 300, the supporting platform 310, the positioning jig 320, the clamping groove 321, the transverse moving module 330, the moving member 331, the power mechanism 332, the sliding rail 333 and the adsorbing member 340; a chute 351; a sliding structure 352; a pod 361; a surplus material recovery box 362; a visual inspection mechanism 400, a first industrial camera 410, a bracket 420, a visual origin index 430; a burn-in apparatus 500, a burn-in board 510, a burn-in board fixing apparatus 520; a second pick-up device 600 comprising a drive mechanism 610, a suction nozzle 620, a second industrial camera 630; the outer frame structure 700, the top plate 710, the side plate 720 and the alarm lamp 730.
Detailed Description
For the purpose of promoting a better understanding of the objects, aspects and advantages of the present disclosure, reference is made to the following detailed description taken in conjunction with the accompanying drawings.
It is to be noted that technical terms or scientific terms used in the embodiments of the present disclosure should have a general meaning as understood by those having ordinary skill in the art to which the present disclosure belongs, unless otherwise defined. The use of "first," "second," and similar terms in the embodiments of the disclosure is not intended to indicate any order, quantity, or importance, but rather to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
As shown in fig. 1, an embodiment of the present disclosure provides an intelligent assembly system for aging electronic components, including:
a vibration tray mechanism 100, see fig. 2, the vibration tray mechanism 100 includes a chassis tray including a tray body 111 for carrying and separating electronic components to be assembled by circular vibration; a fixing bracket for fixing the tray body 111; the direct vibration track is connected with the fixing frame and is used for conveying separated electronic components through direct vibration; the straight vibration rail comprises a rail 121 and a supporting seat 122 for fixing the rail 121; a material taking platform 130 connected with the straight vibration rail 121; the material taking platform 130 is used for loading the conveyed electronic components;
a first pickup device 200 connected to the vibration disk mechanism 100; referring to fig. 3 and 4, the pickup device includes a pickup nozzle 210 for picking up the separated electronic component and releasing it; a carrying mechanism connected to the pickup nozzle 210, the carrying mechanism including a cam driver 221 and a cam engagement structure 222 connected to the cam driver 221, the cam engagement structure 222 being configured to drive the pickup nozzle 210 to move;
a jig transfer platform 300 connected to the pickup device; referring to fig. 5 and 6, the jig transfer platform 300 includes a supporting platform 310 and a positioning jig 320 disposed on the supporting platform 310, where the positioning jig 320 has a slot 321 for carrying the released electronic component; a traverse module 330 connected to the positioning jig 320 for moving the positioning jig 320;
a vision inspection mechanism 400 connected to the jig transfer platform 300 and the aging apparatus 500; referring to fig. 7, the visual inspection mechanism 400 includes a first industrial camera 410 electrically connected to the upper computer; the first industrial camera 410 is used for shooting an image of an electronic component, transmitting the image to an upper computer and identifying the appearance of the electronic component in the image;
the aging device 500 is connected with the jig transfer platform 300; referring to fig. 8, the aging apparatus 500 includes an aging board 510 and an aging board fixing apparatus 520; the aging plate 510 is arranged on the aging fixing device, and the aging plate 510 is used for assembling electronic components;
a second pickup 600 including a driving mechanism 610 and a suction nozzle 620; referring to fig. 9, the suction nozzle 620 is connected to the driving mechanism 610, picks up the electronic component in the card slot 321 under the driving of the driving mechanism 610, moves the electronic component to a position above the first industrial camera 410 for shooting and detection, and assembles the qualified electronic component into the burn-in board 510.
According to the intelligent assembling system for aging of electronic components, the vibration disc mechanism 100 is arranged, the vibration disc mechanism 100 comprises a rack disc and a disc body 111, the rack disc is used for bearing and separating the electronic components to be assembled through circular vibration; a fixing bracket for fixing the tray 111; the direct vibration track is connected with the fixing frame and used for conveying separated electronic components through direct vibration; a first pickup device 200 connected to the vibration plate mechanism 100 is provided; arranging the picking device to comprise a picking suction nozzle 210 for picking up and releasing the separated electronic components; a carrying mechanism connected to the pickup nozzle 210, the carrying mechanism including a cam driver 221 and a cam engagement structure 222 connected to the cam driver 221, the cam engagement structure 222 being configured to drive the pickup nozzle 210 to move; a jig transfer platform 300 connected with the pickup device is arranged; the jig transferring platform 300 comprises a supporting platform 310 and a positioning jig 320 arranged on the supporting platform 310, wherein the positioning jig 320 is provided with a clamping groove 321 for bearing the released electronic components; a traverse module 330 connected to the positioning jig 320 for moving the positioning jig 320; arranging a visual detection mechanism 400 connected with the jig transfer platform 300 and the aging device 500; providing the visual inspection mechanism 400 includes a first industrial camera 410 in electrical connection with the upper computer; the first industrial camera 410 is used for shooting images of electronic components, transmitting the images to an upper computer and identifying the appearances of the electronic components in the images; arranging an aging device 500 connected with the jig transfer platform 300; the aging device 500 comprises an aging plate 510 and an aging plate fixing device 520; the aging plate 510 is arranged on the aging fixing device, and the aging plate 510 is used for assembling electronic components; providing a second pick-up device 600 comprising a drive mechanism 610 and a suction nozzle 620; the suction nozzle 620 is connected with the driving mechanism 610, electronic components in the clamping groove 321 are picked up under the driving of the driving mechanism 610, the electronic components are moved to the position above the first industrial camera 410 to be shot and detected, and qualified electronic components are assembled into the aging board 510. Electronic components to be assembled can be uniformly arranged in the vibration disc mechanism 100, so that the electronic components are regularly arranged on a preset straight vibration track one by one; after vibrating to the material taking position, the materials are picked up by the pickup nozzle 210 of the pickup device and then are placed into the slot 321 of the positioning jig 320 of the jig transfer platform 300 one by one; and the electronic components qualified for detection are assembled in the burn-in board 510 through the detection of the first industrial camera 410 in the visual detection mechanism 400 after being grabbed by the suction nozzle 620 of the second picking device 600, so that the intelligent assembly of the burn-in board 510 is realized. The bottleneck that the existing test guarantee capability is difficult to meet the production requirement in the key process of the reliability test of the electronic component in the aging test of the electronic component is effectively overcome, the production progress requirement and the quality reliability requirement of the electronic component are met, and the assembling efficiency is good.
It should be noted that the electronic component aging intelligent assembly system according to the embodiment of the present disclosure further includes a control system. The control system can comprise an upper computer, an alarm lamp 730, a microswitch and the like. The upper computer can be wirelessly connected with each relevant hardware device in the system, for example, the connection is realized through Ethernet; data interaction can be performed through the lora wireless transmission module. The microswitch is electrically connected with the computer and is used for driving the alarm lamp 730 to be turned on or off.
In some embodiments, the mount in the vibrating disk mechanism 100 includes a mount body 1121 and a mount platform 1122. The fixing platform 1122 is used for fixing and supporting the fixing frame body 1121. The shape of the fixing frame body 1121 is adapted to the shape of the bottom of the tray 111, and may be, for example, a cylinder. It should be understood that the vibrating plate mechanism 100 further includes a first vibrator which is in contact with the fixed frame and the plate body 111, respectively. The frame plate is driven to vibrate in a circular vibration mode through the first vibrator, so that the electronic components in the plate body 111 are separated into single electronic components, and the folding of the electronic components is avoided. And the vibration generator and the upper computer perform data interaction through the lora wireless transmission module.
In some embodiments, the volume of the tray 111 may be determined according to specific requirements, and may be determined according to the size, shape, number of electronic components to be detected, and the like. For example, in the 0805 type electronic component, the volume may be designed so that 2000PCS (pieces) can be accommodated in the tray body 111. The tray body 111 is provided with a discharge port, and a single electronic component is vibrated out of the discharge port through the circular vibration of the rack tray and enters the direct vibration track.
In some embodiments, a first sensor is disposed on the tray 111 for detecting whether the electronic components in the tray 111 are sufficient. First sensor and host computer can be connected through lora wireless transmission module, when detecting that electronic components lacks the material, can drive alarm lamp 730 and open through host computer control micro-gap switch, suggestion disk body 111 lacks the material.
In some embodiments, a direct vibration rail is coupled to the plate 111. The vertical vibration rail includes a rail 121 and a support base 122 for fixing the rail 121. Specifically, the end of the rail 121 may be inserted into the discharge hole of the tray 111, so that the single electronic component enters the rail 121 from the discharge hole. The rail 121 may be provided with a cover plate 123 to enable stable transportation of the electronic components. It should be understood that the straight vibrating rail is provided with a second vibrator, which is in contact with the rail 121 and the support base 122, respectively. The rail 121 is driven by the second vibrator to vibrate in a direct vibration manner, so that the electronic component on the rail 121 is conveyed forward. The second vibrator and the upper computer can carry out data interaction through the lora wireless transmission module.
In some embodiments, the straight vibration track may be a blowing and feeding straight vibration track, and air blowing may be achieved by controlling air of an air compressor through an electromagnetic valve. The structure that specifically realizes blowing is prior art, and this disclosure does not relate to the improvement to the structure of blowing now.
In some embodiments, a second sensor is disposed on the direct vibration rail. The second sensor may be a fiber optic sensor. The second sensor is used for detecting whether electronic components in the direct vibration track are sufficient or not. And the second sensor and the upper computer can perform data interaction through the lora wireless transmission module. And when the electronic components are detected to be full, temporarily stopping the vibration of the rack tray.
In some embodiments, the reclaiming platform 130 includes a platform body that is connected to the vertical vibration rail and the rack tray at both ends of the platform body. The upper end of the material taking platform 130 in the vertical direction is used for bearing and loading electronic components, and the first picking device 200 is used for picking up the electronic components.
In some embodiments, the reclaiming platform 130 is provided with a fifth sensor, which may be a fiber optic sensor. And the fifth sensor is used for detecting whether the electronic component is conveyed into the material taking groove or not. That is, whether the track that directly shakes is carried in place when carrying electronic components can be detected through setting up the fifth sensor. That is, the vibration plate mechanism 100 is provided with a first sensor, a second sensor and a fifth sensor, the first sensor is arranged on the plate body 111, the second sensor is arranged on the straight vibration track, and the fifth sensor is arranged on the material taking groove. Through setting up first sensor, second sensor and fifth sensor, can regulate and control the feeding and the pay-off to electronic components better, improve assembly efficiency.
In some embodiments, the first pickup device 200 is coupled to the take-out platform 130 of the vibratory pan mechanism 100.
The pickup nozzle 210 is provided with a first elastic contractive member to provide a buffering force when the pickup nozzle 210 sucks the electronic component. The first elastic constriction may for example be a spring or the like. The pick-up nozzle 210 may suck the electronic components in the material taking platform 130 in a vacuum suction manner. It should be understood that vacuum pick-up may be achieved by connection to an external vacuum suction pump. The specific pick-up nozzle 210 may be constructed in the prior art and may include, for example, a vacuum chuck, a vacuum piping system connected to the vacuum chuck, etc. The vacuum pipeline system can comprise an air inlet pipe and an air release pipe, and an air release valve is arranged on the air release pipe. The vacuum pump is used for continuously pumping vacuum, so that the adsorption of the electronic components is realized. The vacuum pump is stopped, the air escape valve is opened, the vacuum in the air escape pipe is eliminated, and the electronic component can be released.
In some embodiments, the handling mechanism may be a U-shaped handling mechanism. The cam engagement structure 222 has a U-shaped groove to engage with the cam of the cam driver 221. The cam matching mechanism is driven by a servo motor. It should be noted that the cam driver 221 is a conventional technology, and the specific structure and principle thereof are conventional and will not be described herein.
In some embodiments, a third sensor 230 is disposed on the cam matching structure 222, and the third sensor 230 is used for detecting whether the picking suction nozzle 210 fails to suck the electronic component. The third sensor 230 and the upper computer can perform data interaction through the lora wireless transmission module. When detecting that electronic components absorbs the failure, can drive alarm lamp 730 through host computer control micro-gap switch and open, indicate that electronic components absorbs the failure. And the carrying mechanism can be controlled to stop through an upper computer. By providing the third sensor 230, the stability of the electronic component suction can be improved.
In some embodiments, the jig transfer platform 300 is connected to the pickup device and the vision inspection mechanism 400, respectively. Specifically, the pickup device and the vision inspection mechanism 400 may be connected through the support platform 310, respectively. The traverse module 330 is disposed on the support platform 310. Specifically, the traverse module 330 may include a moving member 331, a power mechanism 332 connected to the moving member 331, and a sliding rail 333 disposed on the supporting platform 310. The power mechanism 332 may be a conventional structure, such as a micro motor. The sliding rail 333 may be disposed parallel to the support platform 310. The moving member 331 may be sleeved on the sliding rail 333 and driven by the power mechanism 332 to move along the sliding rail 333 so as to move the slot 321 of the positioning fixture 320 to a position corresponding to the pick-up nozzle 210 and receive the electronic component released by the pick-up nozzle 210.
In some embodiments, the card slot 321 is provided in a plurality, and the card slots 321 are provided at equal intervals. A plurality of slots 321 may be disposed in the middle of the positioning jig 320. Each card slot 321 is used for carrying one electronic component. Through setting up a plurality of draw-in grooves 321 at the equidistant middle part at positioning jig 320, can realize better moving the year to electronic components to improve subsequent second pickup assembly 600's picking efficiency.
In some embodiments, the positioning fixture 320 is provided with a fourth sensor for detecting whether a foreign object exists in the slot 321 or whether the power mechanism 332 moves the slot 321 to a position corresponding to the elastic suction nozzle 620. The fourth sensor may be an optical fiber sensor, and the optical fiber sensor is provided with an optical head. When detecting that foreign matter exists in the clamping groove 321 or the power mechanism 332 does not move the clamping groove 321 to the position corresponding to the elastic suction nozzle 620, the upper computer can control the micro switch to drive the alarm lamp 730 to be turned on to prompt that the clamping groove 321 is abnormal. By providing the fourth sensor, the accuracy of releasing the electronic component to the card slot 321 and the efficiency of releasing to the card slot 321 can be improved.
Referring to fig. 10, in some embodiments, the jig transferring platform 300 further includes an absorbing and lifting structure connected to the slot 321 of the positioning jig 320. This adsorb jacking structure is connected with outside vacuum generator, just adsorb jacking structure includes jacking piece and absorption 340. The jacking piece is arranged below the positioning jig 320, and the jacking piece is provided with a sliding groove 351 and a sliding structure 352. When the suction nozzle 620 of the second picking device 600 sucks the electronic component in the slot 321, the sliding structure 352 can move upwards along the sliding groove 351 under the power provided by the external jacking cylinder, so that the electronic component is pushed out of the slot 321 of the positioning jig 320, the risk of failure in picking the electronic component from the slot 321 is reduced, and the intelligent assembly efficiency of the electronic component is improved.
In some embodiments, the suction member 340 is disposed at an end of the sliding structure 352 near the slot 321. The suction unit 340 can provide vacuum suction force to the electronic device placed in the slot 321 through the vacuum generator, so as to prevent the electronic device from being mistakenly taken up when the pick-up nozzle 210 returns to the original position after releasing the electronic device. The suction member 340 may be, for example, a suction strip or the like.
In some embodiments, the drive mechanism 610 of the second pick-up device 600 may be an existing drive mechanism 610, such as an existing multi-axis robot, for example, an Eposon LS20 series four-axis robot. The driving mechanism 610 performs data interaction with the upper computer through the lora wireless transmission module. The driving structure is provided with vision calibration system software, a controller and the like.
In some embodiments, the suction nozzle 620 is provided with a second elastic contractive member to provide a buffering force when the suction nozzle 620 sucks the electronic component. The second elastic contraction member may be, for example, a bouncing ball or the like. The second elastic shrinkage structure is arranged, so that indentation or damage to the electronic component can be avoided. The shape of the end of the suction nozzle 620 is matched with the shape of the plurality of card slots 321, so that all the electronic components of the card slots 321 can be grabbed at one time. Specifically, the suction nozzle 620 includes a body and a suction tip. The second elastic constricting element being disposed within the body; the sucking tail end is arranged at the end part of the body in the vertical direction.
In some embodiments, burn-in apparatus 500 further includes a pre-press that encloses a pocket for mounting electronic components in burn-in board 510 and is open on top. When the suction nozzle 620 equipped with the electronic component is moved to a position directly above the burn-in board 510, the driving mechanism 610 descends and drives the suction nozzle 620 to descend, and the electronic component is mounted on a corresponding position of the burn-in board 510. Then the suction nozzle 620 continues to descend vertically, the elastic contraction member contracts, and the prepressing member is pressed to enable the lower surface of the prepressing member to contact with the upper plane of the groove, so that the prepressing work of the burn-in board 510 is completed, and the installation of the electronic component is completed.
In some embodiments, the visual inspection mechanism 400 includes a first industrial camera 410 and a bracket 420 for securing the first industrial camera 410. The first industrial camera 410 can photograph an image of the electronic component located thereabove and picked up by the suction nozzle 620 of the second pickup device 600 under the control of the upper computer, and transmit the photographed image to the upper computer, recognize the appearance of the electronic component in the image, and judge whether the appearance has a defect. Defects may be, for example, burrs, voids, cracks, and the like. Correspondingly, the jig transfer platform 300 further includes a material-throwing box 361 (see fig. 12) and a remainder-material-recovering box 362 (see fig. 13) disposed on the supporting platform 310, and the material-throwing box 361 and the remainder-material-recovering box are respectively used for accommodating electronic components with defective appearances and electronic components with normal appearances.
In some embodiments, the second pickup device 600 further includes a second industrial camera 630 electrically connected with the upper computer; the second industrial camera 630 is used for shooting images of the aging board 510 in the moving process of the driving mechanism 610, transmitting the images to an upper computer, analyzing the relative positions of the suction nozzle 620 and the aging board 510, and guiding the assembly of electronic components. When the suction nozzle 620 moves to a position right above the burn-in board 510, an image of the burn-in board 510 is shot and transmitted to an upper computer, and whether the electronic component is assembled on the burn-in board 510 is identified. The device is also used for shooting images of electronic components assembled in the burn-in board 510, transmitting the images to an upper computer, and identifying the placement positions of the electronic components in the images on the burn-in board 510.
In some embodiments, the visual inspection mechanism 400 further comprises a visual origin marker 430; the visual origin calibration 430 is disposed on the bracket 420 for fixing the first industrial camera 410, and performs visual coordinate origin calibration to correspond the coordinates of the first industrial camera 410 with the coordinates of the second industrial camera 630. The vision origin calibration 430 may be a calibration ceramic plate, which may be detachably mounted on the bracket 420.
In some embodiments, referring to fig. 1 and 11, the electronic component aging intelligent assembly system further includes an outer frame 700, where the outer frame 700 includes a bottom plate, a top plate 710 and side plates 720, the side plates 720 enclose the bottom plate and form an accommodating space, and the vibration disk mechanism 100, the first pickup device 200, the transfer jig platform 300, the aging device 500 and the second pickup device 600 are respectively disposed in the accommodating space; the alarm lamp 730 is provided on the outer frame.
In some embodiments, the cross members connecting the bottom, top and side panels 710, 720 of the outer frame are welded using 50 square tubes. The bottom plate adopts a continuous iron plate welding and reinforcing mode, so that the strength and the rotation parallelism are ensured. The height of the bottom of the outer frame from the ground may be 100mm. The bottom can set up the silence area universal wheel of stopping, fixed stabilizer blade and support the lower margin to the whole electronic components of light removal smelts intelligent assembly system always. Including door panels in the side panels 720, the door panels may be disposed on all four sides to facilitate opening of the outer frame. The door plate is formed by bending an iron plate with the thickness of 2mm, and is firm and durable; and the surface of the door panel is subjected to baking finish treatment, so that the door panel is rust-proof and convenient to maintain. The equipment outer frame can be made by the aluminium alloy, and the surface can be provided with the ya keli dustcoat that opens the door greatly, and convenient troubleshooting, equipment maintenance and observation equipment running condition. A safety door lock special for equipment can be further arranged on the side plate 720 of the outer frame, so that the equipment can be ensured to stop moving immediately under the condition of mistakenly opening the door, and the safety of the equipment and personnel is guaranteed.
The utility model discloses a novel 0805 type electronic components smelts assembly method always, and this method can realize satisfying electronic components and smelts automatic assembly demand always based on manipulator (also be the second pick device 600), compares the mode that the component assembly was carried out to traditional manual one by one, and assembly efficiency and accuracy obtain promoting by a wide margin. Starting from the aspects of process flow, process layout optimization and the like, the overall design scheme of the intelligent assembly of the electronic components based on the manipulator (namely the second picking device 600) is planned by combing the intelligent assembly flow of the electronic components, the motion characteristic and control strategy design of the manipulator and the system software/hardware design are researched, the intelligent assembly device of the electronic components based on the manipulator is built by solidifying various software/hardware modules, and various performance indexes are tested and verified. The manipulator can carry out self-adaptation discernment to the censorship components and parts to possess the intelligent assembly function of smelting to tiny, slice formula electronic components and parts always, manipulator end effector's positioning accuracy can reach 30 mu m, and assembly rate can reach 1500/hour, and detection efficiency promotes more than 200%, can promote the efficiency and the quality that electronic components and parts always smelts the assembly by a wide margin, and then promotes the digitization, the intelligent level of electronic components and parts experimental detection key process, lays the foundation for electronic components and parts cloud detection.
Based on the same inventive concept, the invention also provides an intelligent assembly method for aging of electronic components, which corresponds to any embodiment system.
Referring to fig. 14 and 15, the electronic component aging intelligent assembly method includes:
s810, controlling the fixed frame to vibrate, and separating the electronic components in the disc body 111 into a direct vibration track; controlling the straight vibrating track to vibrate, and conveying the electronic components in the track to the material taking platform 130;
s820, controlling the cam matching structure 222 to drive the pick-up nozzle 210 to pick up the electronic component of the material taking platform 130;
s830, the pick-up nozzle 210 and the traverse module 330 are controlled to move simultaneously, so that the slot 321 corresponds to the position of the pick-up nozzle 210, and the pick-up nozzle 210 is controlled to release the electronic component into the slot 321 of the positioning jig 320;
s840, controlling the driving mechanism 610 to drive the suction nozzle 620 to pick up the electronic component in the card slot 321, and moving the electronic component to the upper side of the first industrial camera 410;
s850, controlling the first industrial camera 410 to shoot the image of the electronic component picked up by the suction nozzle 620 and transmitting the image to the upper computer;
s860, identifying the appearance of the electronic component in the image by the upper computer, and detecting whether the appearance of the electronic component in the image has defects or not;
s870, in response to determining that there is a defect, controlling the suction nozzle 620 to eject the electronic component into the ejector box 361 by controlling the driving mechanism 610; or in response to determining that no defect is present, controlling the suction nozzles 620 by controlling the driving mechanism 610 to mount the electronic components into the burn-in board 510.
In some embodiments, after assembling electronic components into the burn-in board 510, the method further comprises: the second industrial camera 630 is controlled to shoot an image of the electronic component assembled in the burn-in board 510 and transmit the image to the upper computer, and the placement position of the electronic component in the image on the burn-in board 510 is identified.
In some embodiments, the step of the vision calibration system of the second pickup apparatus 600 corresponding the coordinates of the first industrial camera 410 to the coordinates of the second industrial camera 630 may specifically include:
calibrating a first coordinate relationship of the first industrial camera 410 and the driving mechanism 610 of the second pickup unit 600;
calibrating a second coordinate relationship of the second industrial camera 630 and the driving mechanism 610 of the second pickup device 600;
the relationship of the center points of the first industrial camera 410, the second industrial camera 630, and the suction nozzle 620 is calibrated.
In some embodiments, calibrating the first coordinate relationship of the first industrial camera 410 and the driving mechanism 610 of the second pickup apparatus 600 specifically includes:
a first focal length and a first field of view are calculated for the first industrial camera 410 to take a picture. In particular by
Figure GDA0003366731930000141
Figure GDA0003366731930000142
A first focal length is calculated. Wherein, f 1 Is a first focal length; y is 1 ' is the image size; l1 is a first object distance; y1 is the first object size. By passing
Figure GDA0003366731930000143
A first field of view is calculated. Wherein S is 1 A first field of view; y is 1 ' is the image size; f. of 1 Is a first focal length; l1 is a first object distance. The schematic diagram may be as in fig. 16;
the ratio of the pixel coordinates to the actual coordinates is calculated from the picture of the electronic component taken by the first industrial camera 410. Specifically, the ratio of the pixel size in the picture to the actual object size can be calculated.
Based on the radius size and the scale value of the circle in the visual origin identifier 430, the coordinate ratio of the first industrial camera 410 to the drive mechanism 610 is calculated. In an application scene, the difference value between the radius of the inner circle in a shot picture and the radius of the circle found by the camera can be calculated, and when the difference value is smaller than 0.012, the ratio value of the radius of the inner circle in the calibration ceramic chip and the radius of the outer circle can be calculated, so that the coordinate ratio can be obtained. And obtaining a first coordinate relation between the first industrial camera 410 and the robot through nine-point calibration according to the coordinate ratio. In an application scenario, the first coordinate relationship may be specifically as follows: average value of X: 0.0079mm; average value of Y: 0.0373mm; x maximum value: 0.0204mm; maximum value of Y: 0.0682mm; minimum value of X: 0.0000mm; minimum value of Y: 0.0131mm.
In some embodiments, calibrating the second coordinate system of the second industrial camera 630 and the driving mechanism 610 of the second pick-up device 600 comprises:
a second focal length and a second field of view are calculated for the second industrial camera 630 taking a picture. In particular by
Figure GDA0003366731930000144
Figure GDA0003366731930000145
A second focal length is calculated. Wherein f is 2 Is the second focal length;Y 2 ' is the image size; l2 is a second distance; y2 is the second object size. By passing
Figure GDA0003366731930000146
A second field of view is calculated. Wherein S is 2 A second field of view; y is 2 ' is the image size; f. of 2 Is the second focal length; l2 is the second distance. The schematic diagram may be as in fig. 17.
The ratio of the pixel coordinates to the actual coordinates is calculated from the picture of the electronic component taken by the second industrial camera 630. Specifically, the ratio of the pixel size in the picture to the actual object size can be calculated.
The coordinate ratio of the second industrial camera 630 to the drive mechanism 610 is calculated based on the radius size and the scale value of the circle in the visual origin calibration 430. In an application scene, the difference value between the radius of the inner circle in a shot picture and the radius of the circle found by the camera can be calculated, and when the difference value is less than 0.056, the ratio value of the radius of the inner circle in the calibration ceramic chip and the radius of the outer circle can be calculated, so that the coordinate ratio can be obtained. And obtaining a second coordinate relation between the second industrial camera 630 and the robot through nine-point calibration according to the coordinate ratio. In an application scenario, the second coordinate relationship may be specifically as follows: average value of X: 0.0156mm; average value of Y: 0.0157mm; maximum value of X: 0.0396mm; maximum value of Y: 0.0254mm; minimum value of X: 0.0038mm; minimum value of Y: 0.0058mm.
In some embodiments, calibrating the relationship of the center points of the first industrial camera 410, the second industrial camera 630, and the suction nozzle 620 may specifically include:
a first relationship (i.e., pixel value) between the nozzle 620 center point pixel value and the center of the first industrial camera 410 is obtained. In an application scenario, the application scenario may specifically be δ x =957.1083; δ y =1363.9571.
A second relationship (i.e., pixel value) between the center point pixel value of the suction nozzle 620 and the center of the second industrial camera 630 is obtained. In an application scenario, specifically, Δ x = -5.3468; Δ y =100.654.
The value of the relationship scaled from the first and second relationships may be, for example, the X average: -5.0405; average value of Y: 99.2821; x maximum value: -81.1852; maximum value of Y: 0.1103; minimum value of X: 0.0000; y minimum 0.0000.
After the suction nozzle 620 picks up the electronic component with qualified appearance, the first industrial camera 410 is used for shooting an image of the electronic component on the suction nozzle 620, transmitting the image to the upper computer, and analyzing whether the electronic component has assembly abnormality such as being askew or not. The second industrial camera 630 is used for shooting images of the aging board 510 in the moving process of the driving mechanism 610, transmitting the images to an upper computer, analyzing the relative positions of the suction nozzle 620 and the aging board 510, and guiding the assembly of electronic components. And is also used for shooting the image of the burn-in board 510 before the electronic components are assembled to the burn-in board 510, and transmitting the image to the upper computer to identify whether the electronic components are assembled in the burn-in board 510. The device is also used for shooting images of electronic components assembled in the burn-in board 510 and transmitting the images to an upper computer, and identifying whether the placement positions of the electronic components in the images on the burn-in board 510 are accurate or not.
In some embodiments, before the suction nozzle 620 of the second pick-up device 600 sucks the electronic component, the method further comprises calibrating the suction nozzle 620, and setting parameters of the suction nozzle 620; positioning parameters of the burn-in board 510 are set.
The method can be implemented by a corresponding system in any one of the foregoing embodiments, and has the beneficial effects of the corresponding system embodiment, which are not described herein again.
It should be noted that the embodiments of the present disclosure can be further described in the following ways:
in some embodiments, the second pickup device 600 further includes a second industrial camera 630 electrically connected with the upper computer; the second industrial camera 630 is used for shooting images of electronic components assembled in the burn-in board 510 and transmitting the images to an upper computer, and recognizing the placement positions of the electronic components in the images on the burn-in board 510.
In some embodiments, the visual inspection mechanism 400 further comprises a visual origin marker 430; the visual origin calibration 430 is disposed on the bracket 420 for performing visual origin of coordinates calibration to correspond the coordinates of the first industrial camera 410 with the coordinates of the second industrial camera 630.
In some embodiments, the jig transfer platform 300 further includes a polishing box 361 and a remainder recycling box 362 disposed on the supporting platform 310 for respectively holding electronic components with defective appearance and electronic components with normal appearance; the jig transfer platform 300 further comprises an adsorption jacking structure comprising a jacking piece and an adsorption piece 340; the jacking piece is arranged below the positioning jig 320, the jacking piece is provided with a sliding groove 351 and a sliding structure 352, and the sliding structure 352 can move along the sliding groove 351 to push the electronic component out of the clamping groove 321; the suction member 340 is disposed on the sliding structure 352 for sucking the electronic component after the electronic component is released by the pick-up nozzle 210.
In some embodiments, a first sensor, a second sensor and a fifth sensor are disposed on the vibration disc mechanism 100, and respectively perform data interaction with an upper computer through a wireless transmission module; the first sensor is arranged on the tray body 111 and used for detecting whether electronic components in the tray body 111 are sufficient; the second sensor is arranged on the straight vibration track 333121 and used for detecting whether electronic components in the straight vibration track 333121 are sufficient or not; the fifth sensor is arranged on the material taking platform 130 and used for detecting whether the electronic component is conveyed to the material taking platform 130.
In some embodiments, a third sensor 230 is disposed on the cam matching structure 222, and the third sensor 230 is used for detecting whether the picking nozzle 210 fails to suck the electronic component; the pick-up nozzle 210 is provided with a first elastic contraction member to provide a buffering force when the pick-up nozzle 210 sucks the electronic component; the suction nozzle 620 comprises a body and a suction end, and the shape of the suction end is matched with that of the clamping groove 321; a second elastic contraction member is arranged in the body to provide a buffering force when the suction nozzle 620 sucks the electronic component.
In some embodiments, the card slot 321 is provided in a plurality, and the plurality of card slots 321 are arranged at equal intervals; the plurality of engaging grooves 321 are disposed in the middle of the positioning jig 320.
In some embodiments, a fourth sensor is disposed on the positioning fixture 320 for detecting whether a foreign object exists in the card slot 321; the intelligent assembling system for aging electronic components further comprises an outer frame, wherein the outer frame comprises a bottom plate, a top plate 710 and side plates 720, the side plates 720 surround the bottom plate and form an accommodating space, and the vibration disc mechanism 100, the first pickup device 200, the jig transfer platform 300, the aging device 500 and the second pickup device 600 are respectively arranged in the accommodating space; the outer frame is provided with an alarm lamp 730 and a microswitch electrically connected with the upper computer; the microswitch is used for driving the alarm lamp 730 to be turned on or off.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, is limited to these examples; within the idea of the present disclosure, also technical features in the above embodiments or in different embodiments may be combined, steps may be implemented in any order, and there are many other variations of the different aspects of the embodiments of the present disclosure as described above, which are not provided in detail for the sake of brevity.
In addition, well-known power/ground connections to Integrated Circuit (IC) chips and other components may or may not be shown in the provided figures for simplicity of illustration and discussion, and so as not to obscure the embodiments of the disclosure. Furthermore, devices may be shown in block diagram form in order to avoid obscuring embodiments of the present disclosure, and this also takes into account the fact that specifics with respect to implementation of such block diagram devices are highly dependent upon the platform within which the embodiments of the present disclosure are to be implemented (i.e., specifics should be well within purview of one skilled in the art). Where specific details (e.g., circuits) are set forth in order to describe example embodiments of the disclosure, it should be apparent to one skilled in the art that the embodiments of the disclosure can be practiced without, or with variation of, these specific details. Accordingly, the description is to be regarded as illustrative instead of restrictive.
While the present disclosure has been described in conjunction with specific embodiments thereof, many alternatives, modifications, and variations of these embodiments will be apparent to those of ordinary skill in the art in light of the foregoing description. For example, other memory architectures, such as Dynamic RAM (DRAM), may use the discussed embodiments.
The disclosed embodiments are intended to embrace all such alternatives, modifications and variances which fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalents, improvements, and the like that may be made within the spirit and principles of the embodiments of the disclosure are intended to be included within the scope of the disclosure.

Claims (10)

1. The utility model provides an electronic components smelts intelligent assembly system always which characterized in that includes:
the vibration disc mechanism comprises a rack disc, wherein the rack disc comprises a disc body and a fixing frame, the disc body is used for bearing and separating electronic components to be assembled through circular vibration, and the fixing frame is used for fixing the disc body; the vibration disc mechanism also comprises a direct vibration track connected with the fixed frame, and the direct vibration track is used for conveying separated electronic components through direct vibration; the straight vibration rail comprises a rail and a supporting seat for fixing the rail; the vibration disc mechanism also comprises a material taking platform which is respectively connected with the direct vibration track and the rack disc; the material taking platform is used for loading the conveyed electronic components;
the first pickup device is connected with the vibration disc mechanism; the picking device comprises a picking suction nozzle for picking or releasing the separated electronic component; the carrying mechanism is connected with the picking suction nozzle and comprises a cam driver and a cam matching structure connected with the cam driver, and the cam matching structure is used for driving the picking suction nozzle to move;
the jig transferring platform is connected with the pickup device; the jig transferring platform comprises a supporting platform and a positioning jig arranged on the supporting platform, and the positioning jig is provided with a clamping groove and used for bearing the released electronic components; the transverse moving module is connected with the positioning jig and is used for moving the positioning jig; the transverse moving module comprises a moving part, a power mechanism connected with the moving part and a track arranged on the supporting platform; the moving piece can move along the track under the driving of the power mechanism;
the visual detection mechanism is connected with the jig transfer platform and the aging device; the visual detection mechanism comprises a first industrial camera electrically connected with the upper computer and a bracket for fixing the first industrial camera; the first industrial camera is used for shooting an image of the electronic component, transmitting the image to the upper computer and identifying the appearance of the electronic component in the image;
the aging device is connected with the jig transfer platform; the aging device comprises an aging plate and an aging plate fixing device; the aging plate is arranged on the aging fixing device and used for assembling electronic components;
a second pickup device including a drive mechanism and a suction nozzle; the suction nozzle with actuating mechanism connects, and pick up the electronic components in the draw-in groove under actuating mechanism's drive, and remove electronic components extremely shoot the detection in the top of first industry camera, will detect qualified electronic components assembly extremely in the ageing board.
2. The electronic component aging intelligent assembly system as claimed in claim 1, wherein the second pick-up device further comprises a second industrial camera electrically connected to the upper computer; the second industrial camera is used for shooting images of electronic components assembled in the burn-in board, transmitting the images to the upper computer and identifying the placement positions of the electronic components in the images on the burn-in board.
3. The intelligent electronic component aging assembly system as recited in claim 2, wherein the visual inspection mechanism further comprises a visual origin index; the visual origin point calibration piece is arranged on the support and used for performing visual coordinate origin point calibration so as to enable the coordinates of the first industrial camera to correspond to the coordinates of the second industrial camera.
4. The intelligent assembly system for aging of electronic components as claimed in claim 1, wherein the jig transfer platform further comprises a polishing box and a remainder recovery box disposed on the support platform for respectively accommodating electronic components with defective appearance and electronic components with normal appearance; the jig transferring platform also comprises an adsorption jacking structure which comprises a jacking piece and an adsorption piece; the jacking piece is arranged below the positioning jig and is provided with a sliding groove and a sliding structure, and the sliding structure can move along the sliding groove to push the electronic component out of the clamping groove; the absorption piece is arranged on the sliding structure and used for absorbing the electronic components after the electronic components are released by the pickup suction nozzle.
5. The intelligent assembling system for electronic components and parts ageing as claimed in claim 3, wherein the vibrating disk mechanism is provided with a first sensor, a second sensor and a fifth sensor, and the first sensor, the second sensor and the fifth sensor are respectively in data interaction with an upper computer through a wireless transmission module; the first sensor is arranged on the tray body and used for detecting whether electronic components in the tray body are sufficient or not; the second sensor is arranged on the direct vibration track and used for detecting whether electronic components in the direct vibration track are sufficient or not; the fifth sensor is arranged on the material taking platform and used for detecting whether the electronic component is conveyed to the material taking platform or not.
6. The electronic component aging intelligent assembling system as claimed in claim 1, wherein a third sensor is provided on the cam fitting structure, the third sensor being configured to detect whether the pickup nozzle fails to suck the electronic component; the picking suction nozzle is provided with a first elastic contraction piece so as to provide buffer force when the picking suction nozzle sucks the electronic component; the suction nozzle comprises a body and a suction tail end, and the shape of the suction tail end is matched with that of the clamping groove; a second elastic contraction part is arranged in the body, so that a buffering force is provided when the suction nozzle sucks the electronic component.
7. The intelligent assembly system for aging of electronic components as claimed in claim 1, wherein the card slot is provided in plurality, and the plurality of card slots are provided at equal intervals; a plurality of draw-in grooves set up the middle part at positioning jig.
8. The intelligent assembly system for aging of electronic components as claimed in claim 1, wherein a fourth sensor is disposed on the positioning fixture for detecting whether foreign matter exists in the card slot; the intelligent electronic component aging assembly system further comprises an outer frame, wherein the outer frame comprises a bottom plate, a top plate and side plates, the side plates surround the bottom plate and form an accommodating space, and the vibration disc mechanism, the first pickup device, the jig transfer platform, the aging device and the second pickup device are respectively arranged in the accommodating space; the outer frame is provided with an alarm lamp and a microswitch electrically connected with the upper computer; the microswitch is used for driving the alarm lamp to be turned on or off.
9. An electronic component aging intelligent assembling method, characterized in that the electronic component aging intelligent assembling system according to any one of claims 1 to 8 is applied for assembling, the method comprising:
controlling the fixed frame to vibrate, and separating the electronic components in the disc body into the direct vibration track; controlling the straight vibration track to vibrate, and conveying the electronic components in the track to a material taking platform;
the control cam is matched with a structure to drive the picking suction nozzle to pick up the electronic component of the material taking platform;
simultaneously controlling the pickup suction nozzle and the transverse moving module to move so that the clamping groove corresponds to the pickup suction nozzle, and controlling the pickup suction nozzle to release the electronic component to the clamping groove of the positioning jig;
controlling a driving mechanism to drive a suction nozzle to pick up the electronic component in the clamping groove and moving the electronic component to the position above the first industrial camera;
controlling a first industrial camera to shoot the image of the electronic component picked up by the suction nozzle and transmitting the image to an upper computer;
the upper computer identifies the appearance of the electronic components in the image and detects whether the appearance of the electronic components in the image has defects;
in response to the fact that the defect exists, the suction nozzle is controlled to throw the electronic component into the material throwing box through controlling the driving mechanism; or in response to determining that no defect exists, controlling the suction nozzle to assemble the electronic component into the burn-in board by controlling the driving mechanism.
10. The method of assembling as recited in claim 9, wherein after assembling electronic components into the burn-in board, the method further comprises: and controlling a second industrial camera to shoot images of the electronic components assembled in the burn-in board, transmitting the images to an upper computer, and identifying the placing positions of the electronic components in the images on the burn-in board.
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