CN113810519A - Shell of electronic equipment and processing method thereof - Google Patents
Shell of electronic equipment and processing method thereof Download PDFInfo
- Publication number
- CN113810519A CN113810519A CN202010543020.9A CN202010543020A CN113810519A CN 113810519 A CN113810519 A CN 113810519A CN 202010543020 A CN202010543020 A CN 202010543020A CN 113810519 A CN113810519 A CN 113810519A
- Authority
- CN
- China
- Prior art keywords
- shell
- glue layer
- electronic device
- processing method
- convex surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003672 processing method Methods 0.000 title claims abstract description 15
- 239000003292 glue Substances 0.000 claims abstract description 27
- 238000007650 screen-printing Methods 0.000 claims abstract description 15
- 238000005488 sandblasting Methods 0.000 claims abstract description 13
- 239000010410 layer Substances 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 19
- 239000012790 adhesive layer Substances 0.000 claims description 13
- 238000012545 processing Methods 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000011165 3D composite Substances 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 238000005422 blasting Methods 0.000 claims description 3
- 230000007062 hydrolysis Effects 0.000 claims description 3
- 238000006460 hydrolysis reaction Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 239000004576 sand Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 description 9
- 239000002131 composite material Substances 0.000 description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
- 239000004926 polymethyl methacrylate Substances 0.000 description 4
- 230000003666 anti-fingerprint Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000012788 optical film Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- ZHPNWZCWUUJAJC-UHFFFAOYSA-N fluorosilicon Chemical compound [Si]F ZHPNWZCWUUJAJC-UHFFFAOYSA-N 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0279—Improving the user comfort or ergonomics
- H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/08—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for polishing surfaces, e.g. smoothing a surface by making use of liquid-borne abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/40—Printing on bodies of particular shapes, e.g. golf balls, candles, wine corks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/0243—Mechanical details of casings for decorative purposes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Mechanical Engineering (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The application provides a shell of electronic equipment and a processing method thereof. The processing method comprises the following steps: providing a curved surface shell body, wherein the convex surface of the curved surface shell body is a smooth surface; forming a glue layer on the convex surface through silk screen printing, wherein the glue layer only covers the local convex surface; carrying out sand blasting treatment on the convex surface which is not protected by the glue layer to obtain a local matte area; and removing the glue layer to obtain the shell of the electronic device. The processing method provided by the application can more accurately manufacture the splicing of the smooth surface and the dummy surface in a screen printing glue layer mode, is more suitable for manufacturing the dummy surface area with complex patterns on the curved surface shell, and can enable the glue layer to be more easily removed after sand blasting and have no residue, so that the manufactured shell has higher yield.
Description
Technical Field
The application relates to the technical field of shell processing of electronic equipment, in particular to a shell of electronic equipment and a processing method thereof.
Background
With the development of the times, people have pursued the internal performance of the mobile terminal and have pursued the external texture and beauty. Among them, the cover plate of the three-dimensional (3D) composite board is generally applied to middle and low-end mobile terminals due to its low cost and good visual effect.
At present, the convex surface of the 3D composite board has two different appearance effects of a smooth surface and a matte surface, but at the present stage, a processing technology which has the splicing effect of the smooth surface and the matte surface on the surface of a 3D shell does not exist.
Disclosure of Invention
An object of the embodiment of the present application is to provide a processing method for protecting an adhesive layer and shielding sandblasting through silk-screen printing, which can obtain a housing of an electronic device that is the same as a dumb housing, and the silk-screen printing mode selected by the processing method can more accurately form a non-planar adhesive layer on a 3D housing body, and the removing step after sandblasting is gentler, faster and residue-free, so that the surface of the processed housing is cleaner.
In a first aspect of an embodiment of the present application, a method for processing a housing of an electronic device is provided.
According to an embodiment of the application, the machining method comprises: providing a curved surface shell body, wherein the convex surface of the curved surface shell body is a smooth surface; forming a glue layer on the convex surfaces through silk printing, wherein the glue layer only covers partial convex surfaces; carrying out sand blasting treatment on the convex surface which is not protected by the glue layer to obtain a local matte area; and removing the adhesive layer to obtain the shell of the electronic equipment.
By adopting the processing method provided by the embodiment of the application, the splicing of the smooth surface and the dummy surface can be accurately manufactured in a mode of screen printing of the adhesive layer, the method is more suitable for manufacturing the dummy surface area with complex patterns on the curved-surface shell, and the adhesive layer is easier to remove after sand blasting and has no residue, so that the manufactured shell has higher yield.
In a second aspect of the present application, a housing for an electronic device is presented.
According to an embodiment of the application, the housing is obtained by the above-mentioned machining method.
The convex surface of the curved surface shell of the electronic equipment provided by the embodiment of the application has the splicing of the smooth surface and the dummy surface, so that the appearance effect of the shell is higher in grade and better in texture, and the partial dummy surface can also improve the anti-slipping performance of the shell. It will be appreciated by those skilled in the art that the features and advantages described above with respect to the method of manufacturing the housing of the electronic device are applicable to the housing of the electronic device and will not be described in detail herein.
In a third aspect of the present application, an electronic device is presented.
According to an embodiment of the application, the electronic device comprises the shell.
The electronic equipment of the embodiment of the application has the fashionable appearance effect of being matte and the same, so that the appearance of the electronic equipment has higher grade and better texture, and the market competitiveness of the electronic equipment is further improved. It will be appreciated by those skilled in the art that the features and advantages described above with respect to the housing of the electronic device, which are not described in detail herein, still apply to the electronic device.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic flow chart illustrating a method for manufacturing a housing of an electronic device according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural diagram of a cross-section (a) and a longitudinal section (b) of a curved housing body according to one embodiment of the present application;
FIG. 3 is a schematic top view of a product after step S300 in the manufacturing method according to an embodiment of the present application;
FIG. 4 is a schematic cross-sectional view of a curved housing of the same body of the present application in accordance with one embodiment of the present application;
FIG. 5 is a schematic perspective view of an electronic device according to an embodiment of the present application.
Reference numerals
100 curved surface casing body
101 convex surface
102 open pore
200 glue layer
10 casing
1 electronic device
Detailed Description
The following examples are presented in detail and are not to be construed as limiting the present application, as those skilled in the art will appreciate. Unless otherwise indicated, specific techniques or conditions are not explicitly described in the following examples, and those skilled in the art may follow techniques or conditions commonly employed in the art or in accordance with the product specifications.
In one aspect of the embodiments of the present application, a method for processing a housing of an electronic device is provided. According to an embodiment of the present application, referring to fig. 1, the processing method includes:
s100: a curved housing body is provided.
In this step, a curved casing body 100 is provided, and the convex surface 101 of the curved casing body 100 may be a smooth surface. Specifically, referring to fig. 2, the curved housing body 100 may be a three-dimensional (3D) composite plate cover, specifically formed of polymethyl methacrylate (PMMA) or the like, for example.
In some embodiments of the present application, the curved surface housing body 100 may be formed by sequentially performing Ultraviolet (UV) transfer printing on a composite board substrate to form a texture layer, dip-dyeing to form a color layer, coating to form an optical film layer, and screen printing to form a pattern layer, then forming the composite board substrate into a three-dimensional composite board cover plate at a high pressure, then continuously coating a hardening liquid to form a hardened layer, and finally processing a hole in a numerical control manner. Thus, the 3D curved casing body 100 can be manufactured.
S200: and forming a glue layer on the convex surface of the curved surface shell body by silk screen printing.
In this step, the adhesive layer 200 is formed on the convex surface 101 of the curved casing body 100 in the step S200 by silk-screen printing, and the adhesive layer 200 covers only a part of the convex surface 101. Therefore, the shell with the light-emitting dumb appearance effect can be finally manufactured through the light surface area of the local protection part.
Moreover, the existing laser engraving method after ink spraying is more suitable for a planar (2D) shell, while the screen printing method is more suitable for a 3D curved shell body 100, especially for the position accuracy of the junction of a smooth surface area and a dummy surface area near an edge curved surface, and the non-planar position can be always kept at the printing line position by rotating the curved shell body 100 by adopting the curved screen printing technology.
In some embodiments of the present application, the glue layer 200 may be formed after being cured by hydrosol, so that the hydrosol is firstly silk-screened onto the convex surface 101 of the curved surface housing body 100, and then is cured and molded by ultraviolet rays (UV) and other modes, so that the glue layer 200 is attached to the convex surface 101 more along with the shape, and the pattern size precision of the glue layer 200 is higher. In some embodiments, the silk-screen hydrosol may be modified acrylic resin, so that the UV-cured adhesive layer 200 can be quickly removed by hydrolysis in warm water. Wherein the wavelength of the curing ultraviolet can be selected from 365-395 nm, and the curing energy can be 500-800mJ/cm2。
In some embodiments of the present disclosure, the thickness of the adhesive layer 200 may be 30 to 50 micrometers, so that the subsequent sand blasting process can be effectively prevented from affecting the smooth surface area by using the adhesive layer 200 with the above thickness. According to the embodiment of the application, the pattern shape of the glue layer 200 can be selected from numbers, letters, Chinese characters, logos (logos), various geometric shapes, and the like, such as a strip shape. In some embodiments of the application, the number of the silk-screen printing plates can be 200-400 meshes, for example, 300 meshes, so that more complicated glue layer 200 patterns can be silk-screened by selecting the silk-screen printing plates with high density, and the finally manufactured object has a more fashionable appearance.
S300: and carrying out sand blasting treatment on the convex surface which is not protected by the glue layer.
In this step, the convex surface 101 not protected by the glue layer 200 is subjected to a sandblasting treatment to obtain a partially matt area. In addition, please refer to fig. 3, which shows a schematic top view structure of the product obtained in this step.
In some embodiments of the present application, the sand material for the sand blasting may be selected from alumina or zirconia with 200-400 mesh, the sand blasting pressure may be 1.5-3 kg, and the distance from the spray gun to the convex surface may be 50-150 mm. Thus, by using the above-mentioned blasting conditions, a significant matte effect can be formed in the polymethyl methacrylate (PMMA) hardened layer.
S400: and removing the glue layer to obtain the shell of the electronic device.
In this step, the adhesive layer 200 is finally removed to obtain the housing of the electronic device with the appearance effect of splicing the smooth surface and the matte surface.
In some embodiments of the present application, the manner of removing the glue layer 200 may be to soak in 50-60 degrees celsius water for hydrolysis, so that the modified acrylic resin is adopted as the glue layer 200 after the hydrosol is cured, and the glue layer can be removed quickly and cleanly only by soaking in warm water for a period of time, and the removing condition is mild without damaging each optical film layer structure on the curved surface housing body 100. In addition, the warm water soaking is softer than high-energy removal modes such as laser etching and the like, so that the processing efficiency and the yield of the processing method are higher.
In some specific examples, after step S400, the anti-fingerprint (AF) treatment may be further performed on the convex surface by using a spray gun spraying scheme, and specifically, the spraying flow rate of the spray gun may be 18.5 mL/min. Thus, the uniformly and finely dispersed droplets are applied to the surface by means of pressure or centrifugal force, and the film liquid is made of fluorine-silicon high polymer, so that a nano transparent coating can be formed on the surface as an anti-fingerprint film layer. Finally, CNC finishing impression can be carried out, specifically, the rotating speed of the main shaft is 45000-55000 rpm, and the feeding speed is 1500-2000 mm/min, so that the hand feeling of the electronic equipment shell can be smoother.
In summary, according to the embodiments of the present application, a processing method is provided, in which a smooth surface and a dummy surface can be precisely spliced by screen printing a glue layer, and the processing method is more suitable for manufacturing a dummy surface area with a complex pattern on a curved surface housing, and the glue layer is easier to remove after sand blasting and has no residue, so that the yield of the manufactured housing is higher.
In another aspect of an embodiment of the present application, a housing of an electronic device is provided. According to an embodiment of the application, the shell is obtained by the above-mentioned machining method. Thus, referring to fig. 4, the outer surface of the housing 10 has an appearance effect of splicing the plain area a and the dummy area B.
In summary, according to the embodiments of the present application, a casing of an electronic device is provided, in which a convex surface of a curved casing has a smooth surface and a dummy surface, so that the appearance of the casing is higher in grade and better in texture, and the partial dummy surface can improve the anti-sliding performance of the casing. It will be appreciated by those skilled in the art that the features and advantages described above with respect to the method of manufacturing the housing of the electronic device are applicable to the housing of the electronic device and will not be described in detail herein.
In another aspect of an embodiment of the present application, an electronic device is provided. According to an embodiment of the present application, referring to fig. 5, the electronic device 1 includes the housing 10 described above.
According to the embodiment of the application, the specific type of the electronic device is not particularly limited, specifically, for example, a mobile phone, a tablet computer, a smart watch, and the like, and those skilled in the art may select the electronic device according to the specific application of the electronic device, which is not described herein again. It should be noted that the electronic device includes, in addition to the above-mentioned housing, other necessary components and structures, such as a display device, a processor, a memory, a battery, a circuit board, a camera, and the like, for example, a mobile phone, and those skilled in the art can design and supplement the electronic device according to the specific type of the electronic device, which is not described herein again.
In summary, according to the embodiments of the present application, an electronic device is provided, in which a housing of the electronic device has a matte fashion appearance effect, so that the appearance of the electronic device has a higher grade and a better texture, and further market competitiveness of the electronic device is improved. It will be appreciated by those skilled in the art that the features and advantages described above with respect to the housing of the electronic device, which are not described in detail herein, still apply to the electronic device.
In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.
Claims (10)
1. A method for processing a shell of an electronic device is characterized by comprising the following steps:
providing a curved surface shell body, wherein the convex surface of the curved surface shell body is a smooth surface;
forming a glue layer on the convex surfaces through silk printing, wherein the glue layer only covers partial convex surfaces;
carrying out sand blasting treatment on the convex surface which is not protected by the glue layer to obtain a local matte area;
and removing the adhesive layer to obtain the shell of the electronic equipment.
2. The process of claim 1 wherein said curved shell body comprises a three-dimensional composite sheet cover.
3. The process of claim 1, wherein the subbing layer is formed by curing an aqueous sol.
4. The process of claim 3, wherein the hydrosol is a modified acrylic resin.
5. The processing method according to claim 4, wherein the removing is performed by soaking in water at 50-60 ℃ for hydrolysis.
6. The process of claim 1, wherein the thickness of the adhesive layer is 30 to 50 μm.
7. The processing method according to claim 1, wherein the number of the screen printing plates for silk screen printing is 200-400 meshes.
8. The method as claimed in claim 1, wherein the sand material subjected to the blasting is alumina or zirconia of 200 to 400 mesh, the blasting pressure is 1.5 to 3kg, and the distance from the lance to the convex surface is 50 to 150 mm.
9. A housing for an electronic device, characterized by being obtained by the method of any one of claims 1 to 8.
10. An electronic device characterized by comprising the housing of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010543020.9A CN113810519A (en) | 2020-06-15 | 2020-06-15 | Shell of electronic equipment and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010543020.9A CN113810519A (en) | 2020-06-15 | 2020-06-15 | Shell of electronic equipment and processing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113810519A true CN113810519A (en) | 2021-12-17 |
Family
ID=78944525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010543020.9A Pending CN113810519A (en) | 2020-06-15 | 2020-06-15 | Shell of electronic equipment and processing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113810519A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114737151A (en) * | 2022-03-22 | 2022-07-12 | 东莞市微科光电科技有限公司 | Lens coating process |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB796401A (en) * | 1953-12-14 | 1958-06-11 | Kodak Ltd | Polymer hydrosols and coating compositions containing them, particularly for photography |
| JPH04339839A (en) * | 1991-05-17 | 1992-11-26 | Okamoto Ind Inc | Surface treatment of rubber product |
| US20050095398A1 (en) * | 2003-10-29 | 2005-05-05 | Nippon Bee Chemical Co., Ltd. | Aqueous base paint and coated article |
| CN102140277A (en) * | 2011-04-25 | 2011-08-03 | 王泝舟 | Baking-curing high hardness water transfer printing ink without adopting varnish protection and printing process |
| CN203331672U (en) * | 2013-06-04 | 2013-12-11 | 祥和彩瓷制造(上海)有限公司 | Water transfer paper structure |
| CN104129188A (en) * | 2014-07-16 | 2014-11-05 | 增城市运豪五金塑料有限公司 | Baking-free strong-stretching decorative pattern transfer method and transfer paper |
| CN105307429A (en) * | 2014-07-25 | 2016-02-03 | 维沃移动通信有限公司 | Electronic product housing and surface treatment process thereof |
| CN205035311U (en) * | 2015-09-23 | 2016-02-17 | 广东欧珀移动通信有限公司 | Casing and terminal |
| CN205681717U (en) * | 2016-06-06 | 2016-11-09 | 广东欧珀移动通信有限公司 | Silk-screen shell structure and electronic equipment |
| CN106163150A (en) * | 2016-06-29 | 2016-11-23 | 深圳市金立通信设备有限公司 | The processing method of a kind of terminal shell, terminal shell and terminal |
| CN107116949A (en) * | 2017-03-31 | 2017-09-01 | 联想(北京)有限公司 | A kind of pattern preparation method and electronic equipment |
| CN107487008A (en) * | 2017-09-26 | 2017-12-19 | 广东长盈精密技术有限公司 | The dust-proof processing technology of mobile phone shell sealing of hole |
| CN108016101A (en) * | 2017-12-15 | 2018-05-11 | 东莞市达瑞电子股份有限公司 | A kind of MULTILAYER COMPOSITE high transparency protective film and preparation method thereof |
| CN110049645A (en) * | 2019-04-10 | 2019-07-23 | Oppo广东移动通信有限公司 | Casting of electronic device and preparation method thereof and electronic equipment |
| CN110253406A (en) * | 2019-06-10 | 2019-09-20 | Oppo广东移动通信有限公司 | Cover board and preparation method thereof and electronic equipment |
| CN111234597A (en) * | 2018-11-28 | 2020-06-05 | 广东志高空调有限公司 | Silk-screen printing ink |
-
2020
- 2020-06-15 CN CN202010543020.9A patent/CN113810519A/en active Pending
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB796401A (en) * | 1953-12-14 | 1958-06-11 | Kodak Ltd | Polymer hydrosols and coating compositions containing them, particularly for photography |
| JPH04339839A (en) * | 1991-05-17 | 1992-11-26 | Okamoto Ind Inc | Surface treatment of rubber product |
| US20050095398A1 (en) * | 2003-10-29 | 2005-05-05 | Nippon Bee Chemical Co., Ltd. | Aqueous base paint and coated article |
| CN102140277A (en) * | 2011-04-25 | 2011-08-03 | 王泝舟 | Baking-curing high hardness water transfer printing ink without adopting varnish protection and printing process |
| CN203331672U (en) * | 2013-06-04 | 2013-12-11 | 祥和彩瓷制造(上海)有限公司 | Water transfer paper structure |
| CN104129188A (en) * | 2014-07-16 | 2014-11-05 | 增城市运豪五金塑料有限公司 | Baking-free strong-stretching decorative pattern transfer method and transfer paper |
| CN105307429A (en) * | 2014-07-25 | 2016-02-03 | 维沃移动通信有限公司 | Electronic product housing and surface treatment process thereof |
| CN205035311U (en) * | 2015-09-23 | 2016-02-17 | 广东欧珀移动通信有限公司 | Casing and terminal |
| CN205681717U (en) * | 2016-06-06 | 2016-11-09 | 广东欧珀移动通信有限公司 | Silk-screen shell structure and electronic equipment |
| CN106163150A (en) * | 2016-06-29 | 2016-11-23 | 深圳市金立通信设备有限公司 | The processing method of a kind of terminal shell, terminal shell and terminal |
| CN107116949A (en) * | 2017-03-31 | 2017-09-01 | 联想(北京)有限公司 | A kind of pattern preparation method and electronic equipment |
| CN107487008A (en) * | 2017-09-26 | 2017-12-19 | 广东长盈精密技术有限公司 | The dust-proof processing technology of mobile phone shell sealing of hole |
| CN108016101A (en) * | 2017-12-15 | 2018-05-11 | 东莞市达瑞电子股份有限公司 | A kind of MULTILAYER COMPOSITE high transparency protective film and preparation method thereof |
| CN111234597A (en) * | 2018-11-28 | 2020-06-05 | 广东志高空调有限公司 | Silk-screen printing ink |
| CN110049645A (en) * | 2019-04-10 | 2019-07-23 | Oppo广东移动通信有限公司 | Casting of electronic device and preparation method thereof and electronic equipment |
| CN110253406A (en) * | 2019-06-10 | 2019-09-20 | Oppo广东移动通信有限公司 | Cover board and preparation method thereof and electronic equipment |
Non-Patent Citations (1)
| Title |
|---|
| 李进军，吴峰编: "《包装印刷[M]》", pages: 198 - 200 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114737151A (en) * | 2022-03-22 | 2022-07-12 | 东莞市微科光电科技有限公司 | Lens coating process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101707422B1 (en) | Cover glass and method of manufacturing the same | |
| US20180072614A1 (en) | Method of manufacturing glass cover | |
| EP3826275B1 (en) | Housing and mobile terminal | |
| CN111943519B (en) | Manufacturing method of anti-glare glass shell, anti-glare glass shell and electronic equipment | |
| CN111315169B (en) | Manufacturing method of shell assembly | |
| CN102180047B (en) | Insert mold transcription film including three-dimentional pattern of metal texture and method for fabricating the same | |
| CN111901996B (en) | Shell assembly, preparation method thereof and electronic equipment | |
| CN107231774B (en) | Electronic device shell, electronic device and electronic device shell machining method | |
| US9751297B1 (en) | Surface treatment method for composite surfaces | |
| CN113810519A (en) | Shell of electronic equipment and processing method thereof | |
| KR101594877B1 (en) | Cover glass and method of manufacturing the same | |
| CN111491471A (en) | Shell assembly, preparation method and electronic equipment | |
| KR20160124449A (en) | Windows Mobile and IT equipment for UV pattern is formed Glass UV Glass and window molding method | |
| CN114100998A (en) | Method for preparing micro-nano structure on surface of substrate, substrate with micro-nano structure on surface and application of substrate | |
| CN210959082U (en) | Rear cover and electronic equipment | |
| CN113133236A (en) | Preparation method of shell assembly, shell assembly and electronic equipment | |
| KR20150126317A (en) | Cover glass and method of manufacturing the same | |
| CN113573526A (en) | Preparation method of shell, shell and electronic equipment | |
| CN110723909A (en) | Method for processing decorative pattern and microscopic texture on surface of base material | |
| CN202271586U (en) | Anti-electromagnetic wave protecting film of electronic product | |
| KR20130039395A (en) | A method for manufacturing a cover of mobile device and the cover of mobile device using the same | |
| KR20150126571A (en) | Cover glass and method of manufacturing the same | |
| CN114979320A (en) | Manufacturing method of rear shell, rear shell and electronic equipment | |
| CN112040678A (en) | Shell machining method, shell and electronic equipment | |
| CN114554754A (en) | Electronic equipment and preparation method of metal workpiece |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |