CN113782975B - Wave-transparent dielectric plate-resistive film frequency selective surface composite wave-absorbing device - Google Patents
Wave-transparent dielectric plate-resistive film frequency selective surface composite wave-absorbing device Download PDFInfo
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- CN113782975B CN113782975B CN202110902845.XA CN202110902845A CN113782975B CN 113782975 B CN113782975 B CN 113782975B CN 202110902845 A CN202110902845 A CN 202110902845A CN 113782975 B CN113782975 B CN 113782975B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/0013—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices working as frequency-selective reflecting surfaces, e.g. FSS, dichroic plates, surfaces being partly transmissive and reflective
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
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Abstract
The invention discloses a wave-transparent dielectric plate-resistive film frequency selection surface composite wave-absorbing device, which sequentially comprises a first wave-transparent dielectric plate, a first dielectric substrate layer, a first resistive film frequency selection surface layer, a second wave-transparent dielectric plate, an impedance matching module and a total reflection bottom plate from top to bottom; the impedance matching module comprises N impedance matching units which are distributed from top to bottom in sequence; the impedance matching unit sequentially comprises a second dielectric substrate layer, a second resistive film frequency selection surface layer and a dielectric isolation layer from top to bottom; the frequency selective surface layer of the resistive film is a lossy frequency selective surface, has good selectivity on electromagnetic waves, is not easy to corrode, is not easy to be influenced by external environments such as ocean and the like, and has stable wave absorbing performance; in addition, the frequency selective surface layer of the first resistive film with larger equivalent input impedance is inserted between the two wave-transmitting dielectric plates, so that the impedance-frequency dispersion of the composite wave-absorbing device can be reduced, the wave-absorbing bandwidth is widened, and higher and more stable wave-absorbing performance is realized.
Description
Technical Field
The invention belongs to the technical field of composite wave-absorbing materials, and particularly relates to a wave-transparent dielectric plate-resistive film frequency selective surface composite wave-absorbing device.
Background
The radar technology is developed rapidly, and different types of radars exist according to different targets and requirements; among these, the main threat comes from the fire radar frequency band. The frequency of the fire control radar frequency band is 8.0-18.0 GHz, and is one of important frequency bands for researching the stealth of the target radar; the detection technology for ships makes the surface ships exposed on the open sea surface extremely vulnerable to attacks from the air, the sea and the water, and the threats faced by the ships are more and more serious. Therefore, in this frequency band, it is imperative to apply a wave-absorbing material capable of absorbing electromagnetic waves.
The traditional wave-absorbing material for the fire control radar frequency band is a coating type wave-absorbing material formed by mixing powder with wave-absorbing performance and various adhesives, wherein the most common wave-absorbing materials are ferrite wave-absorbing materials, metal micro powder wave-absorbing materials and polycrystalline iron fiber wave-absorbing materials. When the coating type wave absorbing material is applied to a ship structure, a wave-transmitting medium plate needs to be added on the outer side of a wave absorbing body in consideration of the structural appearance strength, so that the wave absorbing performance of the original coating type wave absorbing material is seriously deteriorated, and the excellent wave absorbing performance at 8.0-18.0 GHz is difficult to meet by adjusting the components of the material.
The Frequency Selective Surface (FSS) is a periodic structure and is a typical structural wave-absorbing material; in order to avoid the problems, in the prior art, metal FSS is generally adopted as a wave-absorbing material, and a metal FSS welding lumped element has good selection characteristics on electromagnetic waves.
Disclosure of Invention
Aiming at the defects or improvement requirements of the prior art, the invention provides a wave-transparent dielectric plate-resistive film frequency selective surface composite wave-absorbing device, aiming at solving the technical problem that the wave-absorbing performance of the prior art is gradually deteriorated under the severe marine environment.
In order to achieve the above object, in a first aspect, the present invention provides a wave-transparent dielectric slab-resistive film frequency selective surface composite wave-absorbing device, which sequentially comprises, from top to bottom, a first wave-transparent dielectric slab, a first dielectric substrate layer, a first resistive film frequency selective surface layer, a second wave-transparent dielectric slab, an impedance matching module, and a total reflection bottom plate;
the impedance matching module comprises N impedance matching units which are distributed from top to bottom in sequence; the impedance matching unit sequentially comprises a second dielectric substrate layer, a second resistive film frequency selection surface layer and a dielectric isolation layer from top to bottom; n is an integer greater than or equal to 2;
each resistive film frequency selective surface layer is provided with different FSS patterns; the equivalent input impedance of the frequency selective surface layer of the first resistive film is greater than the equivalent input impedance of the frequency selective surface layer of the second resistive film; the equivalent input impedance of the frequency selective surface layer of the second resistive film in the uppermost impedance matching unit in the impedance matching module is smaller than the equivalent input impedance of the frequency selective surface layer of the second resistive film in the other impedance matching units in each layer in the impedance matching module;
the impedance matching module is used for regulating and controlling the equivalent input impedance of the impedance matching module based on the FSS pattern of each second resistive film frequency selection surface layer, so that after the equivalent input impedance is connected with the impedance of the first wave-transmitting dielectric plate and the impedance of the second wave-transmitting dielectric plate in parallel, the impedance of the composite wave-absorbing device can be matched with the impedance of a free space, and the reflectivity of electromagnetic waves is reduced;
the frequency selective surface layer of the first resistive film is used as an impedance modification layer of the first wave-transparent dielectric plate and the second wave-transparent dielectric plate and is used for reducing impedance-frequency dispersion of the composite wave-absorbing device so as to widen the wave-absorbing bandwidth.
Further preferably, the FSS pattern includes a plurality of FSS cells arranged in a row-column cycle.
It is further preferred that the period of the FSS unit is 5-20mm and the resistive film surface square resistances of the first resistive film frequency-selective surface layer and the second resistive film frequency-selective surface layer are 10-300Ohm/sq.
Further preferably, the FSS cells of the frequency selective surface layer of the first resistive film are a deformed cross pattern, specifically: the four short arms of the cross are each loaded with a pattern behind the choke pattern.
It is further preferred that the line width of the FSS cells of the frequency selective surface layer of the first resistive film is 0.1 to 3mm and the inter-cell gap is 0.3 to 2mm.
Further preferably, the FSS cell of the frequency selective surface layer of the second resistive film is in the form of a square ring or a fractal of a square ring.
It is further preferred that the FSS cells of the frequency selective surface layer of the second resistive film have a loop width of 0.1-3mm and an inter-cell gap of 0.3-2mm.
Further preferably, the total reflection bottom plate is a solid or hollow total reflection back plate.
Further preferably, the medium isolation layer is made of aramid paper honeycomb material, glass fiber reinforced epoxy resin material, ceramic material, polyester material or foam composite material; the thickness is 1mm-10mm.
More preferably, the first dielectric substrate layer and the second dielectric substrate layer are both made of glass fiber reinforced epoxy resin or polyimide films, and the thickness of the glass fiber reinforced epoxy resin or polyimide films is 0.025 mm-0.8 mm.
In general, compared with the prior art, the above technical solutions conceived by the present invention can achieve the following beneficial effects:
1. the invention provides a wave-transparent dielectric plate-resistive film frequency selection surface composite wave-absorbing device, wherein an impedance matching module utilizes a patterning structure of a resistive film to accurately regulate and control the impedance of each layer of frequency selection, and then the impedance matching module is connected with the impedance of a wave-transparent dielectric plate in parallel, so that the impedance of the composite wave-absorbing device can be matched with the impedance of a free space, the reflectivity of electromagnetic waves is reduced, and the wave-absorbing property is met; the frequency selective surface layer of the resistive film is a lossy frequency selective surface, has good selectivity on electromagnetic waves, is not easy to corrode, has no device loading, is not easy to be influenced by external environments such as oceans and the like, and has stable wave absorbing performance; meanwhile, the first resistance film frequency selection surface layer with larger equivalent input impedance is inserted between the first wave-transmitting dielectric plate and the second wave-transmitting dielectric plate, so that the impedance-frequency dispersion of the composite wave-absorbing device can be reduced, the wave-absorbing bandwidth is widened, and higher and more stable wave-absorbing performance can be realized.
2. The wave-transparent dielectric plate-resistive film frequency selection surface composite wave-absorbing device provided by the invention enables the impedance of the composite wave-absorbing device to be matched with the free space impedance based on the impedance matching module, and can avoid the problem of wave-absorbing performance deterioration caused by loading the wave-transparent dielectric plate on the existing wave-absorbing body.
3. The wave-transparent dielectric plate-resistive film frequency selective surface composite wave-absorbing device provided by the invention can realize the performance of absorbing electromagnetic waves in the angular region range of 8-18GHz and 0-45 degrees.
4. The wave-transparent dielectric plate-resistive film frequency selective surface composite wave-absorbing device provided by the invention uses the polyimide film and the foam composite material as main raw materials, and the raw materials have the characteristic of small weight, so that compared with the traditional dielectric wave-absorbing material, the composite wave-absorbing device provided by the invention is a light wave-absorbing device and is suitable for carriers requiring low additional weight.
Drawings
Fig. 1 is a schematic structural diagram of a wave-transparent dielectric plate-resistive film frequency selective surface composite wave-absorbing device provided by the invention;
fig. 2 is a schematic 3D structure diagram of one element pattern in the wave-transparent dielectric plate-resistive film frequency selective surface composite wave absorbing device provided in embodiment 1 of the present invention;
fig. 3 is a schematic diagram of a square-ring fractal pattern provided in embodiment 1 of the present invention;
FIG. 4 is a schematic view of a circular pattern provided in example 1 of the present invention;
fig. 5 is a schematic view of a cross pattern with a choke pattern as provided in example 1 of the present invention;
FIG. 6 is a schematic diagram showing equivalent input impedance of the frequency selective surface of each layer of the resistive film provided in embodiment 1 of the present invention;
fig. 7 is a schematic diagram of an oblique incidence reflectivity characteristic curve of the composite wave-absorbing device provided in embodiment 2 of the invention under TE polarization;
fig. 8 is a schematic diagram of an oblique incidence reflectivity characteristic curve of the composite wave absorbing device provided in embodiment 2 of the present invention under TM polarization;
fig. 9 is a schematic diagram of an oblique incidence reflectivity characteristic curve of the composite wave-absorbing device provided in embodiment 3 of the invention under TE polarization;
fig. 10 is a schematic diagram of an oblique incidence reflectivity characteristic curve of the composite wave absorbing device provided in embodiment 3 of the present invention under TM polarization.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
In order to achieve the above object, the present invention provides a wave-transparent dielectric slab-resistive film frequency selective surface composite wave absorbing device, as shown in fig. 1, which comprises, from top to bottom, a first wave-transparent dielectric slab 101, a first dielectric substrate layer 102, a first resistive film frequency selective surface layer 103, a second wave-transparent dielectric slab 104, an impedance matching module 105 and a total reflection bottom plate 106;
the impedance matching module comprises N impedance matching units which are distributed from top to bottom in sequence; the impedance matching unit sequentially comprises a second dielectric substrate layer, a second resistive film frequency selection surface layer and a dielectric isolation layer from top to bottom; n is an integer greater than or equal to 2; it should be noted that N is determined according to the impedance of each impedance matching module and the impedance change after the modules are connected in parallel, and the final purpose is to achieve impedance matching.
Each resistive film frequency selective surface layer is provided with different FSS patterns; the equivalent input impedance of the first resistive film frequency selective surface layer is greater than the equivalent input impedance of the second resistive film frequency selective surface layer; the equivalent input impedance of the frequency selective surface layer of the second resistive film in the uppermost layer of the impedance matching unit in the impedance matching module is smaller than the equivalent input impedance of the frequency selective surface layer of the second resistive film in the other layers of the impedance matching units in the impedance matching module;
the impedance matching module is used for regulating and controlling the equivalent input impedance of the impedance matching module based on the FSS pattern of each second resistive film frequency selection surface layer, so that after the equivalent input impedance is connected with the impedance of the first wave-transmitting dielectric plate and the impedance of the second wave-transmitting dielectric plate in parallel, the impedance of the composite wave-absorbing device can be matched with the impedance of a free space, and the reflectivity of electromagnetic waves is reduced;
the frequency selective surface layer of the first resistive film is used as an impedance modification layer of the first wave-transparent dielectric plate and the second wave-transparent dielectric plate and is used for reducing impedance-frequency dispersion of the composite wave-absorbing device so as to widen the wave-absorbing bandwidth.
Further, the frequency selective surface 3 of the above-mentioned second resistive film, the frequency selective surface layer 6 of the second resistive film and the frequency selective surface layer 9 of the first resistive film have FSS patterns thereon; the FSS graph comprises a plurality of FSS units which are arranged according to a row-column period; in some alternative embodiments, each resistive film frequency selective surface layer is prepared as a single piece with the corresponding dielectric substrate layer. The FSS graph is manufactured on the dielectric substrate layer; in particular, it can be prepared by any conventional technique, such as screen printing, ink-jet printing, chemical vapor deposition, and the like. The frequency selection surface 3 of the second resistance film and the frequency selection surface layer 6 of the second resistance film are used as impedance matching layers, the FSS unit is in a square ring shape or a fractal shape of a square ring, the period is 5-20mm, and the square resistance of the surface of the resistance film is 10-300Ohm/sq; the ring width of the pattern structure is 0.1-3mm, and the gaps between the units are 0.3-2mm. The frequency selective surface layer 9 of the first resistive film is used as an impedance modifying layer, the FSS unit of the surface layer is a deformed cross pattern, namely a pattern formed by loading a choke pattern on each of four short arms of the cross, the line width is 0.1-3mm, the gaps among the units are 0.3-2mm, the unit period is 5-20mm, and the sheet resistance of the surface of the resistive film is 10-300Ohm/sq.
In some optional embodiments, the total reflection bottom plate is a solid or hollow total reflection back plate.
In some alternative embodiments, the dielectric isolation layers 2 and 5 are aramid paper honeycomb or foam composite materials having a relative dielectric constant in the range of 1.07 to 1.15, a loss tangent in the range of 0.0017 to 0.0039, and a thickness in the range of 1mm to 10mm.
In some alternative embodiments, the second wave-transparent dielectric plate 8 and the first wave-transparent dielectric plate 11 are glass fiber composite quartz dielectric plates, and have a relative dielectric constant in a range of 3.34 to 4.5, a loss tangent in a range of 0.0178 to 0.2, and a thickness in a range of 0.5mm to 4mm.
The wave absorbing frequency band of the composite wave absorbing device provided by the invention is 8-18GHz, and the coverage angle domain is 0-45 degrees.
In order to further explain the wave-transparent dielectric plate-resistive film frequency selective surface composite wave-absorbing device provided by the invention, the value of N is taken as 2, and the following is detailed in combination with the embodiment:
examples 1,
A wave-transparent dielectric plate-resistive film frequency selective surface composite wave-absorbing device, as shown in FIG. 2, comprises from bottom to top: the frequency selective substrate comprises a total reflection bottom plate 1, a medium isolation layer 2 attached to the total reflection bottom plate, a second resistive film frequency selective surface layer 3 attached to the surface of the medium isolation layer 2, a second medium substrate layer 4 attached to the second resistive film frequency selective surface layer 3, a medium isolation layer 5 attached to the second medium substrate layer 4, a second resistive film frequency selective surface layer 6 attached to the surface of the medium isolation layer 5, a second medium substrate layer 7 attached to the second resistive film frequency selective surface layer 6, a second wave-transmitting medium plate 8 attached to the second medium substrate layer 7, a first resistive film frequency selective surface layer 9 attached to the surface of the second wave-transmitting medium plate 8, a second medium substrate layer 10 attached to the first resistive film frequency selective surface layer 9, and a first wave-transmitting medium plate 11 attached to the second medium substrate layer 10.
Wherein, the total reflection bottom plate 1 is a metal back plate, the size is 300mm multiplied by 300mm, and the thickness is 5mm; the dimensions of the FSS cells in the second resistive-film frequency-selective surface layer 3, the second resistive-film frequency-selective surface layer 6 and the first resistive-film frequency-selective surface layer 9 are all 9.5mm x 9.5mm. As shown in fig. 3, the FSS cell of the frequency selection surface 3 of the second resistive film is a square ring fractal topology, and in the present embodiment, a square ring fractal is obtained by expanding a new square ring at four corners of the square ring; the surface sheet resistance of the frequency selective surface layer 3 of the second resistive film was 50Ohm/sq, the inter-cell gap was 0.5mm, and the loop width was 0.6mm. As shown in fig. 4, the FSS cells of the frequency selective surface 6 of the second resistive film are of square ring topology, the surface square resistance of the frequency selective surface layer 6 of the second resistive film is 20Ohm/sq, the inter-cell gap is 0.3mm, and the ring width is 0.4mm. As shown in fig. 5, the FSS cell of the first resistive film frequency selective surface layer 9 is a deformed cross pattern, specifically a pattern loaded with one choke pattern on each of the four short arms of the cross, denoted as a cross pattern with choke patterns; the surface square resistance of the frequency selective surface layer 9 of the first resistive film is 50Ohm/sq, the width of the deformed cross pattern is 0.4mm, the choke length is 5mm and the choke width is 0.5mm.
For the embodiment, a composite wave absorbing device based on a three-layer resistive film FSS is provided; the real part of impedance and the imaginary part of impedance of the three-layer resistive film FSS are shown in FIG. 6;
due to the introduction of the wave-transparent dielectric plate, the frequency dispersion of the input impedance curve of the wave absorber is more serious, so that the impedance curve is widened, and the wave-absorbing bandwidth is reduced. According to the invention, the first resistive film rate selection surface layer 9 and the second dielectric substrate layer 10 attached to the first resistive film rate selection surface layer are inserted between the second wave-transparent dielectric plate 8 and the first wave-transparent dielectric plate 11, the first resistive film rate selection surface layer 9 is an impedance modification layer, the pattern of the FSS unit is a cross structure with a choke pattern, the cross structure has an impedance real part larger than 500 ohms and an impedance imaginary part smaller than-400 ohms, and the impedance characteristic with a large modulus value ensures that the wave-transparent rate of the resistive film layer is very high (within the range of 8-18GHz > -2 dB), so that the wave-absorbing bandwidth can be widened; the first resistive film rate selective surface layer 9 can modify the impedance characteristic of the dielectric plate without affecting the reflection characteristic of the wave-transparent dielectric plate, thereby realizing broadband wave absorption.
It should be noted that the square-ring fractal structure shown in fig. 3 can enable the composite wave absorbing device to achieve more accurate impedance matching in a broadband range. Specifically, the equivalent input impedance of the square ring and ring fractal resistive film frequency selective surface is as shown in fig. 6. Under the condition that the surface sheet resistance of the resistive film FSS is the same, the real impedance part of the square ring fractal is far larger than the real impedance part of the ring, and the imaginary impedance part of the square ring fractal is far smaller than the imaginary impedance part of the ring. Therefore, better impedance matching can be realized by adopting a square ring fractal structure in the second resistive film FSS than by adopting a simple square ring structure, namely the real impedance part after parallel connection is closer to 377ohm free space impedance, and the imaginary impedance part is closer to 0. In the present embodiment, the second resistive film frequency selective surface layer 3 and the second resistive film frequency selective surface layer 6 are impedance matching layers; the FSS cells of the frequency selective surface 3 of the second resistive film are square ring fractal topologies, and the FSS cells of the frequency selective surface 6 of the second resistive film are square ring topologies; the frequency-selective surface layer 3 of the lower second resistive film has a relatively large impedance, the frequency-selective surface layer 6 of the upper second resistive film has a relatively small impedance, and the impedance of the frequency-selective surface layer 6 of the upper second resistive film is smaller than the impedance of the frequency-selective surface layer 6 of the upper second resistive film. After the smaller impedance is compounded with the wave-transparent dielectric plate modified by the frequency selective surface layer 9 of the first resistive film, the whole structure achieves good wave-absorbing effect in a broadband.
It should be noted that, the impedance rule of the N impedance matching units in the impedance matching module is: from bottom to top of the total reflection plate, the impedance of the 1 st to the N-1 st impedance matching units has no fixed size rule and mainly plays a role in impedance matching; the impedance of the nth impedance matching unit (corresponding to the uppermost impedance matching unit in the specific embodiment) must be lower than the impedance of the other impedance matching units, so that the overall impedance of the N impedance matching units and the uppermost wave-transmitting dielectric slab are compounded to achieve a good wave-absorbing effect of the overall structure; the impedance matching units from bottom to top in the impedance matching module are marked as 1-N, wherein the impedance of the frequency selection surface layer of the second resistive film in the 1 st to N-1 st impedance matching units has no fixed size rule and mainly plays a role in impedance matching; the impedance of the frequency selective surface layer of the second resistive film in the nth impedance matching unit (corresponding to the frequency selective surface layer 6 of the second resistive film in the uppermost impedance matching unit in this embodiment) must be smaller than the impedance of the frequency selective surface layers of the second resistive films in the other impedance matching units, so that the total impedance of the N impedance matching units and the wave-transparent dielectric plate of the uppermost layer can achieve a good wave-absorbing effect of the whole structure after being compounded.
Examples 2,
The structure of the wave-transparent dielectric plate-resistive film frequency selective surface composite wave-absorbing device in the embodiment is the same as that of the embodiment 1; in addition to example 1, the second dielectric substrate layer 4, the second dielectric substrate layer 7, and the second dielectric substrate layer 10 were all made of Polyimide (PI) material, and had a thickness of 0.025mm, a dielectric constant of 3.5, and a dielectric loss tangent of 0.0027.
The dielectric isolation layer 2 is made of aramid paper honeycomb material, the relative dielectric constant of the aramid paper honeycomb material is 1.07, the loss tangent of the aramid paper honeycomb material is 0.0017, and the thickness of the aramid paper honeycomb material is 3mm; the dielectric isolation layer 5 is made of aramid paper honeycomb material, the relative dielectric constant of the aramid paper honeycomb material is 1.07, the loss tangent of the aramid paper honeycomb material is 0.0017, and the thickness of the aramid paper honeycomb material is 8mm; the second wave-transparent dielectric plate 8 is a glass fiber composite quartz dielectric plate, the relative dielectric constant of which is 3.34, the loss tangent of which is 0.0178 and the thickness of which is 2mm; the first wave-transparent dielectric plate 11 is a glass fiber composite quartz dielectric plate, and has a relative dielectric constant of 3.34, a loss tangent of 0.0178, and a thickness of 2mm.
In the electromagnetic simulation software CST, the reflectivity under the oblique incidence condition in the range of 0-45 degrees is calculated for two different polarization conditions. The wave-absorbing device has oblique incidence reflectivity characteristics under TE polarization as shown in FIG. 7, and oblique incidence reflectivity characteristics under TM polarization as shown in FIG. 8. It can be seen that under the condition of loading the wave-transparent dielectric plate, the normal incidence wave-absorbing performance of the composite wave-absorbing structure can achieve a reflectivity reduction effect of-10 dB in the frequency range of 8-18 GHz. In the range of 0-45 degree oblique incidence angle, under two polarization conditions, the composite wave-absorbing structure still maintains the low reflection characteristic, and the aim of electromagnetic wave absorption is realized.
Examples 3,
The structure of the wave-transparent dielectric plate-resistive film frequency selective surface composite wave-absorbing device in the embodiment is the same as that in the embodiment 1; in addition to example 1, the materials of the second dielectric substrate layer 4, the second dielectric substrate layer 7 and the second dielectric substrate layer 10 are all glass fiber reinforced epoxy resin (FR 4) materials, the thickness is 0.15mm, the dielectric constant is 4.3, and the dielectric loss tangent is 0.025.
The dielectric isolation layer 2 is made of a foam composite material, the relative dielectric constant of the foam composite material is 1.15, the loss tangent of the foam composite material is 0.0178, and the thickness of the foam composite material is 3mm; the dielectric isolation layer 5 is made of a foam composite material, the relative dielectric constant of the foam composite material is 1.15, the loss tangent of the foam composite material is 0.0178, and the thickness of the foam composite material is 8mm; the second wave-transparent dielectric plate 8 is a glass fiber composite quartz dielectric plate, the relative dielectric constant of which is 4.5, the loss tangent of which is 0.02 and the thickness of which is 1.5mm; the first wave-transparent dielectric plate 11 is a glass fiber composite quartz dielectric plate, and has a relative dielectric constant of 4.5, a loss tangent of 0.02 and a thickness of 2.5mm.
In the electromagnetic simulation software CST, the reflectivity under the oblique incidence condition in the range of 0-45 degrees is calculated for two different polarization conditions. The wave-absorbing device has oblique incidence reflectivity characteristics under TE polarization as shown in FIG. 9, and oblique incidence reflectivity characteristics under TM polarization as shown in FIG. 10. It can be seen that under the condition of loading the wave-transparent dielectric plate, the normal incidence wave-absorbing performance of the composite wave-absorbing structure can achieve a reflectivity reduction effect of-10 dB in the frequency range of 8-18 GHz. In the range of 0-45 degree oblique incidence angle, under two polarization conditions, the composite wave-absorbing structure still maintains the low reflection characteristic, and the aim of electromagnetic wave absorption is realized.
It will be understood by those skilled in the art that the foregoing is only an exemplary embodiment of the present invention, and is not intended to limit the invention to the particular forms disclosed, since various modifications, substitutions and improvements within the spirit and scope of the invention are possible and within the scope of the appended claims.
Claims (7)
1. A wave-transparent dielectric plate-resistive film frequency selective surface composite wave-absorbing device is characterized by comprising a first wave-transparent dielectric plate, a first dielectric substrate layer, a first resistive film frequency selective surface layer, a second wave-transparent dielectric plate, an impedance matching module and a total reflection bottom plate from top to bottom in sequence;
the impedance matching module comprises N impedance matching units which are distributed from top to bottom in sequence; the impedance matching unit sequentially comprises a second dielectric substrate layer, a second resistive film frequency selection surface layer and a dielectric isolation layer from top to bottom; n is an integer greater than or equal to 2;
each resistive film frequency selective surface layer is provided with different FSS patterns; the equivalent input impedance of the first resistive film frequency selective surface layer is greater than the equivalent input impedance of the second resistive film frequency selective surface layer; the equivalent input impedance of the frequency selective surface layer of the second resistive film in the uppermost impedance matching unit in the impedance matching module is smaller than the equivalent input impedance of the frequency selective surface layer of the second resistive film in the impedance matching units of other layers in the impedance matching module;
the impedance matching module is used for regulating and controlling the equivalent input impedance of the impedance matching module based on the FSS pattern of each second resistive film frequency selection surface layer, so that after the impedance matching module is connected with the impedance of the first wave-transmitting dielectric slab and the impedance of the second wave-transmitting dielectric slab in parallel, the impedance of the composite wave-absorbing device can be matched with the impedance of a free space, and the reflectivity of electromagnetic waves is reduced;
the first resistance film frequency selective surface layer is used as an impedance modification layer of the first wave-transparent dielectric plate and the second wave-transparent dielectric plate and is used for reducing impedance-frequency dispersion of the composite wave-absorbing device so as to widen wave-absorbing bandwidth;
the FSS graph comprises a plurality of FSS units which are arranged according to a row-column cycle;
the FSS cells of the frequency selective surface layer of the first resistive film are a deformed cross pattern, specifically: loading a pattern behind a choke pattern on each of the four short arms of the cross;
the FSS unit of the second resistance film frequency selection surface layer is in a square ring shape or a fractal shape of a square ring.
2. The composite wave absorbing device according to claim 1, wherein the period of the FSS unit is 5-20mm; the resistive film surface square resistances of the first resistive film frequency selective surface layer and the second resistive film frequency selective surface layer are in the range of 10-300Ohm/sq.
3. The composite wave absorbing device of claim 1, wherein the FSS elements of the frequency selective surface layer of the first resistive film have a line width of 0.1-3mm and an inter-element gap of 0.3-2mm.
4. The composite wave absorbing device of claim 1, wherein the FSS elements of the frequency selective surface layer of the second resistive film have a loop width of 0.1-3mm and an inter-element gap of 0.3-2mm.
5. The composite wave absorbing device according to any one of claims 1 to 4, wherein the total reflection bottom plate is a solid or hollow total reflection back plate.
6. The composite wave absorbing device according to any one of claims 1 to 4, wherein the dielectric isolation layer is made of an aramid paper honeycomb material, a glass fiber reinforced epoxy resin material, a ceramic material, a polyester material or a foam composite material; the thickness is 1mm-10mm.
7. The composite wave absorbing device according to any one of claims 1 to 4, wherein the first dielectric substrate layer and the second dielectric substrate layer are both made of glass fiber reinforced epoxy resin or polyimide film and have a thickness of 0.025mm to 0.8mm.
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| CN115360526B (en) * | 2022-09-19 | 2023-07-18 | 西安电子科技大学 | Frequency selective super-surface structure with double wave-transmitting frequency bands and three wave-absorbing frequency bands |
| CN115360528B (en) * | 2022-10-24 | 2022-12-30 | 中国科学院长春光学精密机械与物理研究所 | Radar switch frequency selective surface loaded with polyaniline |
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