CN113775943A - Full-spectrum illuminating lamp - Google Patents

Full-spectrum illuminating lamp Download PDF

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Publication number
CN113775943A
CN113775943A CN202111165560.9A CN202111165560A CN113775943A CN 113775943 A CN113775943 A CN 113775943A CN 202111165560 A CN202111165560 A CN 202111165560A CN 113775943 A CN113775943 A CN 113775943A
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China
Prior art keywords
light
substrate
cup
full spectrum
face
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Pending
Application number
CN202111165560.9A
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Chinese (zh)
Inventor
闫玲
李钊英
罗丽光
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MLS Co Ltd
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MLS Co Ltd
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Priority to CN202111165560.9A priority Critical patent/CN113775943A/en
Publication of CN113775943A publication Critical patent/CN113775943A/en
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/68—Details of reflectors forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/69—Details of refractors forming part of the light source
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

The invention discloses a full-spectrum illuminating lamp, which comprises a substrate, a light-emitting chip arranged on the substrate, inorganic packaging glue, a lens with an accommodating groove and a reflecting cup, wherein the lens is arranged on the substrate; the lens is adhered to the substrate through the inorganic packaging adhesive, the inner wall of the accommodating groove and the substrate jointly enclose to form a sealed cavity, the reflection cup is located in the sealed cavity and is annular, and the light-emitting chip is located in the reflection cup. The invention can condense light to improve the illumination effect, can also effectively reduce the aging and attenuation speed, prolongs the service life of a full-spectrum illumination lamp, and belongs to the technical field of illumination devices.

Description

Full-spectrum illuminating lamp
Technical Field
The invention relates to the technical field of lighting devices, in particular to a full-spectrum lighting lamp.
Background
In the packaging process of a light-emitting chip of the existing lighting equipment, an organic silicon adhesive is mostly used for bonding a lens and a substrate, and organic materials are accelerated to be oxidized by being excited by short-wave high-energy ultraviolet light in the long-term service process, particularly, when the organic materials are irradiated by the ultraviolet light, the organic silicon is accelerated to be aged and attenuated, so that the performance is deteriorated, and finally, the radiation intensity of a device is reduced. The air tightness of the light emitting chip package is problematic, and particularly, the lighting device is prone to failure in underwater, high-temperature and high-humidity environments. In addition, the existing light-emitting chip has poor light-gathering effect and poor lighting effect after being packaged.
Disclosure of Invention
Aiming at the technical problems in the prior art, the invention aims to: the invention provides a full-spectrum illuminating lamp, which can condense light to improve the illuminating effect, can effectively reduce the aging and attenuation speed and prolong the service life of the full-spectrum illuminating lamp.
In order to achieve the purpose, the invention adopts the following technical scheme:
a full-spectrum illuminating lamp comprises a substrate, a light-emitting chip arranged on the substrate, inorganic packaging glue, a lens with an accommodating groove and a reflecting cup; the lens is adhered to the substrate through the inorganic packaging adhesive, the inner wall of the accommodating groove and the substrate jointly enclose to form a sealed cavity, the reflection cup is located in the sealed cavity and is annular, and the light-emitting chip is located in the reflection cup.
Further, the reflecting cup is provided with a first end connected with the substrate and a second end abutted on the lens; be equipped with the draw-in groove on the base plate, first serving is equipped with and is used for the card to go into block portion in the draw-in groove, anti-light cup will first sub-chamber and second sub-chamber are separated into to sealed chamber, luminous chip is located in first sub-intracavity.
Further, the axis of the light reflecting cup is perpendicular to the substrate, the light emitting chip is located on the axis of the light reflecting cup, and the inner diameter of the light reflecting cup gradually increases along the axis of the light reflecting cup and in the direction departing from the substrate.
Furthermore, a concave mirror is arranged on the inner wall of the reflecting cup; the quantity of concave mirror is a plurality of, a plurality of the concave mirror evenly distributed on the inner wall of reflection of light cup.
Further, the full-spectrum illuminating lamp also comprises a radiating fin; the substrate is provided with a first end face and a second end face; the lens is adhered to the first end face through the inorganic packaging adhesive, the light-emitting chip is installed on the first end face, and the radiating fin is installed on the second end face.
Further, the substrate is aluminum nitride ceramic.
Further, the substrate includes a wiring layer and an insulating layer; the first end face is located on the wiring layer, and the second end face is located on the insulating layer.
Further, the insulating layer is an epoxy resin plate.
Further, the inorganic encapsulating adhesive is an inorganic compound produced by a sol-gel method.
Further, the light emitting chip is a purple light LED chip.
Compared with the prior art, the invention has the beneficial effects that: the substrate and the lens are packaged by the inorganic packaging adhesive, so that the light-emitting chip is positioned in a closed cavity, the inorganic packaging adhesive can effectively reduce the aging and attenuation speed, and the service life of the full-spectrum illuminating lamp is prolonged. Meanwhile, the reflecting cup can not only condense light, but also prevent ultraviolet light from irradiating the inorganic packaging adhesive, and further prevent the aging and attenuation speed of the inorganic packaging adhesive.
Drawings
Fig. 1 is a schematic structural diagram of a full-spectrum illuminating lamp.
FIG. 2 is a schematic view of the connection between the reflective cup and the substrate.
In the figure, 1 is a substrate, 2 is a light emitting chip, 3 is an inorganic packaging adhesive, 4 is a lens, 5 is a reflective cup, 6 is a first sub-cavity, 7 is a second sub-cavity, 8 is a heat sink, 9 is a conductive film, 10 is electrorheological fluid, 11 is a wiring layer, 12 is an insulating layer, 13 is a first limit groove, 14 is a first gap, and 51 is a concave mirror.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "communicating" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
For convenience of description, unless otherwise noted, the up-down direction described below coincides with the up-down direction of fig. 1 itself, and the left-right direction described below coincides with the left-right direction of fig. 1 itself.
As shown in fig. 1 to 2, the present embodiment provides a full spectrum illumination lamp, which includes a substrate 1, a light emitting chip 2 mounted on the substrate 1, an inorganic packaging adhesive 3, a lens 4 having a receiving groove, and a reflective cup 5; the light emitting chip 2 is an LED chip, the lens 4 is transparent glass, a part of light emitted by the light emitting chip 2 penetrates out of the lens 4, and the rest part of light penetrates out of the lens 4 after being reflected by the reflecting cup 5. Lens 4 pastes on base plate 1 through inorganic encapsulation glue 3, and the inner wall of holding tank encloses jointly with base plate 1 and closes formation seal chamber, and anti-light cup 5 is located seal chamber, and anti-light cup 5 is cyclic annular, and luminous chip 2 is located anti-light cup 5. Inorganic encapsulation glues 3 and does not contain any organic matter, can bond base plate 1 and lens 4 equally to possess intact leakproofness, can guarantee the inside gas tightness of full spectrum light, the application field of full spectrum light can expand to under water, high temperature, high humid environment. The LED chip is inversely welded on the substrate 1 in the full-spectrum illuminating lamp through eutectic, so that the use of the traditional solid crystal organic glue is avoided; and when the electrical connection of the ultraviolet LED chip is ensured, heat can be conducted to the substrate 1, so that the heat conducting property of the device is improved, and the stability and the service life of the device are improved.
Wherein, full spectrum: the spectrum of the light emitting chip 2 includes a spectrum curve of ultraviolet light, visible light, and infrared light.
Specifically, in one embodiment, the lens 4 is glass, the outer surface of the lens 4 is a convex spherical surface, and the inner wall of the accommodating groove is a concave spherical surface, so as to increase the irradiation angle.
Specifically, in one embodiment, a groove is annularly arranged on the inner wall of the accommodating groove, and the inorganic packaging adhesive 3 forms a bump for being clamped into the groove, so that the lower end of the lens 4 is more firmly adhered to the inorganic packaging adhesive 3.
Specifically, in one embodiment, the reflector cup 5 has a first end (lower end) connected to the substrate 1 and a second end (upper end) abutting on the lens 4; the substrate 1 is provided with a clamping groove, and the first end is provided with a clamping part which is clamped into the clamping groove. The light-reflecting cup 5 divides the sealed cavity into a first sub-cavity 6 and a second sub-cavity 7, and the light-emitting chip 2 is positioned in the first sub-cavity 6. First sub-chamber 6 is isolated with second sub-chamber 7, and second sub-chamber 7 encircles and is established outside anti-light cup 5, and inorganic encapsulation glues 3 and is located outside first sub-chamber 6 for on inorganic encapsulation glues 3 can not be shone to the light of emitting chip 2, avoid inorganic encapsulation to glue 3 and receive the influence of light, make the light of emitting chip 2 concentrate more simultaneously, shine the effect better.
Specifically, in one embodiment, the axis of the reflective cup 5 is perpendicular to the substrate 1, the light emitting chip 2 is located on the axis of the reflective cup 5, and the inner diameter of the reflective cup 5 gradually increases along the axis of the reflective cup 5 and in a direction away from the substrate 1. The base plate 1 is horizontally arranged, and the inner diameter of the reflection cup 5 gradually increases from bottom to top.
Specifically, in an embodiment, a first limiting groove 13 is formed in the substrate 1, the first limiting groove 13 is in a shape of a Chinese character 'tu', a first limiting block and a second limiting block are respectively arranged on opposite side walls of the first limiting groove 13, a first gap 14 is formed between the first limiting block and the second limiting block, the lower end of the reflective cup 5 is a first connecting end, a first conductive film 9 is arranged on the first connecting end, an electrorheological fluid 10 is wrapped in the first conductive film 9, the conductive film 9 is clamped into the first limiting groove 13 from the first gap 14, and the shape of the conductive film 9 is the same as that of the first limiting groove 13. When full gloss register for easy reference light is in non-operating condition, reflection of light cup 5 realizes the location through the common centre gripping of the up end of base plate 1 and the inner wall of holding tank. When the full-spectrum illuminating lamp is in a working state, a circuit in the substrate 1 is communicated with the first conductive film 9 and the light-emitting chip 2, and the electrorheological fluid 10 in the first conductive film 9 becomes a solid and is clamped on the inner wall of the first limiting groove 13, so that the lower end of the reflecting cup 5 is tightly fixed with the substrate 1, and even if the inorganic packaging adhesive 3 goes wrong, the reflecting cup 5 and the substrate 1 can also be stably connected. When the lamp is in a non-working state, no current exists, and the electrorheological fluid 10 is in a liquid state, so that the full-spectrum illuminating lamp is convenient to overhaul and replace internal parts.
Specifically, in an embodiment, a second limiting groove is formed in an inner wall of the accommodating cavity of the lens 4, the second limiting groove is in a convex shape, a third limiting block and a fourth limiting block are respectively arranged on opposite side walls of the second limiting groove, a second gap is formed between the third limiting block and the fourth limiting block, the upper end of the reflective cup 5 is a second connecting end, a second conductive film 9 is also arranged on the second connecting end, electrorheological fluid 10 is wrapped in the second conductive film 9, the second conductive film 9 is clamped into the second limiting groove from the second gap, and the shape of the second conductive film 9 is the same as that of the second limiting groove. When full gloss register for easy reference light is in non-operating condition, reflection of light cup 5 realizes the location through the common centre gripping of the up end of base plate 1 and the inner wall of holding tank. Anti-light cup 5 is the metalwork, when full gloss register light in operating condition, the electric current of the circuit in the base plate 1 flows anti-light cup 5 in proper order, second conducting film 9, electrorheological fluids 10 in the second conducting film 9 becomes the solid and blocks on the inner wall of second spacing groove, make the upper end of anti-light cup 5 closely fix together with lens 4, even inorganic packaging glues 3 and goes wrong, 5 lower extremes of anti-light cup also can be firmly connected with base plate 1, 5 upper ends of anti-light cup also can be firmly connected with lens 4, first subchamber 6 that luminous chip 2 is in is totally airtight. When the lamp is in a non-working state, no current exists, and the electrorheological fluid 10 is in a liquid state, so that the full-spectrum illuminating lamp is convenient to overhaul and replace internal parts.
Specifically, in one embodiment, the inner wall of the reflective cup 5 is provided with a concave mirror 51; the number of the concave mirrors 51 is multiple, and the concave mirrors 51 are uniformly distributed on the inner wall of the reflecting cup 5.
Specifically, in one embodiment, the concave surface of the concave mirror 51 is a concave spherical surface. The included angle beta between the axis of the reflector cup 5 and the preset linear direction is 30-65 degrees, the preset linear direction is a connecting line between the sphere center of the concave spherical surface and the lowest point of the concave spherical surface, and when the angle beta is 45 degrees, the reflection and condensation effects of the reflector cup 5 are optimal.
Specifically, in one embodiment, the radii of the concave spherical surfaces of the concave mirrors are different, and the radius calculation formula of each concave mirror is as follows: d ═ a1+ a2+ A3;
Figure BDA0003291181320000051
wherein c is the distance from the spherical center of the concave spherical surface to the axis of the reflecting cup, h is the height of the reflecting cup, l is the length of the bus of the reflecting cup, gamma is the emission range of the light-emitting chip, and alpha is the included angle between l and h.
Specifically, in one embodiment, the full spectrum illumination lamp further comprises a heat sink 8; the substrate 1 has a first end face and a second end face; the lens 4 is adhered to the first end face through the inorganic packaging adhesive 3, the light emitting chip 2 is installed on the first end face, and the heat radiating fin 8 is installed on the second end face. The first end face is located on the upper end face of the substrate 1, and the second end face is located on the lower end face of the substrate 1. When the ultraviolet LED chip is electrically connected, heat can be conducted to the substrate 1 and then transferred to the radiating fin 8, and the radiating fin 8 increases the radiating performance of the device, so that the stability and the service life of the device are improved.
Specifically, in one embodiment, the substrate 1 is an Aluminum Nitride Ceramic (Aluminum Nitride Ceramic) which is a Ceramic having Aluminum Nitride (AIN) as a main crystal phase. The AIN crystal is a covalent bond compound with [ AIN4 ] tetrahedron as a structural unit, has a wurtzite structure, and belongs to a hexagonal system. The chemical composition AI is 65.81%, the N is 34.19%, the specific gravity is 3.261g/cm3, the crystal is white or gray white, the single crystal is colorless and transparent, and the sublimation decomposition temperature under normal pressure is 2450 ℃. Is a high-temperature heat-resistant material. Coefficient of thermal expansion (4.0-6.0) X10/deg.C. The heat conductivity of the polycrystalline AIN reaches 260W/(m.k), and is 5-8 times higher than that of alumina, so that the polycrystalline AIN has good thermal shock resistance and can resist extreme heat of 2200 ℃. In addition, aluminum nitride has the property of being resistant to attack by molten aluminum and other molten metals and gallium arsenide, and particularly has excellent resistance to attack by molten aluminum. The aluminum nitride ceramic can conduct heat to the ceramic substrate 1 while ensuring the electrical connection of the ultraviolet LED chip, thereby increasing the heat-conducting property of the device, and further improving the stability and the service life of the device.
Specifically, in one embodiment, the substrate 1 includes a wiring layer 11 and an insulating layer 12; the first end face is located on the wiring layer 11, and the second end face is located on the insulating layer 12. The wiring layer 11 is formed by evaporating and sputtering each metal layer on the substrate 1, applying a photoresist, and then etching the metal electrode through the steps of exposure, development, etching, and the like.
Specifically, in one embodiment, the bump manufacturing and annealing process is optimized on the wiring layer 11 to obtain a metal bump with low hardness and uniformity, so as to improve the bonding yield.
Specifically, in one embodiment, the insulating layer 12 is an epoxy board.
Specifically, in one embodiment, the ceramic substrate 1 is an insulator, and in order to electrically connect the metal layers on the upper and lower surfaces of the wiring layer 11 of the ceramic substrate 1, a through hole needs to be formed between the ceramic insulator bodies between the two metal layers.
Specifically, in one embodiment, the inorganic sealing compound 3 is a metal inorganic compound manufactured by a sol-gel method. The sol-gel process is a new approach in wet chemical processes for preparing materials.
In one embodiment, the subject name may replace the "full spectrum light" with a "light". In particular, in one embodiment, the subject name may replace the "full spectrum illumination lamp" with the "light emitting device". In particular, in one embodiment, the subject name may replace the "full spectrum illumination lamp" with the "light emitting device". Specifically, in one embodiment, the subject name may replace the "full spectrum light" with "LED light.
Specifically, in one embodiment, the light emitting chip 2 is a violet light emitting chip.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.

Claims (10)

1. A full spectrum light, its characterized in that: the LED packaging structure comprises a substrate, a light-emitting chip arranged on the substrate, inorganic packaging glue, a lens with a containing groove and a light reflecting cup; the lens is adhered to the substrate through the inorganic packaging adhesive, the inner wall of the accommodating groove and the substrate jointly enclose to form a sealed cavity, the reflection cup is located in the sealed cavity and is annular, and the light-emitting chip is located in the reflection cup.
2. The full spectrum lighting lamp as claimed in claim 1, wherein: the reflecting cup is provided with a first end connected with the substrate and a second end abutted against the lens; be equipped with the draw-in groove on the base plate, first serving is equipped with and is used for the card to go into block portion in the draw-in groove, anti-light cup will first sub-chamber and second sub-chamber are separated into to sealed chamber, luminous chip is located in first sub-intracavity.
3. The full spectrum lighting lamp as claimed in claim 1, wherein: the axis of the light reflecting cup is perpendicular to the substrate, the light emitting chip is positioned on the axis of the light reflecting cup, and the inner diameter of the light reflecting cup gradually increases along the axis of the light reflecting cup and in the direction departing from the substrate.
4. The full spectrum lighting lamp as claimed in claim 3, wherein: a concave mirror is arranged on the inner wall of the light reflecting cup; the quantity of concave mirror is a plurality of, a plurality of the concave mirror evenly distributed on the inner wall of reflection of light cup.
5. The full spectrum lighting lamp as claimed in claim 1, wherein: the heat dissipation plate also comprises a heat dissipation plate; the substrate is provided with a first end face and a second end face; the lens is adhered to the first end face through the inorganic packaging adhesive, the light-emitting chip is installed on the first end face, and the radiating fin is installed on the second end face.
6. The full spectrum lighting lamp as claimed in claim 1, wherein: the substrate is aluminum nitride ceramic.
7. The full spectrum lighting lamp as claimed in claim 5, wherein: the substrate comprises a wiring layer and an insulating layer; the first end face is located on the wiring layer, and the second end face is located on the insulating layer.
8. The full spectrum lighting lamp as claimed in claim 7, wherein: the insulating layer is an epoxy resin plate.
9. The full spectrum lighting lamp as claimed in claim 1, wherein: the inorganic packaging adhesive is an inorganic compound manufactured by a sol-gel method.
10. A full spectrum lighting lamp as claimed in any one of claims 1 to 9, wherein: the light emitting chip is a purple light LED chip.
CN202111165560.9A 2021-09-30 2021-09-30 Full-spectrum illuminating lamp Pending CN113775943A (en)

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CN108240583A (en) * 2016-12-27 2018-07-03 罗周连 A kind of LED ceiling lamp with optical lens lens cover
CN206370440U (en) * 2017-01-19 2017-08-01 厦门多彩光电子科技有限公司 A kind of LED filament and LED filament lamp
CN106898684A (en) * 2017-04-14 2017-06-27 桂林电子科技大学 A kind of multi-chip and UVLED array supports of connecting
CN208997978U (en) * 2018-10-08 2019-06-18 郑州森源新能源科技有限公司 LED automobile lamp
CN112151662A (en) * 2019-06-28 2020-12-29 王定锋 Circuit board module manufactured by LED lamp beads of glass diffusion cover and manufacturing method thereof
CN111578240A (en) * 2020-06-02 2020-08-25 张克清 Energy-saving lamp connecting device convenient to install based on capacitance change
CN111769397A (en) * 2020-07-22 2020-10-13 姜青青 Night anti-loosening socket
CN112332160A (en) * 2020-10-27 2021-02-05 於少林 Special crowd uses safe power socket
CN112524507A (en) * 2020-11-23 2021-03-19 戴祥禄 Shrink protection type does not have cover desk lamp

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