CN113766756A - 高密度线路板生产用显影去膜蚀刻装置及其实施方法 - Google Patents
高密度线路板生产用显影去膜蚀刻装置及其实施方法 Download PDFInfo
- Publication number
- CN113766756A CN113766756A CN202110916988.6A CN202110916988A CN113766756A CN 113766756 A CN113766756 A CN 113766756A CN 202110916988 A CN202110916988 A CN 202110916988A CN 113766756 A CN113766756 A CN 113766756A
- Authority
- CN
- China
- Prior art keywords
- plate
- inner cavity
- circuit board
- film
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 title claims abstract description 68
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 90
- 239000007864 aqueous solution Substances 0.000 claims abstract description 28
- 238000005096 rolling process Methods 0.000 claims abstract description 11
- 230000000694 effects Effects 0.000 claims abstract description 7
- 238000007667 floating Methods 0.000 claims description 34
- 239000000243 solution Substances 0.000 claims description 32
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 23
- 238000010438 heat treatment Methods 0.000 claims description 21
- 239000010453 quartz Substances 0.000 claims description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 239000012528 membrane Substances 0.000 claims description 6
- 230000005389 magnetism Effects 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 230000008569 process Effects 0.000 description 5
- 230000005484 gravity Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 210000003437 trachea Anatomy 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110916988.6A CN113766756B (zh) | 2021-08-11 | 2021-08-11 | 高密度线路板生产用显影去膜蚀刻装置及其实施方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110916988.6A CN113766756B (zh) | 2021-08-11 | 2021-08-11 | 高密度线路板生产用显影去膜蚀刻装置及其实施方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN113766756A true CN113766756A (zh) | 2021-12-07 |
CN113766756B CN113766756B (zh) | 2023-02-17 |
Family
ID=78788960
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110916988.6A Active CN113766756B (zh) | 2021-08-11 | 2021-08-11 | 高密度线路板生产用显影去膜蚀刻装置及其实施方法 |
Country Status (1)
Country | Link |
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CN (1) | CN113766756B (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102822614A (zh) * | 2009-09-17 | 2012-12-12 | 蓝瑚科技有限公司 | 传热和/或储热的系统及方法 |
JP2013053372A (ja) * | 2012-11-15 | 2013-03-21 | Ebara Corp | 磁性体膜めっき装置及びめっき処理設備 |
CN209745017U (zh) * | 2018-11-23 | 2019-12-06 | 重庆岩昱节能科技有限公司 | 一种高温熔岩造粒余热回收系统 |
EP3842149A1 (en) * | 2019-12-29 | 2021-06-30 | Applied Cells Inc. | Biological entity separation device |
-
2021
- 2021-08-11 CN CN202110916988.6A patent/CN113766756B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102822614A (zh) * | 2009-09-17 | 2012-12-12 | 蓝瑚科技有限公司 | 传热和/或储热的系统及方法 |
JP2013053372A (ja) * | 2012-11-15 | 2013-03-21 | Ebara Corp | 磁性体膜めっき装置及びめっき処理設備 |
CN209745017U (zh) * | 2018-11-23 | 2019-12-06 | 重庆岩昱节能科技有限公司 | 一种高温熔岩造粒余热回收系统 |
EP3842149A1 (en) * | 2019-12-29 | 2021-06-30 | Applied Cells Inc. | Biological entity separation device |
Also Published As
Publication number | Publication date |
---|---|
CN113766756B (zh) | 2023-02-17 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20211207 Assignee: XINFENG ZHENGTIANWEI ELECTRONIC TECHNOLOGIES Co.,Ltd. Assignor: XINFENG FUCHANGFA ELECTRONIC Co.,Ltd. Contract record no.: X2023980049034 Denomination of invention: Development and film removal etching device for high-density circuit board production and its implementation method Granted publication date: 20230217 License type: Common License Record date: 20231130 |
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EE01 | Entry into force of recordation of patent licensing contract | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20211207 Assignee: SHENZHEN ZHENGTIANWEI TECHNOLOGIES CO.,LTD. Assignor: XINFENG FUCHANGFA ELECTRONIC Co.,Ltd. Contract record no.: X2023980050304 Denomination of invention: Development and film removal etching device for high-density circuit board production and its implementation method Granted publication date: 20230217 License type: Common License Record date: 20231205 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Development and film removal etching device for high-density circuit board production and its implementation method Granted publication date: 20230217 Pledgee: Agricultural Bank of China Limited Xinfeng County Branch Pledgor: XINFENG FUCHANGFA ELECTRONIC Co.,Ltd. Registration number: Y2024980013496 |