CN113755930B - Device and method for guaranteeing stability of electroplating current - Google Patents
Device and method for guaranteeing stability of electroplating current Download PDFInfo
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- CN113755930B CN113755930B CN202111092770.XA CN202111092770A CN113755930B CN 113755930 B CN113755930 B CN 113755930B CN 202111092770 A CN202111092770 A CN 202111092770A CN 113755930 B CN113755930 B CN 113755930B
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
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- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a device and a method for ensuring the stability of electroplating current, wherein the device comprises: the water storage tank is a cavity with an opening at the upper part; at least one conductive seat which is arranged in the water storage tank at intervals; the end part of the conductive component is assembled on the conductive seat; the water inlet channels are arranged in the conductive seat at intervals, one end of each water inlet channel corresponds to the outer wall of the end part of the conductive assembly, and the other end of each water inlet channel extends to the outer wall of the conductive seat; a plurality of water outlet channels which are communicated with the bottom of the water storage tank at intervals. The method comprises a method for electroplating by adopting the device. The invention solves the technical problems that the connection part of the electroplating device is easy to oxidize and the current stability and the current efficiency are influenced in the prior art.
Description
Technical Field
The invention relates to the technical field of electrochemical surface treatment, in particular to a device and a method for guaranteeing stability of electroplating current.
Background
During electrochemical surface treatment, the conducting device for electroplating industry is mainly characterized in that a conducting copper seat is connected with a cathode, a plated material is placed at an anode, and an anode copper bar is connected with the cathode copper seat for conducting electricity.
However, the electroplating environment and the electrolyte are very easy to corrode the copper base and the anode copper rod, so that an oxide layer is very easy to form on the surfaces of the copper base and the anode copper rod, the resistance of a connection part is increased, and the electroplating current efficiency is finally influenced.
Disclosure of Invention
The invention aims to provide a device and a method for ensuring the stability of electroplating current, and solves the technical problems that in the prior art, the connection part of an electroplating device is easy to oxidize, and the current stability and the current efficiency are influenced.
The embodiment of the application discloses device that guarantee electroplating current is stable includes:
the water storage tank is a cavity with an opening at the upper part;
at least one conductive seat which is arranged in the water storage tank at intervals;
the end part of the conductive component is assembled on the conductive seat;
the water inlet channels are arranged in the conductive seat at intervals, one end of each water inlet channel corresponds to the outer wall of the end part of the conductive assembly, and the other end of each water inlet channel extends to the outer wall of the conductive seat;
and the water outlet channels are communicated with the bottom of the water storage tank at intervals.
The embodiment of the application designs the conductive seat, increases a plurality of water inlet channels, can realize intermittent type nature trickle to increase the wettability of conductive area, improve electrically conductive efficiency, effectively improve current utilization, guarantee the quality of electroplating.
On the basis of the technical scheme, the embodiment of the application can be further improved as follows:
furthermore, a V-shaped assembling groove is formed in the conductive seat;
the conductive component comprises a conductive rod, the end part of the conductive rod is V-shaped, the end part of the conductive rod is arranged in the assembling groove, and the beneficial effect of the step is that the conductive rod and the assembling groove are mutually matched to ensure the stability after assembly.
Furthermore, inhalant canal with the inner wall of assembly groove is perpendicular, adopts this step's beneficial effect to avoid rivers to pile up in the bottom of assembly groove perpendicularly through inhalant canal, influences subsequent current efficiency.
Furtherly, every the inhalant canal of electrically conductive seat is fourteen, inhalant canal evenly distributed in the both sides of assembly groove, the homogeneity that adopts this step can improve the trickle through many inhalant canals.
Further, the inlet channel that is located assembly trough one side divides into vertical interval distribution at least two, and the beneficial effect who adopts this step is through distributing into the inlet channel that two are listed as, can improve the homogeneity of drenching.
Further, the conductive assembly further comprises:
at least two conductive blocks respectively connected with two ends of the conductive rod;
the roller, both ends respectively with the inboard of conducting block is connected, adopts the beneficial effect of this step to be convenient for subsequent electroplating through conductive component.
Further, conductive component still includes waterproof silica gel, waterproof silica gel set up in the inboard of conducting block, the beneficial effect who adopts this step is to avoid the plating solution to exert an influence to subsequent electrically conductive.
Furthermore, the conducting seat is a red copper conducting seat, the conducting rod is a red copper rod with an outer layer wrapped with an acid-base resistant coating, and the beneficial effect of the step is that the stability of the current can be improved through the red copper material.
The application also discloses a method for ensuring the stability of electroplating current, wherein the device is adopted for electroplating, when the electroplating current is greater than 100A, water is injected into the water inlet channel every 10-20min, and the flow rate is not greater than 1L/min; and stopping injecting water into the water inlet channel when the electroplating current is less than or equal to 100A.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
1. a plurality of inhalant canals are increased in the embodiment of the application, and intermittent water spraying can be realized, so that the wettability of a conductive area is increased, the conductive efficiency is improved, the current utilization rate is effectively improved, and the electroplating quality is ensured.
2. The embodiment of the application changes the material that guide's electricity seat and conductive component used, carries out the intermittent type nature trickle simultaneously, and reinforcing conductive area wettability effectively improves current utilization and rates, improves electroplating article outward appearance quality.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic structural diagram of an apparatus for ensuring electroplating current stability according to an embodiment of the present invention;
FIG. 2 is a schematic view of a barrel portion of an apparatus for stabilizing a plating current according to an embodiment of the present invention;
FIG. 3 is a left side view of a conductive block of an apparatus for ensuring stable plating current according to an embodiment of the present invention;
FIG. 4 is a partial left side view of a conductive socket of an apparatus for ensuring stable plating current according to an embodiment of the present invention;
reference numerals:
1-a water storage tank; 2-a conductive seat; 3-a conductive component; 4-a water inlet channel; 5-a water outlet channel; 6-assembling a groove;
301-a conductive rod; 302-a conductive block; 303-a roller; 304-waterproof silica gel.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.
It is to be noted that, unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the present invention belongs.
In the description of the present application, it is to be understood that the terms "upper", "lower", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In order to better understand the technical scheme, the technical scheme is described in detail in the following with reference to the attached drawings and the detailed description.
Example (b):
as shown in fig. 1 and 4, the embodiment of the application discloses a device for ensuring stability of electroplating current, which comprises:
the water storage tank 1 is a cavity with an opening at the upper part, the water storage tank 1 is used for storing water, when water flow falls from a subsequent conductive seat, the water storage tank 1 can contain water, the water flow is prevented from flowing everywhere, and the specific shape of the water storage tank is not limited and can be a cuboid or other shapes;
the water storage tank comprises a water storage tank 1, at least one conductive seat 2 and at least two conductive rods, wherein the conductive seats 2 are arranged in the water storage tank 1 at intervals, the conductive seats 2 are used for supporting subsequent conductive components, and in order to ensure stable assembly of the subsequent conductive components 3, the conductive rods are arranged at intervals and used for placing the subsequent conductive components;
the end part of the conductive component 3 is assembled on the conductive seat 2;
the water inlet channels 4 are arranged in the conductive seat 2 at intervals, one end of each water inlet channel 4 corresponds to the outer wall of the end part of the conductive component 3, and the other end of each water inlet channel extends to the outer wall of the conductive seat 2. The water inlet channels 4 are arranged in the conductive seat 2, and when the water inlet device is used, water is injected from one end far away from the conductive component 3 and then flows into the outer wall of the conductive component 3, so that the cooling of the conductive component 3 is finished, meanwhile, the oxidation of the conductive component 3 is avoided, and the electroplating effect is ensured;
a plurality of exhalant passage 5, the interval communicate in 1 bottom of aqua storage tank, this exhalant passage 5 is used for the drainage, and rivers reach behind conducting component 3's the outer wall, can strike conducting component 3's outer wall, along inhalant passage 4's return to inside the backflow to aqua storage tank 1, then discharge from exhalant passage 5, guarantee the inside temperature of aqua storage tank 1.
In one embodiment, the conductive seat 2 is provided with a V-shaped assembling groove 6, and the assembling groove 6 is matched with the conductive rod of the conductive component to form a support, so that the stability of the conductive component 3 can be ensured;
conductive component 3 includes conducting rod 301, conducting rod 301's tip is the V type, just conducting rod 301's tip set up in inside the assembly groove 6, this conducting rod 301 is the V type, can closely laminate with assembly groove 6, guarantees its stability.
Wherein, inhalant canal 4 with the inner wall of assembly groove 6 is perpendicular, and this inhalant canal 4 is higher than the one end of keeping away from conducting rod 301 near the one end of conducting rod 301 simultaneously, promptly behind rivers striking conducting rod 301's the outer wall, can flow back along inhalant canal 4, and it is inside to get into aqua storage tank 1 at last, avoids rivers to pile up in 6 bottoms of assembly groove like this, influences subsequent electric conductivity.
In an embodiment, the number of the water inlet channels 4 of each conducting seat 2 is fourteen, the water inlet channels 4 are uniformly distributed on two sides of the assembling groove 6, and stable cooling of the conducting rod 301 can be ensured through a plurality of water inlet channels and uniform distribution.
In an embodiment, the water inlet channels 4 on one side of the assembling grooves 6 are divided into at least two rows which are vertically distributed at intervals, and in the embodiment, the assembling grooves 6 are distributed in a left-right staggered mode, so that the uniformity of water spraying can be improved.
As shown in fig. 1 to 3, the conductive component 3 further includes:
at least two conductive blocks 302 respectively connected to two ends of the conductive rod 301;
the roller 303 has two ends respectively connected to the inner sides of the conductive blocks 302, and the conductive assembly 3 in the embodiment of the present invention includes the conductive blocks 302 and the roller 303, which are conventional components and are used for electroplating.
Wherein, conducting component 3 still includes waterproof silica gel 304, waterproof silica gel 304 set up in the inboard of conducting block 302, inside waterproof silica gel 304 in this application can prevent that the plating solution from getting into the conducting block, lead to the conducting block to be stained with other partial metals, influence the electrically conductive effect.
In an embodiment, the conductive seat 2 is a red copper conductive seat, the conductive rod 301 is a red copper rod with an acid-base resistant coating wrapped on the outer layer, and the stability of the current can be ensured by the red copper material.
This application is to the electric conductivity experiment in red copper seat and brass seat, reachs actual current and current efficiency (actual current uses the clamp-on ammeter to measure), and the table is as follows:
example 2:
the application also discloses a method for ensuring the stability of the electroplating current, namely, the device in the embodiment 1 is adopted for electroplating; in actual electroplating, when the electroplating current is more than 100A, injecting water into the water inlet channel every 20min at a flow rate of not more than 1L/min; and stopping injecting water into the water inlet channel when the electroplating current is less than or equal to 100A.
Example 3:
the application also discloses a method for ensuring the stability of the electroplating current, namely, the device in the embodiment 1 is adopted for electroplating; in actual electroplating, when the electroplating current is greater than 100A, water is injected into the water inlet channel every 15min, and the flow rate is not greater than 1L/min; and stopping injecting water into the water inlet channel when the electroplating current is less than or equal to 100A.
Example 4:
the application also discloses a method for ensuring the stability of the electroplating current, namely, the device in the embodiment 1 is adopted for electroplating; in actual electroplating, when the electroplating current is more than 100A, water is injected into the water inlet channel every 10min, and the flow rate is not more than 1L/min; and stopping injecting water into the water inlet channel when the electroplating current is less than or equal to 100A.
The tables prepared in examples 2 to 4, and using the conventional method on the market as a control, are as follows:
therefore, the current efficiency of the electroplating device is far greater than that of the conventional electroplating device and method.
In the description of the present invention, numerous specific details are set forth. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Moreover, various embodiments or examples and features of various embodiments or examples described in this specification can be combined and combined by one skilled in the art without being mutually inconsistent.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention, and they should be construed as being included in the following claims and description.
Claims (7)
1. An apparatus for ensuring stable electroplating current, comprising:
the water storage tank is a cavity with an opening at the upper part;
at least one conductive seat which is arranged in the water storage tank at intervals;
the end part of the conductive component is assembled on the conductive seat;
the water inlet channels are arranged in the conductive seat at intervals, one end of each water inlet channel corresponds to the outer wall of the end part of the conductive assembly, and the other end of each water inlet channel extends to the outer wall of the conductive seat;
the water outlet channels are communicated with the bottom of the water storage tank at intervals;
a V-shaped assembling groove is formed in the conductive seat;
the conductive assembly comprises a conductive rod, the end part of the conductive rod is V-shaped, and the end part of the conductive rod is arranged in the assembling groove;
the inlet channel is perpendicular to the inner wall of the assembling groove, and one end of the inlet channel, which is close to the conducting rod, is higher than one end of the inlet channel, which is far away from the conducting rod.
2. The apparatus of claim 1, wherein the number of water inlet channels of each conductive seat is fourteen, and the water inlet channels are uniformly distributed on two sides of the assembly groove.
3. The device for ensuring the stability of electroplating current according to claim 2, wherein the water inlet channels at one side of the assembly groove are divided into at least two rows which are vertically distributed at intervals.
4. The apparatus of claim 2, wherein the conductive assembly further comprises:
at least two conductive blocks respectively connected with two ends of the conductive rod;
and two ends of the roller are respectively connected with the inner sides of the conductive blocks.
5. The device of claim 4, wherein the conductive assembly further comprises a waterproof silicone rubber disposed on an inner side of the conductive block.
6. The device for ensuring the stability of the electroplating current according to claim 2, wherein the conductive seat is a red copper conductive seat, and the conductive rod is a red copper rod coated with an acid-base resistant coating.
7. A method for guaranteeing stable electroplating current is characterized in that the device of any one of claims 1 to 6 is adopted for electroplating, when the electroplating current is more than 100A, water is injected into the water inlet channel every 10 to 20min, and the flow rate is not more than 1L/min; and when the electroplating current is less than or equal to 100A, stopping filling water into the water inlet channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111092770.XA CN113755930B (en) | 2021-09-17 | 2021-09-17 | Device and method for guaranteeing stability of electroplating current |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111092770.XA CN113755930B (en) | 2021-09-17 | 2021-09-17 | Device and method for guaranteeing stability of electroplating current |
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| CN113755930A CN113755930A (en) | 2021-12-07 |
| CN113755930B true CN113755930B (en) | 2023-01-13 |
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Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201605340U (en) * | 2010-01-29 | 2010-10-13 | 锦州万友机械部件有限公司 | Plated conductive seat |
| CN102011170B (en) * | 2010-07-06 | 2012-06-13 | 无锡出新环保设备有限公司 | Water-bath type cooling V-shaped electroplating seat |
| CN202116676U (en) * | 2011-05-30 | 2012-01-18 | 昆山市华涛电子有限公司 | V-shaped seat for electroplating line |
| CN202705534U (en) * | 2012-08-09 | 2013-01-30 | 成都明天高新产业有限责任公司 | Improved printed circuit board (PCB) electroplating copper cell negative electrode V-shaped base |
| CN203320167U (en) * | 2013-06-04 | 2013-12-04 | 重庆科发表面处理有限责任公司 | V-shaped electroplating seat |
| CN105603496B (en) * | 2016-03-16 | 2019-02-01 | 无锡出新环保设备有限公司 | A kind of water-cooled conductive seat for electroplating device |
| CN109957829B (en) * | 2019-04-28 | 2020-09-18 | 安泰科技股份有限公司 | Conductive seat for electroplating roller |
| CN211972482U (en) * | 2020-01-17 | 2020-11-20 | 深圳市睿昌盛精密科技有限公司 | V-shaped electrifying base for surface treatment |
| CN212983090U (en) * | 2020-06-27 | 2021-04-16 | 扬州依利安达电子有限公司 | Novel electroplating 'V' seat external cooling device |
| CN213172644U (en) * | 2020-07-31 | 2021-05-11 | 江门市超越科技有限公司 | Water-cooled conductive seat for electroplating equipment |
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