CN114790564A - Electroplating device with deplating function - Google Patents
Electroplating device with deplating function Download PDFInfo
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- CN114790564A CN114790564A CN202210466216.1A CN202210466216A CN114790564A CN 114790564 A CN114790564 A CN 114790564A CN 202210466216 A CN202210466216 A CN 202210466216A CN 114790564 A CN114790564 A CN 114790564A
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- deplating
- electroplating
- conductive roller
- power supply
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to the technical field of electroplating equipment, in particular to an electroplating device with a deplating function, which comprises an electroplating pool, a deplating component, a conductive roller, an electroplating anode, an electroplating power supply and a deplating power supply, wherein the electroplating pool is arranged on the electroplating pool; the deplating component, the conductive roller and the electroplating anode are all positioned in the electroplating pool; the deplating component comprises a deplating cathode; the electroplating power supply is connected with the electroplating anode and the conductive roller; the deplating power supply is connected with the deplating cathode and the conductive roller. The electroplating power supply is connected with the electroplating anode and the conductive roller, the conductive roller is contacted with the plated object, so that the plated object and the electroplating anode form an electroplating loop, the deplating power supply is connected with the deplating cathode and the conductive roller to form a deplating loop, namely the conductive roller forms two loops, the conductive roller can be electroplated with electroplating metal in the electroplating loop, and the electroplating metal on the conductive roller in the deplating loop is electrolyzed and reduced into metal ions to return to the electroplating solution, thereby effectively realizing the effect of electroplating while deplating.
Description
Technical Field
The invention relates to the technical field of electroplating equipment, in particular to an electroplating device with a deplating function.
Background
The electroplating process adopted by the electroplating equipment is a process for plating a thin layer of other metals or alloys on the surfaces of certain metals by utilizing an electrolysis principle, and is a process for attaching a layer of metal film on the surfaces of the metals or other material parts by utilizing an electrolysis effect so as to play roles of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), improving the appearance and the like.
The electroplating equipment is usually provided with an upper row of conductive rollers and a lower row of conductive rollers, a plated object enters between the two rows of conductive rollers, each conductive roller in the two rows of conductive rollers rotates respectively to move the plated object forward, and the plated object is electrified by electrifying the conductive rollers so as to complete the electroplating operation of the plated object in the moving process.
The conductive roller in the scheme is generally communicated with a cathode to enable an object to be plated to be also formed into a cathode, an outer metal conductive layer of the conductive roller is in a column shape which is integrally formed, namely the outer metal conductive layer of the conductive roller can be integrally formed into the cathode, an anode plate is arranged in the electroplating equipment at a position which is not far away from the object to be plated and the conductive roller to enable the object to be plated and the anode plate to form a loop, but the conductive roller and the anode plate can form the loop at the same time, namely the conductive roller is electroplated at the same time, and the electroplating metal is plated on the conductive roller to enable the surface of the conductive roller to be uneven under long-time operation, so that a hump effect can be generated, the electroplating quality is influenced, and the maintenance frequency is increased.
Disclosure of Invention
The invention aims to provide an electroplating device which can realize electroplating and deplating of electroplating equipment.
In order to solve the technical problems, the invention adopts the following technical scheme:
an electroplating device with a deplating function comprises an electroplating pool, a deplating assembly, a conductive roller, an electroplating anode, an electroplating power supply and a deplating power supply; the deplating component, the conductive roller and the electroplating anode are all positioned in the electroplating pool;
the deplating component comprises a deplating cathode;
the electroplating power supply is connected with the electroplating anode and the conductive roller;
the deplating power supply is connected with the deplating cathode and the conductive roller.
Preferably, the deplating assembly further comprises a deplating box and a diaphragm, the deplating box is provided with an accommodating cavity and an opening communicated with the accommodating cavity, the deplating cathode is installed in the accommodating cavity, the diaphragm is covered on the opening, and the opening faces the conductive roller.
Preferably, the deplating cathode is arranged on the inner bottom surface of the accommodating cavity and is opposite to the diaphragm.
Preferably, the separator is capable of blocking metal ions.
Preferably, the device also comprises a liquid storage tank and a pumping pump; the containing cavity is respectively communicated with the liquid storage tank and the pumping pump through pipelines, and the liquid storage tank is communicated with the pumping pump through pipelines.
Preferably, the conductive rollers are arranged in two rows and are symmetrically arranged, the electroplating anode is arranged between two adjacent conductive rollers in the same row of conductive rollers, and the conductive rollers and the deplating assemblies are arranged in a one-to-one correspondence manner.
Preferably, the anode of the electroplating power supply is connected with the electroplating anode, and the cathode of the electroplating power supply is connected with the conductive roller;
the positive pole of the deplating power supply is connected with the conductive roller, and the negative pole of the deplating power supply is connected with the deplating cathode.
The invention has the beneficial effects that:
the utility model provides an electroplating device with deplating function, including installing deplating subassembly and the conducting roller of mutually supporting in electroplating bath, electroplating power connects electroplating positive pole and conducting roller, and the conducting roller contacts by the thing of plating, causes the thing of plating and electroplating positive pole to form the electroplating return circuit, deplating power connects deplating negative pole and conducting roller and forms the deplating return circuit, that is to say the conducting roller forms two return circuits, the conducting roller can be electroplated with the plating metal in electroplating return circuit, the electroplating metal on the conducting roller reduces into metal ion and gets back to the plating solution again in the deplating return circuit, and then effectively realize the effect of deplating while electroplating.
Drawings
Fig. 1 is a schematic sectional view of the side structure of the present invention.
FIG. 2 is a schematic sectional view of the side structure of the deplating assembly and the conductive roller in the invention.
FIG. 3 is a schematic view of the connection of the deplating assembly with the reservoir and the pump according to the present invention.
Detailed Description
The present invention will be further described with reference to the following examples, which are not intended to limit the scope of the present invention.
As shown in fig. 1 to 3, an electroplating device with a deplating function comprises an electroplating pool 1, a deplating component 2, a conductive roller 3, an electroplating anode 4, an electroplating power supply U1 and a deplating power supply U2; the deplating component 2, the conductive roller 3 and the electroplating anode 4 are all positioned in the electroplating pool 1;
the deplating component 2 comprises a deplating cathode 21;
the electroplating power supply U1 is connected with the electroplating anode 4 and the conductive roller 3;
the stripping power supply U2 is connected with the stripping cathode 21 and the conductive roller 3.
In practical operation of the electroplating apparatus with deplating function of this embodiment, the positive electrode of the electroplating power supply U1 is connected to the electroplating anode 4, the negative electrode of the electroplating power supply U1 is connected to the conductive roller 3, and the conductive roller 3 contacts the object to be plated 7, so that the object to be plated 7 and the electroplating anode 4 form an electroplating loop; the anode of the deplating power supply U2 is connected with the conductive roller 3, and the cathode of the deplating power supply U2 is connected with the deplating cathode 21, so that the deplating cathode 21 and the conductive roller 3 form a deplating loop; that is, the conductive roller 3 forms two loops in which the conductive roller 3 is electroplated with the plating metal, and in which the plating metal on the conductive roller 3 is electrolytically reduced back to the plating solution again.
In this embodiment, the deplating assembly 2 further comprises a deplating box 22 and a diaphragm 23, the deplating box 22 is provided with an accommodating cavity 24 and an opening communicated with the accommodating cavity 24, the deplating cathode 21 is installed in the accommodating cavity 24, the diaphragm 23 covers the opening, and the opening faces the conductive roller 3.
The deplating cathode 21 is made of at least one of flaky, net-shaped and unconfined titanium and stainless steel which can be used as a plating cathode material.
In the deplating loop, the electroplated metal on the surface of the conductive roller 3 is electrolyzed and reduced into metal ions to return to the electrolyte and move towards the deplating cathode 21, but due to the obstruction of the diaphragm 23, the metal ions can only stay in the electroplating solution outside the deplating box 22 and then are electroplated on the plated object 7 by the electroplating loop again, and the metal ions electrolytically separated from the surface of the conductive roller 3 are recycled while the electroplating and the deplating are realized, so as to solve the problem of frequent maintenance, wherein the frequent maintenance comprises replacing the deplating cathode 21 because if the electroplated metal on the surface of the conductive roller 3 is only transferred onto the deplating cathode 21, the deplating cathode 21 needs to be replaced at every certain time to ensure the deplating effect.
In this embodiment, the deplating cathode 21 is installed on the inner bottom surface of the accommodating cavity 24 and is opposite to the diaphragm 23. The stripping cathode 21 is opposite to the diaphragm 23, that is to say the stripping cathode 21 is also opposite to the conductive roller 3 towards the opening.
In this embodiment, the separator 23 is capable of blocking metal ions. The diaphragm 23 is made of ion material, metal ions are larger than the ions of the diaphragm 23 and do not pass through the diaphragm 23, and hydrogen ions are smaller than the ions of the diaphragm 23 and can freely pass through the diaphragm 23.
In this embodiment, the device further comprises a liquid storage tank 5 and a pumping pump 6; the accommodating cavity 24 is respectively communicated with the liquid storage tank 5 and the pumping pump 6 through pipelines, and the liquid storage tank 5 is communicated with the pumping pump 6 through a pipeline.
The pumping pump 6 is preferably a pump; the accommodating cavity 24 is filled with electrolyte; the electrolytic reduction reaction of the conductive roller 3 generates gas in the accommodating cavity 24, the pumping pump 6 pumps electrolyte from the liquid storage tank 5 through a pipeline and conveys the electrolyte into the accommodating cavity 24, the electrolyte in the accommodating cavity 24 flows back to the liquid storage tank 5 through another pipeline due to the pumping of the pumping pump 6 to form circulation, and the gas is also taken out of the accommodating cavity 24 through the circulation.
As shown in fig. 1, in this embodiment, the conductive rollers 3 are arranged in two rows and are symmetrically arranged, wherein the plating anode 4 is disposed between two adjacent conductive rollers 3 in the same row of conductive rollers 3, and the conductive rollers 3 and the deplating assemblies 2 are disposed in a one-to-one correspondence manner.
In practical operation, two rows of symmetrically arranged conductive rollers 3 are arranged in a plating pool 1, a plated object 7 enters between the two rows of conductive rollers 3, each conductive roller 3 in the two rows of conductive rollers 3 respectively rotates to enable the plated object 7 to advance, meanwhile, the negative pole of a plating power supply U1 is connected with the conductive rollers 3, the positive pole of the plating power supply U1 is connected with a plating anode 4, and the conductive rollers 3 are contacted with the plated object 7, so that the plated object 7 and the plating anode 4 form a plating loop to enable metal ions in a plating solution to be plated on the plated object 7;
the deplating components 2 correspond to the conductive rollers 3 one by one, and the deplating components 2 are arranged on one side of each conductive roller 3, which is far away from the plated object 7; the positive electrode of the deplating power supply U2 is connected with the conductive roller 3, the negative electrode of the deplating power supply U2 is connected with the deplating cathode 21, one side surface of the conductive roller 3 close to the deplating cathode 21 and the deplating cathode 21 form a deplating loop, the deplating loop electrolytically reduces the plated metal on the conductive roller 3 into metal ions which return to the electrolyte and move towards the deplating cathode 21, but due to the arrangement of the diaphragm 23, the metal ions cannot pass through the diaphragm 23, and then the metal ions are electroplated on the plated object 7 by the electroplating loop, so that the metal ions are recycled.
In the description of the present invention, it should be noted that, for the terms of orientation, such as "central", "lateral (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate that the orientation and positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific scope of the present invention.
Furthermore, if the terms "first" and "second" are used for descriptive purposes only, they are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. Thus, a definition of "a first" or "a second" feature may explicitly or implicitly include one or more of the features, and in the description of the invention, "a number" means two or more unless explicitly defined otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "assembled", "connected", and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; mechanical connection is also possible; the two elements can be directly connected with each other or connected with each other through an intermediate medium, and the two elements can be communicated with each other. The specific meanings of the above-mentioned terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
The above-mentioned embodiments only express a plurality of embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (7)
1. Electroplating device with deplating function, its characterized in that: comprises an electroplating pool (1), a deplating component (2), a conductive roller (3), an electroplating anode (4), an electroplating power supply (U1) and a deplating power supply (U2); the deplating component (2), the conductive roller (3) and the electroplating anode (4) are all positioned in the electroplating pool (1);
the deplating component (2) comprises a deplating cathode (21);
the electroplating power supply (U1) is connected with the electroplating anode (4) and the conductive roller (3);
the deplating power supply (U2) is connected with the deplating cathode (21) and the conductive roller (3).
2. An electroplating device with a deplating function according to claim 1, wherein: the deplating component (2) further comprises a deplating box (22) and a diaphragm (23), wherein the deplating box (22) is provided with an accommodating cavity (24) and an opening communicated with the accommodating cavity (24), the deplating cathode (21) is installed in the accommodating cavity (24), the diaphragm (23) is covered on the opening, and the opening faces the conductive roller (3).
3. An electroplating device with a deplating function according to claim 2, wherein: the deplating cathode (21) is arranged on the inner bottom surface of the accommodating cavity (24) and is opposite to the diaphragm (23).
4. An electroplating apparatus with a deplating function according to claim 2, wherein: the membrane (23) is capable of blocking metal ions.
5. An electroplating apparatus with a deplating function according to claim 2, wherein: the device also comprises a liquid storage tank (5) and a pumping pump (6); the accommodating cavity (24) is respectively communicated with the liquid storage tank (5) and the pumping pump (6) through pipelines, and the liquid storage tank (5) is communicated with the pumping pump (6) through a pipeline.
6. An electroplating apparatus with a deplating function according to claim 1, wherein: the conductive rollers (3) are arranged in two rows and are symmetrically arranged, the electroplating anodes (4) are arranged between two adjacent conductive rollers (3) in the same row of conductive rollers (3), and the conductive rollers (3) and the deplating assemblies (2) are arranged in a one-to-one correspondence manner.
7. An electroplating device with a deplating function according to claim 1, wherein: the anode of the electroplating power supply (U1) is connected with the electroplating anode (4), and the cathode of the electroplating power supply (U1) is connected with the conductive roller (3);
the positive pole of the deplating power supply (U2) is connected with the conductive roller (3), and the negative pole of the deplating power supply (U2) is connected with the deplating cathode (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210466216.1A CN114790564A (en) | 2022-04-29 | 2022-04-29 | Electroplating device with deplating function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210466216.1A CN114790564A (en) | 2022-04-29 | 2022-04-29 | Electroplating device with deplating function |
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| Publication Number | Publication Date |
|---|---|
| CN114790564A true CN114790564A (en) | 2022-07-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210466216.1A Pending CN114790564A (en) | 2022-04-29 | 2022-04-29 | Electroplating device with deplating function |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117144452A (en) * | 2023-10-07 | 2023-12-01 | 广东捷盟智能装备有限公司 | Electroplating mechanism for removing long copper of conductive roller |
| WO2024037008A1 (en) * | 2022-08-19 | 2024-02-22 | 昆山科比精工设备有限公司 | Cathode conductive device and electroplating equipment |
| WO2024067514A1 (en) * | 2022-09-26 | 2024-04-04 | 隆基绿能科技股份有限公司 | Solar cell electroplating device and solar cell electroplating method |
-
2022
- 2022-04-29 CN CN202210466216.1A patent/CN114790564A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024037008A1 (en) * | 2022-08-19 | 2024-02-22 | 昆山科比精工设备有限公司 | Cathode conductive device and electroplating equipment |
| WO2024067514A1 (en) * | 2022-09-26 | 2024-04-04 | 隆基绿能科技股份有限公司 | Solar cell electroplating device and solar cell electroplating method |
| CN117144452A (en) * | 2023-10-07 | 2023-12-01 | 广东捷盟智能装备有限公司 | Electroplating mechanism for removing long copper of conductive roller |
| CN117144452B (en) * | 2023-10-07 | 2024-08-09 | 广东捷盟智能装备股份有限公司 | Electroplating mechanism for removing long copper of conductive roller |
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