CN102011170B - Water-bath type cooling V-shaped electroplating seat - Google Patents
Water-bath type cooling V-shaped electroplating seat Download PDFInfo
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- CN102011170B CN102011170B CN201010218330XA CN201010218330A CN102011170B CN 102011170 B CN102011170 B CN 102011170B CN 201010218330X A CN201010218330X A CN 201010218330XA CN 201010218330 A CN201010218330 A CN 201010218330A CN 102011170 B CN102011170 B CN 102011170B
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Abstract
The invention discloses a water-bath type cooling V-shaped electroplating seat, comprising a cathode V-shaped conductive seat matched with a cathode conductive head and a copper bar connected with the cathode of a power supply, wherein the upper end of the conductive seat is provided with a cooling water hole through which cooling water is introduced into a V-shaped groove, the bottom of the conductive seat is fixedly provided with a stainless steel standing water tray, the stainless steel standing water tray is communicated with the V-shaped groove and is provided with a water outlet, the water outlet is connected with a cleaning tank of electroplating equipment, the cooling water of the cooling device of the electroplating seat flows through the V-shaped groove of the conductive seat, cools down the conductive seat and then is discharged into the standing water tray, the cooling water in the standing water tray is further utilized to fully cool down the exterior of the conductive seat so that the oxidation of a V-shaped contact surface between the conductive head and the conductive seat is reduced, and the cooling water in the standing water tray is then discharged into the cleaning tank of the electroplating equipment for reuse.
Description
Technical field
The present invention relates to a kind of Electroplating Production utility appliance, particularly relate to a kind of water-bath type cooling and electroplate the V-type seat.
Background technology
As everyone knows; Electroplating industry utilizes the V-type seat to accomplish the location and the conduction work of plating piece as negative electrode usually; Usually according to the size of the weight decision V-type seat of electroplating required strength of current and plating piece, the chromium plating cathode block is the copper conductive seat of V-type, and the copper V-type conductive seat of traditional chromium plating in the course of the work; Contact surface at conductive head and V-type conductive seat passes through the rubescent promote the oxidation of can generating heat owing to having than big electric current; Produce phenomenons such as loose contact, sparking, cause the electroplating parts quality to be affected, and have certain potential safety hazard.
Summary of the invention
The object of the present invention is to provide a kind of water-bath type cooling to electroplate the V-type seat, it has simple in structure, and good cooling results is energy-conservation, and the characteristics that improve processing safety.
The objective of the invention is to realize through following technical scheme:
The V-type seat is electroplated in a kind of water-bath type cooling, and it comprises cathode V-type conductive seat that cooperates the setting of negative electrode conductive head and the copper bar that connects power cathode, wherein, offers cooling water hole on the said conductive seat, and water coolant is introduced in the V-type groove through cooling water hole.
The bottom of said conductive seat is fixed with stainless steel ponding pallet, and said ponding pallet is connected with the V-type groove, and offers posticum on the said ponding pallet.
Said posticum connects the rinse bath of electroplating device.
Said cooling water hole is opened in the upper end of conductive seat.
Also be provided with the limiting plate that the aid in guide conductive head descends on the said conductive seat.
Beneficial effect of the present invention is that said water-bath type cooling is electroplated the V-type seat and on conductive seat, offered cooling water hole, and is fixed with stainless steel ponding pallet in its bottom; Cooling-water flowing enters the ponding pallet after the V-type groove of conductive seat cools off conductive seat, utilize the water coolant in the ponding pallet that the conductive seat outside is fully cooled off again, has reduced the oxidation of conductive head and conductive seat V-type contact surface; Water coolant in the said ponding pallet enters the rinse bath of electroplating device again; Reuse, not only simple in structure, good cooling results; And energy-conservation, improved processing safety.
Description of drawings
According to accompanying drawing and embodiment the present invention is done further explain below.
Fig. 1 is the sectional view of water-bath type cooling plating V-type seat of the present invention,
Fig. 2 electroplates the side-view of V-type seat for water-bath type cooling of the present invention.
Among the figure:
1, conductive seat; 2, conductive head; 3, cooling water hole; 4, V-type groove; 5, ponding pallet; 6, posticum; 7, standing bolt; 8, limiting plate; 9, copper bar; 10, rinse bath.
Embodiment
See also Fig. 1 and shown in Figure 2, Fig. 1 is the sectional view of water-bath type cooling plating V-type seat of the present invention, and Fig. 2 is the side-view that the V-type seat is electroplated in water-bath type cooling of the present invention.
In present embodiment; Said water-bath type cooling is electroplated the V-type seat and is comprised the cathode V-type conductive seat 1 that cooperates negative electrode conductive head 2 to be provided with, and the lower end of said conductive seat 1 is fixed with the copper bar 9 that is connected with the negative pole of power supply, and the negative charge of power supply passes to conductive head 2 through copper bar 9 and conductive seat 1 like this; Conductive head 2 is transferred to negative charge on the workpiece through copper bar 9 again; Electrolytic solution is got back to anode bar and is formed the plating loop in the negative charge entering groove, and offers cooling water hole 3 on the said conductive seat 1, and water coolant is introduced in the V-type grooves 4 through cooling water hole 3; The bottom of said conductive seat 1 is fixed with stainless steel ponding pallet 5 through standing bolt 7; Said ponding pallet 5 is connected with V-type groove 4, and offers posticum 6 on the said ponding pallet 5, and said posticum 6 connects the rinse bath 10 of electroplating device; In addition, also be provided with the limiting plate 8 that aid in guide conductive head 2 descends on the said conductive seat 1.
During work, conductive head 2 drops in the conductive seat 1 in the guiding of limiting plate 8, and cooling-water flowing cools off through 4 pairs of conductive seats 1 of V-type groove of conductive seat 1; Water guarantees that originally as dielectric medium conduction is good when non-closely cooperating, and enters ponding pallet 5 then; Utilize the water coolant in the ponding pallet 5 that conductive seat 1 outside is fully cooled off again, guaranteed the working temperature of conductive seat 1, even big electric current is not through generating heat yet; Reduced the oxidation of conductive head 2, and water has increased the contact area of conductive head 2 with V-type conductive seat 1 as conducting medium with conductive seat 1V contact surface; Reduced the equivalent load in the loop, so the output rating reduction, reach energy-conservation effect; Water coolant in the last ponding pallet 5 enters the rinse bath 10 of electroplating device again, reuses the conserve water resource.
Claims (5)
1. the V-type seat is electroplated in a water-bath type cooling, and it comprises cathode V-type conductive seat that cooperates the setting of negative electrode conductive head and the copper bar that connects power cathode, it is characterized in that: offer cooling water hole on the said conductive seat, water coolant is introduced in the V-type groove through cooling water hole.
2. the V-type seat is electroplated in water-bath type cooling according to claim 1, and it is characterized in that: the bottom of said conductive seat is fixed with stainless steel ponding pallet, and said ponding pallet is connected with the V-type groove, and offers posticum on the said ponding pallet.
3. electroplate the V-type seat according to claim 1 or 2 each described water-bath type coolings, it is characterized in that: said posticum connects the rinse bath of electroplating device.
4. the V-type seat is electroplated in water-bath type cooling according to claim 3, and it is characterized in that: said cooling water hole is opened in the upper end of conductive seat.
5. the V-type seat is electroplated in water-bath type cooling according to claim 4, it is characterized in that: also be provided with the limiting plate that the aid in guide conductive head descends on the said conductive seat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010218330XA CN102011170B (en) | 2010-07-06 | 2010-07-06 | Water-bath type cooling V-shaped electroplating seat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010218330XA CN102011170B (en) | 2010-07-06 | 2010-07-06 | Water-bath type cooling V-shaped electroplating seat |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102011170A CN102011170A (en) | 2011-04-13 |
| CN102011170B true CN102011170B (en) | 2012-06-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010218330XA Active CN102011170B (en) | 2010-07-06 | 2010-07-06 | Water-bath type cooling V-shaped electroplating seat |
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| CN (1) | CN102011170B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102383168B (en) * | 2011-08-22 | 2015-03-04 | 无锡鼎亚电子材料有限公司 | Pressing wheel type conductive slot |
| CN105603496B (en) * | 2016-03-16 | 2019-02-01 | 无锡出新环保设备有限公司 | A kind of water-cooled conductive seat for electroplating device |
| CN105714364B (en) * | 2016-03-30 | 2018-07-03 | 河南平高电气股份有限公司 | A kind of plating cathode conducting seat, plating cathode electric installation and electroplating device |
| CN112853435B (en) * | 2020-12-22 | 2022-02-18 | 纽堡科技(天津)有限公司 | Conductive V-shaped seat device |
| CN113755930B (en) * | 2021-09-17 | 2023-01-13 | 扬州虹扬科技发展有限公司 | Device and method for guaranteeing stability of electroplating current |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2705473Y (en) * | 2004-04-23 | 2005-06-22 | 上海应用技术学院 | Electroplating V-shape base for increasing conductivity |
| CN201186957Y (en) * | 2008-04-30 | 2009-01-28 | 深圳市兴森快捷电路科技股份有限公司 | Base for electroplating printed circuit board |
| CN201770797U (en) * | 2010-07-06 | 2011-03-23 | 无锡出新环保设备有限公司 | Water bath type cooling and electroplating V-shaped seat |
-
2010
- 2010-07-06 CN CN201010218330XA patent/CN102011170B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2705473Y (en) * | 2004-04-23 | 2005-06-22 | 上海应用技术学院 | Electroplating V-shape base for increasing conductivity |
| CN201186957Y (en) * | 2008-04-30 | 2009-01-28 | 深圳市兴森快捷电路科技股份有限公司 | Base for electroplating printed circuit board |
| CN201770797U (en) * | 2010-07-06 | 2011-03-23 | 无锡出新环保设备有限公司 | Water bath type cooling and electroplating V-shaped seat |
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| Publication number | Publication date |
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| CN102011170A (en) | 2011-04-13 |
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