CN218175164U - Solar cell electroplating device - Google Patents
Solar cell electroplating device Download PDFInfo
- Publication number
- CN218175164U CN218175164U CN202221853188.0U CN202221853188U CN218175164U CN 218175164 U CN218175164 U CN 218175164U CN 202221853188 U CN202221853188 U CN 202221853188U CN 218175164 U CN218175164 U CN 218175164U
- Authority
- CN
- China
- Prior art keywords
- solar cell
- electroplating
- unit
- clamping assembly
- sub
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The application discloses solar wafer electroplating device relates to the solar photovoltaic technology field. The solar cell electroplating device comprises: the electroplating bath is provided with a liquid inlet and a liquid outlet, and an anode electrically connected with the anode of an electroplating power supply is arranged in the electroplating bath; the conductive clamping assembly is arranged in the electroplating bath and is electrically connected with the negative electrode of the electroplating power supply, and the conductive clamping assembly is used for clamping the solar cell and is electrically connected with the solar cell; the conductive clamping assembly is adjacent to at least one of the liquid inlet and the liquid outlet. Under the clamping and fixing action of the conductive clamping assembly, the influence of eddy currents formed by the liquid inlet and the liquid outlet on the solar cell can be reduced, the solar cell is in a relatively stable environment, the risks of breakage and hidden cracking of the solar cell are reduced, and the yield of the solar cell is improved.
Description
Technical Field
The application belongs to the technical field of solar photovoltaic, and particularly relates to a solar cell electroplating device.
Background
At present, the electroplating technology is widely researched as a novel electrode preparation method of a solar cell. As a promising electrode preparation method, electroplating not only can greatly reduce the cost in the production process of the solar cell, but also the electrode prepared by the electroplating technology has higher height-width ratio and better conductivity compared with the electrode prepared by the traditional screen printing, the internal resistance of the cell is lower, the shading loss can be reduced, and the photoelectric conversion efficiency of the solar cell can be effectively improved.
When preparing an electrode by a traditional electroplating technology, in order to improve the electroplating quality, a liquid inlet and a liquid outlet are usually arranged on an electroplating bath, and the circulation of electroplating liquid in the electroplating bath is realized by utilizing the liquid inlet and the liquid outlet.
When the electroplating bath with the liquid inlet and the liquid outlet is used for preparing the electrode, because eddy currents are easily formed at the liquid inlet and the liquid outlet, the fluctuation of electroplating liquid is large, the problem that solar cells are broken and hidden and cracked is easily caused, and the yield of the solar cells is reduced.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application aims to provide a solar cell electroplating device, which can solve the problems of easy breakage and hidden cracking of a solar cell in an electroplating process.
In order to solve the technical problem, the present application is implemented as follows:
the embodiment of the application provides a solar wafer electroplating device, solar wafer electroplating device includes:
the electroplating bath is provided with a liquid inlet and a liquid outlet, and an anode electrically connected with a positive electrode of an electroplating power supply is arranged in the electroplating bath;
the conductive clamping assembly is arranged in the electroplating bath and is electrically connected with the cathode of the electroplating power supply, and the conductive clamping assembly is used for clamping the solar cell and is electrically connected with the solar cell;
the conductive clamping assembly is adjacent to at least one of the liquid inlet and the liquid outlet.
Optionally, the conductive clamping assembly includes a plurality of conductive clamping members, and the plurality of conductive clamping members are arranged at intervals along a first direction;
in the electroplating bath, the liquid flow direction of the liquid inlet and/or the liquid flow direction of the liquid outlet are perpendicular to the first direction.
Optionally, the solar cell electroplating apparatus further includes: a positioning assembly;
the positioning assembly is arranged in the electroplating bath;
the positioning assembly forms a limiting space, and in the electroplating process, the solar cell is embedded in the limiting space.
Optionally, the positioning assembly comprises: a plurality of locating pins;
the positioning pins are arranged at intervals along the circumferential direction of the electroplating bath and form the limiting space.
Optionally, the positioning assembly comprises: a limiting groove;
the limiting groove extends along the peripheral side of the electroplating bath;
in the electroplating process, the solar cell is embedded in the limiting groove.
Optionally, the plating bath comprises: a first unit and a second unit;
when the first unit and the second unit are at a first relative position, a gap for loading and unloading the solar cell is formed between the first unit and the second unit;
when the first unit and the second unit are in the second relative position, the first unit and the second unit are buckled into the electroplating bath.
Optionally, the conductive clamping assembly comprises: the first sub-clamping assembly and the second sub-clamping assembly;
the first sub-clamping assembly and the second sub-clamping assembly are arranged oppositely, the first sub-clamping assembly is connected with the first unit, and the second sub-clamping assembly is connected with the second unit;
the first sub-clamping assembly and/or the second sub-clamping assembly are/is electrically connected with the negative electrode of the electroplating power supply;
when the first unit and the second unit are located at the second relative position, the first sub-clamping assembly is used for being abutted to a first surface of the solar cell piece, the second sub-clamping assembly is used for being abutted to a second surface of the solar cell piece, and the first surface and the second surface are two opposite surfaces of the solar cell piece.
Optionally, the anode comprises a first anode plate and a second anode plate;
the first anode plate is connected with the first unit, and the second anode plate is connected with the second unit;
the first anode plate and the second anode plate are respectively and electrically connected with the anode of the electroplating power supply;
in the electroplating process, the first anode plate is opposite to the first surface of the solar cell piece, and the second anode plate is opposite to the second surface of the solar cell piece.
Optionally, the solar cell electroplating device further includes: a drive mechanism;
the drive mechanism is connected with at least one of the first unit and the second unit to drive the first unit and the second unit to switch between the first relative position and the second relative position.
Optionally, one of the first unit and the second unit is provided with a positioning rod, and the other of the first unit and the second unit is provided with a positioning hole;
the positioning rod penetrates through the positioning hole and is in sliding connection with the positioning hole.
Optionally, the solar cell electroplating device further includes: a fluid providing device;
and the fluid supply device is connected with the liquid inlet and is used for continuously supplying electroplating solution into the electroplating bath through the liquid inlet in the electroplating process.
Optionally, the solar cell electroplating apparatus further includes: a transport mechanism;
the transmission mechanism is connected with the solar cell and is used for transmitting the solar cell into the electroplating bath.
In this application embodiment, solar wafer electroplating device includes: the electroplating bath is provided with a liquid inlet and a liquid outlet, and an anode electrically connected with the anode of an electroplating power supply is arranged in the electroplating bath; the conductive clamping assembly is arranged in the electroplating bath and is electrically connected with the negative electrode of the electroplating power supply, and the conductive clamping assembly is used for clamping the solar cell and is electrically connected with the solar cell; the electrically conductive clamping assembly is proximate to at least one of the liquid inlet and the liquid outlet. Under the clamping and fixing action of the conductive clamping assembly, the influence of eddy currents formed by the liquid inlet and the liquid outlet on the solar cell can be reduced, the solar cell is in a relatively stable environment, the risks of breakage and hidden cracking of the solar cell are reduced, and the yield of the solar cell is improved.
Drawings
Fig. 1 is a schematic structural diagram of a solar cell electroplating apparatus according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a first unit structure according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a second cell structure according to an embodiment of the present application;
fig. 4 is a second schematic structural diagram of the first unit according to the embodiment of the present application.
Description of reference numerals:
10-an electroplating bath; 20-an anode; 30-a conductive clamping assembly; 40-solar cell slice; 50-a positioning pin; 60-a transport mechanism; 101-liquid inlet; 102-a liquid outlet; 103-a first unit; 104-a second unit; 105-a positioning rod; 106-positioning holes; 201-a first anode plate; 202-a second anode plate; 301-a conductive clip; 302-a first sub-clamping assembly; 303-second sub-gripper assembly.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
In the description of the present invention, it is to be understood that the terms "height", "upper", "lower", "bottom", "inner", "outer", "circumferential", and the like, indicate orientations or positional relationships based on those illustrated in the drawings, are merely for convenience in describing the present invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.
The solar cell electroplating apparatus provided in the embodiment of the present application is described in detail below with reference to the accompanying drawings by using specific embodiments and application scenarios thereof.
Referring to fig. 1 to 3, an embodiment of the present application provides a solar cell electroplating apparatus, including: the electroplating bath 10 is provided with a liquid inlet 101 and a liquid outlet 102, and an anode 20 electrically connected with a positive electrode of an electroplating power supply is arranged in the electroplating bath 10; the conductive clamping assembly 30 is arranged in the electroplating bath 10 and is electrically connected with the negative electrode of the electroplating power supply, and the conductive clamping assembly 30 is used for clamping the solar cell piece 40 and is electrically connected with the solar cell piece 40; the conductive clamping assembly 30 is proximate to at least one of the inlet port 101 and the outlet port 102.
Specifically, as shown in fig. 1 to 3, the electroplating tank 10 is used to provide an electroplating site, the electroplating tank 10 has an inner cavity, and the anode 20 and the conductive clamping assembly 30 are disposed in the inner cavity of the electroplating tank 10. The plating tank 10 may be closed or semi-closed, and an inner cavity of the plating tank 10 is filled with a plating solution, which includes a water-soluble metal salt and a buffer. During the electroplating process, one or more of copper powder, nickel powder, copper oxide powder, copper salt, tin salt or nickel salt can be added into the electroplating bath 10 to maintain the concentration of the electroplating solution stable and ensure the continuity of the electroplating process.
The electroplating power supply is provided with a positive pole and a negative pole, the positive pole 20 is electrically connected with the positive pole of the electroplating power supply, and the positive pole 20 can be connected in series with the positive pole of the electroplating power supply through a flexible lead or connected in series with the positive pole of the electroplating power supply through a rigid conductive piece. The anode 20 may be made of copper, nickel, or the like, and is capable of precipitating metal cations during the electroplating process to replenish the metal cations in the electroplating solution. The number of anodes 20 may be set according to the actual requirements of the electroplating.
At least part of the conductive clamping assembly 30 is made of conductive material, the conductive clamping assembly 30 is electrically connected with the negative electrode of the electroplating power supply, and similarly, the conductive clamping assembly 30 can be connected in series with the negative electrode of the electroplating power supply through a flexible lead or connected in series with the negative electrode of the electroplating power supply through a rigid conductive piece. The conductive clamping assembly 30 is used for clamping the solar cell 40 and electrically connected with the solar cell 40, so that the solar cell 40 is electrically connected with a negative circuit of the electroplating power supply.
In the embodiment of the present application, the solar cell 40 may be a heterojunction cell (HJT) having an Intrinsic amorphous layer, a TOPCon (Tunnel Oxide passivation Contacts) cell, or the like. The solar cell 40 has a grid line pattern and electrode contacts on the surface thereof, and the conductive clamping assembly 30 is electrically connected to the electrode contacts. The non-grid line region of the solar cell 40 is covered with an insulating layer (or referred to as an electroplating mask), and in the electroplating process, the region covered with the insulating layer is not in direct contact with an electroplating solution, and the electroplating solution is only in contact with the grid line region needing electroplating.
In the electroplating process, the conductive clamping assembly 30 inevitably contacts the electroplating solution, in order to prevent the conductive clamping assembly 30 from corroding and plating, an insulating layer is arranged on at least part of the outer surface of the conductive clamping assembly 30, the insulating layer at least partially covers the conductive clamping assembly 30, and only the position of the conductive clamping assembly 30, which is used for being in conductive contact with the solar cell 40, is exposed, so that the stability of the electrical connection between the conductive clamping assembly 30 and the solar cell 40 is ensured. Through setting up isolated insulation layer, can reduce electrically conductive centre gripping subassembly 30 and corrode, go up the phenomenon of plating, promote the durability. The insulating layer can be made of teflon, rubber and other materials, and can also be formed on the outer surface of the conductive clamping component 30 in a mode of spraying insulating paint.
Electroplating solution can be filled into the inner cavity of the electroplating tank 10 through the liquid inlet 101 of the electroplating tank 10, so that the anode 20, the solar cell 40 and the conductive clamping assembly 30 are electrically connected and conducted through the electroplating solution to form an electroplating loop. In the embodiment of the present application, the electroplating solution may completely fill the inner cavity of the electroplating bath 10, or may not completely fill the inner cavity of the electroplating bath 10, and in practical applications, the side of the solar cell 40 to be electroplated and the corresponding anode 20 are completely immersed in the electroplating solution.
When the electroplating solution in the electroplating bath 10 is circulated through the liquid inlet 101 and the liquid outlet 102, a vortex phenomenon is easily generated at the liquid inlet 101 and the liquid outlet 102, and the fluctuation of the electroplating solution is large, so that impact is generated on the solar cell 40, and the solar cell 40 is broken and hidden apart. Therefore, the conductive clamping assembly 30 may be disposed at a position close to the liquid inlet 101 and/or the liquid outlet 102, and the liquid inlet 101 and the liquid outlet 102 may be respectively located at two sides of the conductive clamping assembly 30; an electrically conductive clamping assembly 30 may also be provided at both the inlet 101 and outlet 102. The distance between the liquid inlet 101 and the liquid outlet 102 and the conductive clamping assembly 30 can be determined according to the size of the electroplating tank 10 and the flow rate of the electroplating solution, and the like, as long as it can be ensured that the conductive clamping assembly 30 can stably clamp the solar cell 40 under the condition that the electroplating solution is fluctuated, which is not limited in the embodiment of the present application.
In the embodiment of the application, the conductive clamping assembly 30 is arranged at a position close to the liquid inlet 101 and/or the liquid outlet 102, under the clamping and fixing effects of the conductive clamping assembly 30, the influence of the eddy current formed by the liquid inlet 101 and the liquid outlet 102 on the solar cell 40 can be reduced, the solar cell 40 is in a relatively stable environment, the risks of breakage and hidden cracking of the solar cell 40 are reduced, and the yield of the solar cell 40 is improved.
Alternatively, as shown in fig. 2 to 3, the conductive clamping assembly 30 includes a plurality of conductive clamping members 301, and the plurality of conductive clamping members 301 are arranged at intervals along a first direction; in the plating tank 10, the liquid flow direction of the liquid inlet 101 and/or the liquid flow direction of the liquid outlet 102 is perpendicular to the first direction.
Specifically, as shown in fig. 2 to 3, the conductive clip assembly 30 includes a plurality of conductive clips 301, the conductive clips 301 having a conductive body portion surrounded by an insulating material, and an end portion of the conductive body portion having a conductive contact portion exposed from the insulating material. The conductive main body part can be a composite conductive material formed by wrapping conductive rubber outside conductive metal or conductive carbon material, and the like; the conductive clip 301 may also include a single conductive body portion made of a conductive metal, and the single conductive body portion made of a conductive metal is preferably 316L stainless steel, 316 stainless steel, 304 stainless steel, monel, a conductive carbon material, or a conductive rubber, and may be specifically selected according to the ph of the electroplating solution and the chemical properties of the electroplating metal corresponding to electroplating, so as to ensure that the conductive body portion is not corroded in the electrolyte, and after the electroplating metal is plated, the electroplating metal is deplated without causing great damage to the conductive body portion.
A plurality of conductive clamps 301 are arranged at intervals along the first direction, and each conductive clamp 301 corresponds to one electrode contact on the solar cell 40. During the electroplating process, the first direction may be an arrangement direction of electrode contacts on the solar cell 40.
The flow of the plating solution in the inlet port 101 and the outlet port 102 can be substantially divided into two portions, one portion being the flow of the plating solution in the pipe and the other portion being the flow of the plating solution into the interior of the plating cell 10. When the plating solution enters the inner cavity of the plating cell 10, the liquid flow direction of the liquid inlet 101 and/or the liquid flow direction of the liquid outlet 102 are perpendicular to the first direction. Because the flow direction of the electroplating solution is perpendicular to the arrangement direction of the conductive clamping pieces 301, the conductive clamping pieces 301 block the electroplating solution less, the electroplating solution can smoothly pass through the gaps between the conductive clamping pieces 301, the liquid retention phenomenon is reduced, the circulation efficiency of the electroplating solution is improved, and the electroplating quality is improved.
Optionally, the solar cell electroplating device further includes: a positioning assembly; the positioning assembly is arranged in the electroplating bath 10; the positioning assembly forms a limiting space, and in the electroplating process, the solar cell piece 40 is embedded in the limiting space.
Specifically, a positioning assembly is arranged in the electroplating bath 10, and the positioning assembly and the inner wall of the electroplating bath 10 can be fixed in a clamping, bonding or welding manner. The positioning assembly forms a limiting space, and the limiting space is matched with the shape of the solar cell 40. In the electroplating process, the solar cell 40 is embedded in the limiting space, the conductive contact part of the conductive clamping piece 301 can be accurately aligned with the electrode contact on the surface of the solar cell 40, and the yield of electroplating of the solar cell 40 is improved.
Optionally, as shown in fig. 4, the positioning assembly includes: a plurality of positioning pins 50; the positioning pins 50 are arranged at intervals along the circumferential direction of the plating tank 10, and form the limiting space.
Specifically, as shown in fig. 4, in the embodiment of the present application, the positioning assembly includes a plurality of positioning pins 50, and the positioning pins 50 may be fixed to the inner wall of the electroplating tank 10 by snapping, bonding, or welding. The height of the positioning pin 50 is greater than the height of the conductive clamp 301 in the direction from the notch to the bottom of the plating tank 10. A plurality of positioning pins 50 are arranged at intervals in the circumferential direction of the plating tank 10, thereby forming the above-described limit space. The number of the positioning pins 50 may be selected according to the size of the solar cell 40, which is not limited in the embodiment of the present invention. In the electroplating process, the solar cell piece 40 is embedded in the limit space formed by the positioning pin 50, the conductive contact part of the conductive clamping piece 301 can be accurately aligned with the electrode contact on the surface of the solar cell piece 40, and the electroplating yield of the solar cell piece 40 is improved.
Optionally, the positioning assembly comprises: a limiting groove; the limiting groove extends along the peripheral side of the electroplating bath 10; in the electroplating process, the solar cell 40 is embedded in the limiting groove.
Specifically, the limiting groove extends along the circumferential side of the electroplating bath 10, and the solar cell 40 is embedded in the limiting groove during the electroplating process, so that the alignment problem between the solar cell 40 and the electroplating bath 10 can be reduced, and the circumferential side of the solar cell 40 can be protected. In the embodiment of the present application, the limiting groove may be disposed corresponding to at least one side of the solar cell 40, so as to position the solar cell 40 in at least one direction through the limiting groove. Alternatively, the limiting groove may also extend from one side edge of the solar cell 40 to the other adjacent side edge, and it is understood that, when the solar cell 40 is in a regular rectangular shape, the limiting groove may play a role in positioning the solar cell 40 in two perpendicular directions. In the electroplating process, the solar cell 40 is embedded in the limiting groove, the conductive contact part of the conductive clamping piece 301 can be accurately aligned with the electrode contact on the surface of the solar cell 40, and the yield of electroplating of the solar cell 40 is improved.
Alternatively, referring to fig. 1 to 4, the plating tank 10 includes: a first unit 103 and a second unit 104; when the first unit 103 and the second unit 104 are in the first relative position, a gap for mounting and dismounting the solar cell 40 is formed between the first unit 103 and the second unit 104; when the first unit 103 and the second unit 104 are in the second relative position, the first unit 103 and the second unit 104 are snapped together to form the electroplating bath 10.
Specifically, as shown in fig. 1 to 4, the plating tank 10 includes a first unit 103 and a second unit 104, one of the first unit 103 and the second unit 104 may be a tank body, and the other of the first unit 103 and the second unit 104 may be a tank cover, and the entire plating tank 10 is formed by the engagement of the tank body and the tank cover. The first unit 103 and the second unit 104 may also be both troughs, and in the electroplating process, the first unit 103 and the second unit 104 are respectively located at two sides of the solar cell 40.
The first unit 103 and the second unit 104 have a first relative position and a second relative position. When the first unit 103 and the second unit 104 are in the first relative position, a gap for mounting and dismounting the solar cell 40 is formed between the first unit 103 and the second unit 104, so that the solar cell 40 is conveniently mounted and dismounted. When the first unit 103 and the second unit 104 are in the second relative position, the first unit 103 and the second unit 104 are buckled to form the electroplating tank 10. By switching the first unit 103 and the second unit 104 between the first relative position and the second relative position, the fast switching between the loading and unloading scene and the electroplating scene of the solar cell 40 can be realized, and the production efficiency is improved.
Alternatively, as shown with reference to fig. 1 to 4, the conductive clamping assembly 30 includes: a first sub-gripper assembly 302 and a second sub-gripper assembly 303; the first sub-clamping assembly 302 and the second sub-clamping assembly 303 are oppositely arranged, the first sub-clamping assembly 302 is connected with the first unit 103, and the second sub-clamping assembly 303 is connected with the second unit 104; the first sub-clamping assembly 302 and/or the second sub-clamping assembly 303 are electrically connected with the negative electrode of the electroplating power supply; when the first unit 103 and the second unit 104 are at the second relative position, the first sub-clamping assembly 302 is configured to abut against a first surface of the solar cell 40, the second sub-clamping assembly 303 is configured to abut against a second surface of the solar cell 40, and the first surface and the second surface are two opposite surfaces of the solar cell 40.
Specifically, as shown in fig. 1 to 4, the conductive clamping assembly 30 is used for clamping the solar cell 40 and electrically connected to the solar cell 40. The conductive clamping assembly 30 includes a first sub-clamping assembly 302 and a second sub-clamping assembly 303, each of the first sub-clamping assembly 302 and the second sub-clamping assembly 303 including a plurality of conductive clamping members 301. The first sub-gripper assembly 302 and the second sub-gripper assembly 303 are disposed opposite each other. The first sub-clamping assembly 302 is connected with the first unit 103, and the second sub-clamping assembly 303 is connected with the second unit 104, and the specific connection mode may be welding, bonding, or clamping. The solar cell piece 40 comprises a first surface and a second surface which are opposite, when the first unit 103 and the second unit 104 are in the second relative position, a clamping space is formed between the first sub-clamping assembly 302 and the second sub-clamping assembly 303, the solar cell piece 40 is located in the clamping space, the first sub-clamping assembly 302 abuts against the first surface of the solar cell piece 40, and the second sub-clamping assembly 303 abuts against the second surface of the solar cell piece 40.
One function of the first sub-clamping assembly 302 and the second sub-clamping assembly 303 is to clamp and fix the solar cell 40, so that the solar cell 40 is kept in a stable state during the electroplating process. The first sub-clamping assembly 302 and the second sub-clamping assembly 303 are electrically connected with electrode contacts on the surface of the solar cell 40, so that the circuit between the solar cell 40 and the negative electrode of the electroplating power supply is conducted. Whether the first sub-clamping assembly 302 and the second sub-clamping assembly 303 are electrically connected with the negative electrode of the electroplating power supply or not can be selected according to the actual electroplating requirement of the solar cell 40. For example, only one of the first surface or the second surface of the solar cell 40 is plated, and correspondingly, the first sub-clamping assembly 302 or the second sub-clamping assembly 303 can be electrically connected to the negative electrode of the plating power supply; if the first surface and the second surface of the solar cell 40 need to be plated simultaneously, both the first sub-clamping assembly 302 and the second sub-clamping assembly 303 are electrically connected to the negative electrode of the plating power supply.
Alternatively, referring to fig. 1-4, the anode 20 includes a first anode plate 201 and a second anode plate 202; the first anode plate 201 is connected with the first unit 103, and the second anode plate 202 is connected with the second unit 104; the first anode plate 201 and the second anode plate 202 are respectively electrically connected with the anode of the electroplating power supply; during the electroplating process, the first anode plate 201 is opposite to the first surface of the solar cell 40, and the second anode plate 202 is opposite to the second surface of the solar cell 40.
Specifically, as shown in fig. 1 to 4, the anode 20 includes a first anode plate 201 and a second anode plate 202, the first anode plate 201 and the second anode plate 202 are respectively connected in series with the positive electrode of the electroplating power supply, and the first anode plate 201 and the second anode plate 202 are connected in parallel. The first anode plate 201 is connected with the first unit 103, the second anode plate 202 is connected with the second unit 104, in the electroplating process, the first anode plate 201 and the second anode plate 202 can be respectively located on two sides of the solar cell piece 40, the first anode plate 201 is opposite to the first surface of the solar cell piece 40, the second anode plate 202 is opposite to the second surface of the solar cell piece 40, consistency of electroplating solution concentration on two sides of the solar cell piece 40 is improved, and electroplating quality is favorably improved.
The structure of the first anode plate 201 and the second anode plate 202 may include: one or more of a planar structure, a net-shaped structure, a linear structure and a point structure. Preferably, the anode 20 plate with a net structure or a dot matrix structure can be selected, and the anode 20 plate with a net structure or a dot matrix structure has better fluidity of the plating solution and improved plating uniformity compared with the anode 20 plate with a planar structure or the anode 20 plate with a net structure or a dot matrix structure.
Optionally, the solar cell electroplating device further includes: a drive mechanism; the drive mechanism is connected to at least one of the first unit 103 and the second unit 104 to drive the first unit 103 and the second unit 104 to switch between the first relative position and the second relative position.
Specifically, the first unit 103 and the second unit 104 may be switched between the first relative position and the second relative position manually, or the movement of the first unit 103 or the second unit 104 may be controlled by a driving mechanism. The driving mechanism can be a combination of a motor and a lead screw, and can also be a combination of an air cylinder and a connecting rod. When the driving mechanism is provided, the driving mechanism may be connected to at least one of the first unit 103 and the second unit 104 to drive the first unit 103 and the second unit 104 to switch between the first relative position and the second relative position. Through setting up actuating mechanism, can promote solar wafer electroplating device's degree of automation, and then promote production efficiency.
Alternatively, as shown in fig. 1 to 4, one of the first unit 103 and the second unit 104 is provided with a positioning rod 105, and the other of the first unit 103 and the second unit 104 is provided with a positioning hole 106; the positioning rod 105 is inserted into the positioning hole 106 and slidably connected to the positioning hole 106.
Specifically, as shown in fig. 1 to 4, the positioning rods 105 may be provided in the first unit 103, the positioning holes 106 may be provided in the second unit 104, the number of the positioning rods 105 and the number of the positioning holes 106 may be the same, and the number of the positioning rods 105 and the positioning holes 106 may be selected according to the size of the plating vessel 10. For example, with a square plating tank 10, four sets of positioning rods 105 and positioning holes 106 may be provided at four corners of the plating tank 10. Of course, the first unit 103 may be provided with the positioning hole 106 and the second unit 104 may be provided with the positioning rod 105. The positioning rod 105 is inserted into the positioning hole 106 and slidably connected to the positioning hole 106. When the first unit 103 and the second unit 104 move relatively, the first unit 103 and the second unit 104 can be limited by the matching of the positioning rod 105 and the positioning hole 106, and the alignment accuracy of the first unit 103 and the second unit 104 is improved.
Optionally, the solar cell electroplating device further includes: a fluid providing device; the fluid supply device is connected with the liquid inlet 101 and is used for continuously supplying electroplating solution into the electroplating bath 10 through the liquid inlet 101 in the electroplating process.
Specifically, in order to make the ion concentration in the plating solution meet the plating requirement during the plating process of the solar cell 40, the plating solution may be a flowing plating solution. For example, the solar cell electroplating device further comprises: and the fluid supply device is connected with the liquid inlet 101 and is used for continuously supplying electroplating solution to the inner cavity of the electroplating bath 10 through the liquid inlet 101 in the electroplating process. Specifically, the fluid supply device may be a water pump, a circulation pump, or the like, and the fluid supply device may be connected to the liquid inlet 101 through a pipeline or the like. In the embodiment of the application, through the fluid supply device, the ion concentration in the electroplating solution in the inner cavity of the electroplating bath 10 can be supplemented in time in the electroplating process, which is beneficial to improving the ion exchange speed of the surface of the solar cell 40, and further the electroplating quality and the electroplating efficiency are improved.
Optionally, referring to fig. 1, the solar cell electroplating apparatus further includes: a transfer mechanism 60; the transmission mechanism 60 is connected to the solar cell 40 and is used for transmitting the solar cell 40 into the electroplating bath 10.
Specifically, as shown in fig. 1, the solar cell 40 may be moved by the transfer mechanism 60 while the position of the plating tank 10 is maintained, or the plating tank 10 may be moved by the transfer mechanism 60 while the position of the solar cell 40 is maintained. Specifically, the transmission mechanism 60 is connected to the solar cell 40 and is configured to drive the solar cell 40 to move to an electroplating position in the electroplating tank 10; alternatively, the transmission mechanism 60 is connected to the electroplating tank 10 and is used for driving the electroplating tank 10 to be close to the solar cell 40 so as to enable the solar cell 40 to enter the electroplating position in the electroplating tank 10. In the embodiment of the present application, the transmission mechanism 60 may specifically be a motor, an air cylinder, or the like.
In summary, the solar cell electroplating device according to the embodiment of the present application at least includes the following advantages:
in this application embodiment, solar wafer electroplating device includes: an electroplating bath 10 having a liquid inlet 101 and a liquid outlet 102, wherein an anode 20 electrically connected with a positive electrode of an electroplating power supply is arranged in the electroplating bath 10; the conductive clamping assembly 30 is arranged in the electroplating bath 10 and is electrically connected with a cathode of an electroplating power supply, and the conductive clamping assembly 30 is used for clamping the solar cell piece 40 and is electrically connected with the solar cell piece 40; an electrically conductive clamping assembly 30 is proximate at least one of the inlet port 101 and the outlet port 102. Under the clamping and fixing action of the conductive clamping assembly 30, the influence of the eddy current formed by the liquid inlet 101 and the liquid outlet 102 on the solar cell 40 can be reduced, so that the solar cell 40 is in a relatively stable environment, the risks of breakage and hidden cracking of the solar cell 40 are reduced, and the yield of the solar cell 40 is improved.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the present embodiments are not limited to those precise embodiments, which are intended to be illustrative rather than restrictive, and that various changes and modifications may be effected therein by one skilled in the art without departing from the scope of the appended claims.
Claims (12)
1. The utility model provides a solar wafer electroplating device which characterized in that, solar wafer electroplating device includes:
the electroplating bath is provided with a liquid inlet and a liquid outlet, and an anode electrically connected with the anode of an electroplating power supply is arranged in the electroplating bath;
the conductive clamping assembly is arranged in the electroplating bath and is electrically connected with the cathode of the electroplating power supply, and the conductive clamping assembly is used for clamping the solar cell and is electrically connected with the solar cell;
the conductive clamping assembly is proximate to at least one of the liquid inlet and the liquid outlet.
2. The solar cell electroplating device according to claim 1, wherein the conductive clamping assembly comprises a plurality of conductive clamping members, and the plurality of conductive clamping members are arranged at intervals along a first direction;
in the electroplating bath, the liquid flow direction of the liquid inlet and/or the liquid flow direction of the liquid outlet are perpendicular to the first direction.
3. The solar cell plating apparatus of claim 1, further comprising: a positioning assembly;
the positioning assembly is arranged in the electroplating bath;
the positioning assembly forms a limiting space, and in the electroplating process, the solar cell is embedded in the limiting space.
4. The solar cell electroplating device according to claim 3, wherein the positioning assembly comprises: a plurality of locating pins;
the positioning pins are arranged at intervals along the circumferential direction of the electroplating bath and form the limiting space.
5. The solar cell electroplating device according to claim 3, wherein the positioning assembly comprises: a limiting groove;
the limiting groove extends along the peripheral side of the electroplating bath;
in the electroplating process, the solar cell is embedded in the limiting groove.
6. The solar cell electroplating apparatus according to claim 1, wherein the electroplating bath comprises: a first unit and a second unit;
when the first unit and the second unit are at a first relative position, a gap for loading and unloading the solar cell is formed between the first unit and the second unit;
when the first unit and the second unit are in the second relative position, the first unit and the second unit are buckled to form the electroplating tank.
7. The solar cell plating apparatus of claim 6, wherein the conductive clamping assembly comprises: the first sub-clamping assembly and the second sub-clamping assembly;
the first sub-clamping assembly and the second sub-clamping assembly are arranged oppositely, the first sub-clamping assembly is connected with the first unit, and the second sub-clamping assembly is connected with the second unit;
the first sub-clamping assembly and/or the second sub-clamping assembly are/is electrically connected with the negative electrode of the electroplating power supply;
when the first unit and the second unit are located at the second relative position, the first sub-clamping assembly is used for being abutted to a first surface of the solar cell piece, the second sub-clamping assembly is used for being abutted to a second surface of the solar cell piece, and the first surface and the second surface are two opposite surfaces of the solar cell piece.
8. The solar cell electroplating apparatus according to claim 7, wherein the anode comprises a first anode plate and a second anode plate;
the first anode plate is connected with the first unit, and the second anode plate is connected with the second unit;
the first anode plate and the second anode plate are respectively and electrically connected with the anode of the electroplating power supply;
in the electroplating process, the first anode plate is opposite to the first surface of the solar cell piece, and the second anode plate is opposite to the second surface of the solar cell piece.
9. The solar cell electroplating device according to claim 6, further comprising: a drive mechanism;
the drive mechanism is connected with at least one of the first unit and the second unit to drive the first unit and the second unit to switch between the first relative position and the second relative position.
10. The solar cell electroplating device according to claim 6, wherein one of the first unit and the second unit is provided with a positioning rod, and the other of the first unit and the second unit is provided with a positioning hole;
the positioning rod penetrates through the positioning hole and is in sliding connection with the positioning hole.
11. The solar cell electroplating device according to claim 1, further comprising: a fluid providing device;
and the fluid supply device is connected with the liquid inlet and is used for continuously supplying electroplating solution into the electroplating tank through the liquid inlet in the electroplating process.
12. The solar cell electroplating device according to claim 1, further comprising: a transport mechanism;
the transmission mechanism is connected with the solar cell and is used for transmitting the solar cell into the electroplating bath.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221853188.0U CN218175164U (en) | 2022-07-18 | 2022-07-18 | Solar cell electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221853188.0U CN218175164U (en) | 2022-07-18 | 2022-07-18 | Solar cell electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218175164U true CN218175164U (en) | 2022-12-30 |
Family
ID=84615412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221853188.0U Active CN218175164U (en) | 2022-07-18 | 2022-07-18 | Solar cell electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218175164U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023179748A1 (en) * | 2022-03-25 | 2023-09-28 | 苏州太阳井新能源有限公司 | Cell electroplating method and apparatus |
| CN117089912A (en) * | 2023-10-18 | 2023-11-21 | 无锡釜川科技股份有限公司 | Horizontal clamping type electroplating device |
-
2022
- 2022-07-18 CN CN202221853188.0U patent/CN218175164U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023179748A1 (en) * | 2022-03-25 | 2023-09-28 | 苏州太阳井新能源有限公司 | Cell electroplating method and apparatus |
| CN117089912A (en) * | 2023-10-18 | 2023-11-21 | 无锡釜川科技股份有限公司 | Horizontal clamping type electroplating device |
| CN117089912B (en) * | 2023-10-18 | 2024-01-16 | 无锡釜川科技股份有限公司 | Horizontal clamping type electroplating device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN218175164U (en) | Solar cell electroplating device | |
| CN105088323B (en) | Board-like Electropolating hangers | |
| CN102201590A (en) | Acidic zinc single liquid flow energy storage battery | |
| CN104241670B (en) | A kind of perchloric acid system sedimentation type is plumbous flow battery entirely | |
| CN112301394B (en) | Plating cavity capable of improving uniformity of electroplated layer on inner surface of ring-shaped element | |
| CN102181894B (en) | Device and method for carrying out single spraying on power battery case | |
| CN101935852A (en) | Inertial electrode low-temperature aluminium electrolytic cell | |
| CN109786800B (en) | Thermal regeneration ammonia battery adopting foam nickel-based copper-plated electrode and preparation method | |
| CN219547133U (en) | Continuous plate type transmission electroplating device | |
| CN107887673A (en) | A kind of liquid-metal fuel cell | |
| CN108155391A (en) | A kind of efficient nickel-base catalyst for promoting sodium borohydride direct oxidation | |
| CN217600869U (en) | Solar cell electroplating device | |
| CN113130957B (en) | Thermal regeneration ammonia battery adopting graded porous surface composite electrode and preparation method | |
| CN102005580B (en) | Surface-modifying treatment method of stainless steel bipolar plate of proton exchange membrane fuel cell | |
| CN210458373U (en) | Bipolar electrolysis device | |
| CN209947951U (en) | Flow field structure bipolar plate, monocell, green energy vehicle, electronic equipment, mobile communication terminal | |
| CN220468218U (en) | Solar cell electroplating device | |
| CN106757215A (en) | A kind of method that dicyandiamide ionic liquid low-temperature electro-deposition prepares lanthanum nickel alloy film | |
| CN108048885B (en) | It is a kind of based on levulic acid-choline chloride eutectic solvent nickel-phosphorus alloy plating method | |
| WO2024067514A1 (en) | Solar cell electroplating device and solar cell electroplating method | |
| CN221052031U (en) | Flexible clamping type electroplating device | |
| CN104752704A (en) | Method for preparing porous germanium by utilizing electrodeposition of ionic liquid | |
| CN220455435U (en) | Coating titanium anode electrolysis life test device | |
| CN112126966A (en) | Electroplating device for crystalline silicon solar cell electrode | |
| CN117089912B (en) | Horizontal clamping type electroplating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |