CN203320167U - V-shaped electroplating seat - Google Patents
V-shaped electroplating seat Download PDFInfo
- Publication number
- CN203320167U CN203320167U CN2013203197968U CN201320319796U CN203320167U CN 203320167 U CN203320167 U CN 203320167U CN 2013203197968 U CN2013203197968 U CN 2013203197968U CN 201320319796 U CN201320319796 U CN 201320319796U CN 203320167 U CN203320167 U CN 203320167U
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Abstract
The utility model relates to a V-shaped electroplating seat comprising a V-shaped conductive seat, wherein the V-shaped conductive seat is fixed in a water channel, and the water channel is provided with a water inlet and a water outlet which are controllable in open and close. After the structure is employed, since the V-shaped conductive seat is placed in the water channel, water enters from the water inlet formed in a tray and is stored in the tray to cool down the V-shaped conductive seat, and when the water reaches to a certain height, the water flows into an electroplating tank, thus achieving the cyclic utilization of water.
Description
Technical field
The utility model belongs to field of electroplating, specifically discloses a kind of V-shaped electroplating seat.
Background technology
In field of electroplating, the Building V of use conduction usually, as negative electrode, will fly bar and be placed in location and the conduction work that completes plating piece in the conduction Building V, because the conduction Building V is not the fixed conduction of combining closely with flying bar, add that two working faces are not very smooth contacts.Just have the gap of fine inequality, electric current is by just having resistance, and according to the principles of electric and electronic engineering, resistance is larger, and power consumption is just larger, and the heat of generation is just more.Hard chrome plating current consumption is large, and the heat lift velocity is just faster, and excess Temperature will make contact surface produce oxidation, impact is by the strength of current of plating piece, just do not reach the thickness that plating will be shown within the time of setting, and the air cooling poor effect, air cooling can't meet need of production.
The utility model content
It is a kind of simple in structure, with low cost that the purpose of this utility model provides, the V-shaped electroplating seat of energy quick cooling conduction Building V.
The technical solution of the utility model is a kind of V-shaped electroplating seat, comprises the conduction Building V, and described conduction Building V is fixed in a holder tank, is provided with on described holder tank and opens and closes controlled prosopyle and open and close controlled posticum.
Further, described posticum is positioned at holder tank side and connects a pipeline towards plating tank, and the distance of distance holder tank bottom surface is at least 1/3 of conduction Building V height.
Useful technique effect of the present utility model is: after adopting this structure, because the conduction Building V is placed in a holder tank, the prosopyle that water arranges from pallet enters and is stored in pallet, to the conduction Building V, carry out cooling, when the water surface arrives certain altitude, flow in plating tank by posticum, realized the recycle of water.
The accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Wherein: 1, conduction Building V; 2, posticum; 3, prosopyle; 4, limbers; 5, return port; 6, conductive head; 7, extension; 8, screw; 9, pipeline.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in further detail.
A kind of V-shaped electroplating seat as shown in Figure 1, comprise conduction Building V 1, and described conduction Building V 1 is fixed in a holder tank, is provided with on described holder tank and opens and closes controlled prosopyle 3 and open and close controlled posticum 2.Concrete, described posticum 2 is positioned at holder tank side, and the distance of distance holder tank bottom surface is at least 1/3 of conduction Building V 1 height, and introduces in plating tank by pipeline 9.After adopting this structure, because conduction Building V 1 is fixedly installed in the holder tank by screw 8, the prosopyle 3 that water arranges from the holder tank enters and is stored in the holder tank, carry out coolingly to conduction Building V 1, in water flowing, first posticum 2 is closed, when the water surface arrives certain altitude, flow in plating tank by posticum 2, realized the recycle of water, saved water resources.
Further, several limbers 4 are set on described conduction Building V 1, concrete, described limbers 4 is two, is symmetricly set in conduction 1 middle part, Building V.In order further to strengthen cooling performance, on conduction Building V 1, several limbers 4 are set, due to when electroplating, fly bar and be positioned at conduction Building V 1, that is to say, current can enter the contact surface that flies bar and conduction Building V 1 by limbers 4, and the highest place of temperature just herein, can effectively reduce the temperature of this contact surface, oxidation rate slows down, in addition, water is owing to itself being dielectric medium, flying bar, with 1 combination of conduction Building V, not still can guarantee that conduction is good in situation very closely, be equivalent to increase the effective contact area that flies bar and conduction Building V 1, reduced the equivalent load in the loop, therefore output rating reduces, reach energy-conservation effect.
Further, described conduction Building V 1 extends to form extension 7 straight up, is provided with the conductive head 6 of being controlled by return spring on this extension 7.In order further to increase the conductivity flown between bar and conduction Building V 1, conduction Building V 1 is at the extension 7 of direction formation straight up, that is to say that flying bar becomes larger with the contact area of conduction Building V 1, but due to conduction Building V 1 with fly to cling to processing mode and limit, its surface accuracy is not high, although increased contact area, but still can be gapped during contact, so also be provided with the conductive head 6 of being controlled by return spring at extension 7, when fly the bar be placed in the conduction Building V 1 within the time, conductive head 6 is under the promotion of return spring and fly to cling to close contact, has strengthened conductivity.
Further, also be provided with on described holder tank and open and close controlled return port 5, concrete, described return port 5 is placed in posticum 2 tops and introduces water tank.Owing on the holder tank, being provided with posticum 2, and this posticum 2 introduces by pipeline 9 recycle that realizes water in plating tank, but after long-time, may the strength of solution in plating tank be exerted an influence, so posticum 2 tops also are provided with a return port 5, select whether to open return port 5 depending on particular case, the current of this return port 5 are introduced the recycle that has realized equally water resources in water tank.
Claims (6)
1. a V-shaped electroplating seat, comprise conduction Building V (1), and it is characterized in that: described conduction Building V (1) is fixed in a holder tank, is provided with on described holder tank and opens and closes controlled prosopyle (3) and open and close controlled posticum (2).
2. V-shaped electroplating seat according to claim 1 is characterized in that: described posticum (2) is positioned at holder tank side and connects a pipeline (9) that leads to plating tank, and the distance of distance holder tank bottom surface is at least 1/3 of conduction Building V (1) height.
3. V-shaped electroplating seat according to claim 2, is characterized in that: several limbers (4) are set on described conduction Building V (1).
4. V-shaped electroplating seat according to claim 3, it is characterized in that: described limbers (4) are two, are symmetricly set in middle part, conduction Building V (1).
5. V-shaped electroplating seat according to claim 2, it is characterized in that: described conduction Building V (1) extends to form extension (7) straight up, is provided with the conductive head (6) of being controlled by return spring on this extension (7).
6. according to the described V-shaped electroplating seat of claim 1 to 5 any one, it is characterized in that: also be provided with the controlled return port (5) of keying of introducing water tank on described holder tank.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2013203197968U CN203320167U (en) | 2013-06-04 | 2013-06-04 | V-shaped electroplating seat |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2013203197968U CN203320167U (en) | 2013-06-04 | 2013-06-04 | V-shaped electroplating seat |
Publications (1)
Publication Number | Publication Date |
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CN203320167U true CN203320167U (en) | 2013-12-04 |
Family
ID=49659535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2013203197968U Expired - Fee Related CN203320167U (en) | 2013-06-04 | 2013-06-04 | V-shaped electroplating seat |
Country Status (1)
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CN (1) | CN203320167U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103924283A (en) * | 2014-04-18 | 2014-07-16 | 安捷利(番禺)电子实业有限公司 | Adaptive electroplating V-shaped conductive plate base |
CN107761156A (en) * | 2016-08-22 | 2018-03-06 | 盛美半导体设备(上海)有限公司 | Electroplating bath |
CN112064096A (en) * | 2020-09-28 | 2020-12-11 | 厦门精合电气自动化有限公司 | Conductive seat, water-immersed conductive device and water-immersed conductive cooling circulation system |
CN113755930A (en) * | 2021-09-17 | 2021-12-07 | 扬州虹扬科技发展有限公司 | Device and method for guaranteeing stability of electroplating current |
-
2013
- 2013-06-04 CN CN2013203197968U patent/CN203320167U/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103924283A (en) * | 2014-04-18 | 2014-07-16 | 安捷利(番禺)电子实业有限公司 | Adaptive electroplating V-shaped conductive plate base |
CN107761156A (en) * | 2016-08-22 | 2018-03-06 | 盛美半导体设备(上海)有限公司 | Electroplating bath |
CN107761156B (en) * | 2016-08-22 | 2021-05-14 | 盛美半导体设备(上海)股份有限公司 | Electroplating bath |
CN112064096A (en) * | 2020-09-28 | 2020-12-11 | 厦门精合电气自动化有限公司 | Conductive seat, water-immersed conductive device and water-immersed conductive cooling circulation system |
CN113755930A (en) * | 2021-09-17 | 2021-12-07 | 扬州虹扬科技发展有限公司 | Device and method for guaranteeing stability of electroplating current |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131204 Termination date: 20160604 |