CN113752663A - 一种上盖带 - Google Patents
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Abstract
本发明提供了一种上盖带，包括依次叠加的PET层、复合层、胶水层、防粘层和导电层，所述复合层包括PE75％‑85％、CPP7％‑13％和EMMA8％‑12％，所述胶水层包括SEBS橡胶80％‑90％、增粘树脂5％‑15％、聚氨酯5％‑15％；所述防粘层包括蜡粉15％‑25％和环乙烷75％‑85％，所述导电层为聚噻吩导电液，本发明生产的产品质量稳定，无过高工艺要求，其密封性能好、剥离力小于20g，复合层内设有CPP具有高透明、高清晰度，能够使透过率高于70％‑80％，表面电阻低于10E9－10E11。
Description
技术领域
本发明涉及电子元器件进行包装的盖带，尤其是指一种上盖带。
背景技术
伴随着电子设备的小型化，所使用的电子部件也向小型化、高性能化发展，并且，在电子设备的组装工序中将电子部件自动安装在印刷基板上。用于上述芯片型表面安装的电子部件被收纳于连续形成有根据电子部件的形状热成型的收纳袋的载带上。各收纳袋中收纳电子部件后，载带的上面叠放作为覆盖材料的盖带，用加热了的密封刀将盖带的两端在长度方向上连续热封，形成电子部件的包装物。盖带的性能指标主要为剥离力、光学性能、表面电阻和拉伸性能等四大性能。其中剥离力是上盖带最重要的技术指标，贴装厂家需要将上盖带从载带上剥离，取出封装在口袋里的电子元器件并将其安装在电路板上，在这一过程中，为了保证机械手可以准确定位，电子元器件不会跳动或翻转，盖带从载带上剥离的力必须足够稳定；光学性能包括雾度、透光率和透明度，由于需要通过盖带观察封装在载带口袋里的电子元器件芯片上的标记，主要表现为透光率。目前市面上的上盖带其剥离力大多在20g以上、透光率为70％-80％、表面电阻达到10E9－10E11，由于对上盖带的要求很高，所以如何制作在密封时能够密封效果好、需要拉开时只需适当的拉力就能拉开、透过率高且表面电阻低的上盖带便成为现在急需解决的问题。
发明内容
(一)要解决的技术问题
本发明目的在于提供一种上盖带，解决现有技术中上盖带所存在的缺陷。为实现上述之目的，本发明采取如下技术方案：
(二)技术方案
一种上盖带，包括依次叠加的PET层、复合层、胶水层、防粘层和导电层，所述复合层包括PE75％-85％、CPP7％-13％和EMMA8％-12％，所述胶水层包括SEBS橡胶80％-90％、增粘树脂5％-15％、聚氨酯5％-15％；所述防粘层包括蜡粉15％-25％和环乙烷75％-85％，所述导电层为聚噻吩导电液。
进一步，所述复合层包括PE80％、CPP10％和EMMA10％。
进一步，所述防粘层包括蜡粉20％和环乙烷80％。
进一步，所述胶水层包括SEBS橡胶85％，增粘树脂10％，聚氨酯5％。
进一步，所述PET层的厚度为19-25um，所述复合层为15-20um、所述胶水层为10-25um、所述防粘层为1um，所述导电层为1um。
(三)有益效果
本发明与现有技术相比具有明显的优点和有益效果，具体而言，本发明生产的产品质量稳定，无过高工艺要求，其密封性能好、剥离力小于20g，复合层内设有CPP具有高透明、高清晰度，能够使透过率高于70％-80％，表面电阻低于10E9－10E11。
具体实施方式
以下结合实施例，对本发明做进一步说明。
实施例一
一种上盖带，包括依次叠加的PET层、复合层、胶水层、防粘层和导电层，所述复合层包括PE80％、CPP10％和EMMA10％，所述胶水层包括SEBS橡胶85％、增粘树脂10％、聚氨酯5％；所述防粘层包括蜡粉20％和环乙烷80％，所述导电层为聚噻吩导电液，所述PET层的厚度为22um，所述复合层为16um、所述胶水层为14um、所述防粘层为1um，所述导电层为1um。
实施例二
一种上盖带，包括依次叠加的PET层、复合层、胶水层、防粘层和导电层，所述复合层包括PE82％、CPP7％和EMMA11％，所述胶水层包括SEBS橡胶82％、增粘树脂7％、聚氨酯8％；所述防粘层包括蜡粉18％和环乙烷82％，所述导电层为聚噻吩导电液，所述PET层的厚度为22um，所述复合层为16um、所述胶水层为14um、所述防粘层为1um，所述导电层为1um。
实施例三
一种上盖带，包括依次叠加的PET层、复合层、胶水层、防粘层和导电层，所述复合层包括PE75％、CPP13％和EMMA12％，所述胶水层包括SEBS橡胶85％、增粘树脂10％、聚氨酯5％；所述防粘层包括蜡粉20％和环乙烷80％，所述导电层为聚噻吩导电液，所述PET层的厚度为22um，所述复合层为16um、所述胶水层为14um、所述防粘层为1um，所述导电层为1um。
实施例四
一种上盖带，包括依次叠加的PET层、复合层、胶水层、防粘层和导电层，所述复合层包括PE85％、CPP7％和EMMA8％，所述胶水层包括SEBS橡胶90％、增粘树脂5％、聚氨酯5％；所述防粘层包括蜡粉18％和环乙烷82％，所述导电层为聚噻吩导电液，所述PET层的厚度为22um，所述复合层为16um、所述胶水层为14um、所述防粘层为1um，所述导电层为1um。
实施例五
一种上盖带，包括依次叠加的PET层、复合层、胶水层、防粘层和导电层，所述复合层包括PE80％、CPP12％和EMMA8％，所述胶水层包括SEBS橡胶85％、增粘树脂10％、聚氨酯5％；所述防粘层包括蜡粉17％和环乙烷83％，所述导电层为聚噻吩导电液，所述PET层的厚度为22um，所述复合层为16um、所述胶水层为14um、所述防粘层为1um，所述导电层为1um。
实施例六
一种上盖带，包括依次叠加的PET层、复合层、胶水层、防粘层和导电层，所述复合层包括PE80％、CPP10％和EMMA10％，所述胶水层包括SEBS橡胶87％、增粘树脂5％、聚氨酯8％；所述防粘层包括蜡粉24％和环乙烷76％，所述导电层为聚噻吩导电液，所述PET层的厚度为22um，所述复合层为16um、所述胶水层为14um、所述防粘层为1um，所述导电层为1um。
将各实施例的上盖带裁剪成5.5mm宽度作为盖带，在密封温度+150℃、密封时间＝0.5秒、密封压力＝0.345MPa下对8mm宽的导电性PS类载带进行热封，测定剥离力。
用分光光度计测定上盖带的透光率。
将各实施例中裁剪的上盖带呈唱片状卷绕在塑芯上，使上盖带的导电层一侧朝外，在常温环境下放置剪切加工品，使用三菱化学株式会社的HIRESTA UP MCP-HT450，用JISK6911的方法，在常温环境下，外加电压500V，测定上盖带的导电层一侧的表面电阻率。
本发明生产的产品质量稳定，无过高工艺要求，其密封性能好、剥离力小于20g，复合层内设有CPP具有高透明、高清晰度，能够使透过率高于70％-80％，表面电阻低于10E9－10E11。
以上所述，仅是本发明较佳实施例而已，并非对本发明的技术范围作任何限制，故凡是依据本发明的技术实质对以上实施例所作的任何细微修改、等同变化与修饰，均仍属于本发明技术方案的范围内。
Claims (5)
1.一种上盖带，其特征在于：包括依次叠加的PET层、复合层、胶水层、防粘层和导电层，所述复合层包括PE75％-85％、CPP7％-13％和EMMA8％-12％，所述胶水层包括SEBS橡胶80％-90％、增粘树脂5％-15％、聚氨酯5％-15％；所述防粘层包括蜡粉15％-25％和环乙烷75％-85％，所述导电层为聚噻吩导电液。
2.根据权利要求1所述一种上盖带，其特征在于：所述复合层包括PE80％、CPP10％和EMMA10％。
3.根据权利要求1或2所述一种上盖带，其特征在于：所述防粘层包括蜡粉20％和环乙烷80％。
4.根据权利要求1或2所述一种上盖带，其特征在于：所述胶水层包括SEBS橡胶85％，增粘树脂10％，聚氨酯5％。
5.根据权利要求1所述一种上盖带，其特征在于：所述PET层的厚度为19-25um，所述复合层为15-20um、所述胶水层为10-25um、所述防粘层为1um，所述导电层为1um。
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102119108A (zh) * | 2008-08-12 | 2011-07-06 | 住友电木株式会社 | 电子部件包装用盖带和电子部件包装体 |
| CN103600553A (zh) * | 2013-11-19 | 2014-02-26 | 贵溪若邦电子科技有限公司 | 一种smd热封型上盖带 |
| CN105694803A (zh) * | 2016-03-08 | 2016-06-22 | 滨州职业学院 | 一种热熔压敏胶及其制备工艺 |
| CN113426643A (zh) * | 2021-07-06 | 2021-09-24 | 靖江瑞泰电子材料有限公司 | 一种多层结构的热封盖带及制备方法 |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102119108A (zh) * | 2008-08-12 | 2011-07-06 | 住友电木株式会社 | 电子部件包装用盖带和电子部件包装体 |
| CN103600553A (zh) * | 2013-11-19 | 2014-02-26 | 贵溪若邦电子科技有限公司 | 一种smd热封型上盖带 |
| CN105694803A (zh) * | 2016-03-08 | 2016-06-22 | 滨州职业学院 | 一种热熔压敏胶及其制备工艺 |
| CN113426643A (zh) * | 2021-07-06 | 2021-09-24 | 靖江瑞泰电子材料有限公司 | 一种多层结构的热封盖带及制备方法 |
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Application publication date: 20211207 |