CN113741156A - Developing apparatus and developing method - Google Patents

Developing apparatus and developing method Download PDF

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Publication number
CN113741156A
CN113741156A CN202110539078.0A CN202110539078A CN113741156A CN 113741156 A CN113741156 A CN 113741156A CN 202110539078 A CN202110539078 A CN 202110539078A CN 113741156 A CN113741156 A CN 113741156A
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CN
China
Prior art keywords
developing
developer
substrate
supply nozzle
air
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Pending
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CN202110539078.0A
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Chinese (zh)
Inventor
佐田彻也
永田广
麻生丰
藤原真树
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of CN113741156A publication Critical patent/CN113741156A/en
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Coating Apparatus (AREA)

Abstract

The invention provides a developing processing device and a developing processing method capable of inhibiting product defects of a substrate. The developing device of the embodiment includes a conveying mechanism, a feeding portion, a developing portion, and a gas supply portion. The conveying mechanism advectively conveys the substrate with a part of the resist film exposed. The feeding section can feed the substrate. The developing section has a developer supply nozzle that supplies a developer to the surface of the substrate conveyed by the conveying mechanism from the carry-in section. The gas supply unit is provided in the feeding unit and supplies gas obliquely to the developer supply nozzle.

Description

Developing apparatus and developing method
Technical Field
The invention relates to a developing processing apparatus and a developing processing method.
Background
Patent document 1 discloses a technique of advecting a substrate and performing a developing process on the substrate.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2011-54697
Disclosure of Invention
Technical problem to be solved by the invention
The present invention provides a technique for suppressing product defects of a substrate.
Technical solution for solving technical problem
A developing apparatus according to an embodiment of the present invention includes a conveyance mechanism, a feeding unit, a developing unit, and a gas supply unit. The conveying mechanism advectively conveys the substrate with a part of the resist film exposed. The feeding section can feed the substrate. The developing section has a developer supply nozzle that supplies a developer to the surface of the substrate conveyed by the conveying mechanism from the carry-in section. The gas supply unit is provided in the feeding unit and supplies gas obliquely to the developer supply nozzle.
Effects of the invention
According to the present invention, product defects of the substrate can be suppressed.
Drawings
Fig. 1 is a schematic diagram showing a schematic configuration of a developing apparatus according to an embodiment.
Fig. 2 is a schematic view showing the vicinity of the downstream side of the carrying-in portion in the developing device according to the embodiment.
Fig. 3 is a schematic view of the first developer collecting part of the embodiment as viewed from the front.
Fig. 4 is a schematic view of the flow of the developer discharged from the first developer supply nozzle as viewed from the width direction in the developing treatment apparatus of the embodiment.
Fig. 5 is a schematic view of the flow of the developer discharged from the first developer supply nozzle as viewed from the front in the developing device according to the embodiment.
Fig. 6 is (a) diagram illustrating the flow of air sent by the FFU in the developing apparatus according to the embodiment.
Fig. 7 is a diagram (second drawing) illustrating the flow of air sent out by the FFU in the developing apparatus according to the embodiment.
Fig. 8 is a diagram illustrating the flow of the developer dropped from the rear end of the base sheet in the developing apparatus according to the embodiment.
Fig. 9 is a flowchart illustrating substrate processing according to an embodiment.
Fig. 10 is a schematic view showing a part of a developing apparatus according to a modification of the embodiment.
Description of the reference numerals
1 developing processing device
2 conveying mechanism
3 feeding part
4 developing part
10 first developer supply nozzle (developer supply nozzle)
11 second developer supply nozzle (developer supply nozzle)
50 gas supply part
51 first exhaust device
52 second exhaust device (exhaust part)
53 first developer collecting part (developer collecting part)
54 second developer collecting part (developer collecting part)
55 developer recovery tray (developer recovery part)
56 developer receiving part
60 FFU (air supply part)
61 guide plate
61a virtual plane
62 partition board
73 receiving plate
75 discharge part
S substrate
Sa conveys the noodles.
Detailed Description
Hereinafter, embodiments of the developing apparatus and the developing method according to the present disclosure will be described in detail with reference to the drawings. The developing apparatus and the developing method disclosed in the embodiments shown below are not limited to the above embodiments.
(Structure of developing apparatus)
A developing apparatus 1 according to an embodiment will be described with reference to fig. 1. Fig. 1 is a schematic diagram showing a schematic configuration of a developing apparatus 1 according to an embodiment. The development processing apparatus 1 performs a development process on a glass substrate (hereinafter referred to as a "substrate S") on which a part of a resist film is exposed. In the substrate S, a desired circuit pattern is exposed on the resist film.
The developing apparatus 1 includes a conveyance mechanism 2, a feeding section 3, a developing section 4, a flushing section 5, a drying section 6, a feeding section 7, and a control device 8. The developing apparatus 1 includes a feeding unit 3, a developing unit 4, a rinsing unit 5, a drying unit 6, and a feeding unit 7 arranged in this order from the upstream side in the conveying direction of the substrate S conveyed by the conveying mechanism 2.
The conveying mechanism 2 has a plurality of rollers 2 a. The plurality of rollers 2a are disposed at a desired interval in the conveying direction. The plurality of rollers 2a are rotated by a driving device. The transport mechanism 2 rotates the plurality of rollers 2a by a driving device, and transports the substrate S along with the rotation of the plurality of rollers 2 a. Specifically, the transport mechanism 2 transports the substrate S so that the surface of the substrate S moves in the horizontal direction. That is, the conveyance mechanism 2 advectively conveys the substrate S on which a part of the resist film is exposed. The drive device is, for example, an electric motor. The transport mechanism 2 advects the substrate S from the carry-in portion 3 to the carry-out portion 7.
Hereinafter, a horizontal direction perpendicular to the conveyance direction is referred to as a "width direction", and a direction parallel to the vertical direction is referred to as an "up-down direction". The traveling direction of the substrate S in the transport direction is referred to as "front", and the opposite side to the traveling direction of the substrate S in the transport direction is referred to as "rear". That is, the downstream side in the transport direction is "front", and the upstream side in the transport direction is "rear".
The carry-in section 3 carries the substrate S by the carrying device. The substrate S fed into the feeding section 3 is conveyed by the conveying mechanism 2. The feeding Unit 3 is provided with an FFU (Fan Filter Unit) 60 for introducing outdoor air and removing dust from the air flow.
The developing unit 4 performs a developing process on the substrate S conveyed by the conveying mechanism 2 from the carry-in unit 3. The developing section 4 supplies the substrate S with the developer, and fills the substrate S with the developer (i.e., forms a puddle of the developer). The developing portion 4 includes a first developer supply nozzle 10, a second developer supply nozzle 11, and a third developer supply nozzle 12.
The first developer supply nozzle 10 and the second developer supply nozzle 11 (an example of a developer supply nozzle) supply the developer to the surface of the substrate S conveyed by the conveyance mechanism 2 from the carry-in portion 3, and fill the surface of the substrate S with the developer. The first developer supply nozzle 10 and the second developer supply nozzle 11 are disposed on the upstream side of the developing section 4 in the conveying direction of the substrate S. Specifically, the first developer supply nozzle 10 and the second developer supply nozzle 11 are provided at the upstream side end of the developing portion 4. The first developer supply nozzle 10 and the second developer supply nozzle 11 are arranged in line in the conveying direction.
The first developer supply nozzle 10 and the second developer supply nozzle 11 are provided to extend in the width direction. Slit-shaped release openings extending in the width direction are formed at the lower ends of the first developer supply nozzle 10 and the second developer supply nozzle 11. The first and second developer supply nozzles 10 and 11 discharge the developer from the discharge ports and fill the substrate S with the developer.
The third developer supply nozzle 12 is disposed on the downstream side in the conveying direction from the first developer supply nozzle 10 and the second developer supply nozzle 11. The third developer supply nozzle 12 is provided extending in the width direction. A slit-shaped release opening extending in the width direction is formed at the lower end of the third developer supply nozzle 12. The third developer supply nozzle 12 further supplies the developer to the substrate S filled by the first developer supply nozzle 10 and the second developer supply nozzle 11.
The first developer supply nozzle 10, the second developer supply nozzle 11, and the third developer supply nozzle 12 are supplied with developer from a developer supply source 14 via a developer supply line 13. The developer supply line 13 is provided with a flow rate control valve and an on-off valve. The flow rate of the developer supplied from each of the developer supply nozzles 10 to 12 can be controlled by adjusting the opening degree of the flow rate control valve.
The rinse unit 5 performs a rinse process of cleaning the substrate S conveyed from the developing unit 4 by the conveying mechanism 2 with a rinse liquid. The rinse solution is, for example, deionized water (DIW (deionized Water)).
The rinse section 5 includes an air curtain generating nozzle 20, a first rinse solution supply nozzle 21, and a second rinse solution supply nozzle 22.
The air curtain generating nozzle 20 is disposed upstream of the rinsing section 5 in the conveying direction of the substrate S. Specifically, the air curtain generating nozzle 20 is provided at the upstream side end of the flushing part 5. Further, the air curtain generating nozzle 20 may be provided at the downstream side end of the developing section 4.
The air curtain forming nozzle 20 is provided to extend in the width direction. The air curtain forming nozzle 20 discharges air from the discharge opening to form an air curtain. The air curtain generating nozzle 20 drops the developing solution from the surface of the substrate S by the air curtain.
The air curtain forming nozzle 20 is supplied with air from an air supply source 24 via an air supply line 23. The air supply line 23 is provided with a flow rate control valve and an on-off valve. By adjusting the opening degree of the flow control valve, the flow rate of the air discharged from the air curtain producing nozzle 20 can be controlled.
The first rinse liquid supply nozzle 21 is provided upstream of the rinse portion 5 in the conveying direction of the substrate S. The first rinse liquid supply nozzle 21 is provided downstream of the air curtain generating nozzle 20 in the transport direction of the substrate S. The first rinse liquid supply nozzle 21 is provided to extend in the width direction. The first rinse liquid supply nozzle 21 supplies the rinse liquid to the substrate S on which the developing solution is dropped by the air curtain, and cleans the substrate S.
The second rinse liquid supply nozzle 22 is provided on the downstream side of the rinse section 5 in the conveying direction of the substrate S. Specifically, the second rinse liquid supply nozzle 22 is provided at the downstream end of the rinse portion 5 in the conveying direction. The second rinse liquid supply nozzle 22 is provided to extend in the width direction. The second rinse liquid supply nozzle 22 supplies the rinse liquid to the substrate S, and further cleans the substrate S.
The first rinse liquid supply nozzle 21 and the second rinse liquid supply nozzle 22 are supplied with rinse liquid from a rinse liquid supply source 26 via a rinse liquid supply line 25. The rinse liquid supply line 25 is provided with a flow rate control valve and an on-off valve. By adjusting the opening degree of the flow rate control valve, the flow rate of the developer supplied from each of the rinse liquid supply nozzles 21 and 22 can be controlled.
The rinse unit 5 may be provided with a spray nozzle for spraying the rinse liquid between the first rinse liquid supply nozzle 21 and the second rinse liquid supply nozzle 22.
The drying section 6 performs a drying process of drying the substrate S conveyed from the rinsing section 5 by the conveying mechanism 2. The drying unit 6 removes the rinse liquid from the substrate S cleaned with the rinse liquid to dry the substrate S.
The drying section 6 has an air knife 30. The rinse liquid adhering to the substrate S is removed by the air knife 30 to dry the substrate S. The gas knife 30 is provided extending in an oblique direction with respect to the conveyance direction of the substrate S. Specifically, the air knife 30 is provided to extend obliquely with respect to the transport direction and the width direction.
Air is supplied to the air knife 30 from an air supply source 24 via an air supply line 23. The air supply line 23 is provided with a flow rate control valve and an on-off valve. The flow rate of the air discharged from the air knife 30 can be controlled by adjusting the opening degree of the flow control valve.
The feeding unit 7 conveys the substrate S from the drying unit 6 by the conveying mechanism 2. The substrate S conveyed to the sending-out portion 7 is sent out by the conveying device. The delivery unit 7 is provided with FFU40 for drawing outdoor air and removing dust from the air flow.
The control device 8 is, for example, a computer, and includes a control unit 8A and a storage unit 8B. The storage unit 8B is implemented by, for example, a semiconductor Memory element such as a RAM (Random Access Memory) or a Flash Memory, or a storage device such as a hard disk or an optical disk.
The control Unit 8A includes a microcomputer including a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM, an input/output port, and the like, and various circuits. The CPU of the microcomputer realizes control of the development processing apparatus 1 by reading and executing a program stored in the ROM.
The program may be recorded in a computer-readable storage medium, and may be installed from the storage medium to the storage unit 8B of the control device 8. Examples of the computer-readable storage medium include a Hard Disk (HD), a Flexible Disk (FD), an optical disk (CD), a magneto-optical disk (MO), and a memory card.
In addition, as shown in fig. 2, the development processing apparatus 1 includes a gas supply portion 50, a first exhaust device 51, a second exhaust device 52, a first developer collection portion 53, a second developer collection portion 54, a developer recovery tray 55, and a developer receiving portion 56. Fig. 2 is a schematic diagram showing the vicinity of the downstream side of the carrying-in section 3 in the developing apparatus 1 according to the embodiment.
The gas supply unit 50 is provided in the carry-in unit 3, and supplies air (an example of gas) obliquely to the developer supply nozzles 10 and 11 (an example of a developer supply nozzle) to suppress the mist of the developer from adhering to the substrate S carried in the carry-in unit 3. The gas supply section 50 includes the FFU60, the guide plate 61, and the partition plate 62.
The FFU60 is provided on the downstream side of the carry-in section 3 in the conveying direction of the substrate S. The FFU60 (an example of the blowing section) is provided at the top of the feeding section 3. The FFU60 sends air (an example of gas) downward.
The guide plate 61 is disposed below the FFU 60. The guide plate 61 guides air (an example of gas) sent out from the FFU60 (an example of a blowing section) to each of the developer supply nozzles 10 and 11 (an example of a developer supply nozzle). The guide plate 61 is provided extending in the width direction. The guide plate 61 becomes lower in height as going from the upstream side to the downstream side in the conveyance direction of the substrate S. That is, the guide plate 61 is provided obliquely so that the front side is lower than the rear side.
The guide plate 61 is provided so that an intersection between a transport surface Sa of the substrate S transported by the transport mechanism 2 and an imaginary surface 61a extending the guide plate 61 is located upstream of the first developer supply nozzle 10 (an example of a developer supply nozzle) in the transport direction of the substrate S.
The front end of the guide plate 61 on the developing unit 4 side is provided on the downstream side in the conveying direction of the substrate S than the front end on the developing unit 4 side at the standby position where the substrate S is stopped in the carrying-in unit 3. In fig. 2, the substrate S stopped at the standby position is indicated by a dotted line. In addition, the substrate S may not be stopped at the standby position. The substrate S is stopped at the standby position according to the transport speed of the substrate S and the processing status after the developing section 4.
The leading end of the guide plate 61 on the opposite side of the developing unit 4 is provided between both ends of the air blowing port 60a of the FFU60 (an example of the air blowing unit) in the conveying direction of the substrate S. The guide plate 61 is provided so as to be able to divide the air sent out by the FFU60 into a first air flow flowing toward the developing portion 4 along the upper surface of the guide plate 61 and a second air flow passing between the guide plate 61 and the partition plate 62. The guide plate 61 is provided so that, for example, the ratio of the flow rates of the first air flow and the second air flow is "2: 1".
The partition plate 62 is provided to extend downward from an upstream end of the FFU60 (an example of a blowing section) in the conveyance direction of the substrate S. Specifically, the partition plate 62 is provided to extend downward from the end of the air blowing port 60a on the upstream side of the FFU 60. The partition plate 62 is provided to extend in the width direction.
The first exhaust device 51 is provided in the sending portion 3. The first exhaust device 51 is disposed below the guide plate 61. Specifically, the first exhaust device 51 is disposed below the guide plate 61 and below the roller 2 a. The first exhaust device 51 sucks air in the feeding portion 3 and discharges the sucked air to the outside.
The second air exhausting device 52 is provided in the developing portion 4. The second air exhausting device 52 is provided downstream of the respective developer supply nozzles 10, 11 in the conveying direction of the substrate S. The second air discharging device 52 is provided below the roller 2 a. The second air exhausting device 52 sucks air inside the developing section 4 and exhausts the sucked air to the outside. The second air exhausting device 52 (an example of an air exhausting portion) exhausts air (an example of gas) from a downstream side of the developing liquid supply nozzles 10 and 11 (developing liquid supply nozzles) in the conveying direction of the substrate S and from a lower side of the substrate S conveyed by the conveying mechanism 2.
The developer collecting portions 53 and 54 (an example of a developer collecting portion) are provided below the developer supply nozzles 10 and 11 (an example of a developer supply nozzle), and collect the developer discharged from the developer supply nozzles 10 and 11.
Specifically, the first developer collecting portion 53 is disposed below the first developer supply nozzle 10. The second developer collecting portion 54 is disposed below the second developer supply nozzle 11. That is, the first and second developer collecting parts 53 and 54 are provided in line in the conveying direction of the substrate S. In a state where there is no substrate S under the first developing liquid supply nozzle 10, the first developing liquid collecting portion 53 collects the developing liquid discharged from the first developing liquid supply nozzle 10, and discharges the collected developing liquid to the developing liquid recovery tray 55. In a state where there is no substrate S below the second developing liquid supply nozzle 11, the second developing liquid collecting portion 54 collects the developing liquid discharged from the second developing liquid supply nozzle 11, and discharges the collected developing liquid into the developing liquid recovery tray 55.
Next, the structure of the first developer collecting portion 53 will be described with reference to fig. 2 and 3, and the structure of the second developer collecting portion 54 is the same. Fig. 3 is a schematic view of the first developer collecting portion 53 of the embodiment as viewed from the front.
The first developer collecting portion 53 is provided in plurality in the width direction. In fig. 3, an example in which 3 first developer collecting units 53 are arranged is shown, but the present invention is not limited thereto. The first developer collecting portion 53 may be provided in 2 or 4 or more. The first developer collection portion 53 includes a bottom portion 70, a front wall portion 71, a rear wall portion 72, a receiving plate 73, a side wall portion 74, and a discharge portion 75.
The bottom portion 70 is disposed between the roller 2a and the developer recovery tray 55. The bottom 70 is provided extending in the width direction. The front wall 71 extends upward from the front end of the bottom 70. The front wall portion 71 is provided to extend in the width direction. The rear wall portion 72 extends upward from the rear end of the bottom portion 70. The rear wall portion 72 is provided to extend in the width direction.
The receiving plate 73 receives the developing solution discharged from the first developing solution supply nozzle 10 in a case where there is no substrate S under the first developing solution supply nozzle 10 (an example of the developing solution supply nozzle). The receiving plate 73 is inclined with respect to the conveying direction of the substrate S. The receiving plate 73 is provided to extend obliquely upward from the upper end of the rear wall portion 72. Receiving plate 73 is provided obliquely such that the rear end of receiving plate 73 is located rearward of rear wall portion 72. That is, the receiving plate 73 extends obliquely rearward from the upper end of the rear wall portion 72.
The receiving plate 73 is provided so that the developer discharged from the slit-shaped discharge opening of the first developer supply nozzle 10 lands at a portion where it flows in a band shape. Specifically, the length from the tip of the first developer supply nozzle 10 (an example of the developer supply nozzle) to the position where the developer lands on the receiving plate 73 is 10mm or less. The upper end of the receiving plate 73 is lower than the upper end of the roller 2 a. That is, the receiving plate 73 is disposed not to abut against the substrate S. The receiving plate 73 is provided extending in the width direction.
The side wall portion 74 is provided to extend upward from one end of the bottom portion 70 in the width direction. Side wall portion 74 connects front wall portion 71 and rear wall portion 72.
The discharging unit 75 discharges the developer collected by the receiving plate 73 to the developer recovery tray 55 (an example of a developer recovery unit). The discharge portion 75 is provided to extend obliquely downward from the other end of the bottom portion 70 in the width direction. The discharge portion 75 is provided to extend from the other end of the bottom portion 70 in the width direction to the opposite side of the side wall portion 74. The discharging unit 75 is provided to suppress the generation of mist of the developer when the developer discharged from the discharging unit 75 to the developer recovery tray 55 lands on the developer recovery tray 55. Specifically, the discharge portion 75 is provided so that the length from the tip of the discharge portion 75 to the portion where the developer lands on the developer recovery tray 55 is 15mm or less.
The developer recovery tray 55 is disposed below the first developer collecting portion 53 and the second developer collecting portion 54. The developer recovery tray 55 recovers the developer. The developer recovery tray 55 recovers the developer scattered from the base sheet S and the developer discharged from the developer collecting units 53 and 54.
The developer receiving portion 56 is provided below the roller 2 a. The developer receiving portion 56 is provided at the upstream side of the first developer supply nozzle 10 in the conveying direction of the substrate S. The developer receiving portion 56 receives the developer scattered from the end portion on the upstream side of the substrate S and collects the developer. The developer receiving portion 56 discharges the collected developer to the developer recovery tray 55. The developer receiving portion 56 is inclined such that the height thereof becomes lower as it goes from the upstream side to the downstream side in the conveying direction of the substrate S. The developer receiving portion 56 is provided extending in the width direction.
(flow of developing solution)
Next, the flow of the developer discharged from the developer supply nozzles 10 and 11 in a state where the base sheet S is not present below the developer supply nozzles 10 and 11 will be described with reference to fig. 4 and 5. Here, the first developer supply nozzle 10 will be described as an example. Fig. 4 is a schematic view of the flow of the developer discharged from the first developer supply nozzle 10 as viewed from the width direction (left-right direction) in the developing apparatus 1 according to the embodiment. Fig. 5 is a schematic view of the flow of the developer discharged from the 1 st developer supply nozzle 10 as viewed from the front in the developing treatment apparatus 1 of the embodiment. In fig. 5, the front wall portion 71 of the first developer collecting portion 53 is omitted for the sake of explanation.
The developing solution discharged from the first developing solution supply nozzle 10 falls to the receiving plate 73 of the first developing solution collecting portion 53. The receiving plate 73 is formed to be inclined downward as going from the upstream side to the downstream side in the conveying direction of the substrate S. The length from the tip of the first developer supply nozzle 10 to the position where the developer lands on the receiving plate 73 is 10mm or less. Therefore, the generation of the mist of the developing solution when the developing solution lands on the receiving plate 73 can be suppressed.
The developing solution landed on the receiving plate 73 flows along the receiving plate 73 and the rear wall portion 72 to the bottom portion 70. The developer flowing to the bottom portion 70 flows toward the discharge portion 75 in the width direction. Then, the developer is discharged from the discharge portion 75 to the developer recovery tray 55. The discharge portion 75 is formed obliquely downward. The length from the tip of the discharge portion 75 to the portion where the developer lands on the developer recovery tray 55 is 15mm or less. Therefore, when the developer lands on the developer recovery tray 55, the generation of mist of the developer can be suppressed.
By providing the plurality of first developer collecting portions 53 in the width direction, the developer is dispersedly discharged to the developer recovery tray 55. That is, the flow rate of the developer discharged from the 1 discharge unit 75 is reduced. Further, by dispersing the developer liquid in the plurality of discharging portions 75, the developer liquid from each discharging portion 75 can be prevented from flowing together after landing on the developer liquid recovery tray 55. Therefore, when the developer lands on the developer recovery tray 55, the generation of mist of the developer due to disturbance of the flow of the developer can be suppressed.
(flow of air)
Next, the flow of air sent out by FFU60 will be described with reference to fig. 6 and 7. Fig. 6 is (a) diagram illustrating the flow of air sent out by the FFU60 in the developing apparatus 1 according to the embodiment. Fig. 7 is a diagram (second diagram) illustrating the flow of air sent out by FFU60 in developing apparatus 1 according to the embodiment. Fig. 6 shows a state where the substrate S is present at the standby position of the carrying section 3. Fig. 7 shows a state where the substrate S is not present at the standby position of the carrying section 3.
The air sent out from FFU60 is divided into a first air stream and a second air stream by guide plate 61.
The air of the first air flow flows along the upper surface of the guide plate 61 toward the first and second developer supply nozzles 10 and 11. The developing process apparatus 1 has no partition between the carry-in portion 3 and the developing portion 4. Thereby, the flow rate of the air flowing from the sending-in portion 3 to the developing portion 4 by the first air flow becomes large. Therefore, the mist of the developing solution generated in the developing unit 4 can be prevented from flowing to the feeding unit 3. Further, the flow rate of air of the first air flow becomes small. This can prevent the developer filled on the upper surface of the substrate S from being blown by the air of the first air flow, thereby preventing the generation of mist of the developer. Further, it is possible to suppress the mixing of bubbles into the developing solution filled on the upper surface of the substrate S, and to suppress the occurrence of development defects due to the mixing of bubbles.
The transport mechanism 2 transports the intersection of the transport surface Sa of the substrate S and the virtual surface 61a extending the guide plate 61 upstream of the first developer supply nozzle 10 in the transport direction of the substrate S. Therefore, the mist of the developing solution can be suppressed from flowing upstream of the intersection of the transport surface Sa and the virtual surface 61a by the air of the first air flow.
The air of the second air flow passes between the guide plate 61 and the partition plate 62 and flows downward. The air passing between the guide plate 61 and the partition plate 62 flows diffusively along the guide plate 61 and the partition plate 62. By providing the partition plate 62, the flow of air to the upstream side of the sending-in portion 3 can be suppressed. That is, the partition plate 62 increases the flow rate of the air of the second air flow flowing downstream of the FFU 60.
In the case where there is the substrate S at the standby position, the air of the second air flow flows toward the developing section 4 side along the guide plate 61 and the substrate S. The distance between the guide plate 61 and the substrate S becomes shorter as going to the downstream side in the conveying direction of the substrate S. This increases the flow velocity of the air flowing between the guide plate 61 and the substrate S toward the developing unit 4. Therefore, the mist of the developing solution can be suppressed from flowing toward the carrying-in portion 3, and the mist of the developing solution can be suppressed from adhering to the substrate S located at the standby position. The air of the second air flow flowing toward the developing unit 4 through the space between the guide plate 61 and the substrate S merges with the air of the first air flow. Therefore, the blowing of the developing solution filled on the upper surface of the substrate S can be suppressed by the air of the second air flow.
The leading end of the guide plate 61 on the downstream side is provided on the downstream side from the leading end of the substrate S at the standby position in the conveying direction of the substrate S. Thereby, the substrate S at the standby position is covered by the guide plate 61. Therefore, the mist of the developing solution can be suppressed from adhering to the substrate S located at the standby position.
In the case where there is no substrate S at the standby position, the air of the second air flow flows along the guide plate 61 toward the developing section 4 and flows downward through between the rollers 2 a.
The feeding unit 3 is provided with a first exhaust device 51. The first exhaust device 51 is disposed below the guide plate 61, and exhausts air to the outside from below the guide plate 61.
The developing unit 4 is provided with a second air exhaust device 52. The air flowing to the developing portion 4 is discharged to the outside by the second air discharging device 52. The second air discharging device 52 is provided downstream of the second developer supply nozzle 11 and below the roller 2a in the conveying direction of the substrate S. This can suppress the flow of air on the upstream side of the developing unit 4 toward the sending-in unit 3. Therefore, the flow of the mist of the developing solution to the feeding portion 3 side can be suppressed.
(flow of developer spilled from substrate)
Next, the flow of the developer scattered from the base sheet S will be described with reference to fig. 8. Fig. 8 is a diagram illustrating the flow of the developer dropped from the base sheet S in the developing apparatus 1 according to the embodiment. In fig. 8, the flow of the developer is indicated by a dotted arrow.
When the developing solution is filled from the first developing solution supply nozzle 10 and the second developing solution supply nozzle 11 onto the upper surface of the substrate S, the developing solution may flow to the upstream side of the first developing solution supply nozzle 10 in the conveying direction of the substrate S.
The developing treatment apparatus 1 collects the developer dropped from the end portion on the upstream side in the conveying direction of the substrate S by the developer receiving portion 56. The developer receiving portion 56 is inclined such that the height thereof becomes lower as it goes from the upstream side to the downstream side in the conveying direction of the substrate S. Therefore, the developer collected by the developer receiving portion 56 flows downstream in the conveying direction of the substrate S and is discharged to the developer recovery tray 55. The developer scattered from the substrate S is collected by the developer receiving portion 56 and then discharged to the developer recovery tray 55. Therefore, when the developer lands on the developer recovery tray 55, the generation of mist of the developer can be suppressed.
Further, the developer collected by the developer receiving portion 56 is urged to flow downstream by the air flowing from the upstream side to the downstream side in the conveying direction of the substrate S. Therefore, the retention of the developer in the developer receiving portion 56 can be suppressed. Further, the mist of the developing solution generated from the developing solution landing on the developing solution receiving portion 56 can be suppressed from flowing upstream in the conveying direction of the substrate S.
(substrate treatment)
Next, a substrate processing will be described with reference to fig. 9. Fig. 9 is a flowchart illustrating substrate processing according to an embodiment.
The development processing apparatus 1 performs a carry-in process (S100). The developing apparatus 1 feeds the substrate S to the carry-in section 3 by a transport device. The developing apparatus 1 carries the substrate S carried by the carrying mechanism 2 in a advection in the carrying direction.
The development processing apparatus 1 performs development processing (S101). The developing apparatus 1 conveys the substrate S from the carry-in section 3 to the developing section 4. In the developing apparatus 1, the developing solution is supplied from the first developing solution supply nozzle 10 and the second developing solution supply nozzle 11 in a state where air is sent by the FFU60, and the upper surface of the substrate S is filled with the developing solution. Further, the developing treatment apparatus 1 supplies the developing solution from the third developing solution supply nozzle 12 to the upper surface of the substrate S, and further fills the developing solution. Further, the air is discharged to the outside by the first exhaust device 51 and the second exhaust device 52.
The developing apparatus 1 performs a flushing process (S102). The developing apparatus 1 conveys the substrate S from the developing section 4 to the rinsing section 5. The developing apparatus 1 generates an air curtain by the air curtain generating nozzle 20, and drops the developing solution from the upper surface of the substrate S by the air curtain. The developing apparatus 1 supplies the rinse liquid to the substrate S from the first rinse liquid supply nozzle 21 and the second rinse liquid supply nozzle 22, and cleans the substrate S.
The developing apparatus 1 performs a drying process (S103). The developing apparatus 1 conveys the substrate S from the rinsing section 5 to the drying section 6. The developing treatment apparatus 1 discharges air to the substrate S by the air knife 30, removes the rinse liquid from the substrate S, and dries the substrate S.
The development processing apparatus 1 performs the feeding process (S104). The developing apparatus 1 conveys the substrate S from the drying section 6 to the feeding section 7. The substrate S conveyed to the sending-out portion 7 is conveyed by the conveying device.
(Effect)
The developing apparatus 1 includes a conveyance mechanism 2, a feeding portion 3, a developing portion 4, and a gas supply portion 50. The conveyance mechanism 2 advectively conveys the substrate S on which a part of the resist film is exposed. The carry-in section 3 can carry in the substrate S. The developing unit 4 has developer supply nozzles 10 and 11 for supplying the developer to the surface of the substrate S conveyed by the conveying mechanism 2 from the carry-in unit 3. The gas supply unit 50 is provided in the supply unit 3, and supplies air (an example of gas) obliquely to the developer supply nozzles 10 and 11.
Thus, the developing apparatus 1 can suppress the mist of the developer from flowing toward the carrying-in portion 3 by the air flowing toward the developer supply nozzles 10 and 11. Therefore, the developing treatment apparatus 1 can suppress the mist of the developing solution from adhering to the substrate S conveyed in the carry-in portion 3. When the mist of the developing solution adheres to the substrate S before the developing solution is filled, the resist film at the portion where the mist of the developing solution adheres may disappear, and a product defect may occur.
The developing treatment apparatus 1 can suppress the occurrence of product defects by suppressing the adhesion of the mist of the developing solution to the substrate S conveyed in the carry-in portion 3.
The gas supply unit 50 includes an FFU60 (an example of a blowing unit) and a guide plate 61. The FFU60 sends out gas. The guide plate 61 guides the air (an example of gas) sent from the blowing unit to the developer supply nozzles 10 and 11. The guide plate 61 becomes lower in height as going from the upstream side to the downstream side in the conveyance direction of the substrate S.
Accordingly, the developing apparatus 1 can guide air to the developer supply nozzles 10 and 11 along the guide plate 61, and can suppress the mist of the developer from flowing toward the sending-in portion 3. Further, the developing apparatus 1 can suppress an increase in the flow velocity of air flowing toward the substrate S below the developer supply nozzles 10 and 11, and can suppress blowing of the developer filled in the substrate S by the air. Therefore, the development processing apparatus 1 can suppress the generation of the mist of the developing solution. Further, the developing apparatus 1 can suppress the mixing of bubbles in the developing solution filled in the substrate S and suppress the occurrence of development defects due to the mixing of bubbles.
The transport mechanism 2 transports the intersection of the transport surface Sa of the substrate S and the virtual surface 61a extending the guide plate 61 upstream of the developer supply nozzles 10 and 11 in the transport direction of the substrate S.
Thus, the developing apparatus 1 can suppress the mist of the developing solution from flowing upstream of the intersection of the transport surface Sa of the transport mechanism 2 transporting the substrate S and the virtual surface 61a extending the guide plate 61 by the air flowing along the guide plate 61. Therefore, the developing apparatus 1 can suppress the mist of the developer from flowing to the feeding portion 3, and suppress the occurrence of product defects.
The front end of the guide plate 61 on the developing section 4 side is provided on the downstream side in the conveying direction of the substrate S than the front end on the developing section 4 side at the standby position where the substrate S stops in the carry-in section 3.
Thus, the developing apparatus 1 covers the upper side of the substrate S at the stop and standby positions with the guide plate 61, and can suppress the mist of the developing solution from adhering to the substrate S at the stop and standby positions. Therefore, the development processing apparatus 1 can suppress the generation of product defects.
The FFU60 (an example of a blowing unit) is provided at the top of the feeding unit 3 and feeds air (an example of gas) downward.
Thus, the development processing apparatus 1 can suppress the mist of the developer from flying, and suppress the mist of the developer from spreading upward. Therefore, the developing apparatus 1 can suppress the flow of the mist of the developing solution to the feeding portion 3, and suppress the occurrence of product defects.
The leading end of the guide plate 61 on the side opposite to the developing section 4 is provided between both ends of the air blowing port 60a of the FFU60 (an example of the air blowing section) in the conveying direction of the substrate S.
Thus, the developing apparatus 1 can divide the air sent out from the FFU60 into a first air flow flowing along the upper surface of the guide plate 61 toward the developing unit 4 and a second air flow passing between the guide plate 61 and the partition plate 62. Therefore, the developing apparatus 1 guides the air of the first air flow to the developer supply nozzles 10 and 11, and can suppress the mist of the developer from flowing toward the carrying-in portion 3.
Further, the developing apparatus 1 can suppress the mist of the developing solution from flowing upstream of the FFU60 by the second air flow. Further, the developing device 1 can increase the flow velocity of the second air flow flowing below the guide plate 61. For example, in the case where the substrate S is present at the standby position, the distance between the guide plate 61 and the substrate S becomes shorter as it goes to the downstream side in the conveying direction of the substrate S. Therefore, the developing apparatus 1 can suppress the mist of the developing solution from flowing from the lower side to the upstream side of the guide plate 61, and suppress the mist of the developing solution from adhering to the substrate S at the standby position.
The developing processing apparatus 1 includes a partition plate 62. The partition plate 62 is provided to extend downward from an end portion on the upstream side of the FFU60 (an example of a blowing section) in the conveyance direction of the substrate S.
Accordingly, the developing device 1 can suppress the air sent from the FFU60 from flowing upstream of the FFU60, increase the flow rate of the air of the second air flow flowing downstream of the FFU60, and increase the flow velocity of the air of the second air flow. Therefore, the developing treatment apparatus 1 can suppress the mist of the developing solution from flowing upstream in the conveying direction of the substrate S. Therefore, the developing treatment apparatus 1 can suppress the mist of the developing solution from adhering to the substrate S conveyed in the carry-in portion 3.
The developing apparatus 1 includes a second exhaust device 52 (an example of an exhaust unit). The second air discharge device 52 discharges air (an example of gas) from the downstream side of the developer supply nozzles 10 and 11 (an example of the developer supply nozzle) in the substrate S conveyance direction and from the lower side of the substrate S conveyed by the conveyance mechanism 2.
Thus, the developing apparatus 1 discharges the air containing the mist of the developer from the second air discharging device 52, and can suppress the flow of the mist of the developer to the feeding portion 3.
The developing apparatus 1 includes developer collecting portions 53 and 54. The developer collecting portions 53 and 54 are provided below the developer supply nozzles 10 and 11 (an example of a developer supply nozzle), and collect the developer discharged from the developer supply nozzles 10 and 11. Each of the developer collecting portions 53, 54 includes a receiving plate 73. In the case where there is no substrate S under each of the developing liquid supply nozzles 10, 11, the receiving plate 73 receives the developing liquid discharged from each of the developing liquid supply nozzles 10, 11. The receiving plate 73 is inclined with respect to the conveying direction.
Accordingly, in the developing apparatus 1, the developing solution discharged from the developing solution supply nozzles 10 and 11 can be prevented from generating mist of the developing solution in a state where the base sheet S is not present below the developing solution supply nozzles 10 and 11.
The length from the tip of each of the developer supply nozzles 10 and 11 (an example of the developer supply nozzle) to the position where the developer lands on the receiving plate 73 is 10mm or less.
Thus, the development processing apparatus 1 can suppress the generation of the mist of the developer when the developer falls on the receiving plate 73.
The developing apparatus 1 includes a developer recovery tray 55 (an example of a developer recovery unit). The developer recovery tray 55 recovers the developer. Each of the developer collecting portions 53 and 54 includes a discharging portion 75. The discharging portion 75 discharges the developer collected by the receiving plate 73 to the developer recovery tray 55.
Thereby, the developing apparatus 1 can collect the developer collected by the developer collecting portions 53 and 54. Further, the developing device 1 collects the developer in the developer collecting portions 53 and 54, and then discharges the developer from the developer collecting portions 53 and 54 to the developer recovery tray 55. Thus, the development processing apparatus 1 can suppress the generation of mist of the developer due to disturbance of the flow of the developer when the developer falls on the developer recovery tray 55.
The developing process apparatus 1 includes a developer receiving portion 56. The developer receiving portion 56 is provided upstream of the developer supply nozzles 10 and 11 (an example of a developer supply nozzle) in the conveying direction of the substrate S, and receives the developer dropped from the upstream end of the substrate S.
Thus, the developing apparatus 1 can collect the developer dropped from the upstream end in the conveying direction of the substrate S by the developer receiving portion 56, and collect the collected developer. Further, the developing apparatus 1 collects the developer scattered from the base sheet S by the developer receiving portion 56, and then discharges the collected developer to the developer recovery tray 55. Therefore, the development processing apparatus 1 can suppress the generation of mist of the developer when the developer falls on the developer recovery tray 55.
(modification example)
As shown in fig. 10, in the developing apparatus 1 of the modification, when the developing solution is supplied to the substrate S, the height of the end portion on the upstream side of the substrate S is set higher than the heights of the other portions in the conveying direction of the substrate S. The development processing apparatus 1 of the modification provides a height difference to the height of the roller 2a of the conveying mechanism 2, so that the height of the upstream end of the substrate S is higher than the height of the other portions. Specifically, in the case where the substrate S is supplied with the developer by the transport mechanism 2, the height of the substrate S on the upstream side of the first developer supply nozzle 10 (an example of the developer supply nozzle) is made higher than the height of the substrate S below the first developer supply nozzle in the transport direction of the substrate S. Fig. 10 is a schematic diagram showing a part of a developing apparatus 1 according to a modification of the embodiment.
Thus, the developing apparatus 1 of the modified example can suppress the occurrence of mist of the developer by suppressing the developer from spilling from the upstream end of the substrate S in the conveying direction of the substrate S.
In the developing device 1 of the modification, the rear wall portion 72 of each of the developer collecting portions 53 and 54 may be inclined. Specifically, the rear wall portion 72 is inclined such that the lower end side is forward of the upper end side. Thus, the development processing apparatus 1 of the modified example can suppress the generation of the mist of the developer when the developer flows to the bottom portion 70.
In the development processing apparatus 1 of the modification, for example, a funnel-shaped discharge portion may be provided as the discharge portion of the first developer collecting portion 53.
The embodiments disclosed herein are merely illustrative in all respects and should not be considered restrictive. In fact, the above-described embodiments can be implemented in various ways. The above-described embodiments may be omitted, replaced, or changed in various ways without departing from the scope and spirit of the appended claims.

Claims (14)

1. A developing processing apparatus, characterized by comprising:
a conveyance mechanism that advectively conveys a substrate on which a part of the resist film is exposed;
a feeding section for feeding the substrate;
a developing section having a developer supply nozzle that supplies a developer to the surface of the substrate conveyed by the conveying mechanism from the carry-in section; and
and a gas supply unit provided in the supply unit and configured to supply gas to the developer supply nozzle in an inclined manner.
2. The developing process apparatus according to claim 1, characterized in that:
the gas supply unit includes:
an air supply unit for supplying the air; and
a guide plate that guides the gas sent from the blowing section to the developer supply nozzle,
the guide plate becomes lower in height as going from an upstream side to a downstream side in a transport direction of the substrate.
3. The developing process apparatus according to claim 2, characterized in that:
the conveying mechanism conveys an intersection of a conveying surface of the base sheet and an imaginary plane extending the guide plate, upstream of the developer supply nozzle in a conveying direction of the base sheet.
4. The developing process apparatus according to claim 2 or 3, characterized in that:
the front end of the guide plate on the developing section side is disposed downstream in the substrate transport direction than the front end of the developing section side at a standby position where the substrate is stopped in the carry-in section.
5. The developing process apparatus according to claim 2 or 3, characterized in that:
the air supply part is arranged at the top of the feeding part and used for sending the air downwards.
6. The developing process apparatus according to claim 2 or 3, characterized in that:
the front end of the guide plate on the side opposite to the developing part side is provided between both ends of the air supply port of the air supply part in the substrate conveyance direction.
7. The developing process apparatus according to claim 2 or 3, characterized in that:
the partition plate is provided so as to extend downward from an end portion of the substrate on the upstream side of the air blowing section in the conveying direction.
8. The developing apparatus according to any one of claims 1 to 3, characterized in that:
the apparatus includes an exhaust unit configured to exhaust the gas from a downstream side of the developer supply nozzle in a transport direction of the substrate and a lower side of the substrate transported by the transport mechanism.
9. The developing apparatus according to any one of claims 1 to 3, characterized in that:
includes a developer collecting portion disposed below the developer supply nozzle, collecting the developer discharged from the developer supply nozzle,
the developing solution collecting portion has a receiving plate that receives the developing solution discharged from the developing solution supply nozzle without the base sheet below the developing solution supply nozzle,
the receiving plate is inclined with respect to a transport direction of the substrate.
10. The developing processing apparatus according to claim 9, characterized in that:
the length from the front end of the developing solution supply nozzle to the position where the developing solution lands on the receiving plate is 10mm or less.
11. The developing processing apparatus according to claim 9, characterized in that:
comprises a developer recovery part for recovering the developer,
the developer collecting portion has a discharging portion that discharges the developer collected by the receiving plate to the developer collecting portion.
12. The developing apparatus according to any one of claims 1 to 3, characterized in that:
the developing device includes a developer receiving portion provided upstream of the developer supply nozzle in a carrying direction of the base sheet, and receiving the developer dropped from an end portion of the base sheet on the upstream side.
13. The developing apparatus according to any one of claims 1 to 3, characterized in that:
in the above-described conveying mechanism, when the developing solution is supplied to the base sheet, the height of the base sheet on the upstream side of the developing solution supply nozzle is made higher than the height of the base sheet below the developing solution supply nozzle in the conveying direction of the base sheet.
14. A developing method is characterized in that:
the developing method comprises advecting a substrate with a part of a resist film exposed by a conveying mechanism, developing the substrate,
the developing processing method comprises the following steps:
a feeding step of feeding the substrate into a feeding section; and
a developing step of supplying a developing solution to the surface of the substrate conveyed by the conveying mechanism from the carry-in portion by a developing solution supply nozzle,
in the developing step, a gas is obliquely supplied from a gas supply portion provided in the feeding portion to the developer supply nozzle.
CN202110539078.0A 2020-05-27 2021-05-18 Developing apparatus and developing method Pending CN113741156A (en)

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