CN113740701A

CN113740701A - Environment control equipment and chip test system

Info

Publication number: CN113740701A
Application number: CN202010466765.XA
Authority: CN
Inventors: 蔡振龙; 基因·罗森塔尔
Original assignee: First Inspection Co Ltd
Current assignee: First Inspection Co Ltd
Priority date: 2020-05-28
Filing date: 2020-05-28
Publication date: 2021-12-03
Anticipated expiration: 2040-05-28
Also published as: CN113740701B

Abstract

The invention discloses a chip testing system and an environment control device. The chip testing system comprises an environment control device, a central control device and a chip testing device, wherein the environment control device comprises a device body and a pressing device. When the chip testing device is arranged in the accommodating chamber of the equipment body and the central control device enables the abutting device to abut against one side of the chips borne by the chip testing device, the central control device controls the chip testing device to detect the chips. After the chip testing device tests the chips, the central control device controls the abutting device and the chip testing device to be separated from each other, and at the moment, the plurality of moving pieces of the abutting device protrude out of the contact surface of the abutting device and push the plurality of chips so as to separate the plurality of chips from the contact surface.

Description

Environment control equipment and chip test system

Technical Field

The present invention relates to an environmental control apparatus and a chip test system, and more particularly, to an environmental control apparatus and a chip test system suitable for testing a semiconductor device (e.g., a memory).

Background

In many conventional chip testing operations, the related pressing device is used to press the chip, so as to ensure that the chip can be electrically contacted with the electrical connection socket during the testing operation. In the specific implementation, after the chip completes the test operation, the problem that the chip and the pressing device are stuck to each other often occurs. When the chip and the pressing device are sticky, the chip and the pressing device are removed manually, so that the whole detection operation is delayed, the chip and the pressing device are separated manually, and the chip is easy to be damaged due to improper operation of related personnel.

Disclosure of Invention

One embodiment of the invention discloses an environmental control device, which comprises an environmental state control device; the equipment body comprises at least one accommodating chamber, the accommodating chamber is used for accommodating a chip testing device, the chip testing device is used for bearing a plurality of chips, the environmental state control device can be electrically connected with the chip testing device arranged in the accommodating chamber, and the environmental state control device can carry out detection operation on the plurality of chips borne by the environmental state control device through the chip testing device; a pressing device disposed in the accommodating chamber, the pressing device comprising: a contact structure having a plurality of movable grooves, each movable groove being formed by a contact surface of the contact structure being inwardly recessed in a longitudinal direction; the movable pieces are correspondingly arranged in the movable groove; one side of each movable piece opposite to the movable groove is provided with a pushing surface; each movable piece can move in the corresponding movable groove along the longitudinal direction, and the pushing surface can protrude out of the contact surface in the process that the movable piece moves in the movable groove; the limiting pieces are fixedly arranged on the contact structure, the limiting pieces are arranged adjacent to the movable grooves, and the limiting pieces and the contact structure can limit the movable range of the movable pieces in the corresponding movable grooves together; when the chip testing device is arranged in the accommodating chamber, the abutting device is correspondingly positioned above the plurality of chips carried by the chip testing device; the environment state control device can enable the chip testing device arranged in the containing chamber and the abutting device positioned in the containing chamber to move close to each other and enable the abutting surfaces and the contact surfaces of the movable pieces to abut against one side surfaces of the chips; the environmental state control device can enable the chip testing device arranged in the containing chamber and the abutting device positioned in the containing chamber to move away from each other under the condition that the abutting surfaces of the moving pieces and the contact surfaces abut against the side surfaces of the chips together, and the moving pieces correspondingly protrude out of the contact surfaces and abut against the chips originally in contact with the contact surfaces.

Preferably, the height of each movable part in the longitudinal direction is not greater than the depth of each movable groove, and each movable part can retract into the corresponding movable groove; when each moving part retracts into the corresponding moving groove, the pushing surface of each moving part can be flush with the contact surface.

Preferably, the pressing device further comprises a plurality of elastic members, the plurality of elastic members are arranged in the plurality of movable grooves, one end of each elastic member is fixed to the contact structure, and one side of each movable member located in each movable groove is connected with at least one elastic member located in the movable groove; when the pushing surface of each moving part does not abut against the chip, at least one elastic element positioned in each moving groove is in a pressed state, and each elastic element enables a part of the moving part connected with the elastic element to protrude out of the contact surface.

Preferably, the contact structure further comprises a plurality of spring receiving grooves, each spring receiving groove is formed by an inner recess of a bottom wall forming each movable groove in a direction away from the contact surface, each movable groove is communicated with at least two spring receiving grooves, and each spring receiving groove is used for receiving one elastic piece.

Preferably, the plurality of movable grooves are formed in the contact structure side by side, the contact structure further comprises a plurality of limiting grooves, each limiting groove is formed by inwards recessing the contact surface along the longitudinal direction, two ends of each movable groove are respectively communicated with the two limiting grooves, and the depth of each limiting groove is smaller than that of each movable groove.

Preferably, each movable piece is provided with a pushing part and two limiting parts, and the pushing part is arranged in the movable groove; when the pressing device faces the chip testing device arranged in the accommodating chamber, the two limiting parts of each moving part respectively press against the two limiting parts, and part of the pressing part correspondingly protrudes out of the contact surface.

Preferably, the environment control apparatus further includes a temperature adjustment device, the temperature adjustment device is connected to the abutting device, the temperature adjustment device is electrically connected to the environment state control device, and the environment state control device can control the temperature adjustment device to operate, so that the temperature of the contact surface of the contact structure reaches a predetermined high temperature or a predetermined low temperature.

Preferably, the pressing device further comprises: the frame body is arranged around the contact structure and is provided with a ring abutting surface which is flush with the contact surface, or the contact surface is higher than the ring abutting surface; an elastic annular sealing element arranged on the annular abutting surface; when the contact surface is contacted with one side surface of a plurality of chips carried by the chip testing device, the elastic annular sealing piece correspondingly abuts against the chip testing device, and a closed space is correspondingly formed between the contact structure and the chip testing device; the environment control equipment is also connected with an air extractor, and the environment state control device can control the air extractor to extract the air in the closed space outwards.

Preferably, at least one air exhaust gap is formed between the frame body and the contact structure, the frame body is provided with at least one air exhaust hole, the air exhaust hole is communicated with the air exhaust gap, and the air exhaust device can exhaust air in the closed space outwards through the air exhaust hole and the air exhaust gap.

Preferably, the chip testing device comprises at least one first power supply component, at least one second power supply component is arranged in the accommodating chamber, and the equipment body is connected with a power supply device; when the chip testing device is arranged in the accommodating chamber, the power supply equipment can provide power for the chip testing device through the first power supply component and the second power supply component; when the chip testing device is arranged in the accommodating chamber, the contact structure is abutted against the side faces of the chips carried by the chip testing device, the chip testing device is powered on, the contact structure reaches a preset high temperature or a preset low temperature, and when the air in the closed space is pumped out by the air pumping device, the environmental state control device can control the chip testing device to carry out a preset testing program on the chips carried by the chip testing device.

Preferably, the environment control equipment further comprises at least one lifting device, the lifting device is arranged in the accommodating chamber, and the lifting device is connected with the environment state control device; the environmental state control device can control the lifting device to actuate so that the chip testing device arranged in the accommodating chamber is close to or far away from the abutting device in the accommodating chamber.

One embodiment of the present invention discloses a chip testing system, which comprises: a chip testing device for carrying a plurality of chips; a central control device, which comprises at least one environment state control device; at least one environmental control apparatus, comprising: the equipment body comprises at least one accommodating chamber, the accommodating chamber is used for accommodating a chip testing device, the chip testing device is used for bearing a plurality of chips, the environmental state control device can be electrically connected with the chips arranged in the accommodating chamber, and the environmental state control device can carry out detection operation on the plurality of chips borne by the environmental state control device through the chip testing device; a pressing device disposed in the accommodating chamber, the pressing device comprising: a contact structure having a plurality of movable grooves, each movable groove being formed by a contact surface of the contact structure being inwardly recessed in a longitudinal direction; the movable pieces are correspondingly arranged in the movable groove; one side of each movable piece opposite to the movable groove is provided with a pushing surface; each movable piece can move in the corresponding movable groove along the longitudinal direction, and the pushing surface can protrude out of the contact surface in the process that the movable piece moves in the movable groove; the limiting pieces are fixedly arranged on the contact structure, the limiting pieces are arranged adjacent to the movable grooves, and the limiting pieces and the contact structure can limit the movable range of the movable pieces in the corresponding movable grooves together; when the chip testing device is arranged in the accommodating chamber, the abutting device is correspondingly positioned above the plurality of chips carried by the chip testing device; the environment state control device can enable the chip testing device arranged in the containing chamber and the abutting device positioned in the containing chamber to move close to each other and enable the abutting surfaces and the contact surfaces of the movable pieces to abut against one side surfaces of the chips; the environmental state control device can enable the chip testing device arranged in the containing chamber and the pressing device positioned in the containing chamber to move away from each other under the condition that the pushing surfaces and the contact surfaces of the moving pieces are abutted against the side surfaces of the chips together, and the moving pieces correspondingly protrude out of the contact surfaces and push the chips originally contacted with the contact surfaces; the chip testing device is arranged in the accommodating chamber, and when the pushing surfaces and the contact surfaces of the moving pieces are abutted against one side surfaces of the chips together, the central control device can control the chip testing device to perform a preset testing program on the chips.

Preferably, the chip testing device comprises at least one first power supply component, at least one second power supply component is arranged in the accommodating chamber, and the equipment body is connected with a power supply device; when the chip testing device is arranged in the accommodating chamber, the power supply equipment can provide power for the chip testing device through the first power supply component and the second power supply component; when the chip testing device is arranged in the accommodating chamber, the contact structure abuts against the side faces of the chips borne by the chip testing device, the chip testing device is powered on, the contact structure reaches a preset high temperature or a preset low temperature, and air in the closed space is pumped out by the air pumping device, the environmental state control device can control the chip testing device to carry out a preset testing program on the chips borne by the chip testing device.

Preferably, the chip test apparatus comprises: at least one circuit board, wherein two opposite sides of the circuit board are respectively defined as a first side surface and a second side surface; the fixing assembly comprises a first fixing component, a second fixing component and a plurality of abutting-against structural bodies, wherein the first fixing component is arranged on the first side surface, and the second fixing component is fixedly arranged on the second side surface; a plurality of electrical connection sockets disposed on the first side, each electrical connection socket comprising: the electric connecting seat body is provided with a top wall and an annular side wall, the top wall is provided with an opening, one end of the annular side wall is connected with the periphery of the top wall, the other end of the annular side wall is abutted against the circuit board, and the top wall, the annular side wall and the circuit board form a containing groove together; two opposite side surfaces of the top wall are defined as an outer side surface and an inner side surface, and the inner side surface is positioned in the accommodating groove; one side of the top wall opposite to the circuit board is defined as an outer side surface which is flush with a butting surface of the first fixing component opposite to the circuit board; the supporting structure is abutted against the circuit board and is positioned in the accommodating groove; the lifting structure is arranged in the accommodating groove and is provided with a base part and a bearing part, the base part is positioned in the accommodating groove, the base part extends towards one side to form the bearing part, and at least one part of the bearing part is positioned in the opening; the bearing part extends towards one side far away from the base part to form a plurality of limiting parts, at least one part of the limiting parts penetrates through the opening, and a chip containing groove is formed by the limiting parts and the bearing part together and is used for containing a chip; the lifting structure is also provided with a plurality of connecting holes which penetrate through the base part and the bearing part; the elastic components are arranged in the accommodating groove, one end of each elastic component is fixed to the lifting structure, the other end of each elastic component is fixed to the supporting structure, the elastic restoring force generated by the compression of the elastic components enables the base part to abut against the inner side surface of the top wall, and a gap is formed between the lifting structure and the supporting structure; one end of each probe assembly is fixedly arranged on the supporting structure, the other end of each probe assembly abuts against the electric contact structure of the circuit board, and the other ends of the probe assemblies penetrate through the connecting holes; the first fixing component is fixed on the first side surface of the circuit board, and the plurality of abutting structures correspondingly abut against a part of the electric connecting seat bodies of the plurality of electric connecting seats; when the chip accommodating groove is provided with a chip and the limiting part is not pressed by the contact structure, the probe assemblies positioned in the connecting holes are not connected with the electric connecting parts of the chip, and one part of the lifting structure protrudes out of the outer side surface of the top wall; when the chip accommodating groove is provided with a chip, the limiting part is pressed by the contact structure to retract towards the electric connecting seat body, and the elastic annular sealing element is mutually pressed with the top-pressing surface of the first fixing member, the plurality of probe assemblies are connected with the plurality of contact parts of the chip; and the control unit is arranged on the second side surface of the circuit board and comprises a plurality of test modules, and each test module is connected with one part of the electric connecting seats.

In summary, according to the environmental control apparatus and the chip testing system disclosed in the embodiments of the present invention, through the design of the contact structure, the moving members, the limiting members, and the like, when the pressing device presses the plurality of chips, and the chip testing device completes the predetermined testing procedure on the plurality of chips, and the pressing device and the chip testing device are separated from each other, the plurality of moving members protrude from the contact surface of the contact structure to push the plurality of chips, so as to improve the problem that the plurality of chips are adhered to the contact surface.

Drawings

FIG. 1 is a schematic diagram of a chip testing system according to the disclosure.

FIG. 2 is a block diagram of a chip testing system according to the present invention.

FIG. 3 is a schematic diagram of an environmental control apparatus of the present invention.

Fig. 4 and 5 are exploded views of the chip testing device from different viewing angles.

Fig. 6 and 7 are partially exploded views of the chip testing device from different viewing angles.

FIG. 8 is a block diagram of a chip testing apparatus.

FIG. 9 is a cross-sectional exploded view of an electrical connector of the chip testing apparatus according to the present invention.

FIG. 10 is a cross-sectional view of an electrical connector of a chip testing device without a chip according to the disclosure.

FIG. 11 is a schematic cross-sectional view of an electrical connector with a chip of the chip testing device of the present invention.

FIG. 12 is a cross-sectional view of a chip testing device according to the disclosure.

FIG. 13 is a block diagram of a single environmental control apparatus.

Fig. 14 is a schematic view of the pressing device of the present invention.

Fig. 15 is a partially enlarged schematic view of fig. 14.

Fig. 16 is an exploded view of the pressing device of the present invention.

Fig. 17 is a partially enlarged and exploded view of the pressing device of the present invention.

Fig. 18 is a partial perspective cross-sectional view of the pressing device.

Fig. 19 is a partially enlarged view of fig. 18.

Fig. 20 shows a partial sectional front view of the holding-down device.

Fig. 21 is a partial perspective cross-sectional view of another view of the pressing device.

Fig. 22 is a partially enlarged schematic view of fig. 21.

FIG. 23 is a schematic cross-sectional side view of a chip testing apparatus.

FIG. 24 is a cross-sectional view of the pressing device pressing against one side of the chips of the chip testing device.

Fig. 25 is a partially enlarged view of fig. 24.

FIG. 26 is a schematic sectional side view of the pressing device and the chip testing device separated from each other.

Detailed Description

Referring to fig. 1 to 5, fig. 1 is a schematic diagram of a chip testing system disclosed in the present invention, fig. 2 is a schematic block diagram of the chip testing system disclosed in the present invention, and fig. 3 is a schematic diagram of an environment control apparatus of the present invention. The chip test system E disclosed by the invention is used for testing a plurality of chips C. The chip test system E includes: a central control device E1, a chip installation device E2, at least one chip testing device 1, a plurality of environment control devices E3, a transfer device E4 and a sorting device E5.

The central control device E1 is connected with the chip mounting equipment E2, the plurality of environment control equipment E3, the transferring equipment E4 and the sorting equipment E5, and the central control device E1 can control the operation of each equipment; the central control device E1 is, for example, a server, various computer devices, and the like, and is not limited thereto. The chip mounting apparatus E2 may include a robot arm (not shown), which can be controlled by the central control device E1 to take out the chips C on the tray one by one and place the chips C on the electrical connectors 2 of the chip testing apparatus 1 one by one. The chip testing apparatus 1 is used to carry a plurality of chips C, and the chip testing apparatus 1 can be carried by the transfer equipment E4 and transferred among a plurality of workstations (e.g., a chip mounter E2, a plurality of environmental control equipments E3, a transfer equipment E4, and a sorting equipment E5). A plurality of environment control devices E3 are connected to the central control unit E1, and the central control unit E1 can control any one of the environment control devices E3 to operate independently. Each of the environment control devices E3 is configured to enable a plurality of chips C disposed on the chip testing apparatus 1 to perform a predetermined test procedure in an environment with a predetermined temperature (e.g., a predetermined high temperature or a predetermined low temperature); for example, the chip C may be various memories (e.g., NAND Flash, etc.), and each test module 30 can perform at least one of a read test, a write test, and an electrical test on each memory.

Referring to fig. 3 to 8 together, fig. 3 is a schematic view of a chip testing apparatus, fig. 4 and 5 are exploded schematic views of the chip testing apparatus at different viewing angles, fig. 6 and 7 are partially exploded schematic views of the chip testing apparatus at different viewing angles, and fig. 8 is a block schematic view of the chip testing apparatus. The chip testing device 1 includes: a circuit board 10, a fixing component 11, a plurality of electrical connectors 2, a control unit 3 and at least one first power supply member 4. Two opposite sides of the circuit board 10 are respectively defined as a first side 101 and a second side 102 (as shown in fig. 7). The electrical connection sockets 2 are fixedly disposed on the first side surface 101 of the circuit board 10, and each electrical connection socket 2 is used for carrying a chip C. The form of the electrical connector 2 can vary from chip to chip, without limitation.

The fixing assembly 11 includes a first fixing member 111, a second fixing member 112 and a plurality of pressing structures 113. The first fixing member 111 is disposed on the first side 101, and the second fixing member 112 is fixedly disposed on the second side 102. The first fixing member 111 has a plurality of first locking holes 1111, the second fixing member 112 has a plurality of second locking holes 1121, the circuit board 10 has a plurality of circuit board locking holes 103, each first locking hole 1111 is disposed through the first fixing member 111, each second locking hole 1121 is disposed through the second fixing member 112, each circuit board locking hole 103 is disposed through the circuit board 10, and the plurality of first locking holes 1111, the plurality of circuit board locking holes 103, and the plurality of second locking holes 1121 are correspondingly disposed. In practical applications, the number, shape and distribution positions of the first locking holes 1111, the circuit board locking holes 103 and the second locking holes 1121 can be varied according to requirements, and are shown in the drawings only in an exemplary manner.

The first locking holes 1111, the circuit board locking holes 103 and the second locking holes 1121 are used for being locked with locking members (not shown), such as screws, and the circuit board 10 is fixed between the first fixing member 111 and the second fixing member 112. That is, the circuit board 10 is clamped between the first fixing member 111 and the second fixing member 112, and the overall structural strength of the circuit board 10 is improved by the arrangement of the first fixing member 111 and the second fixing member 112. In practical applications, the first fixing member 111 and the second fixing member 112 may be made of a high hardness material such as stainless steel; the circuit board 10 may be formed such that only each of the circuit board locking holes 103 is disposed through the circuit board 10, and besides, the circuit board 10 does not have other holes penetrating through the circuit board 10.

As shown in fig. 3, 4 and 6, the first fixing member 111 and the pressing structure 113 may be integrally formed. Each pressing structure 113 may be formed with a plurality of through holes 1131. When the first fixing member 111 is fixed on the first side 101 of the circuit board 10, the plurality of pressing structures 113 correspondingly press a portion of the electrical connector body 21 of the plurality of electrical connectors 2, and a portion of each electrical connector 2 correspondingly exposes out of each through hole 1131. That is, in addition to the first fixing member 111 and the second fixing member 112 cooperating with each other to clamp the circuit board 10, the first fixing member 111 is also used to fix the plurality of electrical connectors 2 disposed on the first side 101 of the circuit board 10 to the first side 101 of the circuit board 10. In practical applications, each of the pressing structures 113 may include a plurality of locking holes 1132, and each of the pressing structures 113 is detachably fixed to the first fixing member 111 by the plurality of locking holes 1132 matching with a plurality of screws.

In more detail, the first fixing member 111 may include a plurality of group receiving holes 1112, and each group receiving hole 1112 is disposed through the first fixing member 111. Each group receiving hole 1112 is configured to receive a plurality of electrical connectors 2. The first fixing member 111 further includes a plurality of auxiliary fixing portions 1113, and each of the auxiliary fixing portions 1113 is formed by extending a sidewall forming each of the group receiving holes 1112 toward the center of the group receiving hole 1112. When the first fixing member 111 is fixed to the circuit board 10, the height of each auxiliary fixing portion 1113 relative to the circuit board 10 is smaller than the depth of each group accommodating hole 1112.

Each of the pressing structures 113 and the auxiliary fixing portion 1113 may have a plurality of corresponding locking

holes

1132 and 11131, and each of the pressing structures 113 may be an auxiliary fixing portion 1113 that is locked in each of the group receiving holes 1112 by a plurality of locking members (not shown), such as screws. When the pressing structure 113 and the auxiliary fixing portion 1113 are fastened together, the pressing structure 113 correspondingly presses against the pressing portions 213 (as shown in fig. 6 and described in detail later) of the electrical connector bodies 21 of the electrical connectors 2 located in the group accommodating holes 1112, and a portion of the electrical connectors 2 is exposed through the through holes 1131 of the pressing structure 113.

As shown in fig. 6, on the first side 101 of the circuit board 10, a plurality of sets of electrical contact structures 1011 may be formed, each set of electrical contact structures 1011 (e.g., metal pads); when each electrical connection socket 2 is pressed by the pressing structure 113 and fixed on the first side surface 101 of the circuit board 10, one end of each of the probe assemblies 20 (as shown in fig. 10 and described in detail later) of the electrical connection socket 2 is pressed against a set of electrical contact structures 1011, so that the probe assemblies 20 of the electrical connection socket 2 can be electrically connected to the electronic components on the circuit board 10 through the electrical contact structures 1011 when the chip testing apparatus 1 is powered. In practical applications, a plurality of positioning members may be disposed between each electrical connector socket 2 and the circuit board 10, and the positioning members are used to assist each electrical connector socket 2 to be disposed at a correct position on the circuit board 10.

As described above, the first fixing member 111 is fastened to the first side surface 101 of the circuit board 10 by a plurality of fastening members, and the plurality of pressing structures 113 of the first fixing member 111 correspondingly press a portion of each electrical connection socket 2, so that each electrical connection socket 2 can be directly fixed on the circuit board 10 by the first fixing member 111 without screws, and thus, the number of through holes of the circuit board 10 can be greatly reduced.

As shown in fig. 7 and 8, the control unit 3 is disposed on the second side surface 102 of the circuit board 10. The control unit 3 includes a plurality of test modules 30, and each test module 30 is fixedly disposed on the second side 102 of the circuit board 10. The second side 102 of the circuit board 10 may have a plurality of first contact structures 1021, and the second fixing member 112 has a plurality of avoiding holes 1122; when the second fixing member 112 is fixed to the second side 102 of the circuit board 10, the first contact structures 1021 are correspondingly exposed out of the avoiding holes 1122.

Each test module 30 may have a test module body 31 and two second contact structures 32, an electronic component for testing the chip C disposed on the electrical connector 2 is disposed in the test module body 31, the second contact structures 32 are exposed at one side of the test module body 31, and the second contact structures 32 of each test module body 31 are used for contacting with the first contact structures 1021 of the circuit board 10. When each test module 30 is fixedly disposed on the second side 102 of the circuit board 10, the second contact structure 32 of each test module 30 passes through the corresponding avoiding hole 1122 to contact with the first contact structure 1021 of the circuit board 10.

When the second contact structure 32 of each test module 30 contacts the first contact structure 1021 of the circuit board 10 and the chip testing device 1 is powered, each test module 30 can perform the predetermined test procedure on the plurality of chips C carried by the electrical connector 2 through the circuit board 10 and the electrical connector 2. In a specific application, the first contact structure 1021 and the second contact structure 32 may be, for example, a board-to-board connector, and the form of the first contact structure may be, for example, but not limited to, a Pogo pin or a reed. In an embodiment where each test module 30 is used to test the memory, the test module body 31 of each test module 30 may include a Pattern Generator (PG), a Parametric Measurement Unit (PMU), a Device Power supply module (DPS), and a Driver circuit (Driver).

Through the design of the first contact structure 1021 and the second contact structure 32, each test module 30 can be detachably fixed on the second side 102 of the circuit board 10, and through the design of detachably mounting each test module 30 on the circuit board 10, a user can replace the test module 30 as required, and related maintenance personnel can easily disassemble, assemble and maintain a specific test module 30. In addition, the control unit 3 may further include a housing 33, and the housing 33 is used to protect the plurality of test modules 30.

As shown in fig. 7, in practical applications, the test module body 31 may have two auxiliary fixing structures 311, each auxiliary fixing structure 311 may have a plurality of fixing holes 3111, and the second fixing member 112 may correspondingly have a plurality of fixing holes 1123. Each of the testing module bodies 31 can be matched with the fixing holes 3111 and the fixing holes 1123 by a plurality of fasteners (e.g., screws) to detachably fix the testing module 30 on the second fixing member 112.

Referring to fig. 8 to 11, fig. 9 is a schematic sectional exploded view of an electrical connection socket of a chip testing device disclosed in the present invention, fig. 10 is a schematic sectional view of an electrical connection socket of a chip testing device disclosed in the present invention without a chip, fig. 11 is a schematic sectional view of an electrical connection socket of a chip testing device disclosed in the present invention with a chip, and fig. 12 is a schematic sectional view of a chip testing device disclosed in the present invention. Each electrical connector socket 2 comprises: a plurality of probe assemblies 20, an electrical connector body 21, a lifting structure 22, a supporting structure 23 and a plurality of elastic assemblies 24. Each probe assembly 20 includes a needle 201 and a spring 202. One end of the pin body 201 is used to connect with the electrical connection portion C1 (shown in fig. 11) of the chip C. The spring 202 is sleeved on the needle body 201, and when one end of the needle body 201 is pressed, the spring 202 is pressed to generate an elastic restoring force correspondingly, so that when the needle body 201 is not pressed any more, the needle body 201 is restored to an uncompressed position under the action of the elastic restoring force.

The electrical connector body 21 has a top wall 211, a ring-shaped sidewall 212 and a top 213. The top wall 211 has an opening 21A, one side of the annular side wall 212 is connected to the periphery of the top wall 211, the other side of the annular side wall 212 is fixedly disposed on the circuit board 10, and the top wall 211, the annular side wall 212 and the circuit board 10 together form a receiving slot 21B. Opposite sides of the top wall 211 define an outer side 2111 and an inner side 2112 (shown in FIG. 11). In practical applications, the top wall 211 and the annular side wall 212 may be integrally formed.

As shown in fig. 3, 6 and 8, the annular sidewall 212 further protrudes outward to form a top 213. When the pressing structure 113 is fixed to the first fixing member 111 and the first fixing member 111 is fixed to the circuit board 10, the pressing structure 113 correspondingly abuts against the abutting portions 213 of the electrical sockets 2. That is, each abutting portion 213 is disposed to facilitate the abutting of the abutting structure 113, and the shape of the abutting portion 213 may be designed to correspond to the abutting structure 113 and the through hole 1131.

As shown in fig. 8 to 11, the lifting structure 22 includes a base 221 and a supporting portion 222. The base 221 is completely disposed in the receiving groove 21B, the base 221 extends toward one side to form a bearing portion 222, and a portion of the bearing portion 222 can pass through the opening 21A. The carrying portion 222 extends to a side away from the base portion 221 to form four limiting portions 223, the four limiting portions 223 may be located at four corners of the carrying portion 222, and the four limiting portions 223 and the carrying portion 222 together form a chip accommodating groove 22B, the chip accommodating groove 22B is used for providing a chip C, and the four limiting portions 223 are used for being mutually clamped with the chip C. The lifting structure 22 further has a plurality of connection holes 22A (shown in fig. 11), and each connection hole 22A is disposed through the base portion 221 and the bearing portion 222.

A portion of the plurality of probe assemblies 20 is fixedly disposed in the supporting structure 23, and the plurality of probe assemblies 20 are fixedly disposed at one end of the supporting structure 23 for connecting with the electrical contact structure 1011 (shown in fig. 6) of the circuit board 10; the other ends of the probe assemblies 20 are located in the connecting holes 22A, and one end of the probe assembly 20 located in the connecting holes 22A is used to connect with the electrical connection portion C1 of the chip C.

In practical applications, the supporting structure 23 may include a base structure 231 and an auxiliary structure 232. The base structure 231 is disposed in the receiving cavity 21B, and the base structure 231 and the electrical connector body 21 are fixed to each other (for example, fixed to the electrical connector body 21 by matching with a plurality of screws). The base structure 231 has a plurality of through holes 2311, and one end of the plurality of probe assemblies 20 is fixedly disposed in the plurality of through holes 2311 of the base structure 231. The auxiliary structure 232 is disposed in the receiving groove 21B, the auxiliary structure 232 is located between the base structure 231 and the top wall 211, and the auxiliary structure 232 and the base structure 231 are fixed to each other (for example, fastened to each other by screws). The auxiliary structure 232 has a plurality of supporting holes 2321 disposed at intervals, the supporting holes 2321 communicate with the through holes 2311 of the base structure 231, the supporting holes 2321 are disposed corresponding to the connecting holes 22A, the supporting holes 2321 and the through holes 2311 together form a plurality of probe channels, and the probe assemblies 20 are disposed in the probe channels.

As shown in fig. 9 and 10, the supporting structure 23 is disposed in the accommodating groove 21B, and the elastic component 24 is disposed between the supporting structure 23 and the lifting structure 22. The elastic assembly 24 enables the base 221 of the lifting structure 22 to abut against the inner side 2112 of the top wall 211, and a gap S is correspondingly formed between the base 221 and the supporting structure 23. In practical applications, when the electrical connector 2 is fixed on the circuit board 10 and the position-limiting portion 223 of the electrical connector 2 is not pressed by an external force, the four elastic elements 24 located between the lifting structure 22 and the supporting structure 23 may be slightly compressed, and the elastic restoring force generated by the compression of the elastic elements 24 will make the lifting structure 22 firmly abut against the inner side 2112 of the top wall 211.

As shown in fig. 11, when the chip C is fixedly disposed in the chip accommodating slot 22B and the lifting structure 22 is not pressed, the electrical connection portions C1 of the chip C are correspondingly accommodated in the connection holes 22A, and the probe assemblies 20 are not connected with the electrical connection portions C1 (e.g., do not contact each other). When the lifting structure 22 is pressed, at least a portion of the lifting structure 22 will be retracted into the electrical connector body 21, that is, the lifting structure 22 will move toward the circuit board 10 relative to the supporting structure 23, and the plurality of probe assemblies 20 will be correspondingly connected to the plurality of electrical connection portions C1 of the chip C.

Referring to fig. 3 to fig. 6 again, in practical applications, the electrical connection sockets 2 may be divided into a plurality of electrical connection socket groups, each electrical connection socket group includes at least one electrical connection socket 2, and each test module 30 is correspondingly connected to all the electrical connection sockets 2 of one electrical connection socket group. For example, in fig. 3 and 4 of the present embodiment, the circuit board 10 is provided with 72 electrical connectors 2, which can be divided into 6 electrical connector groups, each electrical connector group includes 12 electrical connectors 2, and 12 electrical connectors 2 in each electrical connector group are located in the same group accommodating hole 1112, and 12 electrical connectors 2 in each electrical connector group are connected to the same test module 30; as shown in fig. 5, the circuit board 10 is provided with 6 test modules 30. Of course, the number of the electrical connection sockets 2 disposed on the circuit board 10 and the number of the electrical connection socket groups correspondingly partitioned can be changed according to the requirement.

By the design of connecting the electrical connectors 2 disposed on the circuit board 10 to different test modules 30, the test modules 30 and the chips C connected to the electrical connectors 2 can transmit signals faster and less easily. More specifically, if the circuit board 10 provided with 72 electrical connection sockets 2 is connected to only one signal input source, when the signal emitted from the signal input source is transmitted from one side of the circuit board 10 to the other side of the circuit board 10, the signal is attenuated obviously, which may result in inaccurate chip test results.

In practical applications, all the electrical connectors 2 in each electrical connector group may be connected in parallel, and all the electrical connectors 2 connected in parallel in the same electrical connector group are connected to the same test module 30; in other words, all the electrical sockets 2 to which the respective test modules 30 are connected in parallel. In addition, any electrical connector 2 in each electrical connector group is not connected to any electrical connector 2 in other electrical connector groups. For example, suppose that four electrical connectors 2 are disposed on the circuit board 10: z1, Z2, Q1, Q2, four electrical sockets 2 are divided into two groups of electrical sockets, the first group includes Z1, Z2, the second group includes Q1, Q2, then Z1 and Z2 are connected in parallel, Q1 and Q2 are connected in parallel, Z1 is not connected with Q1 (whether in parallel or in series), Z1 is not connected with Q2 (whether in parallel or in series), Z2 is not connected with Q1 (whether in parallel or in series), and Z2 is not connected with Q2 (whether in parallel or in series).

Through the design that the electrical connection seats 2 of different electrical connection seat groups are not mutually connected, when the chip testing device 1 fails, related maintenance personnel can quickly find out the damaged electrical connection seat 2 by testing each electrical connection seat group one by one, and the related maintenance personnel can only replace the damaged electrical connection seat 2, the components of the electrical connection seat 2, the electrical connection seat 2 in the same group or the testing module 30, and the related personnel do not need to replace all the electrical connection seats 2 of the whole circuit board 10 or all the testing modules 30.

As shown in fig. 3 and fig. 4, in practical applications, the number of the through holes 1131 of the pressing structure 113 may be, for example, the number corresponding to the electrical connectors 2 located in the group accommodating hole 1112, and when the pressing structure 113 is disposed in the group accommodating hole 1112, each through hole 1131 of the pressing structure 113 correspondingly penetrates through a part of one electrical connector 2. Of course, in different embodiments, the number of through holes 1131 of the pressing structure 113 may not completely correspond to the number of electrical connectors 2.

As shown in fig. 3 and fig. 6, through the design of the first fixing member 111 and the pressing structure 113, each electrical connection socket 2 is directly fixed on the circuit board 10 in a pressing manner, and each set of electrical connection socket group is correspondingly pressed by one pressing structure 113, so that when any electrical connection socket 2 fails, a relevant person only needs to remove the screw between the first fixing member 111 and the pressing structure 113 corresponding to the electrical connection socket 2, and then can directly remove and replace the electrical connection socket 2. That is, the design of the first fixing member 111 and the pressing structure 113 allows the related maintenance personnel or machine to easily and quickly maintain, replace and install the specific electrical connector 2.

As shown in fig. 3 and 4, the first power supply member 4 included in the chip testing apparatus 1 may be a metal structure formed on the circuit board 10, and the first power supply member 4 may be connected to the plurality of testing modules 30 through the circuit board 10. The first power supply member 4 may be, for example, a board-to-board connector, and may be, for example, a PoGo pin or a reed, but not limited thereto. The first power supply member 4 is configured to be connected to the second power supply member E36 (shown in fig. 13) of the environmental control device E3 (shown in fig. 12), and the power supply device connected to the environmental control device E3 can supply power to each test module 30 through the second power supply member E36, the first power supply member 4, the plurality of first contact structures 1021 (shown in fig. 6) and the plurality of second contact structures 32 (shown in fig. 7), the power supply device is a power supply device independent from the chip testing apparatus 1, and the power supply device can be any device capable of supplying power, which is not limited herein. That is, the chip testing apparatus 1 basically performs the predetermined test program on the plurality of chips C connected thereto without being connected to the power supply device through the first power supply means 4 by the respective test modules 30. Of course, in different embodiments, the chip testing apparatus 1 may also be provided with at least one battery, the battery is connected to the plurality of testing modules 30, and the battery can supply power to the plurality of testing modules 30.

In practical applications, the first power supply member 4 and the second power supply member E36 may be, for example, metal conductive structures formed on a circuit board, and when the first power supply member 4 and the second power supply member E36 are in contact, the chip testing device 1 and the environmental status control device E11 are electrically connected to each other; alternatively, the first feeding means 4 and the second feeding means E36 may be transmitting and receiving antennas, and power may be wirelessly transmitted therebetween.

Referring to fig. 12 and 13 together, fig. 13 is a block diagram of a single environmental control apparatus E3. Each environmental control equipment E3 includes an equipment body E31, a plurality of lifting devices E32 and a plurality of pressing devices E33. The apparatus body E31 includes a plurality of accommodation chambers E311. The accommodating chamber E311 is mainly used for accommodating the chip testing apparatus 1. The plurality of chambers E311 included in the environmental control apparatus E3 may be connected or not connected to each other, which is not limited herein.

In practical applications, the chip testing system E may include a plurality of environmental control apparatuses E3, the central control apparatus E1 may include a plurality of environmental state control apparatuses E11 (for example, various processors, computers, etc.), and the apparatus body E31 (as shown in fig. 17) of each environmental control apparatus E3 may be correspondingly provided with one environmental state control apparatus E11, that is, each environmental control apparatus E3 may include one environmental state control apparatus E11. In practical applications, each environmental control apparatus E3 can be manufactured and sold independently, and the environmental control apparatus E3 can include the environmental status control device E11 according to the requirement.

In the embodiment where the environmental control apparatus E3 includes a plurality of receiving chambers E311 independent from each other and not connected to each other, each receiving chamber E311 may be provided with a movable door, and the environmental control apparatus E3 may be connected to an air extractor E34. When the chip testing device 1 is disposed in the accommodating chamber E311, the central control device E1 can control the corresponding movable door to operate, so that the accommodating chamber E311 becomes a closed space, and then the central control device E1 can control the air extractor E34 to operate, so that the accommodating chamber E311 is in a state similar to vacuum, so that the temperature in the accommodating chamber E311 is not easily affected by the external environment.

The lifting devices E32 are disposed in the accommodating chambers E311, and the pressing devices E33 are disposed in the accommodating chambers E311, that is, each accommodating chamber E311 is provided with a lifting device E32 and a pressing device E33. In each of the accommodation chambers E311, the pressing device E33 is disposed to face the elevating device E32. Each lifting device E32 is connected to the environmental state control device E11, and the environmental state control device E11 can control each lifting device E32 to independently operate, and the controlled and operated lifting device E32 can make the chip testing device 1 disposed in the accommodating chamber E311 move toward or away from the pressing device E33.

When the chip testing device 1 carrying a plurality of chips C to be tested is disposed in the accommodating chamber E311, the environmental state control device E11 can control the corresponding lifting device E32 to actuate, so that the chip testing device 1 approaches to the pressing device E33 until the pressing device E33 abuts against a side surface of the plurality of chips C carried by the chip testing device 1. When the pressing device E33 is pressed against the side surfaces of the chips C carried by the chip testing apparatus 1, the environmental status control device E11 can control the chip testing apparatus 1, so that the chip testing apparatus 1 performs the predetermined testing procedure on the chips C carried by the chip testing apparatus 1.

In an embodiment where the chip testing system E includes a plurality of environment control devices E3, and each environment control device E3 has an environment state control apparatus E11 independent from other environment control devices E3, each environment control device E3 may independently control the chip testing apparatus 1 disposed in each accommodating chamber E311 to perform different predetermined testing procedures on the chip C carried by the chip testing apparatus.

In practical applications, each environmental control apparatus E3 may further include a plurality of thermostats E35, as shown in fig. 13. Each temperature adjusting device E35 is electrically connected to the environmental state control device E11, each temperature adjusting device E35 is connected to each abutting device E33, and the environmental state control device E11 can control each temperature adjusting device E35 to independently operate, so that the temperature of a contact structure E331 of the abutting device E33 reaches the predetermined low temperature or the predetermined high temperature.

In a specific application, each temperature adjustment device E35 may include a heater E351 and a refrigerator E352, the heater E351 and the refrigerator E352 are respectively connected to the contact structure E331, and the heater E351 and the refrigerator E352 can be independently operated under the control of the environmental condition control device E11, so that the temperature of the contact structure E331 reaches a predetermined high temperature and a predetermined low temperature. The heater E351 is, for example, various heating coils, and the refrigerator E352 is, for example, various refrigeration chips, but not limited thereto. The temperature adjustment device E35 may have both the heater E351 and the refrigerator E352 according to the requirement, but not limited to this; in various embodiments, thermostat E35 may be a thermostat containing only heater E351 or refrigerator E352.

In various embodiments, the temperature regulating device E35 may also include at least one fluid passage for passing the high temperature fluid or the low temperature fluid; when a high temperature fluid or a low temperature fluid passes through the fluid passage, the temperature of the contact structure E331 may be brought to a predetermined high temperature or a predetermined low temperature. In different embodiments, each temperature adjustment device E35 may not be connected to the abutting device E33, and each temperature adjustment device E35 is used to make the temperature of the accommodating chamber E311 directly reach the predetermined high temperature or the predetermined low temperature.

When the chip testing device 1 carries a plurality of chips C and is disposed in the accommodating chamber E311, the environmental state control device E11 controls the lifting device E32 to actuate, so that one side of the plurality of chips C abuts against the contact structure E331 of the abutting device E33; next, the environmental condition control device E11 may control the temperature adjustment device E35 to operate, so that the temperature of the contact structure E331 reaches a predetermined high temperature or a predetermined low temperature; finally, the environmental status control device E11 controls the chip testing device 1 to operate, so that the chip testing device 1 performs the predetermined testing procedure on the plurality of chips C carried by the chip testing device, and thus each chip C performs the predetermined testing procedure in an environment with a predetermined high temperature or a predetermined low temperature.

It should be noted that, in the embodiment, the apparatus body E31 has a plurality of lifting devices E32, and the environmental status control device E11 can achieve the effect of moving the chip testing device 1 and the pressing device E33 disposed in the accommodating chamber E311 toward or away from each other through the lifting device E32, but the environmental status control device E11 is not limited to the lifting device E32 to achieve the same effect; in different embodiments, the pressing device E33 may be connected to a moving device, and the environmental status control device E11 moves the pressing device E33 toward or away from the chip testing device 1 disposed in the accommodating chamber E311 through the moving device.

Referring to fig. 14 to 17 together, fig. 14 is a schematic view of the pressing device of the present invention, fig. 15 is a partially enlarged schematic view of fig. 14, fig. 16 is an exploded schematic view of the pressing device of the present invention, and fig. 17 is a partially enlarged exploded schematic view of the pressing device of the present invention. Each abutting device E33 includes a contact structure E331, a plurality of movable members E332, a plurality of position-limiting members E333, and a plurality of elastic members E334. In different embodiments, the pressing device E33 may not include the plurality of elastic members E334.

The contact structure E331 has a plurality of movable slots E3311, a plurality of position-limiting slots E3312, and a plurality of spring receiving slots E3313. Each of the active slots E3311 is formed by a contact surface E3314 of the contact structure E331 being recessed in a longitudinal direction L. The contact structure E331 may be, for example, a metal rectangular cube, but not limited thereto, the shape of the contact structure E331 may be changed according to the requirement, and the material of the contact structure E331 may be any material with high thermal conductivity and cold conductivity.

Each limit groove E3312 is formed by a contact surface E3314 which is concave inwards in the longitudinal direction L, and each limit groove E3312 is simultaneously connected with one end of a plurality of movable grooves E3311; more specifically, the plurality of movable slots E3311 may be spaced side by side along a first direction, each of the plurality of position-limiting slots E3312 may be disposed along a second direction perpendicular to the first direction, and opposite ends of each of the plurality of movable slots E3311 are correspondingly communicated with the two position-limiting slots E3312.

Referring to fig. 18 to 22 together, fig. 18 is a partial perspective sectional view of the pressing device, fig. 19 is an enlarged partial view of fig. 18, fig. 20 is a front partial sectional view of the pressing device, fig. 21 is a partial perspective sectional view of another viewing angle of the pressing device, and fig. 22 is an enlarged partial view of fig. 21. Each movable piece E332 is correspondingly disposed in one movable groove E3311. Each movable member E332 may have a pushing portion E3321 and two limiting portions E3322, two ends of the pushing portion E3321 extend to form the two limiting portions E3322, and a stepped structure is formed at a position where the pushing portion E3321 is connected to each limiting portion E3322. The height H1 of the pushing portion E3321 of each movable member E332 may be greater than the height H2 of each position-limiting portion E3322, and the connecting position between the pushing portion E3321 and each position-limiting portion E3322 is formed in a structure similar to an L shape. In the drawings of the present embodiment, the movable element E332 is taken as a sheet-shaped structure as an example, but the appearance of the movable element E332 is not limited to that shown in the drawings, and in different embodiments, each movable element E332 may be a thin line structure, for example. In addition, the material of each movable element E332 may be determined according to a predetermined high temperature and a predetermined low temperature, and may be, for example, metal or engineering plastic.

The pushing portion E3321 of each moving member E332 is disposed in the moving groove E3311, a height H1 of the pushing portion E3321 of each moving member E332 in the longitudinal direction L is not greater than a depth D1 of each moving groove E3311, and each moving member E332 can be retracted into the corresponding moving groove E3311. When each movable part E332 is retracted into the corresponding movable groove E3311, the abutting surface E3323 of each movable part E332 may be flush with the contact surface E3314, or the abutting surface E3323 of the movable part E332 may be located in the movable groove E3311.

Each limiting member E333 is fixedly disposed in the limiting groove E3312, and each limiting member E333 is used to limit a moving range of the moving member E332 relative to the contact structure E331. In practical applications, the depth D2 of each of the position-limiting grooves E3312 in the longitudinal direction L is less than the depth D1 of each of the movable grooves E3311 in the longitudinal direction L, the thickness T of each of the position-limiting members E333 is equal to or less than the depth D2 of each of the position-limiting grooves E3312, and the shape of each of the position-limiting members E333 substantially corresponds to the shape of each of the position-limiting grooves E3312, and when each of the position-limiting members E333 is fixedly disposed in the position-limiting groove E3312, each of the position-limiting grooves E3312 is filled with the position-limiting member E333. Each of the position-limiting members E333 may be, for example, any material with high thermal conductivity and cold conductivity, but not limited thereto. Each of the position-limiting members E333 may be detachably fixed to the contact structure E331 by engaging with a plurality of screws, for example.

Specifically, each movable groove E3311 and each stopper groove E3312 connected thereto are communicated with each other in the longitudinal direction L; when the position-limiting member E333 is disposed in the position-limiting groove E3312, the position-limiting portion E3322 of the movable member E332 is blocked by the position-limiting member E333 and cannot leave the contact structure E331 through the position-limiting groove E3312, but the position-limiting portion E3322 of the movable member E332 can still move in the movable groove E3311. When the pushing surface E3323 of the moving member E332 faces the ground, the limiting portion E3322 of the moving member E332 is abutted against the limiting member E333 under the influence of gravity, and a part of the pushing portion E3321 is correspondingly exposed out of the moving groove E3311, and a part of the pushing portion E3321 protrudes out of the contact surface E3314.

Each spring receiving groove E3313 is formed by a bottom wall E3315 forming each movable groove E3311 being recessed in a direction away from the contact surface E3314, each movable groove E3311 being in communication with at least two spring receiving grooves E3313, each spring receiving groove E3313 being configured to receive one elastic member E334. One end of each elastic member E334 is fixed to the contact structure E331, and the other end of each elastic member E334 is connected to the movable member E332.

In practical applications, when the movable element E332 is limited in the movable groove E3311 by the limiting element E333, each elastic element E334 may be in a pressed state, and the elastic restoring force generated by the pressing of each elastic element E334 causes the two limiting portions E3322 of the elastic element E334 to be tightly abutted against the two limiting elements E333, and a part of the abutting portion E3321 of each elastic element E334 protrudes from the contact surface E3314 at any time, that is, the abutting surface E3323 protrudes from the contact surface E3314 at any time.

Referring to fig. 23 to 25, fig. 23 is a schematic cross-sectional side view of the chip testing apparatus, fig. 24 is a schematic cross-sectional view of a pressing device pressing against one side of a plurality of chips of the chip testing apparatus, and fig. 25 is an enlarged partial view of fig. 24. As shown in fig. 23, when the chip testing device 1 is not pressed by the pressing device E33, a pressing surface 1114 of the first fixing member 111 is flush with the outer side surface 2111 of each electrical connector body 21, and a portion of the lifting structure 22 of each electrical connector 2 is disposed higher than the pressing surface 1114. That is, when each chip C is disposed in the electrical connection socket 2 and the chip testing apparatus 1 is not pressed by the pressing device E33, a portion of the lifting structure 22 may be disposed higher than the top face 1114; the chip C disposed in the lifting structure 22 may be higher than the top surface 1114 or not higher than the top surface 1114, which is not limited herein.

As shown in fig. 24 and fig. 25, when the environmental condition control device E11 controls the lifting device E32 to operate, so that the contact surface E3314 of the abutting device E33 and the pushing surface E3323 of the movable element E332 simultaneously contact one side of the chips C carried by the chip testing apparatus 1, the elastic elements E334 are pressed again, and each elastic element E334 generates a larger elastic restoring force.

When the contact surface E3314 of the abutting device E33 and the pushing surface E3323 of the movable element E332 simultaneously contact one side of the chips C carried by the chip testing apparatus 1, the environmental state control device E11 can control the operation of the temperature adjusting device E35, so that the temperature of the contact structure E331 reaches a predetermined high temperature or a predetermined low temperature, and the environmental state control device E11 controls the chip testing apparatus 1 to perform a predetermined testing procedure on the chips C carried by the chip testing apparatus 1.

Referring to fig. 14 and fig. 15 again, in practical applications, the pressing device E33 may further include a frame E335 and an elastic annular sealing member E336. The frame E335 is disposed around the contact structure E331, and the contact surface E3314 of the contact structure E331 may be disposed flush with a ring pressing surface E3351 of the frame E335, and the ring pressing surface E3351 is correspondingly disposed with an elastic annular sealing member E336. In various embodiments, the contact surface E3314 may be higher than the ring abutting surface E3351, but the contact surface E3314 is not lower than the ring abutting surface E3351. The elastic annular sealing element E336 is disposed on the annular pressing surface E3351, and the elastic annular sealing element E336 is disposed around the contact structure E331. The elastic ring seal E336 may be made of rubber or other material capable of returning to its original shape when pressed. As for the cross-sectional shape of the elastic ring seal E336, for example, it may be circular, oval, trapezoidal, etc., without limitation.

As shown in fig. 23 to fig. 25, when the contact structure E331 presses against a side surface of the plurality of chips C carried by the chip testing apparatus 1, a portion of the contact structure E331 simultaneously presses against the top surface 1114 of the first fixing member 111, and the elastic ring-shaped sealing member E336 correspondingly presses against the top surface 1114 of the first fixing member 111, the contact structure E331, the first fixing member 111, the pressing structure 113 and the circuit board 10 together form a closed space SP, and the plurality of electrical sockets 2 are correspondingly located in the closed space SP.

When the contact structure E331 presses against a side of the chips C carried by the chip testing apparatus 1 and the electrical connectors 2 are correspondingly located in the enclosed space SP, the central control apparatus E1 can control the operation of the air extractor E34 to extract the air in the enclosed space SP outward, so that the enclosed space SP is in a state similar to vacuum, and during the process of extracting the air outward by the air extractor E34, the chip testing apparatus 1 and the pressing apparatus E33 will be pressed against each other more tightly by the negative pressure.

As shown in fig. 14 and 15, in practical applications, an air-extracting gap G may be formed between the contact structure E331 and the frame E335, the air-extracting gap G may be disposed around the contact structure E331, and the frame E335 may be formed with a plurality of air-extracting holes E3352, the air-extracting holes E3352 are communicated with the air-extracting gap G (for example, the frame E335 has corresponding passages therein), and the air-extracting holes E3352 are communicated with the air-extracting device E34. In the embodiment, the air-extracting gap G is disposed to substantially surround the contact structure E331, but the position and shape of the air-extracting gap G are not limited thereto, as long as the enclosed space SP can communicate with the air-extracting device E34 through the air-extracting gap G and the air-extracting hole E3352. In addition, the number, shape and arrangement position of the air pumping holes E3352 can be changed according to requirements.

It should be noted that, in practical applications, after the chip testing apparatus 1 is disposed in one of the accommodating chambers E311, the central control device E1 may first control the lifting device E32 to move a predetermined distance, so that the chip testing apparatus 1 moves to a position where it contacts with the abutting device E33, i.e., the elastic annular sealing member E336 contacts with the abutting surface 1114 of the chip testing apparatus 1; then, the central control device E1 can control the air extractor E34 and the lifting device E32 to operate together, so that the enclosed space SP gradually assumes a state similar to vacuum, and thus the contact structure E331 will press against the lifting structure 22 of each electrical socket 2, so that each lifting structure 22 retracts into the corresponding electrical socket 2.

In practical applications, the central control device E1 controls the air extracting device E34, and the time point of extracting the air in the enclosed space SP can be designed according to the requirement. For example, the central control device E1 may determine whether the chip testing device 1 is already disposed at a predetermined position in the accommodating chamber E311 by at least one sensor (e.g., an optical sensor or a mechanical pressing sensor) disposed in the accommodating chamber E311 (as shown in fig. 17), and the central control device E1 controls the air extractor E34 to operate to extract the air in the enclosed space SP when the chip testing device 1 is determined to be located at the predetermined position in the accommodating chamber E311 by the sensor.

As shown in fig. 15, 23 and 24, by the design that the outer side surface 2111 of each electrical connection socket 2 is flush with the abutting surface 1114, the contact surface E3314 of the contact structure E331 is flush with the ring abutting surface E3351 (or the contact surface E3314 is not lower than the ring abutting surface E3351), the elastic annular sealing element E336 is disposed on the ring abutting surface E3351, and the like, the acting force required by the lifting device E32 to push against the chip testing device 1 can be greatly reduced in cooperation with the operation of the air extracting device E34. More specifically, the lifting device E32 is to make the chip testing device 1 approach the contact structure E331 of the pressing device E33, so that the contact structure E331 contacts the chips C on the electrical connection sockets 2 simultaneously. As explained above, when the contact structure E331 contacts the chips C on a plurality of electrical sockets 2 simultaneously, the lifting device E32 will have to resist the elastic restoring force generated by the compression of the elastic component 24 from each electrical socket 2 and the elastic restoring force generated by the compression of each probe component 20 in each electrical socket 2; therefore, the air in the enclosed space SP is evacuated by the air evacuation device E34 to make the enclosed space SP in a negative pressure state, so that the force required for pushing the lifting device E32 against the chip testing device 1 can be greatly reduced.

In particular, according to the above description of the chip testing device 1, since only the circuit board locking hole 103 is disposed through the circuit board 10 of the chip testing device 1, when the pressing device E33 abuts against the first fixing member 111, the sealing performance of the enclosed space SP is easily controlled, and the air-extracting device E34 is relatively easy to reach a state of approximately vacuum in the process of extracting the air in the enclosed space SP outwards. That is, in the chip testing apparatus 1 according to the present invention, the number of through holes in the circuit board 10 is significantly reduced by the design of the first fixing member 111, the second fixing member 112, and the like, so that the closed space SP can be relatively easily brought into a vacuum state when the air extracting device E34 extracts air from the closed space SP.

FIG. 26 is a cross-sectional side view of the pressing device and the chip testing device separated from each other. When the chip testing device 1 completes a predetermined testing procedure on the chip C carried by the chip testing device 1, and the environmental status control device E11 controls the lifting device E32 to operate, so that when the chip testing device 1 moves away from the abutting device E33, the elastic restoring force generated by the pressing of each elastic member E334 will move the moving member E332 in the moving slot E3311, and the abutting surface E3323 of the moving member E332 will be changed from a state flush with the contact surface E3314 or a state located in the moving slot E3311 to a state protruding out of the contact surface E3314, and the chip C originally abutting against the contact surface E3314 and the abutting surface E3323 will be pushed by the moving member E332 and will not contact with the contact surface E3314. Therefore, by the arrangement of the movable element E332, in the process of separating the chip testing device 1 and the pressing device E33 from each other, the problem that each chip C is not easily stuck to the contact surface E3314 of the contact structure E331 occurs.

It should be noted that, in the embodiment that the pressing device E33 is not provided with a plurality of elastic members E334, only the movable member E332 of the pressing device E33 needs to be disposed toward the ground, and in the process of separating the pressing device E33 from the chip testing apparatus 1, each movable member E332 can still automatically protrude from the contact surface E3314 under the influence of gravity, and can similarly push the chip C originally in contact with the contact surface E3314, thereby also avoiding the problem of sticking the chip C to the contact surface E3314.

As shown in fig. 3 and 16, in the drawings of the present embodiment, the pressing device E33 includes 24 movable elements E332 and 8 limiting elements E333 as an example, and each 4 movable elements E332 are used to abut against 12 chips C carried by the electrical connection base 2, that is, each movable element E332 abuts against 3 chips C correspondingly, but in practical application, the number of the movable elements E332 and the limiting elements E333 included in the pressing device E33 is not limited to that shown in the drawings. In addition, each movable element E332 corresponds to the number of the chips C to be abutted against, which is not limited to 3, and the number can be increased or decreased according to the requirement.

In practical applications, the contact area of each movable element E332 with each chip C is smaller than the area of the side C2 of the chip C opposite to the electrical connection socket 2, for example, the contact area of each movable element E332 with each chip C may be less than ten percent of the area of the side C2 of the chip C, and preferably, the contact area of each movable element E332 with each chip C may be five percent of the area of the side C2 of the chip C. Whether a plurality of elastic elements E334 are disposed in the pressing device E33 may be determined according to the contact area between each movable element E332 and the chip C.

Referring to fig. 1 and 2 again, the transfer equipment E4 is disposed between the environmental control equipments E3, and the transfer equipment E4 is used for carrying the chip testing apparatus 1. The transfer apparatus E4 may comprise a robot and a holding component for holding the chip testing device 1. The central control device E1 is connected to the transfer facility E4, and the central control device E1 can control the transfer facility E4 to set the chip testing apparatus 1 carrying a plurality of chips C in any of the accommodation chambers E311 (see fig. 17) of any of the environment control facilities E3. In contrast, the transfer device E4 may be controlled by the central control device E1 to move the chip testing apparatus 1 disposed in any of the accommodating chambers E311 out of the accommodating chamber E311.

The sorting apparatus E5 is connected to the central control device E1, and the sorting apparatus E5 can be controlled by the central control device E1 to detach the chips C from the electrical connectors 2 of the chip testing apparatus 1, and the sorting apparatus E5 can place the chips C on a tray of a good area a1 or a tray of a defective area a2 according to the test results of the chips C after passing a predetermined test procedure. The sorting device E5 may for example comprise a robot arm. In an embodiment where the sorting apparatus E5 and the chip mounting apparatus E2 are disposed at adjacent positions, the chip mounting apparatus E2 and the sorting apparatus E5 may share the same robot arm. In practical applications, the good area a1 may be divided into a plurality of areas according to requirements, and the sorting apparatus E5 may arrange the chips C in different areas of the good area a1 according to the test results of the chips C after passing through the predetermined test procedures, for example, the chips C may be distinguished according to the operation performance of the chips C.

In summary, according to the environmental control device and the chip testing system including the environmental control device of the present invention, by forming the plurality of movable grooves in the pressing device and disposing the plurality of movable members in the plurality of movable grooves, when the pressing device is separated from the plurality of chips disposed on the chip testing device, the plurality of chips can be pressed by a portion of the plurality of movable members protruding from the contact surface of the contact structure, so that the problem of adhesion between the plurality of chips and the pressing device can be substantially improved, and even the problem of adhesion can be solved.

The disclosure is only a preferred embodiment of the invention and is not intended to limit the scope of the invention, so that all equivalent technical changes made by using the contents of the specification and the drawings are included in the scope of the invention.

Claims

1. An environment control apparatus, characterized by comprising:

an environmental state control device;

the equipment body comprises at least one accommodating chamber, the accommodating chamber is used for accommodating a chip testing device, the chip testing device is used for bearing a plurality of chips, the environment state control device can be electrically connected with the chip testing device arranged in the accommodating chamber, and the environment state control device can carry out detection operation on the plurality of chips borne by the environment state control device through the chip testing device;

a pressing device disposed in the accommodating chamber, the pressing device comprising:

a contact structure having a plurality of movable grooves, each of the movable grooves being formed by a contact surface of the contact structure being recessed in a longitudinal direction;

the movable pieces are correspondingly arranged in the movable groove; one side of each movable piece opposite to the movable groove is provided with a pushing surface; each movable piece can move in the corresponding movable groove along the longitudinal direction, and the pushing surface can protrude out of the contact surface in the process that the movable piece moves in the movable groove;

the limiting pieces are fixedly arranged on the contact structure, the limiting pieces are arranged adjacent to the movable grooves, and the limiting pieces and the contact structure can limit the movable range of the movable pieces in the corresponding movable grooves together;

when the chip testing device is arranged in the accommodating chamber, the abutting device is correspondingly positioned above the plurality of chips carried by the chip testing device;

the environment state control device can enable the chip testing device arranged in the containing chamber and the abutting device positioned in the containing chamber to move close to each other, and enable the abutting surfaces and the contact surfaces of the movable pieces to abut against one side surfaces of the chips together;

the environmental state control device can enable the chip testing device arranged in the containing chamber and the abutting device positioned in the containing chamber to move away from each other under the condition that the abutting surfaces of the moving pieces and the contact surfaces abut against the side surfaces of the chips together, and the moving pieces correspondingly protrude out of the contact surfaces and abut against the chips originally in contact with the contact surfaces.

2. The environmental control apparatus according to claim 1, wherein each of said movable members has a height in said longitudinal direction not greater than a depth of each of said movable grooves, and each of said movable members is capable of being retracted into a corresponding one of said movable grooves; when each moving piece retracts into the corresponding moving groove, the pushing surface of each moving piece can be flush with the contact surface.

3. The environmental control apparatus according to claim 1, wherein the pressing device further comprises a plurality of elastic members disposed in the plurality of movable slots, and one end of each of the elastic members is fixed to the contact structure, and is connected to at least one of the elastic members disposed in the movable slots at one side of each of the movable members disposed in each of the movable slots; when the pushing surface of each moving part does not abut against the chip, at least one elastic element positioned in each moving groove is in a pressed state, and each elastic element enables a part of the moving part connected with the elastic element to protrude out of the contact surface.

4. The environmental control apparatus according to claim 3, wherein said contact structure further comprises a plurality of spring receiving grooves, each of said spring receiving grooves being formed by a bottom wall defining each of said movable grooves being recessed away from said contact surface, and each of said movable grooves being in communication with at least two of said spring receiving grooves, each of said spring receiving grooves being adapted to receive one of said elastic members.

5. The environmental control apparatus according to claim 1, wherein a plurality of the movable grooves are formed in the contact structure side by side with each other, the contact structure further includes a plurality of stopper grooves, each of the stopper grooves is formed by the contact surface being recessed in the longitudinal direction, both ends of each of the movable grooves are respectively communicated with two of the stopper grooves, and a depth of each of the stopper grooves is smaller than a depth of each of the movable grooves.

6. The environmental control apparatus according to claim 5, wherein each of the movable members has a pushing portion and two limiting portions, the pushing portion being disposed in the movable groove; when the pressing device faces the chip testing device arranged in the accommodating chamber, the two limiting parts of each moving part respectively press against the two limiting parts, and part of the pressing part correspondingly protrudes out of the contact surface.

7. The environmental control apparatus according to claim 1, further comprising a temperature adjustment device, wherein the temperature adjustment device is connected to the pressing device, the temperature adjustment device is electrically connected to the environmental status control device, and the environmental status control device can control the temperature adjustment device to operate so that the temperature of the contact surface of the contact structure reaches a predetermined high temperature or a predetermined low temperature.

8. The environmental control apparatus according to claim 7, wherein the pressing means further comprises:

the frame body is arranged around the contact structure and provided with a ring abutting surface which is flush with the contact surface, or the contact surface is higher than the ring abutting surface;

an elastic annular sealing element arranged on the ring abutting surface; when the contact surface is contacted with one side surface of a plurality of chips carried by the chip testing device, the elastic annular sealing element is correspondingly pressed against the chip testing device, and a closed space is correspondingly formed between the contact structure and the chip testing device;

the environment control equipment is also connected with an air exhaust device, and the environment state control device can control the air exhaust device to exhaust the air in the closed space outwards.

9. The environmental control apparatus according to claim 8, wherein at least one air exhaust gap is formed between the frame body and the contact structure, the frame body has at least one air exhaust hole, the air exhaust hole is communicated with the air exhaust gap, and the air exhaust device can exhaust the air in the closed space through the air exhaust hole and the air exhaust gap.

10. The environmental control apparatus according to claim 8, wherein the chip testing device comprises at least a first power supply member, the accommodating chamber is provided with at least a second power supply member, and the apparatus body is connected to a power supply apparatus; when the chip testing device is arranged in the accommodating chamber, the power supply equipment can provide power for the chip testing device through the first power supply component and the second power supply component; when the chip testing device is arranged in the accommodating chamber, the contact structure abuts against the side faces of the chips carried by the chip testing device, the chip testing device is powered on, the contact structure reaches the preset high temperature or the preset low temperature, and air in the closed space is pumped out by the air pumping device, the environmental state control device can control the chip testing device to carry out a preset testing program on the chips carried by the chip testing device.

11. The environmental control apparatus according to claim 1, further comprising at least one lifting device disposed in the housing chamber, the lifting device being connected to the environmental condition control device; the environment state control device can control the lifting device to actuate so that the chip testing device arranged in the accommodating chamber is close to or far away from the pressing device in the accommodating chamber.

12. A chip test system, comprising:

a chip testing device for carrying a plurality of chips;

a central control device, which comprises at least one environment state control device; and

at least one environmental control apparatus, comprising:

the equipment body comprises at least one accommodating chamber, the accommodating chamber is used for accommodating a chip testing device, the chip testing device is used for bearing a plurality of chips, the environment state control device can be electrically connected with the chips arranged in the accommodating chamber, and the environment state control device can carry out detection operation on the plurality of chips borne by the environment state control device through the chip testing device;

wherein, under the state that the pushing surfaces and the contact surfaces of the moving members are abutted against the side surfaces of the chips together, the environmental state control device can enable the chip testing device arranged in the accommodating chamber and the abutting device positioned in the accommodating chamber to move away from each other, and the moving members correspondingly protrude out of the contact surfaces and push against the chips originally contacted with the contact surfaces;

the chip testing device is arranged in the accommodating chamber, and when the pushing surfaces and the contact surfaces of the moving pieces are abutted against one side surfaces of the chips together, the central control device can control the chip testing device to perform a preset testing program on the chips.

13. The chip testing system according to claim 12, wherein the height of each of the movable members in the longitudinal direction is not greater than the depth of each of the movable grooves, and each of the movable members is capable of being retracted into the corresponding movable groove; when each moving piece retracts into the corresponding moving groove, the pushing surface of each moving piece can be flush with the contact surface.

14. The chip testing system according to claim 12, wherein the pressing device further comprises a plurality of elastic members disposed in the plurality of movable slots, one end of each of the elastic members is fixed to the contact structure, and one side of each of the movable members located in each of the movable slots is connected to at least one of the elastic members located in the movable slot; when the pushing surface of each moving part does not abut against the chip, at least one elastic element positioned in each moving groove is in a pressed state, and each elastic element enables a part of the moving part connected with the elastic element to protrude out of the contact surface.

15. The system for testing chips of claim 14 wherein said contact structure further comprises a plurality of spring receiving slots, each of said spring receiving slots being formed by a bottom wall defining each of said movable slots being recessed away from said contact surface, and each of said movable slots being in communication with at least two of said spring receiving slots, each of said spring receiving slots being adapted to receive one of said elastic members.

16. The chip testing system according to claim 12, wherein a plurality of the movable grooves are formed in the contact structure side by side, the contact structure further comprises a plurality of limiting grooves, each of the limiting grooves is formed by the contact surface being recessed in the longitudinal direction, two ends of each of the movable grooves are respectively communicated with two of the limiting grooves, and a depth of each of the limiting grooves is smaller than a depth of each of the movable grooves.

17. The chip testing system according to claim 16, wherein each of the moving members has a pushing portion and two limiting portions, the pushing portion being disposed in the moving slot; when the pressing device faces the chip testing device arranged in the accommodating chamber, the two limiting parts of each moving part respectively press against the two limiting parts, and part of the pressing part correspondingly protrudes out of the contact surface.

18. The system for testing chips of claim 12, wherein the environmental control apparatus further comprises a temperature adjustment device, the temperature adjustment device is connected to the pressing device, the temperature adjustment device is electrically connected to the environmental status control device, and the environmental status control device can control the temperature adjustment device to operate so as to make the temperature of the contact surface of the contact structure reach a predetermined high temperature or a predetermined low temperature.

19. The chip test system according to claim 18, wherein the pressing device further comprises:

20. The chip testing system according to claim 19, wherein at least one air-extracting gap is formed between the frame body and the contact structure, the frame body has at least one air-extracting hole, the air-extracting hole is communicated with the air-extracting gap, and the air-extracting device can extract air in the closed space through the air-extracting hole and the air-extracting gap.

21. The chip testing system according to claim 19, wherein the chip testing apparatus comprises at least a first power supply member, the accommodating chamber is provided with at least a second power supply member, and the apparatus body is connected to a power supply apparatus; when the chip testing device is arranged in the accommodating chamber, the power supply equipment can provide power for the chip testing device through the first power supply component and the second power supply component; when the chip testing device is arranged in the accommodating chamber, the contact structure abuts against the side faces of the chips carried by the chip testing device, the chip testing device is powered on, the contact structure reaches the preset high temperature or the preset low temperature, and air in the closed space is pumped out by the air pumping device, the environmental state control device can control the chip testing device to carry out the preset testing program on the chips carried by the chip testing device.

22. The chip testing system according to claim 12, wherein the environmental control apparatus further comprises at least one elevating device disposed in the accommodating chamber, the elevating device being connected to the environmental condition control device; the environment state control device can control the lifting device to actuate so that the chip testing device arranged in the accommodating chamber is close to or far away from the pressing device in the accommodating chamber.

23. The chip test system according to claim 19, wherein the chip test apparatus comprises:

at least one circuit board, wherein two opposite sides of the circuit board are respectively defined as a first side surface and a second side surface;

the fixing assembly comprises a first fixing component, a second fixing component and a plurality of abutting-against structural bodies, wherein the first fixing component is arranged on the first side surface, and the second fixing component is fixedly arranged on the second side surface;

a plurality of electrical connectors disposed on the first side, each electrical connector comprising:

the electric connecting seat body is provided with a top wall and an annular side wall, the top wall is provided with an opening, one end of the annular side wall is connected with the periphery of the top wall, the other end of the annular side wall is abutted against the circuit board, and a containing groove is formed by the top wall, the annular side wall and the circuit board together; two opposite side surfaces of the top wall are defined as an outer side surface and an inner side surface, and the inner side surface is positioned in the accommodating groove; one side of the top wall opposite to the circuit board is defined as an outer side face, and the outer side face is flush with a butting face of the first fixing member opposite to the circuit board;

the supporting structure is abutted against the circuit board and is positioned in the accommodating groove;

the lifting structure is arranged in the accommodating groove and is provided with a base part and a bearing part, the base part is positioned in the accommodating groove, the base part extends towards one side to form the bearing part, and at least one part of the bearing part is positioned in the opening; the bearing part extends towards one side far away from the base part to form a plurality of limiting parts, at least one part of the limiting parts penetrates through the opening, a chip containing groove is formed by the limiting parts and the bearing part together, and the chip containing groove is used for containing the chip; the lifting structure is also provided with a plurality of connecting holes which penetrate through the base part and the bearing part;

at least one elastic component, which is arranged in the containing groove, one end of each elastic component is fixed on the lifting structure, the other end of each elastic component is fixed on the supporting structure, the elastic restoring force generated by the compression of the elastic components enables the base part to be abutted against the inner side surface of the top wall, and a gap is formed between the lifting structure and the supporting structure;

one end of each probe assembly is fixedly arranged on the supporting structure, the other end of each probe assembly abuts against the electric contact structure of the circuit board, and the other ends of the probe assemblies penetrate through the connecting holes;

when the first fixing member is fixed on the first side surface of the circuit board, the plurality of abutting structural bodies correspondingly abut against a part of the electric connecting seat bodies of the plurality of electric connecting seats;

when the chip accommodating groove is provided with the chip and the limiting part is not pressed by the contact structure, the probe assemblies positioned in the connecting holes are not connected with the electric connecting parts of the chip, and part of the lifting structure protrudes out of the outer side surface of the top wall;

when the chip accommodating groove is provided with the chip, the limiting part is pressed by the contact structure to retract towards the electric connection seat body, and the elastic annular sealing element is mutually pressed with the top pressing surface of the first fixing component, the plurality of probe assemblies are connected with the plurality of contact parts of the chip;

and the control unit is arranged on the second side surface of the circuit board and comprises a plurality of test modules, and each test module is connected with one part of the electric connecting seats.