CN113740701B

CN113740701B - Environment control equipment and chip test system

Info

Publication number: CN113740701B
Application number: CN202010466765.XA
Authority: CN
Inventors: 蔡振龙; 基因·罗森塔尔
Original assignee: First Inspection Co ltd
Current assignee: First Inspection Co ltd
Priority date: 2020-05-28
Filing date: 2020-05-28
Publication date: 2024-03-08
Anticipated expiration: 2040-05-28
Also published as: CN113740701A

Abstract

The invention discloses a chip testing system and environment control equipment. The chip testing system comprises an environment control device, a central control device and a chip testing device, wherein the environment control device comprises a device body and a pressing device. When the chip testing device is arranged in the accommodating chamber of the equipment body, and the central control device enables the pressing device to press one sides of the chips borne by the chip testing device, the central control device controls the chip testing device to detect the chips. When the chip testing device tests the chips, the central control device controls the pressing device and the chip testing device to be separated from each other, and at the moment, the plurality of movable pieces of the pressing device protrude out of the contact surface of the pressing device and push the plurality of chips to separate the chips from the contact surface.

Description

Environment control equipment and chip test system

Technical Field

The present invention relates to an environmental control apparatus and a chip test system, and more particularly, to an environmental control apparatus and a chip test system suitable for testing semiconductor devices (e.g., memories).

Background

In the existing testing operation of various chips, the chips are mostly pressed by using the relevant pressing device, so as to ensure that the chips can be electrically contacted with the electric connection seat in the testing operation process. In a specific implementation, after the chip completes the test operation, the problem that the chip and the pressing device are adhered to each other often occurs. When the chip and the pressing device are sticky, the chip is removed by means of manual operation, so that the whole detection operation is delayed, the chip and the pressing device are separated from each other by means of manual operation, and the chip is easy to damage due to improper operation of related personnel.

Disclosure of Invention

One embodiment of the invention discloses an environment control device, which comprises an environment state control device; the equipment body comprises at least one accommodating chamber, the accommodating chamber is used for accommodating a chip testing device, the chip testing device is used for bearing a plurality of chips, the environment state control device can be electrically connected with the chip testing device arranged in the accommodating chamber, and the environment state control device can carry out a detection operation on the plurality of chips borne by the environment state control device through the chip testing device; a pressing device, it sets up in the accommodation room, presses the device to include: a contact structure having a plurality of movable grooves, each of the movable grooves being formed by a contact surface of the contact structure being concave in a longitudinal direction; the movable pieces are correspondingly arranged in one movable groove; one side of each movable piece opposite to the movable groove is provided with a pushing surface; each movable piece can move in the corresponding movable groove along the longitudinal direction, and the pushing surface can protrude out of the contact surface in the process of moving the movable piece in the movable groove; the limiting pieces are fixedly arranged on the contact structure and are adjacent to the movable grooves, and the limiting pieces and the contact structure can limit the movable ranges of the movable pieces in the corresponding movable grooves together; when the chip testing device is arranged in the accommodating chamber, the pressing device is correspondingly positioned above a plurality of chips borne by the chip testing device; the environment state control device can enable the chip testing device arranged in the accommodating chamber and the pressing device arranged in the accommodating chamber to move close to each other, and enable the pressing surfaces and the contact surfaces of the movable pieces to be pressed against one side surface of the chips; the environment state control device can enable the chip testing device arranged in the accommodating chamber and the pressing device arranged in the accommodating chamber to move away from each other in a state that the pushing surfaces of the movable pieces and the contact surfaces are together abutted against the side surfaces of the chips, and the movable pieces correspondingly protrude out of the contact surfaces and push against the chips originally contacted with the contact surfaces.

Preferably, the height of each movable piece in the longitudinal direction is not greater than the depth of each movable groove, and each movable piece can be retracted in the corresponding movable groove; when each movable piece is retracted in the corresponding movable groove, the pushing surface of each movable piece can be flush with the contact surface.

Preferably, the pressing device further comprises a plurality of elastic pieces, the plurality of elastic pieces are arranged in the plurality of movable grooves, one end of each elastic piece is fixed on the contact structure, and one side of each movable piece positioned in each movable groove is connected with at least one elastic piece positioned in the movable groove; when the pushing surface of each movable piece is not abutted against the chip, at least one elastic piece in each movable groove is in a pressed state, and a part of the movable piece connected with each elastic piece protrudes out of the contact surface.

Preferably, the contact structure further comprises a plurality of spring accommodating grooves, each spring accommodating groove is formed by a bottom wall forming each movable groove concavely toward a direction away from the contact surface, each movable groove is communicated with at least two spring accommodating grooves, and each spring accommodating groove is used for accommodating one elastic piece.

Preferably, the plurality of movable grooves are formed in the contact structure side by side with each other, the contact structure further comprises a plurality of limiting grooves, each limiting groove is formed by the contact surface along the longitudinal direction in a concave manner, two ends of each movable groove are respectively communicated with the two limiting grooves, and the depth of each limiting groove is smaller than that of each movable groove.

Preferably, each movable piece is provided with a pushing part and two limiting parts, and the pushing parts are arranged in the movable grooves; when the pressing device faces the chip testing device arranged in the accommodating chamber, the two limiting parts of each movable part respectively abut against the two limiting parts, and a part of the pushing part correspondingly protrudes out of the contact surface.

Preferably, the environmental control device further comprises a temperature adjusting device, the temperature adjusting device is connected with the pressing device, the temperature adjusting device is electrically connected with the environmental state control device, and the environmental state control device can control the temperature adjusting device to act so that the temperature of the contact surface of the contact structure reaches a preset high temperature or a preset low temperature.

Preferably, the pressing device further comprises: the frame body is arranged around the contact structure and is provided with a ring pressing surface, and the ring pressing surface is flush with the contact surface or the contact surface is higher than the ring pressing surface; an elastic annular sealing element arranged on the annular pressing surface; when the contact surface is contacted with one side surface of a plurality of chips carried by the chip testing device, the elastic annular sealing element correspondingly presses the chip testing device, and a closed space is correspondingly formed between the contact structure and the chip testing device; the environment control equipment is also connected with an air extractor, and the environment state control device can control the air extractor to extract the air in the closed space outwards.

Preferably, at least one air extraction gap is formed between the frame body and the contact structure, the frame body is provided with at least one air extraction hole, the air extraction hole is communicated with the air extraction gap, and the air extraction device can extract the air in the closed space outwards through the air extraction hole and the air extraction gap.

Preferably, the chip testing device comprises at least one first power supply component, at least one second power supply component is arranged in the accommodating chamber, and the device body is connected with a power supply device; when the chip testing device is arranged in the accommodating chamber, the power supply equipment can provide power for the chip testing device through the first power supply component and the second power supply component; when the chip testing device is arranged in the accommodating chamber, the contact structure is abutted against the side surfaces of a plurality of chips borne by the chip testing device, the chip testing device is powered, the contact structure reaches a preset high temperature or a preset low temperature, and air in the closed space is pumped out by the air pumping device, and the environment state control device can control the chip testing device to conduct a preset testing program on the chips borne by the chip testing device.

Preferably, the environment control device further comprises at least one lifting device, wherein the lifting device is arranged in the accommodating chamber and is connected with the environment state control device; the environment state control device can control the lifting device to act so that the chip testing device arranged in the accommodating chamber approaches to or is far away from the pressing device in the accommodating chamber.

One embodiment of the present invention discloses a chip test system, comprising: a chip testing device for carrying a plurality of chips; a central control device, which comprises at least one environmental state control device; at least one environmental control apparatus comprising: the equipment body comprises at least one accommodating chamber, the accommodating chamber is used for accommodating a chip testing device, the chip testing device is used for bearing a plurality of chips, the environment state control device can be electrically connected with the chips arranged in the accommodating chamber, and the environment state control device can carry out a detection operation on the plurality of chips borne by the environment state control device through the chip testing device; a pressing device, it sets up in the accommodation room, presses the device to include: a contact structure having a plurality of movable grooves, each of the movable grooves being formed by a contact surface of the contact structure being concave in a longitudinal direction; the movable pieces are correspondingly arranged in one movable groove; one side of each movable piece opposite to the movable groove is provided with a pushing surface; each movable piece can move in the corresponding movable groove along the longitudinal direction, and the pushing surface can protrude out of the contact surface in the process of moving the movable piece in the movable groove; the limiting pieces are fixedly arranged on the contact structure and are adjacent to the movable grooves, and the limiting pieces and the contact structure can limit the movable ranges of the movable pieces in the corresponding movable grooves together; when the chip testing device is arranged in the accommodating chamber, the pressing device is correspondingly positioned above a plurality of chips borne by the chip testing device; the environment state control device can enable the chip testing device arranged in the accommodating chamber and the pressing device arranged in the accommodating chamber to move close to each other, and enable the pressing surfaces and the contact surfaces of the movable pieces to be pressed against one side surface of the chips; the environment state control device can enable the chip testing device arranged in the accommodating chamber and the pressing device arranged in the accommodating chamber to move away from each other in a state that the pushing surfaces of the movable pieces and the contact surfaces are together abutted against the side surfaces of the chips, and the movable pieces correspondingly protrude out of the contact surfaces and push against the chips originally contacted with the contact surfaces; when the pushing surface and the contact surface of the plurality of movable pieces are propped against one side surface of the plurality of chips together, the central control device can control the chip testing device to perform a preset testing program on the plurality of chips.

Preferably, the chip test apparatus comprises: at least one circuit board, two opposite sides of which are respectively defined as a first side surface and a second side surface; the fixing assembly comprises a first fixing member, a second fixing member and a plurality of pressing structures, wherein the first fixing member is arranged on the first side surface, and the second fixing member is fixedly arranged on the second side surface; a plurality of electric connection seats, it sets up in first side, and each electric connection seat contains: the electric connecting seat body is provided with a top wall and a ring side wall, the top wall is provided with an opening, one end of the ring side wall is connected with the periphery of the top wall, the other end of the ring side wall is propped against the circuit board, and the top wall, the ring side wall and the circuit board jointly form a containing groove; the two opposite side surfaces of the top wall are defined as an outer side surface and an inner side surface, and the inner side surface is positioned in the accommodating groove; the side of the top wall opposite to the circuit board is defined as an outer side surface, and the outer side surface is flush with a propped top surface of the first fixing member opposite to the circuit board; the supporting structure is propped against the circuit board and is positioned in the accommodating groove; the lifting structure is arranged in the accommodating groove and is provided with a base part and a bearing part, the base part is positioned in the accommodating groove, the base part extends to one side to form the bearing part, and at least one part of the bearing part is positioned in the opening; the bearing part extends to one side far away from the base part to form a plurality of limiting parts, at least one part of the limiting parts penetrates out of the open hole, and the limiting parts and the bearing part jointly form a chip accommodating groove for accommodating a chip; the lifting structure is also provided with a plurality of connecting holes which penetrate through the base part and the bearing part; the elastic components are arranged in the accommodating grooves, one end of each elastic component is fixed on the lifting structure, the other end of each elastic component is fixed on the supporting structure, the elastic restoring force generated by the compression of the plurality of elastic components enables the base to be propped against the inner side surface of the top wall, and a gap is formed between the lifting structure and the supporting structure; one end of each probe assembly is fixedly arranged on the supporting structure, the other end of each probe assembly is propped against the electric contact structure of the circuit board, and the other ends of the probe assemblies penetrate through the connecting holes; when the first fixing component is fixed on the first side surface of the circuit board, the plurality of pressing structures correspondingly press against a part of the electric connection seat body of the plurality of electric connection seats; when the chip accommodating groove is provided with a chip and the limiting part is not pressed by the contact structure, the probe assemblies in the plurality of connecting holes are not connected with the plurality of electric connecting parts of the chip, and part of the lifting structure protrudes out of the outer side surface of the top wall; when the chip accommodating groove is provided with a chip, the limiting part is pressed by the contact structure to shrink inwards towards the electric connection seat body, and the elastic annular sealing piece is mutually pressed with the propped top surface of the first fixing member, the plurality of probe assemblies are connected with the plurality of contact parts of the chip; and the control unit is arranged on the second side surface of the circuit board and comprises a plurality of test modules, and each test module is connected with a part of the electric connection seat.

In summary, according to the environmental control apparatus and the chip testing system disclosed in the embodiments of the present invention, through the design of the contact structure, the movable member, the limiting member, and the like, when the pressing device presses the plurality of chips, and the chip testing device completes the predetermined testing procedure on the plurality of chips, the pressing device and the chip testing device are separated from each other, the plurality of movable members protrude from the contact surface of the contact structure, and push the plurality of chips, so as to solve the problem that the plurality of chips adhere to the contact surface.

Drawings

Fig. 1 is a schematic diagram of a chip testing system according to the present disclosure.

FIG. 2 is a block diagram of a chip test system according to the present invention.

Fig. 3 is a schematic diagram of an environmental control apparatus of the present invention.

Fig. 4 and 5 are exploded views of the chip testing apparatus from different angles.

Fig. 6 and 7 are partially exploded views of a chip testing device from different angles.

FIG. 8 is a block diagram of a chip testing apparatus.

Fig. 9 is a schematic exploded view of a cross section of an electrical connection socket of a chip testing apparatus according to the present invention.

Fig. 10 is a schematic cross-sectional view of the electrical connection base of the chip testing device disclosed in the invention, which is not provided with a chip.

Fig. 11 is a schematic cross-sectional view of an electrical connection pad of a chip testing apparatus according to the present invention.

Fig. 12 is a schematic cross-sectional view of a chip testing apparatus according to the present disclosure.

FIG. 13 is a block schematic diagram of a single environmental control apparatus.

Fig. 14 is a schematic view of a pressing device according to the present invention.

Fig. 15 shows a partially enlarged schematic view of fig. 14.

Fig. 16 is an exploded view of the pressing device of the present invention.

Fig. 17 is an enlarged and exploded view of a portion of the pressing device of the present invention.

Fig. 18 is a schematic partial perspective view of the pressing device.

Fig. 19 shows a partially enlarged schematic view of fig. 18.

Fig. 20 is a front view, partly in section, of the pressing device.

Fig. 21 is a schematic partial perspective cross-sectional view of another view of the pressing device.

Fig. 22 is an enlarged partial schematic view of fig. 21.

Fig. 23 is a schematic cross-sectional side view of a chip testing apparatus.

FIG. 24 is a schematic cross-sectional view of a pressing device pressing one side of a plurality of chips of the chip testing device.

Fig. 25 is an enlarged partial schematic view of fig. 24.

Fig. 26 is a schematic cross-sectional side view showing the pressing device and the chip testing device separated from each other.

Detailed Description

Referring to fig. 1 to 5, fig. 1 is a schematic diagram of a chip testing system according to the present disclosure, fig. 2 is a block schematic diagram of a chip testing system according to the present disclosure, and fig. 3 is a schematic diagram of an environmental control apparatus according to the present disclosure. The chip test system E is used for testing a plurality of chips C. The chip test system E includes: a central control device E1, a chip mounting equipment E2, at least a chip testing device 1, a plurality of environment control equipment E3, a transfer equipment E4 and a classification equipment E5.

The central control device E1 is connected with the chip mounting equipment E2, a plurality of environment control equipment E3, a transfer equipment E4 and a classification equipment E5, and the central control device E1 can control the operation of each equipment; the central control device E1 is not limited to this, and may be, for example, a server, various computer devices, or the like. The chip mounting apparatus E2 may include a mechanical arm (not shown), which can be controlled by the central control device E1 to take out the plurality of chips C on the tray (tray) one by one and then place the chips C on the plurality of electrical connection seats 2 of the chip testing device 1 one by one. The chip testing apparatus 1 is used for carrying a plurality of chips C, and the chip testing apparatus 1 can be carried by a transferring device E4 to be transferred between a plurality of workstations (e.g. a chip mounting device E2, a plurality of environmental control devices E3, a transferring device E4 and a sorting device E5). The plurality of environmental control apparatuses E3 are connected to the central control device E1, and the central control device E1 can control any one of the environmental control apparatuses E3 to operate independently. Each environmental control device E3 is configured to make a plurality of chips C disposed on the chip testing apparatus 1 perform a predetermined testing procedure in an environment with a predetermined temperature (e.g., a predetermined high temperature or a predetermined low temperature); for example, the chip C may be various memories (for example, NAND Flash, etc.), and each test module 30 can perform at least one of a read test, a write test and an electrical test on each memory.

Referring to fig. 3 to 8, fig. 3 is a schematic diagram of a chip testing apparatus, fig. 4 and 5 are respectively an exploded schematic diagram of the chip testing apparatus at different viewing angles, fig. 6 and 7 are respectively a partially exploded schematic diagram of the chip testing apparatus at different viewing angles, and fig. 8 is a block schematic diagram of the chip testing apparatus. The chip testing apparatus 1 includes: a circuit board 10, a fixing component 11, a plurality of electrical connection bases 2, a control unit 3 and at least a first power supply member 4. Opposite sides of the circuit board 10 are respectively defined as a first side 101 and a second side 102 (as shown in fig. 7). The plurality of electrical connection sockets 2 are fixedly disposed on the first side 101 of the circuit board 10, and each electrical connection socket 2 is used for carrying one chip C. The form of the electrical connection base 2 may be varied according to different chips C, and is not limited herein.

The fixing assembly 11 includes a first fixing member 111, a second fixing member 112, and a plurality of pressing structures 113. The first fixing member 111 is disposed on the first side 101, and the second fixing member 112 is fixedly disposed on the second side 102. The first fixing member 111 has a plurality of first locking holes 1111, the second fixing member 112 has a plurality of second locking holes 1121, and the circuit board 10 has a plurality of circuit board locking holes 103, each of the first locking holes 1111 is provided through the first fixing member 111, each of the second locking holes 1121 is provided through the second fixing member 112, each of the circuit board locking holes 103 is provided through the circuit board 10, and the plurality of first locking holes 1111, the plurality of circuit board locking holes 103, and the plurality of second locking holes 1121 are provided correspondingly. In practical applications, the number, shape and distribution of the first locking holes 1111, the circuit board locking holes 103 and the second locking holes 1121 may be changed according to needs, and the present invention is only one exemplary embodiment.

The first locking holes 1111, the circuit board locking holes 103 and the second locking holes 1121 are used to lock with a plurality of locking members (not shown, for example, screws), and the circuit board 10 is fixed between the first fixing member 111 and the second fixing member 112. That is, the circuit board 10 is clamped between the first fixing member 111 and the second fixing member 112, and the overall structural strength of the circuit board 10 is improved by the arrangement of the first fixing member 111 and the second fixing member 112. In practical applications, the first fixing member 111 and the second fixing member 112 may be made of a high-hardness material such as stainless steel; the circuit board 10 may have only each of the circuit board locking holes 103 provided through the circuit board 10, and the circuit board 10 has no other holes penetrating through the circuit board 10.

As shown in fig. 3, 4 and 6, the first fixing member 111 and the pressing structure 113 may be integrally formed. Each pressing structure 113 may be formed with a plurality of perforations 1131. When the first fixing member 111 is fixed to the first side 101 of the circuit board 10, the plurality of pressing structures 113 correspondingly press against a portion of the electrical connector body 21 of the plurality of electrical connectors 2, and a portion of each electrical connector 2 correspondingly exposes out of each through hole 1131. That is, the first fixing member 111 is used to cooperate with the second fixing member 112 to clamp the circuit board 10, and the first fixing member 111 is also used to fix the plurality of electrical connection pads 2 disposed on the first side 101 of the circuit board 10 to the first side 101 of the circuit board 10. In practical applications, each pressing structure 113 may include a plurality of locking holes 1132, and each pressing structure 113 is detachably fixed on the first fixing member 111 through the plurality of locking holes 1132 and a plurality of screws.

In more detail, the first fixing member 111 may include a plurality of group receiving holes 1112, and each group receiving hole 1112 is disposed through the first fixing member 111. Each group accommodating hole 1112 is used for accommodating a plurality of electrical connectors 2. The first fixing member 111 further includes a plurality of auxiliary fixing portions 1113, and each auxiliary fixing portion 1113 is formed by forming a sidewall of each group accommodating hole 1112 and extending toward the center of the group accommodating hole 1112. When the first fixing member 111 is fixed to the circuit board 10, the height of each auxiliary fixing portion 1113 with respect to the circuit board 10 is smaller than the depth of each group accommodation hole 1112.

Each pressing structure 113 and the auxiliary fixing portion 1113 may have a plurality of corresponding locking holes 1132 and 11131, and each pressing structure 113 may be the auxiliary fixing portion 1113 locked in each group accommodating hole 1112 by a plurality of locking members (not shown, for example, screws). When the pressing structure 113 and the auxiliary fixing portion 1113 are locked to each other, the pressing structure 113 presses against the pressing portion 213 (as shown in fig. 6, described in detail below) of the electrical connector body 21 of the plurality of electrical connectors 2 located in the group accommodating hole 1112, and a portion of the plurality of electrical connectors 2 is exposed through the plurality of through holes 1131 of the pressing structure 113.

As shown in fig. 6, on the first side 101 of the circuit board 10, a plurality of sets of electrical contact structures 1011, each set of electrical contact structures 1011 (e.g., metal pads) may be formed; when each electrical connection socket 2 is pressed by the pressing structure 113 and is fixedly disposed on the first side 101 of the circuit board 10, one end of a plurality of probe assemblies 20 (as shown in fig. 10, described in detail later) of the electrical connection socket 2 is correspondingly pressed against a set of electrical contact structures 1011, so that, when the chip testing apparatus 1 is powered, the plurality of probe assemblies 20 of the electrical connection socket 2 can be electrically connected with electronic components disposed on the circuit board 10 through the plurality of electrical contact structures 1011. In practical applications, a plurality of positioning members may be disposed between each electrical connection pad 2 and the circuit board 10, and the plurality of positioning members are used to assist the electrical connection pad 2 to be disposed at a correct position on the circuit board 10.

As described above, the first fixing member 111 is locked to the first side 101 of the circuit board 10 by a plurality of locking members, and the plurality of pressing structures 113 of the first fixing member 111 are correspondingly pressed against a portion of each electrical connection seat 2, so that each electrical connection seat 2 can be directly fixed to the circuit board 10 by the first fixing member 111 without using a screw in a pressing manner, and thus, the number of through holes of the circuit board 10 can be greatly reduced.

As shown in fig. 7 and 8, the control unit 3 is disposed on the second side 102 of the circuit board 10. The control unit 3 includes a plurality of test modules 30, and each test module 30 is fixedly disposed on the second side 102 of the circuit board 10. The second side 102 of the circuit board 10 may have a plurality of first contact structures 1021, and the second fixing member 112 has a plurality of avoidance holes 1122; when the second fixing member 112 is fixed to the second side 102 of the circuit board 10, the plurality of first contact structures 1021 are correspondingly exposed out of the plurality of avoidance holes 1122.

Each test module 30 may have a test module body 31 and two second contact structures 32, electronic components for testing the chip C disposed on the electrical connection base 2 are disposed in the test module body 31, the second contact structures 32 are exposed at one side of the test module body 31, and the second contact structures 32 of each test module body 31 are used for contacting with the first contact structures 1021 of the circuit board 10. When each test module 30 is fixedly disposed on the second side 102 of the circuit board 10, the second contact structure 32 of each test module 30 passes through the corresponding avoidance hole 1122 to contact with the first contact structure 1021 of the circuit board 10.

When the second contact structure 32 of each test module 30 contacts the first contact structure 1021 of the circuit board 10 and the chip testing device 1 is powered, each test module 30 can perform the predetermined test procedure on the chips C carried by the electrical connector 2 through the circuit board 10 and the electrical connector 2. In a specific application, the first contact structure 1021 and the second contact structure 32 may be, for example, board-to-board connectors, which may be, for example, pogo pins or reeds, but not limited thereto. In the embodiment where each test module 30 is used to test a memory, the test module body 31 of each test module 30 may include a graphics generator (Pattern Generator, PG), a parameter measurement unit (Parametric Measurement Unit, PMU), a component power supply module (Device Power Supplies, DPS), and a Driver circuit (Driver).

Through the design of the first contact structure 1021 and the second contact structure 32, each test module 30 can be detachably and fixedly arranged on the second side 102 of the circuit board 10, and through the design that each test module 30 is detachably arranged on the circuit board 10, a user can replace the test module 30 according to requirements, and related maintenance personnel can easily disassemble, assemble and maintain the specific test module 30. In addition, the control unit 3 may further include a housing 33, where the housing 33 is used to protect the plurality of test modules 30.

As shown in fig. 7, in practical application, the test module body 31 may have two auxiliary fixing structures 311, each auxiliary fixing structure 311 may have a plurality of fixing holes 3111, and the second fixing member 112 may have a plurality of corresponding fixing holes 1123. Each of the test module bodies 31 may be detachably fixed to the second fixing member 112 by a plurality of fasteners (e.g. screws) that are engaged with the plurality of fixing holes 3111 and the plurality of fixing holes 1123.

Referring to fig. 8 to 11 together, fig. 9 is a schematic exploded cross-sectional view of an electrical connection socket of a chip testing apparatus according to the present invention, fig. 10 is a schematic cross-sectional view of an electrical connection socket of a chip testing apparatus according to the present invention without a chip, fig. 11 is a schematic cross-sectional view of an electrical connection socket of a chip testing apparatus according to the present invention with a chip, and fig. 12 is a schematic cross-sectional view of a chip testing apparatus according to the present invention. Each electrical connection socket 2 comprises: a plurality of probe assemblies 20, an electrical connector body 21, a lifting structure 22, a supporting structure 23 and a plurality of elastic assemblies 24. Each probe assembly 20 includes a needle 201 and a spring 202. One end of the needle 201 is used to connect with an electrical connection C1 (shown in fig. 11) of the chip C. The spring 202 is sleeved on the needle 201, and when one end of the needle 201 is pressed, the spring 202 is correspondingly pressed to generate elastic restoring force, so that when the needle 201 is not pressed any more, the needle 201 is restored to an unpressurized position under the action of the elastic restoring force.

The electrical connector body 21 has a top wall 211, a ring side wall 212 and a supporting portion 213. The top wall 211 has an opening 21A, one side of the ring side wall 212 is connected to the periphery of the top wall 211, the other side of the ring side wall 212 is fixedly disposed on the circuit board 10, and the top wall 211, the ring side wall 212 and the circuit board 10 together form a receiving slot 21B. Opposite sides of top wall 211 define an outer side 2111 and an inner side 2112 (as shown in fig. 11). In practical applications, the top wall 211 and the ring side wall 212 may be integrally formed.

As shown in fig. 3, 6 and 8, the ring sidewall 212 further protrudes outward to form a supporting portion 213. When the pressing structure 113 is fixed to the first fixing member 111 and the first fixing member 111 is fixed to the circuit board 10, the pressing structure 113 will correspondingly abut against the abutting portion 213 of each electrical connection socket 2. That is, each of the pressing portions 213 is configured to facilitate pressing the pressing structure 113, and the shape of the pressing portion 213 may be designed corresponding to the pressing structure 113 and the through hole 1131.

As shown in fig. 8 to 11, the lifting structure 22 includes a base 221 and a carrying portion 222. The base 221 is completely disposed in the accommodating groove 21B, the base 221 extends to one side to form a bearing portion 222, and a portion of the bearing portion 222 can be disposed through the opening 21A. The carrying portion 222 extends to a side far away from the base 221 to form four limiting portions 223, the four limiting portions 223 may be located at four corners of the carrying portion 222, and the four limiting portions 223 and the carrying portion 222 together form a chip accommodating groove 22B, the chip accommodating groove 22B is used for providing a chip C, and the four limiting portions 223 are used for mutually clamping with the chip C. The lifting structure 22 further has a plurality of connection holes 22A (as shown in fig. 11), and each connection hole 22A is disposed through the base 221 and the carrying portion 222.

A portion of the plurality of probe assemblies 20 is fixedly disposed in the supporting structure 23, and the plurality of probe assemblies 20 are fixedly disposed at one end of the supporting structure 23 for connecting with the electrical contact structure 1011 (shown in fig. 6) of the circuit board 10; the other ends of the plurality of probe assemblies 20 are located in the plurality of connection holes 22A, and one end of the probe assembly 20 located in the plurality of connection holes 22A is connected to the electrical connection portion C1 of the chip C.

In practical applications, the supporting structure 23 may include a base structure 231 and an auxiliary structure 232. The base structure 231 is disposed in the accommodating groove 21B, and the base structure 231 and the electrical connector body 21 are fixed to each other (e.g., fixed to the electrical connector body 21 by a plurality of screws). The base structure 231 has a plurality of through holes 2311, and one end of the plurality of probe assemblies 20 is fixedly disposed in the plurality of through holes 2311 of the base structure 231. The auxiliary structure 232 is disposed in the accommodating groove 21B, and the auxiliary structure 232 is disposed between the base structure 231 and the top wall 211, and the auxiliary structure 232 and the base structure 231 are fixed (e.g. locked by screws). The auxiliary structure 232 has a plurality of support holes 2321 disposed at intervals, the plurality of support holes 2321 are in communication with the plurality of through holes 2311 of the base structure 231, and the plurality of support holes 2321 are disposed corresponding to the plurality of connection holes 22A, and the plurality of connection holes 22A, the plurality of support holes 2321 and the plurality of through holes 2311 together form a plurality of probe channels, in which the plurality of probe assemblies 20 are disposed correspondingly.

As shown in fig. 9 and 10, the supporting structure 23 is disposed in the accommodating groove 21B, and the elastic component 24 is disposed between the supporting structure 23 and the lifting structure 22. The elastic component 24 can make the base 221 of the lifting structure 22 abut against the inner side surface 2112 of the top wall 211, and a gap S is correspondingly formed between the base 221 and the supporting structure 23. In practical application, when the electrical connector 2 is fixed on the circuit board 10 and the limiting portion 223 of the electrical connector 2 is not pressed by an external force, the four elastic components 24 between the lifting structure 22 and the supporting structure 23 may be slightly compressed, and the elastic restoring force generated by the compression of the elastic components 24 will make the lifting structure 22 firmly abut against the inner side surface 2112 of the top wall 211.

As shown in fig. 11, when the chip C is fixedly disposed in the chip accommodating groove 22B and the lifting structure 22 is not pressed, the plurality of electrical connection portions C1 of the chip C are correspondingly accommodated in the plurality of connection holes 22A, and the respective probe assemblies 20 are not connected (e.g. not in contact with) with the plurality of electrical connection portions C1. When the lifting structure 22 is pressed, at least a portion of the lifting structure 22 will retract into the electrical connection seat body 21, i.e. the lifting structure 22 will move towards the circuit board 10 relative to the supporting structure 23, and the plurality of probe assemblies 20 will be correspondingly connected with the plurality of electrical connection parts C1 of the chip C.

Referring to fig. 3 to 6, in practical application, the plurality of electrical connection pads 2 may be divided into a plurality of electrical connection pad groups, each of the electrical connection pad groups includes at least one electrical connection pad 2, and each of the test modules 30 is correspondingly connected to all of the electrical connection pads 2 of one electrical connection pad group. For example, in fig. 3 and 4 of the present embodiment, 72 electrical connection sockets 2 are disposed on the circuit board 10, which can be divided into 6 groups of electrical connection socket groups, each group of electrical connection sockets includes 12 electrical connection sockets 2, and 12 electrical connection sockets 2 in each group of electrical connection sockets are located in the same group accommodating hole 1112, and 12 electrical connection sockets 2 in each group of electrical connection sockets are connected to the same test module 30; as shown in fig. 5, the circuit board 10 is provided with 6 test modules 30. Of course, the number of the electrical connection sockets 2 and the number of the electrical connection socket groups corresponding to the number of the electrical connection socket groups may be changed according to the requirements.

By the design that the plurality of electrical connection seats 2 arranged on the circuit board 10 are respectively connected to the plurality of different test modules 30, the test modules 30 and the plurality of chips C on the electrical connection seats 2 connected with the test modules can transfer signals between each other more quickly and are not easy to attenuate. More specifically, if the circuit board 10 provided with 72 electrical connection sockets 2 is connected to only one signal input source, when a signal sent from the signal input source is transmitted from one side of the circuit board 10 to the other side of the circuit board 10, the signal will be significantly attenuated, which may cause a problem of inaccurate chip test results.

In practical applications, all the electrical connection sockets 2 in each electrical connection socket group may be connected in parallel, and all the electrical connection sockets 2 in the same electrical connection socket group that are connected in parallel are connected to the same test module 30; in other words, all the electrical connection pads 2 to which the respective test modules 30 are connected in parallel. In addition, any one of the electrical connection pads 2 in each electrical connection pad group is not connected to any one of the electrical connection pads 2 in the other electrical connection pad groups. For example, assume that the circuit board 10 is provided with four electrical connection sockets 2, respectively: z1, Z2, Q1, Q2, four electrical connection sockets 2 are partitioned into two groups of electrical connection sockets, a first group of electrical connection sockets comprising Z1, Z2 and a second group of electrical connection sockets comprising Q1, Q2, then Z1 and Z2 are connected in parallel, Q1 and Q2 are connected in parallel, and Z1 is not connected with Q1 (whether in parallel or in series), Z1 is not connected with Q2 (whether in parallel or in series), Z2 is not connected with Q1 (whether in parallel or in series), and Z2 is not connected with Q2 (whether in parallel or in series).

By the design that the plurality of electrical connection sockets 2 of different electrical connection socket groups are not mutually connected, when the chip testing device 1 fails, related maintenance personnel can quickly find out the damaged electrical connection socket 2 by testing each electrical connection socket group one by one, and related maintenance personnel can replace only the damaged electrical connection socket 2, components of the electrical connection socket 2, the electrical connection sockets 2 of the same group or the test modules 30, without replacing all the electrical connection sockets 2 or all the test modules 30 of the whole circuit board 10.

As shown in fig. 3 and 4, in practical application, the number of the through holes 1131 of the pressing structure 113 may be, for example, the number of the electrical connection sockets 2 corresponding to the number of the group accommodating holes 1112, and when the pressing structure 113 is disposed in the group accommodating holes 1112, a portion of one electrical connection socket 2 is correspondingly inserted into each through hole 1131 of the pressing structure 113. Of course, in different embodiments, the number of the through holes 1131 of the pressing structure 113 may not completely correspond to the number of the electrical connection pads 2.

As shown in fig. 3 and 6, by the design of the first fixing member 111 and the pressing structure 113, each electrical connection socket 2 is directly fixed on the circuit board 10 in a pressing manner, and each group of electrical connection socket groups is correspondingly pressed by one pressing structure 113, so that when any electrical connection socket 2 fails, a related person only needs to remove the screw between the first fixing member 111 and the pressing structure 113 corresponding to the electrical connection socket 2, and then the electrical connection socket 2 can be directly removed and replaced. That is, by designing the first fixing member 111 and the pressing structure 113, the maintenance personnel or the machine can easily and quickly maintain, replace and install the specific electrical connection base 2.

As shown in fig. 3 and 4, the first power supply member 4 included in the chip testing apparatus 1 may be a metal structure formed on the circuit board 10, and the first power supply member 4 may be connected to a plurality of test modules 30 through the circuit board 10. The first power supply member 4 may be, for example, a board-to-board connector, which may be, for example, a structure such as a PoGo pin or a reed, but is not limited thereto. The first power supply member 4 is configured to be connected to a second power supply member E36 (shown in fig. 13) of the environmental control device E3 (shown in fig. 12), and the power supply device connected to the environmental control device E3 may supply power to each test module 30 through the second power supply member E36, the first power supply member 4, the plurality of first contact structures 1021 (shown in fig. 6), and the plurality of second contact structures 32 (shown in fig. 7), where the power supply device refers to a power supply device independent of the chip test apparatus 1, and the power supply device may be any device capable of providing power. That is, the chip testing apparatus 1 performs a predetermined test procedure on the plurality of chips C to which each test module 30 is connected, substantially without power, without being connected to the power supply device through the first power supply member 4. Of course, in different embodiments, the chip testing apparatus 1 may also be provided with at least one battery, where the battery is connected to the plurality of testing modules 30, and the battery can supply power to the plurality of testing modules 30.

In practical applications, the first power supply member 4 and the second power supply member E36 may be, for example, metal conductive structures formed on a circuit board, and when the first power supply member 4 and the second power supply member E36 are in contact, the chip testing device 1 and the environmental state control device E11 are electrically connected with each other; alternatively, the first power feeding member 4 and the second power feeding member E36 may transmit and receive the antenna, and power transmission may be performed wirelessly therebetween.

Referring to fig. 12 and fig. 13 together, fig. 13 is a block diagram of a single environmental control apparatus E3. Each environmental control equipment E3 includes an equipment body E31, a plurality of lifting devices E32, and a plurality of pressing devices E33. The apparatus body E31 includes a plurality of accommodating chambers E311. The accommodating chamber E311 is mainly used for accommodating the chip testing apparatus 1. The plurality of accommodating chambers E311 included in the environmental control apparatus E3 may be in communication with each other or not, which is not limited herein.

In practical applications, the chip test system E may include a plurality of environmental control devices E3, and the central control device E1 may include a plurality of environmental state control devices E11 (e.g. various processors, computers, etc.), and the device body E31 (fig. 17) of each environmental control device E3 may be correspondingly provided with one environmental state control device E11, that is, each environmental control device E3 may include one environmental state control device E11. In practical applications, each environmental control device E3 may be manufactured and sold independently, and the environmental control device E3 may include the environmental state control device E11 according to the requirement.

In an embodiment in which the plurality of chambers E311 included in the environmental control apparatus E3 are independent of each other and do not communicate with each other, each chamber E311 may be provided with a movable door, and the environmental control apparatus E3 may be connected with an air extracting device E34. When the chip testing apparatus 1 is disposed in the accommodating chamber E311, the central control apparatus E1 can control the corresponding movable door to actuate so that the accommodating chamber E311 becomes a closed space, and then, the central control apparatus E1 can control the air extractor E34 to actuate so that the accommodating chamber E311 is in a state similar to a vacuum, so that the temperature in the accommodating chamber E311 is not easily affected by the external environment.

The plurality of lifting devices E32 are disposed in the plurality of accommodating chambers E311, and the plurality of pressing devices E33 are disposed in the plurality of accommodating chambers E311, that is, one lifting device E32 and one pressing device E33 are disposed in each accommodating chamber E311. Wherein, in each accommodation chamber E311, the pressing device E33 is disposed facing the lifting device E32. Each lifting device E32 is connected to the environmental state control device E11, and the environmental state control device E11 can control each lifting device E32 to independently operate, and the lifting device E32 operated under control can make the chip testing device 1 disposed in the accommodating chamber E311 approach or separate from the pressing device E33.

When the chip testing device 1 carrying a plurality of chips C to be tested is disposed in the accommodating chamber E311, the environmental state control device E11 can control the corresponding lifting device E32 to act, so that the chip testing device 1 approaches the pressing device E33 until the pressing device E33 abuts against one side of the plurality of chips C carried by the chip testing device 1. When the pressing device E33 abuts against the side surfaces of the chips C carried by the chip testing device 1, the environmental state control device E11 can control the chip testing device 1, so that the chip testing device 1 performs the predetermined test procedure on the chips C carried by the chip testing device.

In an embodiment in which the chip test system E includes a plurality of environmental control apparatuses E3, and each environmental control apparatus E3 has an environmental status control device E11 independent of the other environmental control apparatuses E3, each environmental control apparatus E3 may independently control the chip test device 1 disposed in each housing chamber E311 to perform different predetermined test procedures on the chip C carried thereby.

As shown in fig. 13, in practical application, each environmental control apparatus E3 may further include a plurality of temperature adjustment devices E35. Each temperature adjusting device E35 is electrically connected to the environmental state control device E11, and each temperature adjusting device E35 is connected to each pressing device E33, where the environmental state control device E11 can control each temperature adjusting device E35 to independently actuate, so that the temperature of a contact structure E331 of the pressing device E33 reaches the predetermined low temperature or the predetermined high temperature.

In a specific application, each temperature adjusting device E35 may include a heater E351 and a refrigerator E352, where the heater E351 and the refrigerator E352 are respectively connected to the contact structure E331, and the heater E351 and the refrigerator E352 can be controlled by the environmental state control device E11 to independently operate, so that the temperature of the contact structure E331 reaches a predetermined high temperature and a predetermined low temperature. The heater E351 is, for example, a heating coil, and the refrigerator E352 is, for example, a cooling chip, but not limited to this. The temperature adjusting device E35 may have a heater E351 and a refrigerator E352 according to requirements, but is not limited thereto; in different embodiments, the temperature regulating device E35 may be a device comprising only the heater E351 or the refrigerator E352.

In various embodiments, the temperature adjusting device E35 may also include at least one fluid channel for providing a high temperature fluid or a low temperature fluid to pass through; when a high temperature fluid or a low temperature fluid passes through the fluid passage, the temperature of the contact structure E331 may be brought to a predetermined high temperature or a predetermined low temperature. In a different embodiment, each temperature adjusting device E35 may not be connected to the pressing device E33, and each temperature adjusting device E35 is used to directly reach the temperature of the accommodating chamber E311 to a predetermined high temperature or a predetermined low temperature.

When the chip testing device 1 carries a plurality of chips C and is disposed in the accommodating chamber E311, the environmental state control device E11 controls the lifting device E32 to act, so that one side of the plurality of chips C abuts against the contact structure E331 of the pressing device E33; next, the environmental state control means E11 may control the temperature adjustment means E35 to be operated so that the temperature of the contact structure E331 reaches a predetermined high temperature or a predetermined low temperature; finally, the environmental state control device E11 will control the chip testing device 1 to operate, so that the chip testing device 1 performs the predetermined test procedure on the plurality of chips C carried by the chip testing device, and thus, each chip C will perform the predetermined test procedure in the environment of the predetermined high temperature or the predetermined low temperature.

It should be noted that, in the present embodiment, the apparatus body E31 has a plurality of lifting devices E32, and the environmental state control device E11 can achieve the effect of moving the chip testing device 1 and the pressing device E33 disposed in the accommodating chamber E311 in the direction approaching or separating from each other by the lifting devices E32, but the environmental state control device E11 is not limited to achieve the same effect by using the lifting devices E32; in a different embodiment, the pressing device E33 may be connected to a moving device, and the environmental state control device E11 moves the pressing device E33 toward or away from the chip testing device 1 disposed in the accommodating chamber E311 through the moving device.

Referring to fig. 14 to 17, fig. 14 is a schematic diagram of the pressing device of the present invention, fig. 15 is a partially enlarged schematic diagram of fig. 14, fig. 16 is an exploded schematic diagram of the pressing device of the present invention, and fig. 17 is a partially enlarged exploded schematic diagram of the pressing device of the present invention. Each pressing device E33 includes a contact structure E331, a plurality of moving members E332, a plurality of limiting members E333, and a plurality of elastic members E334. In a different embodiment, the pressing device E33 may not include a plurality of elastic members E334.

The contact structure E331 has a plurality of movable slots E3311, a plurality of limiting slots E3312, and a plurality of spring receiving slots E3313. Each movable slot E3311 is formed by a contact surface E3314 of the contact structure E331 being concave inward in a longitudinal direction L. The contact structure E331 may be, for example, a rectangular metal cube, but not limited to, the shape of the contact structure E331 may be changed according to the requirement, and the material of the contact structure E331 may be any material with high heat conductivity and cold conductivity.

Each limiting groove E3312 is formed by the concave contact surface E3314 in the longitudinal direction L, and each limiting groove E3312 is simultaneously connected with one end of a plurality of movable grooves E3311; more specifically, the plurality of movable grooves E3311 may be arranged at intervals side by side along a first direction, and each of the plurality of limiting grooves E3312 may be arranged along a second direction perpendicular to the first direction, and opposite ends of each of the plurality of movable grooves E3311 are correspondingly communicated with the two limiting grooves E3312.

Referring to fig. 18 to 22, fig. 18 is a schematic partial perspective view of a pressing device, fig. 19 is a schematic partial enlarged view of fig. 18, fig. 20 is a front partial sectional view of the pressing device, fig. 21 is a schematic partial perspective view of another view of the pressing device, and fig. 22 is a schematic partial enlarged view of fig. 21. Each movable member E332 is disposed in a corresponding movable slot E3311. Each movable member E332 may have a pushing portion E3321 and two limiting portions E3322, two ends of the pushing portion E3321 extend to form two limiting portions E3322, and a step structure is formed at a connection position of the pushing portion E3321 and each limiting portion E3322. The height H1 of the pushing portion E3321 of each movable member E332 may be greater than the height H2 of each limiting portion E3322, and the position where the pushing portion E3321 is connected to each limiting portion E3322 is formed in a structure similar to an L shape. In the drawings of the present embodiment, the movable member E332 is shown as a sheet structure, but the shape of the movable member E332 is not limited to that shown in the drawings, and in different embodiments, each movable member E332 may be a thin line structure, for example. In addition, the material of each movable element E332 may be determined according to a predetermined high temperature and a predetermined low temperature, for example, metal or engineering plastic.

The pushing portion E3321 of each movable member E332 is disposed in the movable slot E3311, and a height H1 of the pushing portion E3321 of each movable member E332 in the longitudinal direction L is not greater than a depth D1 of each movable slot E3311, and each movable member E332 can be retracted in the corresponding movable slot E3311. When each movable member E332 is retracted in the corresponding movable groove E3311, the pushing surface E3323 of each movable member E332 may be flush with the contact surface E3314, or the pushing surface E3323 of each movable member E332 may be located in the movable groove E3311.

Each of the limiting members E333 is fixedly disposed in the limiting groove E3312, and each of the limiting members E333 is configured to limit a moving range of the moving member E332 relative to the contact structure E331. In practical applications, the depth D2 of each limiting groove E3312 in the longitudinal direction L is smaller than the depth D1 of each movable groove E3311 in the longitudinal direction L, the thickness T of each limiting member E333 is equal to or smaller than the depth D2 of each limiting groove E3312, and the shape of each limiting member E333 corresponds to the shape of each limiting groove E3312, and when each limiting member E333 is fixedly disposed in the limiting groove E3312, each limiting groove E3312 is filled with the limiting member E333. Each of the limiting members E333 may be made of any material with high heat conductivity and cold conductivity, but is not limited thereto. Each of the limiting members E333 may be, for example, engaged with a plurality of screws, and detachably fixed to the contact structure E331.

Specifically, each movable slot E3311 and each limiting slot E3312 connected thereto are mutually communicated in the longitudinal direction L; when the limiting member E333 is disposed in the limiting groove E3312, the limiting portion E3322 of the movable member E332 is blocked by the limiting member E333 and cannot leave the contact structure E331 through the limiting groove E3312, but the limiting portion E3322 of the movable member E332 can still move in the movable groove E3311. When the pushing surface E3323 of the movable member E332 faces the ground, the limiting portion E3322 of the movable member E332 is abutted against the limiting member E333 under the influence of gravity, and a portion of the pushing portion E3321 is correspondingly exposed out of the movable groove E3311, and a portion of the pushing portion E3321 protrudes out of the contact surface E3314.

Each spring receiving groove E3313 is formed by a bottom wall E3315 forming each movable groove E3311 being recessed in a direction away from the contact surface E3314, and each movable groove E3311 is in communication with at least two spring receiving grooves E3313, each spring receiving groove E3313 being configured to receive one elastic member E334. One end of each elastic element E334 is fixed to the contact structure E331, and the other end of each elastic element E334 is connected to the movable element E332.

In practical applications, when the movable member E332 is limited in the movable slot E3311 by the limiting member E333, each elastic member E334 may be in a pressed state, and the elastic restoring force generated by the pressing of each elastic member E334 will make the two limiting portions E3322 of the elastic member E334 more closely abut against the two limiting members E333, and a portion of the pushing portion E3321 of each elastic member E334 will protrude from the contact surface E3314 at any time, that is, the pushing surface E3323 protrudes from the contact surface E3314 at any time.

Referring to fig. 23 to 25, fig. 23 is a schematic cross-sectional side view of a chip testing apparatus, fig. 24 is a schematic cross-sectional view of a pressing device pressing one side of a plurality of chips of the chip testing apparatus, and fig. 25 is a schematic enlarged partial view of fig. 24. As shown in fig. 23, in the chip testing apparatus 1, when the chip testing apparatus is not pressed by the pressing device E33, a pressing surface 1114 of the first fixing member 111 is flush with the outer side surface 2111 of each electrical connection socket body 21, and a portion of the lifting structure 22 of each electrical connection socket 2 is higher than the pressing surface 1114. That is, when each chip C is disposed in the electrical connection base 2 and the chip testing device 1 is not pressed by the pressing device E33, a portion of the lifting structure 22 may be higher than the pressing surface 1114; the chip C disposed in the lifting structure 22 may be higher than the top surface 1114 or not higher than the top surface 1114, which is not limited herein.

As shown in fig. 24 and 25, when the environmental state control device E11 controls the lifting device E32 to operate, so that the contact surface E3314 of the pressing device E33 and the pushing surface E3323 of the movable member E332 simultaneously contact one side of the chips C carried by the chip testing device 1, the plurality of elastic members E334 are pressed again, and each elastic member E334 generates a larger elastic restoring force.

When the contact surface E3314 of the pressing device E33 and the pressing surface E3323 of the movable member E332 contact one side of the chips C carried by the chip testing device 1 at the same time, the environmental-state control device E11 can control the temperature adjusting device E35 to actuate so that the temperature of the contact structure E331 reaches a predetermined high temperature or a predetermined low temperature, and the environmental-state control device E11 controls the chip testing device 1 to perform a predetermined test procedure on the chips C carried by the chip testing device.

Referring to fig. 14 and 15, in practical application, the pressing device E33 may further include a frame E335 and an elastic annular seal E336. The frame E335 is disposed around the contact structure E331, and the contact surface E3314 of the contact structure E331 may be disposed flush with a ring pressing surface E3351 of the frame E335, and the ring pressing surface E3351 is correspondingly provided with an elastic annular seal E336. In a different embodiment, the contact surface E3314 may also be higher than the ring pressing surface E3351, but the contact surface E3314 is not lower than the ring pressing surface E3351. The elastic annular sealing member E336 is disposed on the ring pressing surface E3351, and the elastic annular sealing member E336 is disposed correspondingly around the contact structure E331. The elastic ring seal E336 may be made of a material that can be restored to its original shape by being pressed by rubber or the like according to the requirement. The cross-sectional shape of the elastic ring seal E336 may be, for example, circular, elliptical, trapezoid, etc., and is not limited thereto.

As shown in fig. 23 to 25, when the contact structure E331 presses against one side of the chips C carried by the chip testing device 1, a portion of the contact structure E331 is simultaneously pressed against the pressing surface 1114 of the first fixing member 111, and the elastic annular seal E336 is correspondingly pressed against the pressing surface 1114 of the first fixing member 111, and the contact structure E331, the first fixing member 111, the pressing structure 113 and the circuit board 10 together form a closed space SP, and the plurality of electrical connection pads 2 are correspondingly located in the closed space SP.

When the contact structure E331 presses against one side of the chips C carried by the chip testing device 1 and the electrical connection bases 2 are correspondingly located in the enclosed space SP, the central control device E1 can control the air extraction device E34 to draw air in the enclosed space SP outwards, so that the enclosed space SP is in a state similar to vacuum, and during the air extraction process of the air extraction device E34, the chip testing device 1 and the pressing device E33 are pressed against each other more tightly under the action of negative pressure.

As shown in fig. 14 and 15, in practical application, an air extraction gap G may be formed between the contact structure E331 and the frame E335, the air extraction gap G may be disposed around the contact structure E331, and the frame E335 may be formed with a plurality of air extraction holes E3352, the air extraction holes E3352 are connected with the air extraction gap G (for example, the frame E335 has a corresponding channel therein), and the air extraction holes E3352 are used for being connected with the air extraction device E34. In the present embodiment, the air extraction gap G is disposed around the contact structure E331, but the specific location and shape of the air extraction gap G are not limited to this, so long as the enclosed space SP can be communicated with the air extraction device E34 through the air extraction gap G and the air extraction hole E3352. In addition, the number, shape and arrangement positions of the air exhaust holes E3352 can be changed according to requirements.

It should be noted that, in practical application, after the chip testing device 1 is disposed in one of the accommodating chambers E311, the central control device E1 may control the lifting device E32 to move a predetermined distance so that the chip testing device 1 moves to a position contacting the pressing device E33, i.e. the elastic annular sealing member E336 contacts the pressing surface 1114 of the chip testing device 1; then, the central control device E1 can control the air extractor E34 and the lifting device E32 to act together, so that the enclosed space SP gradually assumes a state similar to vacuum, and thus, the contact structure E331 will press against the lifting structure 22 of each electrical connection seat 2, and each lifting structure 22 is retracted into the corresponding electrical connection seat 2.

In practical applications, the central control device E1 controls the air extractor E34, and the time point of extracting the air in the enclosed space SP can be designed according to the requirement. For example, the central control device E1 may determine whether the chip testing device 1 is already disposed at a predetermined position in the accommodating chamber E311 by at least one sensor (for example, an optical sensor or a mechanical pressing sensor) disposed in the accommodating chamber E311 (as shown in fig. 17), and when the central control device E1 determines that the chip testing device 1 is disposed at the predetermined position in the accommodating chamber E311 by the sensor, the air extracting device E34 is controlled to extract air in the enclosed space SP.

As shown in fig. 15, 23 and 24, by the design that the outer side surface 2111 of each electrical connection seat 2 is flush with the supporting surface 1114, the contact surface E3314 of the contact structure E331 is flush with the annular pressing surface E3351 (or the contact surface E3314 is not lower than the annular pressing surface E3351), the elastic annular sealing member E336 is disposed on the annular pressing surface E3351, and the like, the acting force required by the lifting device E32 to push against the chip testing device 1 can be greatly reduced by cooperating with the action of the air extracting device E34. More specifically, the lifting device E32 is to make the chip testing device 1 approach to the contact structure E331 of the pressing device E33, so that the contact structure E331 contacts the chips C on the plurality of electrical connection seats 2 simultaneously. As described above, when the contact structure E331 contacts the chips C on the plurality of electrical connection seats 2 at the same time, the lifting device E32 must resist the elastic restoring force generated by the pressing of the elastic components 24 of each electrical connection seat 2 and the elastic restoring force generated by the pressing of each probe component 20 of each electrical connection seat 2 at the same time; therefore, the air in the enclosed space SP is pumped out by the air pumping device E34, so that the enclosed space SP is in a negative pressure state, and the force required by the lifting device E32 when pushing against the chip testing device 1 can be greatly reduced.

In particular, according to the above description of the chip testing apparatus 1, since only the circuit board locking hole 103 is provided through the circuit board 10 of the chip testing apparatus 1, the sealing property of the enclosed space SP will be easily controlled when the pressing device E33 abuts against the first fixing member 111, and the air extracting device E34 will be relatively easy to reach the state of near vacuum in the process of extracting the air in the enclosed space SP. That is, in the chip testing apparatus 1 of the present invention, the number of through holes of the circuit board 10 is greatly reduced by the design of the first fixing member 111, the second fixing member 112, etc., so that the enclosed space SP is relatively easy to reach a vacuum state when the air extractor E34 extracts the enclosed space SP.

Fig. 26 is a schematic cross-sectional side view showing the pressing device and the chip testing device separated from each other. When the chip testing apparatus 1 completes a predetermined testing procedure on the chip C carried by the chip testing apparatus 1, and the environmental state control device E11 controls the lifting device E32 to actuate, so that the chip testing apparatus 1 moves away from the pressing device E33, the elastic restoring force generated by the pressing of the elastic members E334 causes the movable member E332 to move in the movable slot E3311, and the pressing surface E3323 of the movable member E332 is changed from a state of being flush with the contact surface E3314 or a state of being located in the movable slot E3311 into a state of protruding from the contact surface E3314, and the chip C originally pressed against the contact surface E3314 and the pressing surface E3323 is pushed by the movable member E332 and is no longer in contact with the contact surface E3314. Therefore, by the arrangement of the movable member E332, the problem that each chip C is stuck to the contact surface E3314 of the contact structure E331 is not easy to occur during the process of separating the chip testing apparatus 1 and the pressing apparatus E33 from each other.

In the embodiment of the pressing device E33 without the plurality of elastic members E334, only the movable member E332 of the pressing device E33 needs to be disposed towards the ground, and during the process of separating the pressing device E33 from the chip testing device 1, each movable member E332 still can automatically protrude from the contact surface E3314 under the influence of gravity, and can push the chip C that is originally contacted with the contact surface E3314, so as to avoid the sticking problem of the chip C and the contact surface E3314.

As shown in fig. 3 and 16, in the drawings of the present embodiment, the pressing device E33 includes 24 movable members E332 and 8 limiting members E333, and each 4 movable members E332 is used for pressing against 12 chips C carried by the electrical connection base 2, that is, each movable member E332 is correspondingly pressed against 3 chips C, but in practical application, the number of the movable members E332 and the limiting members E333 included in the pressing device E33 is not limited to the number shown in the drawings. In addition, the number of chips C that each movable element E332 corresponds to is not limited to 3, and the number can be increased or decreased according to the requirement.

In practical applications, the contact area between each movable element E332 and each chip C is smaller than the area of the side surface C2 of the chip C opposite to the electrical connection base 2, for example, the contact area between each movable element E332 and each chip C may be within ten percent of the area of the side surface C2 of the chip C, preferably, the contact area between each movable element E332 and each chip C may be five percent of the area of the side surface C2 of the chip C. Whether the pressing device E33 is provided with a plurality of elastic members E334 may be determined according to the contact areas between each movable member E332 and the chip C.

Referring back to fig. 1 and 2, the transferring apparatus E4 is disposed between the plurality of environmental control apparatuses E3, and the transferring apparatus E4 is used for carrying the chip testing device 1. The transferring apparatus E4 may include a robot arm and a holding component for holding the chip testing device 1. The central control device E1 is connected to the transfer equipment E4, and the central control device E1 can control the transfer equipment E4 to set the chip testing device 1 carrying a plurality of chips C in any accommodating chamber E311 (as shown in fig. 17) of any environmental control equipment E3. In contrast, the transferring apparatus E4 may also be controlled by the central control device E1 to move the chip testing device 1 disposed in any one of the accommodating chambers E311 out of the accommodating chamber E311.

The sorting device E5 is connected to the central control device E1, and the sorting device E5 can be controlled by the central control device E1 to detach the chips C from the electrical connection bases 2 of the chip testing device 1, and the sorting device E5 can place the chips C on the carrier tray of the good product area A1 or the carrier tray of the defective product area A2 according to the test result after the chips C pass through the predetermined test program. The sorting device E5 may for example be a robotic arm. In the embodiment in which the sorting device E5 and the chip mounting device E2 are disposed at adjacent positions, the chip mounting device E2 and the sorting device E5 may share the same robot arm. In practical applications, the good area A1 may be divided into a plurality of areas according to the requirements, and the classification device E5 may set the chips C in different areas of the good area A1 according to the test results of the chips C after passing through the predetermined test procedure, for example, the classification device may be used to distinguish the chips C according to the operation performance of the chips C.

In summary, the environmental control apparatus and the chip testing system including the environmental control apparatus of the present invention are designed such that the pressing device is formed with a plurality of movable slots, and a plurality of movable members are disposed in the plurality of movable slots, so that when the pressing device is separated from a plurality of chips disposed on the chip testing device, the plurality of chips can be pressed against a portion of the plurality of movable members protruding from the contact surface of the contact structure, thereby greatly improving the adhesion problem between the plurality of chips and the pressing device, and even solving the adhesion problem accordingly.

The foregoing disclosure is only illustrative of the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, as all changes which come within the meaning and range of equivalency of the description and drawings are therefore intended to be embraced therein.

Claims

1. An environmental control apparatus, characterized in that the environmental control apparatus comprises:

an environmental state control device;

the device body comprises at least one accommodating chamber, wherein the accommodating chamber is used for accommodating a chip testing device, the chip testing device is used for bearing a plurality of chips, the environment state control device can be electrically connected with the chip testing device arranged in the accommodating chamber, and the environment state control device can carry out a detection operation on the plurality of chips borne by the device through the chip testing device;

A pressing device, it sets up in the accommodation room, pressing device includes:

a contact structure having a plurality of movable grooves, each of the movable grooves being formed by a contact surface of the contact structure being concave in a longitudinal direction;

the movable pieces are correspondingly arranged in one movable groove; one side of each movable piece opposite to the movable groove is provided with a pushing surface; each movable piece can move in the corresponding movable groove along the longitudinal direction, and the pushing surface can protrude out of the contact surface in the process of moving the movable piece in the movable groove;

the limiting pieces are fixedly arranged on the contact structure and are adjacent to the movable grooves, and the limiting pieces and the contact structure can jointly limit the movable ranges of the movable pieces in the corresponding movable grooves;

when the chip testing device is arranged in the accommodating chamber, the pressing device is correspondingly positioned above a plurality of chips borne by the chip testing device;

the environment state control device can enable the chip testing device arranged in the accommodating chamber and the pressing device arranged in the accommodating chamber to move close to each other, and enable the pressing surfaces and the contact surfaces of the movable pieces to be pressed against one side surface of the chips;

The environment state control device can enable the chip testing device arranged in the accommodating chamber and the pressing device arranged in the accommodating chamber to move away from each other in a state that the pushing surfaces of the movable pieces and the contact surfaces are together abutted against the side surfaces of the chips, and the movable pieces correspondingly protrude out of the contact surfaces and push against the chips originally contacted with the contact surfaces;

the pressing device further comprises a plurality of elastic pieces, the elastic pieces are arranged in the movable grooves, one end of each elastic piece is fixed on the contact structure, and one side of each movable piece located in each movable groove is connected with at least one elastic piece located in the movable groove; when the pushing surface of each movable piece does not abut against the chip, at least one elastic piece in each movable groove is in a pressed state, and each elastic piece enables a part of the movable piece connected with the elastic piece to protrude out of the contact surface.

2. The environmental control apparatus of claim 1 wherein the height of each of said movable members in said longitudinal direction is no greater than the depth of each of said movable slots, and each of said movable members is retractable into a corresponding one of said movable slots; when each movable piece is retracted in the corresponding movable groove, the pushing surface of each movable piece can be flush with the contact surface.

3. The environmental control apparatus of claim 1 wherein said contact structure further comprises a plurality of spring receiving pockets, each of said spring receiving pockets being formed by a bottom wall defining each of said movable pockets recessed away from said contact surface, each of said movable pockets being in communication with at least two of said spring receiving pockets, each of said spring receiving pockets being configured to receive one of said resilient members.

4. The environmental control apparatus according to claim 1, wherein a plurality of the movable grooves are formed in the contact structure side by side with each other, the contact structure further comprising a plurality of stopper grooves each formed by the contact surface being recessed in the longitudinal direction, both ends of each of the movable grooves being respectively communicated with two of the stopper grooves, and a depth of each of the stopper grooves being smaller than a depth of each of the movable grooves.

5. The environmental control apparatus according to claim 4, wherein each of the movable members has a pushing portion and two limiting portions, and the pushing portion is disposed in the movable slot; when the pressing device faces the chip testing device arranged in the accommodating chamber, the two limiting parts of each movable part respectively abut against the two limiting parts, and a part of the pushing part correspondingly protrudes out of the contact surface.

6. The environmental control apparatus of claim 1, further comprising a temperature adjustment device, wherein the temperature adjustment device is connected to the pressing device, and wherein the temperature adjustment device is electrically connected to the environmental state control device, and wherein the environmental state control device is capable of controlling the temperature adjustment device to actuate so that the temperature of the contact surface of the contact structure reaches a predetermined high temperature or a predetermined low temperature.

7. The environmental control apparatus of claim 6 wherein the pressing means further comprises:

the frame body is arranged around the contact structure and is provided with a ring pressing surface, and the ring pressing surface is flush with the contact surface or is higher than the ring pressing surface;

an elastic annular seal member disposed on the annular pressing surface; when the contact surface is contacted with one side surface of a plurality of chips carried by the chip testing device, the elastic annular sealing element correspondingly presses the chip testing device, and a closed space is correspondingly formed between the contact structure and the chip testing device;

The environment control equipment is also connected with an air extracting device, and the environment state control device can control the air extracting device to extract the air in the closed space outwards.

8. The environmental control apparatus of claim 7 wherein at least one bleed gap is formed between the frame and the contact structure, the frame having at least one bleed hole, the bleed hole being in communication with the bleed gap, and the bleed device being capable of bleeding air from the enclosed space outwardly through the bleed hole and the bleed gap.

9. The environmental control apparatus of claim 7, wherein the chip testing device comprises at least one first power supply member, wherein at least one second power supply member is disposed in the accommodating chamber, and wherein the apparatus body is connected with a power supply apparatus; when the chip testing device is arranged in the accommodating chamber, the power supply equipment can supply power to the chip testing device through the first power supply component and the second power supply component; when the chip testing device is arranged in the accommodating chamber, the contact structure is abutted against the side surfaces of the chips borne by the chip testing device, the chip testing device is powered, the contact structure reaches the preset high temperature or the preset low temperature, and air in the closed space is pumped out by the air pumping device, and the environment state control device can control the chip testing device to conduct a preset test program on the chips borne by the chip testing device.

10. The environmental control apparatus of claim 1, further comprising at least one lifting device disposed in the housing chamber, the lifting device being coupled to the environmental condition control device; the environment state control device can control the lifting device to act so that the chip testing device arranged in the accommodating chamber approaches to or departs from the pressing device in the accommodating chamber.

11. A chip testing system, the chip testing system comprising:

a chip testing device for carrying a plurality of chips;

a central control device, which comprises at least one environmental state control device; and

at least one environmental control apparatus comprising:

the device comprises an equipment body and a control device, wherein the equipment body comprises at least one accommodating chamber, the accommodating chamber is used for accommodating a chip testing device, the chip testing device is used for bearing a plurality of chips, the environment state control device can be electrically connected with the chips arranged in the accommodating chamber, and the environment state control device can carry out detection operation on the chips borne by the environment state control device through the chip testing device;

the chip testing device is arranged in the accommodating chamber, and when the pushing surface and the contact surface of the movable piece are propped against one side surface of the chips together, the central control device can control the chip testing device to perform a preset testing program on the chips;

12. The chip testing system according to claim 11, wherein a height of each movable member in the longitudinal direction is not greater than a depth of each movable slot, and each movable member is retractable into the corresponding movable slot; when each movable piece is retracted in the corresponding movable groove, the pushing surface of each movable piece can be flush with the contact surface.

13. The chip testing system of claim 11, wherein the contact structure further comprises a plurality of spring receiving slots, each spring receiving slot being formed by a bottom wall forming each movable slot being recessed away from the contact surface, each movable slot being in communication with at least two of the spring receiving slots, each spring receiving slot being configured to receive one of the resilient members.

14. The chip testing system of claim 11, wherein a plurality of said movable slots are formed in said contact structure side by side with each other, said contact structure further comprising a plurality of limiting slots, each of said limiting slots being formed by said contact surface being recessed in said longitudinal direction, both ends of each of said movable slots being respectively in communication with two of said limiting slots, and a depth of each of said limiting slots being less than a depth of each of said movable slots.

15. The chip testing system according to claim 14, wherein each movable member has a pushing portion and two limiting portions, and the pushing portion is disposed in the movable slot; when the pressing device faces the chip testing device arranged in the accommodating chamber, the two limiting parts of each movable part respectively abut against the two limiting parts, and a part of the pushing part correspondingly protrudes out of the contact surface.

16. The chip testing system of claim 11, wherein the environmental control apparatus further comprises a temperature adjusting device, the temperature adjusting device is connected to the pressing device, the temperature adjusting device is electrically connected to the environmental state control device, and the environmental state control device can control the temperature adjusting device to actuate so that the temperature of the contact surface of the contact structure reaches a predetermined high temperature or a predetermined low temperature.

17. The chip testing system of claim 16, wherein the pressing device further comprises:

18. The chip testing system of claim 17, wherein at least one air extraction gap is formed between the frame and the contact structure, the frame has at least one air extraction hole, the air extraction hole is in communication with the air extraction gap, and the air extraction device can extract air in the enclosed space outwards through the air extraction hole and the air extraction gap.

19. The chip testing system according to claim 17, wherein the chip testing apparatus comprises at least a first power supply member, at least a second power supply member is disposed in the accommodating chamber, and the apparatus body is connected to a power supply apparatus; when the chip testing device is arranged in the accommodating chamber, the power supply equipment can supply power to the chip testing device through the first power supply component and the second power supply component; when the chip testing device is arranged in the accommodating chamber, the contact structure is abutted against the side surfaces of the chips borne by the chip testing device, the chip testing device is powered, the contact structure reaches the preset high temperature or the preset low temperature, and air in the closed space is pumped out by the air pumping device, and the environment state control device can control the chip testing device to conduct the preset test procedure on the chips borne by the chip testing device.

20. The chip testing system according to claim 11, wherein the environmental control apparatus further comprises at least one lifting device, the lifting device being disposed in the housing chamber, the lifting device being connected to the environmental state control device; the environment state control device can control the lifting device to act so that the chip testing device arranged in the accommodating chamber approaches to or departs from the pressing device in the accommodating chamber.

21. The chip testing system according to claim 17, wherein the chip testing device comprises:

at least one circuit board, two opposite sides of which are respectively defined as a first side surface and a second side surface;

the fixing assembly comprises a first fixing member, a second fixing member and a plurality of pressing structures, wherein the first fixing member is arranged on the first side surface, and the second fixing member is fixedly arranged on the second side surface;

a plurality of electric connection seats, it set up in first side, each electric connection seat contains:

the electric connection seat body is provided with a top wall and a ring side wall, the top wall is provided with an opening, one end of the ring side wall is connected with the periphery of the top wall, the other end of the ring side wall is propped against the circuit board, and a containing groove is formed among the top wall, the ring side wall and the circuit board; the two opposite side surfaces of the top wall are defined as an outer side surface and an inner side surface, and the inner side surface is positioned in the accommodating groove; the side of the top wall opposite to the circuit board is defined as an outer side surface, and the outer side surface is flush with an abutting top surface of the first fixing member opposite to the circuit board;

The supporting structure is propped against the circuit board and is positioned in the accommodating groove;

the lifting structure is arranged in the accommodating groove and is provided with a base part and a bearing part, the base part is positioned in the accommodating groove, the base part extends to one side to form the bearing part, and at least one part of the bearing part is positioned in the opening; the bearing part extends to one side far away from the base part to form a plurality of limiting parts, at least one part of the limiting parts penetrates out of the open hole, and the limiting parts and the bearing part jointly form a chip accommodating groove which is used for accommodating the chip; the lifting structure is also provided with a plurality of connecting holes, and the connecting holes penetrate through the base part and the bearing part;

the elastic components are arranged in the accommodating grooves, one end of each elastic component is fixed on the lifting structure, the other end of each elastic component is fixed on the supporting structure, the elastic restoring force generated by the compression of the elastic components enables the base to be propped against the inner side surface of the top wall, and a gap is formed between the lifting structure and the supporting structure;

The probe assemblies are fixedly arranged on the supporting structure at one end, the other ends of the probe assemblies are propped against the electric contact structure of the circuit board, and the other ends of the probe assemblies penetrate through the connecting holes;

when the first fixing member is fixed on the first side surface of the circuit board, the plurality of pressing structures correspondingly press against a part of the electric connection seat bodies of the plurality of electric connection seats;

when the chip accommodating groove is provided with the chip and the limiting part is not pressed by the contact structure, the probe assemblies in the plurality of connecting holes are not connected with the plurality of electric connecting parts of the chip, and a part of the lifting structure protrudes out of the outer side surface of the top wall;

when the chip accommodating groove is provided with the chip, the limiting part is pressed by the contact structure to shrink inwards towards the electric connection seat body, and the elastic annular sealing element and the propped top surface of the first fixing member are mutually pressed, a plurality of probe assemblies are connected with a plurality of contact parts of the chip;

The control unit is arranged on the second side face of the circuit board and comprises a plurality of test modules, and each test module is connected with a part of the electric connecting seat.