CN111190090B - Connecting structure for module power-on test and corresponding adapter - Google Patents

Abstract

The application provides a connection structure for module circular telegram test, it includes: a circuit board; a sheet-like conductive member having a first surface and a second surface opposite to the first surface, the second surface being attached to a surface of the wiring board, the sheet-like conductive member being conductive in a normal direction of the first surface and non-conductive in a direction parallel to the first surface; the carrier is suitable for carrying a module to be subjected to a power-on test, the module to be subjected to the power-on test comprises a connector, and the carrier comprises a limiting structure which is suitable for accommodating the connector and limiting the connector to move in a direction parallel to the first surface; and a fastener for pressing the connector against the first surface. The application also provides a corresponding adaptor for the module power-on test.

Description

Connecting structure for module power-on test and corresponding adapter

Technical Field

The invention relates to a module power-on test of a production line body.

Background

Along with the development of terminals such as mobile phones and computers, users have a great deal of improvement on various requirements, and particularly along with the development of mobile phones, the pursuit of users on shooting quality enables manufacturers to develop personalized and customized camera modules, such as large apertures, large wide angles, lenses for solving the problem of a large number of lenses caused by aberration, and the like. This drives the optical design to become more complex, and the complex optical systems are sensitive, which poses significant challenges to manufacturing yield and product quality.

On the other hand, to ensure the product quality, the camera module usually needs to pass a series of tests (sometimes called group tests) before shipping. In the camera module group testing stage, a plurality of performance tests and burning of the camera module are required to ensure the normal use of the camera module when the camera module is installed on the mobile equipment terminal. Due to the huge market demand, the camera module (especially the mobile phone camera module) often needs to reach the production scale of tens of millions or even hundreds of millions in a short time. In order to solve the problem of low testing efficiency of a single module, the applicant provides an imposition testing scheme. In the module production test process, the camera module is connected by the intermediary adapter, an array formed by a plurality of camera modules is fixed on the jointed board, and the jointed board is electrically connected with the test equipment to simultaneously complete the test of the plurality of camera modules, so that the production efficiency is greatly improved.

However, after many cycles of the intermediate adapter, the connector may be damaged, which is often not visually identifiable. In the assembly and measurement stage, the damaged intermediary adapter can cause module opening failure (namely, the photosensitive chip of the camera module cannot normally display an imaging result after being electrified), and the production efficiency is influenced. Specifically, the interposer fabric includes an interface for connecting to the module connector and a connection port for connecting to a probe of the test equipment. In order to realize good connection, the interface of the intermediate adapter and the module connector is plugged by a male connector and a female connector which are matched with the module connector. After the intermediate adapter is subjected to multiple circulation, the connector (referring to the connector of the intermediate adapter) may be damaged due to frequent plugging, but the damage cannot be identified by naked eyes, so that the module opening failure is caused, and the production efficiency is affected. Therefore, a solution for module power-on test, which can improve the service life, the through rate of products in a production line and the production efficiency, is urgently needed.

Disclosure of Invention

The present invention aims to provide a solution that overcomes at least one of the drawbacks of the prior art.

According to an aspect of the present invention, there is provided a connection structure for a module power-on test, including: a circuit board; a sheet-like conductive member having a first surface and a second surface opposite to the first surface, the second surface being attached to a surface of the wiring board, the sheet-like conductive member being conductive in a normal direction of the first surface and non-conductive in a direction parallel to the first surface; the carrier is suitable for carrying a module to be subjected to a power-on test, the module to be subjected to the power-on test comprises a connector, and the carrier comprises a limiting structure which is suitable for accommodating the connector and limiting the connector to move in a direction parallel to the first surface; and a fastener for pressing the connector against the first surface.

Wherein the connector comprises a connector array pin array.

Wherein the circuit board includes a contact array in contact with the second surface, each contact location of the contact array being adapted to a location of a respective pin of the connector pin array received in the limiting structure.

Wherein the connector comprises an array of connector pins, the sheet-like conductive element comprising an insulating medium and an array of conductive pins distributed in the insulating medium; and each pin of the connector pin array may cover a plurality of conductive pins of the conductive pin array when the connector is pressed against the first surface.

The sheet-shaped conductive element is conductive cloth, and the conductive cloth comprises silica gel and a conductive pin array distributed in the silica gel.

Wherein, the conductive pin is columnar.

Wherein, the conductive pin is made of metal.

Wherein the axis of the conductive pin and the first surface form an included angle of 0-90 degrees.

Wherein the axis of the conductive pin and the first surface form an included angle of 45-75 degrees.

The circuit board further comprises a switching electrode array and a routing wire for conducting the contact array to the switching electrode array.

The switching electrode array comprises a plurality of switching electrodes, and the size of each switching electrode is larger than that of each contact.

And the distance between the transfer electrodes of the transfer electrode array is larger than the distance between the contacts of the contact array.

Wherein the module to be subjected to the power-on test is an optical device module.

The module to be tested is a camera module or a projection module.

The module to be subjected to the power-on test comprises a module main body and a connector connected with the module main body through a flexible connecting belt, wherein the connector is provided with the connector pin array.

Wherein, the connector is a female plug connector or a male plug connector.

Wherein, the limit structure is a limit hole.

Wherein the fastener includes: the pressing plate is suitable for tightly pressing the module to be subjected to the power-on test between the pressing plate and the carrier; and the buckle is suitable for fixing the pressure plate in a compression state.

One end of the pressing plate is connected with the carrier pivot, and the other end of the pressing plate is connected with the buckle.

One end of the buckle is connected with the pressing plate through a pivot, and the other end of the buckle is suitable for being buckled with the carrier.

Wherein, the carrier includes: the carrier base is suitable for bearing the module to be subjected to the power-on test and is provided with a through hole for accommodating the connector; and the needle seat is matched with the through hole and is provided with the limiting structure.

The pressing plate is provided with a light through hole matched with the module to be subjected to the power-on test.

The circuit board is provided with an avoiding structure for avoiding a light path, and the light path is used for conducting power-on test on the module.

The connecting structure is located on the adapter, wherein the adapter is used for connecting the module to be subjected to the power-on test to the test equipment in an adapter mode.

Wherein the connection structure is located at the test equipment.

According to another aspect of the present application, there is also provided an adaptor for power-on testing of a module, comprising: a patch panel; a sheet-like conductive member having a first surface and a second surface opposite to the first surface, the second surface being attached to a surface of the interposer board, the sheet-like conductive member being conductive in a direction normal to the first surface and non-conductive in a direction parallel to the first surface; a carrier adapted to carry a module to be power-on tested, the module to be power-on tested including a connector, the carrier including a limiting structure adapted to receive the array of connector pins and limit movement of the connector in a direction parallel to the first surface; and a fastener for pressing the connector against the first surface.

The connector comprises a connector pin array, and the adapter circuit board comprises a contact array in contact with the second surface, an adapter electrode array and a wiring for conducting the contact array to the adapter electrode array.

The positions of all the contacts of the contact array are matched with the positions of all the pins of the connector pin array accommodated in the limiting structure, the size of the switching electrodes is larger than that of the contacts, and the distance between the switching electrodes of the switching electrode array is larger than that between the contacts of the contact array.

Wherein the connector comprises an array of connector pins, the sheet-like conductive element comprising an insulating medium and an array of conductive pins distributed in the insulating medium; and each pin of the connector pin array may cover a plurality of conductive pins of the conductive pin array when the connector is pressed against the first surface.

Wherein, the flaky conductive element is conductive cloth.

The conductive cloth comprises silica gel and a conductive needle array distributed in the silica gel.

Wherein, the conductive pin is columnar.

Wherein, the conductive needle is made of metal.

Wherein the axis of the conductive pin and the first surface form an included angle of 0-90 degrees.

Wherein the axis of the conductive pin forms an included angle of 45-75 degrees with the first surface.

Wherein the module to be subjected to the power-on test is an optical device module.

The module to be subjected to the power-on test is a camera module or a projection module.

The module to be tested comprises a module main body and a connector connected with the module main body through a flexible connecting belt, wherein the connector is provided with the connector pin array.

Wherein, the connector is a female plug connector or a male plug connector.

Wherein, the limit structure is a limit hole.

Wherein the fastener comprises: the pressing plate is suitable for tightly pressing the module to be subjected to the power-on test between the pressing plate and the carrier; and the buckle is suitable for fixing the pressure plate in a compression state.

One end of the pressing plate is connected with the carrier pivot, and the other end of the pressing plate is connected with the buckle.

One end of the buckle is connected with the pressing plate through a pivot, and the other end of the buckle is suitable for being buckled with the carrier.

Wherein, the carrier includes: the carrier base is suitable for bearing the module to be subjected to the power-on test and is provided with a through hole for accommodating the connector; and the needle seat is matched with the through hole and is provided with the limiting structure.

The pressing plate is provided with a light through hole matched with the module to be subjected to the power-on test.

The circuit board is provided with an avoiding structure used for avoiding a light path, and the light path is used for carrying out power-on test on the module.

Compared with the prior art, the application has at least one of the following technical effects:

1. this application can replace the connection of original public female connector through outside structure buckle to reduce the damage that the module connector arouses because the plug was surveyed at the group.

2. This application can replace the mode that original connector is connected through electrically conductive cloth, reduces the connector because of the wearing and tearing that the cutting ferrule process produced and because of the problem that the exogenic action leads to the connector deformation, improves the life of intermediary's adaptor.

3. In the present application, the conductive cloth (or other sheet-like conductive elements) can tolerate uneven stress during the installation process with the module connector while still achieving good connection, without being affected.

4. In this application, according to actual verification, the contact is good at the product circulation in-process by electrically conductive cloth as the intermediary adaptor of connector, and the circulation number of times is higher than original connector mode far away, improves automated production's product through rate to improve production efficiency.

Drawings

Exemplary embodiments are illustrated in referenced figures of the drawings. The embodiments and figures disclosed herein are to be regarded as illustrative rather than restrictive.

Fig. 1 is a perspective exploded view of an adaptor for power-on testing of a module according to an embodiment of the present invention;

fig. 2 is a schematic perspective exploded view of an adapter with an avoidance structure for a circuit board according to an embodiment of the present application;

FIG. 3 is a schematic view of the adapter of FIG. 2 shown assembled and snapped together;

FIG. 4 is a partially enlarged schematic view illustrating the positional relationship between the needle holder and the conductive cloth according to an embodiment of the present application;

FIG. 5 is an enlarged view of a portion of the conductive fabric according to an embodiment of the present application;

fig. 6 shows a schematic view of a module connector according to an embodiment of the present application.

Detailed Description

For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that the detailed description is merely illustrative of exemplary embodiments of the present application and does not limit the scope of the present application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.

It should be noted that the expressions first, second, etc. in this specification are used only to distinguish one feature from another feature, and do not indicate any limitation on the features. Thus, a first body discussed below may also be referred to as a second body without departing from the teachings of the present application.

In the drawings, the thickness, size, and shape of an object have been slightly exaggerated for convenience of explanation. The figures are purely diagrammatic and not drawn to scale.

It will be further understood that the terms "comprises," "comprising," "includes," "including," "has," "including," and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Moreover, when a statement such as "at least one of" appears after a list of listed features, the entirety of the listed features is modified rather than modifying individual elements in the list. Furthermore, when describing embodiments of the present application, the use of "may" mean "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to an example or illustration.

As used herein, the terms "substantially," "about," and the like are used as terms of table approximation and not as terms of table degree, and are intended to account for inherent deviations in measured or calculated values that will be recognized by those of ordinary skill in the art.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Fig. 1 is a perspective exploded view of an adaptor for a power-on test of a module according to an embodiment of the present invention. The adapter may also be referred to herein as an intermediate adapter. Referring to fig. 1, the adaptor includes a connection structure 100 comprising: circuit board 10, conductive cloth 20, carrier 30 and fastener 40. The conductive cloth 20 has a first surface 21 and a second surface 22 opposite to the first surface 21, the second surface 22 is attached to the surface of the circuit board 10, the conductive cloth is conductive in the normal direction of the first surface 21 (i.e. conductive in the direction from the first surface 21 to the second surface 22), and is non-conductive in the direction parallel to the first surface 21. For example, when the circuit board and the conductive cloth are both horizontally placed, the conductive cloth is conductive in the vertical direction, and the conductive cloth is non-conductive in the horizontal direction. The carrier 30 is adapted to carry a module to be subjected to a power-on test (e.g., a camera module), which includes an array of connector pins. The connector is used for electrically connecting the module with the circuit of other equipment. The connector may be independent of the module main body, for example, the connector may be electrically connected to the module main body through a flexible connection tape. The connector has a pin array of connectors for simultaneously inputting and outputting multiple signals (or data). For example, camera modules typically require a large number of pins to output image data, and thus connector pin arrays tend to be dense. And the internal space of the terminal device (e.g., a mobile phone) is very compact, the connector tends to be small in size, and accordingly, the pins are thin. The connector will be further described with reference to the accompanying drawings, and therefore, the details of the connector will not be described herein. In this embodiment, the carrier 30 includes a retaining structure 34, and the retaining structure 34 is adapted to receive the connector pin array and limit movement of the connector pin array in a direction parallel to the first surface 21. The spacing structure 34 may limit the horizontal movement of the connector pin array, e.g., when the circuit board and the conductive cloth are both horizontally disposed, i.e., the spacing structure 34 may prevent the connector pin array from moving in the horizontal direction. A fastener 40 is used to press the pin array against the first surface 21. The wiring board 10 may include an array of contacts in contact with the second surface 22, the respective contact locations of the array of contacts being adapted to the locations of the respective pins of the array of connector pins received in the retaining structure 34. The module to be subjected to the power-on test can be an optical device module, such as a camera module or a projection module. The projection module may be, for example, a structured light projection module. The camera shooting module can be a single camera shooting module or a double camera shooting module. The optical device module can also be a structured light module consisting of a camera module and a projection module or other modules capable of three-dimensional imaging. Each of the above modules has a connector for plugging with a circuit board (e.g., a motherboard) of another device, component or module to electrically connect with the circuit board (e.g., the motherboard) of the other device, component or module.

Note that, in the prior art, the conductive fabric may be, for example, a fiber fabric as a base material, which is subjected to a pre-treatment and then plated with a metal plating layer to have a metal characteristic, thereby forming a conductive fiber fabric. Since the conductive cloth has a good electromagnetic shielding effect, it is often used as an electromagnetic shielding protection cover.

In the above embodiment of the present application, the conductive cloth is used to replace the original connector of the adaptor, and the connection position between the connector of the camera module and the conductive cloth is located and limited by the external structure limitation, so that the conductive cloth and the connector of the module have good electrical connection effect. Meanwhile, in the embodiment of the application, the damage of the module connector caused by plugging and unplugging in the assembling and testing stage can be reduced; the adaptor of this embodiment can replace original connector connected mode through electrically conductive cloth, reduces the connector because of the wearing and tearing that the plug process produced and the problem of the connector deformation that leads to because of the exogenic action to improve the life of adaptor, reduced because of the opening failure that the adaptor damaged and lead to, and then improve automated production's product through rate, improve production efficiency.

Further, in one embodiment of the present application, the conductive cloth includes a silica gel and an array of conductive pins distributed in the silica gel. The conductive pin may be cylindrical. The conductive pin can be made of metal. The axis of the conductive pin can form an included angle of 0-90 degrees with the first surface. Preferably, the axis of the conductive pin may form an angle of 45-75 degrees with the first surface. The conductive cloth can realize that: conducting in the direction of the normal to the first surface and non-conducting in the direction parallel to the first surface. Moreover, the conductive cloth can still realize good connection without being influenced under uneven stress in the installation process of the module connector. According to actual verification, the conductive cloth is used as the adaptor of the connector to be well contacted in the product circulation process, and the circulation times are far higher than the connection mode of the plugging and unplugging of the original male and female connectors.

Further, still referring to fig. 1, in one embodiment of the present application, the circuit board 10 may include a contact array, a via electrode array, and a trace for conducting the contact array to the via electrode array. As previously described, the contact array is in contact with the second surface 22 of the conductive cloth 20, and the respective contact positions of the contact array are matched with the positions of the respective pins of the connector pin array received in the stopper structure 34. The patch electrode array may include a plurality of patch electrodes, and the size of the patch electrodes may be larger than the size of the contacts. The pitch between the via electrodes of the via electrode array may be greater than the pitch between the contacts of the contact array.

Further, in one embodiment of the present application, the module to be power-on tested may include a module main body and a connector connected with the module main body by a flexible connection tape, the connector having the connector pin array. The connector may be a female connector or a male connector. In other words, the connection structure using the conductive cloth in the present application is applicable to both the module having the female connector and the module having the male connector. The module to be subjected to the power-on test can be an optical device module, such as a camera module or a projection module. The projection module may be, for example, a structured light projection module. The camera shooting module can be a single camera shooting module or a double camera shooting module. The optical device module can also be a structured light module consisting of a camera module and a projection module or other modules capable of three-dimensional imaging. Each of the above modules has a connector for plugging with a circuit board (e.g., a motherboard) of another device, component or module to electrically connect with the circuit board (e.g., the motherboard) of the other device, component or module.

Further, in an embodiment of the present application, the position limiting structure 33 may be a position limiting hole. The fastener 40 includes: a pressure plate 41 and a catch 42. The carrier 30 includes a carrier base 31 and a wafer mount 32. The carrier base 31 is adapted to bear against the module to be tested electrically and the carrier base 31 has a through hole 33 for receiving the connector. The needle holder 32 is matched with the through hole 33 and has the limiting structure 34 (i.e., limiting hole). The pressing plate 41 is adapted to press the module to be subjected to the electrical test between the pressing plate 41 and the carrier 30 (e.g., between the pressing plate 41 and the carrier base 31), and the clip 42 is adapted to fix the pressing plate 41 in a pressed state. In one embodiment, one end of the pressure plate 41 is pivotally connected to the carrier 30 (e.g., pivotally connected to the carrier base 31), and the other end of the pressure plate 41 is connected to the latch 42. One end of the buckle 42 is pivotally connected to the pressing plate 41, and the other end of the buckle 42 is adapted to be buckled with the carrier 30 (for example, buckled with the carrier base 31).

Still referring to fig. 1, in one embodiment of the present application, the pressing plate 41 has a light passing hole 43 adapted to the module to be electrically tested, so that the testing light path of the camera module or the projection module is not blocked. This embodiment is suitable for the case where the module body and the connector face opposite directions. In this case, the module body is backed by the carrier base 31 (i.e., the module body is facing upward), and the connector is facing the conductive cloth 20 (i.e., the connector is facing downward).

Further, with reference to fig. 1, in one embodiment, the adaptor is structurally divided into an upper and a lower structure, the upper structure mainly comprising a snap 42 and a pressure plate 41. The lower structure mainly includes a carrier 30 (which includes a carrier base 31 and a pin base 32), a conductive cloth 20, and a circuit board 10 (such as but not limited to a PCB board), and the structures of the parts are matched with each other. In the upper structure, the latch 42 is connected to the pressure plate 41 via a pivot (e.g., a pin), and the latch 42 is used to tightly latch the pressure plate 41 to the carrier base 31. It should be noted that the buckle 42 and the pressing plate 41 can be cooperatively connected by other mechanical means, as long as the buckle 42 and the pressing plate 41 are easy to open and close. In fig. 1, the pressing plate 41 has a module light-passing hole 43 as a window for opening the camera module during the performance test. In the lower structure, the carrier base 31 is mechanically connected to the pressing plate 41 in a matching manner, and the carrier base 31 has a connector limiting structure 34 (a limiting hole in fig. 1) for limiting the position of the module connector when the module is placed in the intermediate adaptor. The conductive fabric 20 has densely distributed conductive pins, the angle of the pins may be 0-90 degrees (preferably 45-75 degrees), and the conductive fabric has the capability of conducting a circuit even if the conductive fabric is bent at a certain angle under a stress condition. One surface of the circuit board is communicated with the conductive cloth, the internal circuit is rearranged and amplified, and a large metal conductive point is formed on the other surface and is used for being connected with a test probe in the performance test process, so that the requirement on the precision of the probe is reduced. In this embodiment, the pin pad 32, the conductive cloth 20 and the PCB may form a circuit path of the probe of the module connector and the testing device.

Exemplarily, the work flow of the connection structure of the adaptor is as follows: opening the buckle 42 to make the pressing plate 41 and the carrier base 31 form a 90-degree angle; then the camera module (or other module to be tested) is placed in the carrier base 31, and the connector is placed at a position limiting position, wherein the pin array of the connector is placed in a limiting structure 34 (such as a limiting hole); and finally, the pressing plate 41 is pressed downwards, and the buckle 42 is buckled, so that the pin array of the connector is tightly contacted with the conductive cloth 20, and the contact array of the circuit board 10 is conducted through the conductive cloth 20.

Further, fig. 2 shows a schematic perspective exploded view of an adapter with an avoidance structure for a circuit board according to an embodiment of the present application. Referring to fig. 2, in another embodiment, the circuit board 10 of the interposer has an avoidance structure 19 for avoiding an optical path used for conducting a power-on test on the module. This embodiment is suitable for the case that the module main body and the connector are oriented in the same direction. In this case, the position of the module main body is adapted to the avoiding structure, and the module main body faces downward, and the connector faces the conductive cloth (i.e., the connector faces downward). For example, when the module is a camera module, the lens of the camera module faces downward, and the connector of the camera module faces downward. Further, fig. 3 is a schematic view illustrating a state where the adaptor shown in fig. 2 is assembled and fastened. As shown in fig. 3, the buckle 42 is buckled, so that the pressing plate 41 and the carrier base 31 are pressed against each other, and the pin array of the connector in the limiting structure 34 is tightly contacted with the conductive cloth (note that the conductive cloth is hidden in fig. 3, not shown), and then is conducted with the contact array of the circuit board 10 through the conductive cloth. Also, as shown in fig. 3, the position of the lens of the camera module may correspond to the escape structure 19 so as to arrange the optical path for the power-on test of the optical performance of the camera module.

Further, fig. 4 is a partially enlarged schematic view illustrating a positional relationship between the needle holder and the conductive cloth in one embodiment of the present application. In fig. 4, the header 32 has a retainer hole to accommodate the connector pin array. The conductive cloth 20 is positioned below the needle holder 32. The respective pins of the connector pin array disposed in the stopper holes may pass through the stopper holes to contact the conductive cloth 20.

Fig. 5 is an enlarged view illustrating a partial structure of the conductive cloth according to an embodiment of the present application. Referring to fig. 5, in the present embodiment, the conductive cloth 20 has a conductive pin array formed by uniformly distributed conductive pins 23. The conductive pin 23 may have a cylindrical shape. The conductive pin 23 may be made of metal, such as copper alloy, and the copper alloy may be further plated with gold. The axis of the conductive pin 23 may form an angle of 0-90 degrees with the first surface. Preferably, the axis of the conductive pin may form an angle of 45-75 degrees with the first surface. The cross-section of the conductive pins 23 is very small and each pin in the array of connector pins may correspond to a plurality of conductive pins. For example, each pin in the connector pin array may cover a plurality of conductive pins 23 of the conductive cloth 20. In the fastened state, as long as any pin of the connector of the module to be subjected to the electrical test is conducted with a part of the conductive pins, the conductive pins can transmit the current from the front surface (e.g., the first surface 21 shown in fig. 1) to the back surface (e.g., the second surface 22 shown in fig. 1) of the conductive cloth 20, and further electrically connect with the corresponding contact on the circuit board on the back surface of the conductive cloth 20. In theory, as for any pin of the connector of the module to be subjected to the power-on test, as long as one conductive pin corresponding to the pin is normal, the conduction can be realized. In contrast, in the conventional male-female connector plugging scheme, pins are plugged in a one-to-one manner, and failure of any pin can cause failure in opening the drawing. The design of this embodiment can therefore achieve better reliability. Meanwhile, as the gaps among the conductive pin arrays are filled with the insulating materials, longitudinal conduction and transverse conduction can be realized, namely, conduction is realized in the normal direction of the first surface, and conduction is not realized in the direction parallel to the first surface. It should be noted that in the present application, the conductive cloth may be replaced by other sheet-like conductive elements. The sheet-like conductive element has a first surface and a second surface opposite to the first surface, the second surface is attached to a surface of the wiring board, and the sheet-like conductive element is conductive in a normal direction of the first surface and non-conductive in a direction parallel to the first surface. In one embodiment, the sheet-like conductive element may include, for example, an insulating medium and an array of conductive pins distributed in the insulating medium; and each pin of the connector pin array may cover a plurality of conductive pins of the conductive pin array when the connector is pressed against the first surface.

Fig. 6 shows a schematic view of a module connector according to an embodiment of the present application. Referring to fig. 6, it can be seen that the connector 50 includes a pin array of a plurality of pins 51. The stitch 51 may be a wire and a plurality of stitches 51 may be sequentially arranged on a protruding dielectric keel 52. The insulation grid 52 may be mounted on a base 53. The insulation grid 52 may be in the form of a square box. Note that in fig. 6, the module connector is in an upward state, and when the connection is made, the module connector faces the conductive cloth (i.e., downward direction in fig. 1, 2, and 3).

In a variant embodiment, a connection structure similar to the above-described adapter may also be provided on the test equipment, so that the connector pin array of the module can be electrically connected to the test equipment directly through the connection structure, thereby completing the test. The embodiment is particularly suitable for non-spliced module production lines. In a non-splice type module production line, materials (or called line bodies) on the production line are single modules instead of splices formed by a plurality of modules. In this embodiment, the connection structure for the module power-on test is located in the test equipment. This connection structure includes: circuit board, electrically conductive cloth, carrier and fastener. The conductive cloth is provided with a first surface and a second surface opposite to the first surface, the second surface is attached to the surface of the circuit board, the conductive cloth is conductive in the normal direction of the first surface, and is not conductive in the direction parallel to the first surface. The carrier is adapted to carry a module (e.g., a camera module) to be subjected to a power-on test, the module including an array of connector pins, the carrier including a retaining structure adapted to receive the array of connector pins and limit movement of the array of connector pins in a direction parallel to the first surface. A fastener is used to press the pin array against the first surface. The wiring board may include an array of contacts in contact with the second surface, respective contact locations of the array of contacts being adapted to the location of respective pins of the array of connector pins received in the retaining structure. The module to be tested is an optical device module, such as a camera module or a projection module (e.g., a structured light projection module). In this embodiment, the circuit board of the testing device may be integrated with the circuit board of the connection structure. The test equipment can be directly conducted with the module through the contact array so as to carry out power-on test.

Further, in one embodiment, in the connection structure of the test equipment, the positions of the respective contacts of the contact array are matched with the positions of the respective pins of the connector pin array accommodated in the limiting structure, the size of the patch electrodes may be larger than that of the contacts, and the pitch between the patch electrodes of the patch electrode array may be larger than that between the contacts of the contact array. In this embodiment, the test equipment may be conducted with the module through the through electrode array, so as to perform the power-on test. For example, the test device may have a device probe array that is adapted to the patch electrode array, and the connection may be achieved by plugging the device probe array into the patch electrode array.

The following takes the camera module and the camera module testing apparatus as examples to further describe the intermediary adapter and the connection structure of the present application.

In accordance with one embodiment of the present application, an intermediate adapter plate (which may be considered to be a plate-like intermediate adapter) is provided. A plurality of this intermediary changes the board and can constitute the module test system of making a video recording with material makeup, module and the module test equipment of making a video recording. The camera module testing equipment can be any testing equipment for testing items, and is not limited herein. In this embodiment, the plurality of adapter plates are used to fix and electrically connect the plurality of modules of making a video recording to be detected, and each adapter plate has a plurality of jacks (these jacks can be used as a switching electrode array) that are respectively electrically connected with each pin of the corresponding module of making a video recording to be detected. The distance between a plurality of jacks is greater than the distance between each stitch of the corresponding module of making a video recording that awaits measuring, the size of jack is also greater than the size of the stitch of the module of making a video recording that awaits measuring. The material splicing plate is provided with a plurality of adapter plate mounting positions; the adapter plates are respectively fixed at the adapter plate mounting positions. The material makeup can be fixed to the material receiving unit of the camera module test equipment, and the plurality of jacks of the plurality of adapter plates can be electrically connected with the material receiving unit. It can be seen that the jacks of the adapter plate can be used as adapter electrodes to be plugged with probes of the test equipment and electrically connected. In this embodiment, a plurality of probes of the testing apparatus form a probe array, which may also be referred to herein as a probe base. The probe seat is used for realizing the electric connection with the camera module to be tested.

In one embodiment, a plurality of to-be-tested camera modules are fixed on a material jointed board, the material jointed board is used as a unit for feeding and discharging, each material jointed board is installed on a testing device in a test based on a production line, and each probe seat of the testing device is respectively inserted into a jack corresponding to each to-be-tested camera module on the material jointed board, so that each to-be-tested camera module on the material jointed board can be electrified and images shot by each to-be-tested camera module are parallelly transmitted to each image data acquisition box, and then synchronous testing of the plurality of camera modules is completed.

Further, in one embodiment, the adapter plate is used for respectively fixing and electrically connecting the plurality of camera modules to be tested. During testing, the camera module to be tested is installed on the adapter plate, and then the adapter plate provided with the camera module to be tested is installed on the material splicing plate. Each adapter plate is provided with a plurality of jacks which are respectively and electrically connected with pins of the camera module to be tested, the distance between the jacks is larger than the distance between the pins of the camera module to be tested, and the size of each jack is also larger than the size of the pin of the camera module to be tested. The material makeup has a plurality of keysets installation position, a plurality of keysets are fixed respectively a plurality of keysets installation position. The material makeup can be fixed to the material receiving unit of the camera module test equipment, and the plurality of jacks of the plurality of adapter plates can be electrically connected with the material receiving unit. Because the stitch of the module of making a video recording that awaits measuring is very intensive, when a plurality of modules of making a video recording that await measuring fix on the material makeup with the form of array, the stitch position of the module of making a video recording that awaits measuring of different positions is difficult to the accurate determination. For example, the slight deformation of the material splicing plate may cause the pin of the camera module to be tested at different positions to be dislocated, which makes it difficult to realize the plugging with the testing equipment. In this embodiment, the camera module to be tested is installed on the adapter plate, and then the adapter plate with the camera module to be tested is installed on the material splicing plate. Because the interval between the jack on the keysets is greater than the interval between each stitch of the module of making a video recording that awaits measuring, the size of jack is also greater than the size of the stitch of the module of making a video recording that awaits measuring, consequently tolerance to the position error improves to be convenient for the probe on the test unit panel inserts and then realize the electricity of the module of making a video recording that awaits measuring and test unit.

Based on the above description, it can be seen that each adapter plate all can need to be pegged graft with a large amount of modules of making a video recording in the circulation process, and this inevitably leads to its plug connector wearing and tearing. And the new connection structure that proposes in this application can utilize electrically conductive cloth to replace the plug connector of easy wearing and tearing to the life of keysets has been increased. In addition, the connection structure based on the conductive cloth can reduce the times of pattern opening failure in the test process, and is favorable for improving the production efficiency (or the test efficiency). Due to the adoption of the jointed board testing mode, when any camera module in one jointed board fails to open the picture, the module which fails to open the picture needs to be picked out from the jointed board, taken down and tested again. Both of these steps add to the difficulty of automated operation. Therefore, the number of times of failure in opening the image is reduced, and the production efficiency of the camera module is greatly improved.

It should be noted that the camera module can be replaced by other modules requiring the power-on test of the optical performance, which is easily understood by those skilled in the art. Moreover, the connecting structure is not only suitable for testing the assembled module, but also suitable for testing the semi-finished module.

The above description is only a preferred embodiment of the present application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.

Claims (25)

1. A connection structure for module circular telegram test, its characterized in that includes:

a circuit board;

a sheet-like conductive member having a first surface and a second surface opposite to the first surface, the second surface being attached to a surface of the wiring board, the sheet-like conductive member being conductive in a normal direction of the first surface and non-conductive in a direction parallel to the first surface;

the carrier is suitable for carrying a module to be subjected to a power-on test, the module to be subjected to the power-on test comprises a connector, and the carrier comprises a limiting structure which is suitable for accommodating the connector and limiting the connector to move in a direction parallel to the first surface; and

A fastener for pressing the connector against the first surface,

wherein the connector comprises an array of connector pins, and the sheet-like conductive element comprises an array of conductive pins;

each pin of the connector pin array corresponds to a plurality of conductive pins of the conductive pin array and is in electrical communication with at least one of the conductive pins when the connector is pressed against the first surface;

the axis of the conductive pin and the first surface form an included angle of 45-75 degrees.

2. The connection structure of claim 1, wherein the connector includes an array of connector pins, the circuit board including an array of contacts in contact with the second surface, respective contact locations of the array of contacts being adapted to the locations of respective pins of the array of connector pins received in the retention structure.

3. The connection structure according to claim 1, wherein the sheet-like conductive element further comprises an insulating medium, wherein the array of conductive pins is distributed in the insulating medium.

4. The connecting structure according to claim 3, wherein the sheet-like conductive element is a conductive cloth, the conductive cloth includes a silica gel and an array of conductive pins distributed in the silica gel, and the conductive pins are in a cylindrical shape.

5. The connecting structure as claimed in claim 3, wherein the conductive pin is made of a metal material.

6. The connecting structure according to claim 3, wherein the axis of the conductive pin forms an angle of 0 to 90 degrees with the first surface.

7. The connection structure of claim 2, wherein the circuit board further comprises a patch electrode array and traces that conduct the contact array to the patch electrode array.

8. The connection structure of claim 7, wherein the patch electrode array comprises a plurality of patch electrodes, the patch electrodes having a size larger than the size of the contacts.

9. The connection structure of claim 7, wherein a pitch between the via electrodes of the via electrode array is greater than a pitch between the contacts of the contact array.

10. The connection structure according to claim 1, wherein the module to be subjected to the power-on test is an optical device module.

11. The connection structure according to claim 1, wherein the module to be subjected to the energization test is a camera module or a projector module.

12. The connection structure according to claim 1, wherein the module to be subjected to the power-on test includes a module main body and a connector connected to the module main body by a flexible connection tape, the connector having an array of connector pins.

13. The connection according to claim 12, wherein the connector is a female plug or a male plug.

14. The connection structure according to claim 1, wherein the position-limiting structure is a position-limiting hole.

15. The connection according to claim 1, wherein the fastener comprises:

the pressing plate is suitable for tightly pressing the module to be subjected to the power-on test between the pressing plate and the carrier; and

a buckle adapted to secure the pressure plate in a compressed state.

16. The connection structure of claim 15, wherein one end of the pressure plate is pivotally connected to the carrier and the other end of the pressure plate is connected to the clip.

17. The connecting structure of claim 16, wherein one end of the buckle is pivotally connected to the pressure plate, and the other end of the buckle is adapted to be snapped into the carrier.

18. The connection structure according to claim 1, wherein the carrier includes:

the carrier base is suitable for bearing the module to be subjected to the power-on test and is provided with a through hole for accommodating the connector; and

the needle seat is matched with the through hole and is provided with the limiting structure.

19. The connection structure according to claim 15, wherein the pressure plate has a light passing hole adapted to the module to be subjected to the power-on test.

20. The connection structure according to claim 1, wherein the circuit board has an avoidance structure for avoiding an optical path which is an optical path for conducting an energization test on the module.

21. The connection structure according to claim 1, wherein the connection structure is located at an adaptor for adapting the module to be power-on tested to a test equipment.

22. The connection structure of claim 1, wherein the connection structure is located in a test facility.

23. A adaptor for module circular telegram test, its characterized in that includes:

a patch panel;

a sheet-like conductive member having a first surface and a second surface opposite to the first surface, the second surface being attached to a surface of the interposer board, the sheet-like conductive member being conductive in a direction normal to the first surface and non-conductive in a direction parallel to the first surface;

a carrier adapted to carry a module to be power-on tested, the module to be power-on tested including a connector, the carrier including a limiting structure adapted to receive the array of connector pins and limit movement of the connector in a direction parallel to the first surface; and

A fastener for pressing the connector against the first surface,

wherein the connector comprises an array of connector pins, and the sheet-like conductive element comprises an array of conductive pins;

each pin of the connector pin array corresponds to a plurality of conductive pins of the conductive pin array and is electrically communicated with at least one conductive pin when the connector is pressed on the first surface; and

the axis of the conductive pin and the first surface form an included angle of 45-75 degrees.

24. The interposer of claim 23, wherein the connector comprises an array of connector pins, the interposer circuit board comprising an array of contacts in contact with the second surface, an array of interposer electrodes, and traces that conduct the array of contacts to the array of interposer electrodes;

the positions of all the contacts of the contact array are matched with the positions of all the pins of the connector pin array accommodated in the limiting structure, the size of the switching electrodes is larger than that of the contacts, and the distance between the switching electrodes of the switching electrode array is larger than that between the contacts of the contact array.

25. The transition piece of claim 23, wherein the sheet-like conductive element further comprises an insulating medium, wherein the array of conductive pins is distributed in the insulating medium.

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