CN2804874Y - Conductive measuring means - Google Patents
Conductive measuring means Download PDFInfo
- Publication number
- CN2804874Y CN2804874Y CN 200520058403 CN200520058403U CN2804874Y CN 2804874 Y CN2804874 Y CN 2804874Y CN 200520058403 CN200520058403 CN 200520058403 CN 200520058403 U CN200520058403 U CN 200520058403U CN 2804874 Y CN2804874 Y CN 2804874Y
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- conductive
- vertical
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- measuring
- circuit board
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Abstract
The utility model relates to a conductive measuring means mainly used for measuring an electronic circuit of a printed circuit board. The existing measuring means has high cost and the circuit board to be measured is easy to damage. Thus, the conductive measuring means of the utility model comprises a measuring interface; the utility model is characterized in that the utility model also comprises a measuring board and an elastic and vertical conducting layer covered on the measuring board, wherein the elastic and vertical conducting layer is made of oriented conducting materials; the measuring board is provided with a contact point which is same with a welding point on the printed circuit board to be measured; the contact point is connected with the measuring interface by the conducting materials. After the scheme, the novel conductive measuring means of the utility model has the advantages of simple structure, low cost and good compatibility and the circuit board is not easy to damage; the utility model is widely used in various printed circuit boards during the process of measuring.
Description
Technical field
The utility model relates to a kind of Conductive gauge, is mainly used in the test to printed board circuit.
Background technology
Electronic component on the circuit board should be with suitable circuit serial or parallel connection, to reach a certain specific effect.As be short-circuited or open circuit, circuit board can't use.Therefore, must be before circuit board dispatches from the factory through test, circuit complexity and number of electronic components on the circuit board are too many, need to rely on measurement jig in the test process of electronic component again, cooperate Test Host to finish the test job of electronic component.Existing Conductive gauge mostly is probe press formula tool, it is to join the protruding probe that is exposed to the pedestal top end face of layout with a base interior according to each circuit of electric substrate or the connecting point position of electronic component, the probe bottom links Test Host with circuit, be provided with compression spring in the probe, so that make this probe have certain flexible ability, and can in the contact process of probe and electric substrate and electronic component, contact on the contact its relative position of design one by one with more suitable pressure.According to the size of test density, probe and inner spring size thereof are also different, and probe, spring are more little, and difficulty of processing is big more, and price is also high more.So when the higher printed circuit board (PCB) of test density, its cost is quite high.Simultaneously owing to use probe test, when occurring that probe blocks or during the spring fault, damaging circuit board under test easily.
The utility model content
The technical problems to be solved in the utility model is how to overcome the existing above-mentioned defective of tool, provides a kind of simple in structure, and cost is low, not the Conductive gauge of easy damaged circuit board under test.
For achieving the above object, the utility model Conductive gauge comprises test interface, test board and covers elastic and vertical conductive layer on the test board that wherein, described elastic and vertical conductive layer is made by directed conductive material; Described test board is provided with and the corresponding contact of the solder joint of printed circuit board (PCB) to be measured, and above-mentioned contact links to each other with test interface by conductive material.So design, the probe that utilizes the elastic and vertical conductive layer to replace the needs in the existing tool manually to install is saved artificial.
As optimization, described conductive material is the Copper Foil on the base material of being fixed on through processing.When the solder joint density of circuit board under test was big, test board can contain multilayer board, and described Copper Foil can be distributed on the different plates.When the solder joint density of circuit board under test is big, test board can contain multilayer board, and described Copper Foil can be distributed in so design on the different plates, and Copper Foil is controlled processing automatically through computer, reach the purpose of connecting terminal and test interface, the more existing artificial mode of connection is quick, accurate.
As optimization, described directed conductive material is directed metallic conduction rubber, comprise rubber substrate with evenly, the vertical tinsel in rubber substrate of gathering, above-mentioned tinsel is separated from each other, its two ends end face exposes the upper and lower surface of rubber substrate respectively.
So design, tinsel even, that gather relies on rubber-covered and fixing, and the while is because the elasticity of rubber can guarantee that the tinsel two ends contact well with the contact of circuit board under test and test board respectively.During use, circuit board under test is pressed on the directed metallic conduction rubber layer, test interface is connected Test Host and can be tested.Directed metallic conduction rubber layer has good compatibility, can test multiple circuit board by changing different test boards.
As optimization, described directed conductive material is a nanometer vertical conduction cloth, comprise rubber substrate with evenly, the vertical carbon nano-tube in rubber substrate of gathering, the two ends end face of above-mentioned carbon nano-tube exposes the upper and lower surface of rubber substrate respectively.So design, conductive effect is better.
Advantage of the present utility model:
1, cancels original probe and compression spring, greatly reduced cost;
2, the conductive fiber that spread all in the rubber basic unit of elastic and vertical conductive layer evenly, gathers can be applied in the detection of various printed circuit board (PCB)s, has compatible preferably;
3, utilization replaces time-consuming manual routing through the Copper Foil of computer etching, boring, welding;
4, the abundant elasticity of utilizing rubber matrix, high conformity, conduction contact high conformity.
After adopting such scheme, that the utility model Conductive gauge has is simple in structure, easy to process, not the easy damaged circuit board, the advantage of certain compatibility is arranged, be widely used in the testing process of various printed circuit board (PCB)s.
Description of drawings
Fig. 1 is the structural representation of the utility model Conductive gauge;
The serve as reasons structural representation of the elastic and vertical conductive layer that directed metallic conduction rubber makes of Fig. 2;
Fig. 3 is the structural representation of the elastic and vertical conductive layer made by nanometer vertical conduction cloth;
Fig. 4 is the vertical view of the test board of the utility model Conductive gauge.
Among the figure: 1 is that printed circuit board (PCB) to be measured, 2 is carbon nano-tube for contact, 10 for the solder joint on the printed circuit board (PCB) to be measured, 9 for rubber substrate, 8 for tinsel, 7 for test interface, 6 for Copper Foil, 5 for test board, 4 for elastic and vertical conductive layer, 3.
Embodiment
Embodiment one: shown in Fig. 1,2,3 and 4, the utility model Conductive gauge comprises test interface 5, test board 3 and covers elastic and vertical conductive layer 2 on the test board 3 that wherein, described elastic and vertical conductive layer 2 is made by directed conductive material; Described test board 3 be provided with printed circuit board (PCB) 1 to be measured on solder joint 8 corresponding contacts 9, above-mentioned contact 9 links to each other with test interface 5 by Copper Foil 4.This Copper Foil 4 is through computer etching, boring, welding, as the conductive material of connecting terminal and test interface.
Described directed conductive material is directed metallic conduction rubber, comprise rubber substrate 7 with evenly, the vertical tinsel 6 in rubber substrate 7 of gathering, above-mentioned tinsel 6 is separated from each other, its two ends end face exposes the upper and lower surface of rubber substrate 7 respectively.
So design, tinsel 6 even, that gather relies on rubber-covereds and fixing, and the while is because the elasticity of rubber can guarantee that tinsel 6 two ends contact well with the hard contact 9 of solder joint 8 on the printed circuit board (PCB) 1 to be measured and test board 3 respectively.During use, printed circuit board (PCB) 1 to be measured is pressed on the directed metallic conduction rubber layer, test interface 5 is connected Test Host and can be tested.Directed metallic conduction rubber layer has good compatibility, can test multiple printed circuit board (PCB) by changing different test board 3.
Fig. 4 is the vertical view of the test board of the utility model Conductive gauge, scribbles the insulation enamelled coating on the Copper Foil 4.When the solder joint density of circuit board under test was big, test board can contain multilayer board, and described Copper Foil can be distributed on the different plates.
Embodiment two: described directed conductive material is a nanometer vertical conduction cloth, comprise rubber substrate 7 with evenly, the vertical carbon nano-tube 10 in rubber substrate 7 of gathering, the two ends end face of above-mentioned carbon nano-tube 10 exposes the upper and lower surface of rubber substrate 7 respectively.Remaining part and structure are as described in the enforcement mode one.
Claims (4)
1, a kind of Conductive gauge comprises test interface, it is characterized in that: it also comprises test board and the elastic and vertical conductive layer that covers on the test board, and wherein, described elastic and vertical conductive layer is made by directed conductive material; Described test board be provided with printed circuit board (PCB) to be measured on the corresponding contact of solder joint, above-mentioned contact links to each other with test interface by conductive material.
2, Conductive gauge according to claim 1 is characterized in that: described conductive material is the Copper Foil on the base material of being fixed on through processing.
3, Conductive gauge according to claim 2, it is characterized in that: described directed conductive material is directed metallic conduction rubber, comprise rubber substrate with evenly, vertical tinsel in rubber substrate gathers, above-mentioned tinsel is separated from each other, and its two ends end face exposes the upper and lower surface of rubber substrate respectively.
4, Conductive gauge according to claim 2, it is characterized in that: described directed conductive material is a nanometer vertical conduction cloth, comprise rubber substrate with evenly, the vertical carbon nano-tube in rubber substrate of gathering, the two ends end face of above-mentioned carbon nano-tube exposes the upper and lower surface of rubber substrate respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520058403 CN2804874Y (en) | 2005-05-20 | 2005-05-20 | Conductive measuring means |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520058403 CN2804874Y (en) | 2005-05-20 | 2005-05-20 | Conductive measuring means |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2804874Y true CN2804874Y (en) | 2006-08-09 |
Family
ID=36910163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520058403 Expired - Fee Related CN2804874Y (en) | 2005-05-20 | 2005-05-20 | Conductive measuring means |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2804874Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105158604A (en) * | 2015-08-25 | 2015-12-16 | 贵州航天计量测试技术研究所 | QFN packaged phase-locked chip test device |
| CN105445506A (en) * | 2015-12-24 | 2016-03-30 | 贵州航天计量测试技术研究所 | Welding-free self-clamping interconnection structure |
| CN106597254A (en) * | 2016-12-15 | 2017-04-26 | 深圳市燕麦科技股份有限公司 | Circuit board testing device |
| CN111190090A (en) * | 2018-11-15 | 2020-05-22 | 宁波舜宇光电信息有限公司 | Connection structure and corresponding adapter for module power-on test |
| CN111916259A (en) * | 2020-08-04 | 2020-11-10 | 东莞市雷兹盾电子材料有限公司 | A kind of preparation method of supersoft conductive rubber and supersoft conductive rubber |
| CN117148016A (en) * | 2023-10-26 | 2023-12-01 | 山东合盛铜业有限公司 | Substrate copper foil conductive performance test equipment |
-
2005
- 2005-05-20 CN CN 200520058403 patent/CN2804874Y/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105158604A (en) * | 2015-08-25 | 2015-12-16 | 贵州航天计量测试技术研究所 | QFN packaged phase-locked chip test device |
| CN105445506A (en) * | 2015-12-24 | 2016-03-30 | 贵州航天计量测试技术研究所 | Welding-free self-clamping interconnection structure |
| CN106597254A (en) * | 2016-12-15 | 2017-04-26 | 深圳市燕麦科技股份有限公司 | Circuit board testing device |
| CN111190090A (en) * | 2018-11-15 | 2020-05-22 | 宁波舜宇光电信息有限公司 | Connection structure and corresponding adapter for module power-on test |
| CN111916259A (en) * | 2020-08-04 | 2020-11-10 | 东莞市雷兹盾电子材料有限公司 | A kind of preparation method of supersoft conductive rubber and supersoft conductive rubber |
| CN117148016A (en) * | 2023-10-26 | 2023-12-01 | 山东合盛铜业有限公司 | Substrate copper foil conductive performance test equipment |
| CN117148016B (en) * | 2023-10-26 | 2024-02-02 | 山东合盛铜业有限公司 | Substrate copper foil conductive performance test equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Dongguan Shengyi Electronics Ltd. Assignor: Guo Hongjian Contract fulfillment period: 2006.8.16 to 2011.8.16 Contract record no.: 2009440000036 Denomination of utility model: Conductive measuring means Granted publication date: 20060809 License type: Exclusive license Record date: 20081225 |
|
| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2006.8.16 TO 2011.8.16; CHANGE OF CONTRACT Name of requester: DONGGUAN SHENGYI ELECTRONICS CO., LTD. Effective date: 20081225 |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060809 Termination date: 20120520 |