CN105158604A - QFN packaged phase-locked chip test device - Google Patents
QFN packaged phase-locked chip test device Download PDFInfo
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- CN105158604A CN105158604A CN201510524444.XA CN201510524444A CN105158604A CN 105158604 A CN105158604 A CN 105158604A CN 201510524444 A CN201510524444 A CN 201510524444A CN 105158604 A CN105158604 A CN 105158604A
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- test
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- locked
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Abstract
The invention discloses a QFN packaged phase-locked chip test device, which comprises a test fixture (1). A test adapter circuit board (3) is fixed onto a bottom plate (4). The conductive rubber (2) is arranged to cover a bonding pad of a phase demodulation chip of the test adapter circuit board (3). The pressing device of the test fixture (1) presses a to-be-tested chip onto the conductive rubber (2). The device solves the problems during the testing process of QFN packaged phase-locked chips in the prior art, including the inaccurate test results of devices under the influence of the parasitic parameters of test probes, the abrasion of bonding pads, the damage to chips, the imperfect test results of chips, the badly influenced working reliability of QFN packaged phase-locked chips and the like due to the fact that chips are directly and hardly pressed onto bonding pads.
Description
Technical field
The invention belongs to electronic devices and components technical field of measurement and test, particularly relate to a kind of QFN and encapsulate phase-locked apparatus for testing chip.
Background technology
The test of microwave device is the difficult point of component testing industry always, and especially encapsulate phase-locked chip testing for QFN, difficulty is larger.Traditional test fixture utilizes metal probe that the mode of chip pin and adapter contact pads is carried out device detection.This method because the parasitic parameter that test probe produces affects the test result of device, can even make device cisco unity malfunction when frequency is very high.In addition, present QFN encapsulates phase-locked loop chip by R frequency divider, Fractional-N frequency device, and locking instruction waits circuit to be integrated on chip piece with phase frequency detector, for the test of this powerful phase-locked loop chip, also do not have a kind of very suitable method of testing can detect these functional parameters at present.
Summary of the invention
The technical problem to be solved in the present invention: provide a kind of QFN to encapsulate phase-locked apparatus for testing chip, to solve, on QFN, prior art encapsulates that the parasitic parameter that test probe that phase-locked chip testing exists produces affect the test result of device, chip is directly firmly pressed in test on pad and can there is pad and wear and tear, chip damage and chip functions are tested imperfect, have a strong impact on QFN and encapsulate the problems such as the functional reliability of phase-locked chip.
Technical solution of the present invention:
A kind of QFN encapsulates phase-locked apparatus for testing chip, it comprises test fixture, test adapter circuit plate is fixed on base plate, and conductive rubber covers on the pad of the phase demodulation chip of test adapter circuit plate, and chip under test is pressed on conductive rubber by the hold down gag of test fixture.
The thickness of conductive rubber is 0.15 millimeter.
Test adapter circuit plate comprises toggle switch, toggle switch controls pin with the frequency divider of chip under test and is connected, the output terminal of chip under test is connected with the input end of loop filter, the output terminal of loop filter is connected with the input end of wideband voltage controlled oscillator, the output terminal of wideband voltage controlled oscillator is connected with the input end of power splitter, first output terminal of power splitter is connected with the rf inputs of chip under test, and the second output terminal of power splitter exports radiofrequency signal.
Beneficial effect of the present invention:
The present invention cancels the metal probe of existing test fixture, metal probe is replaced by conductive rubber, the potential danger utilizing the elasticity of conductive rubber can solve hard pressure chip under test to bring, avoids chip under test and is directly firmly pressed in test on pad and can there are pad wearing and tearing, the problems such as chip damage; On the one hand because conductive rubber thickness is selected at 0.15 millimeter, the contact distance of chip under test pin and adapter pad can be reduced, reduce parasitic parameter, ensure the normal transmission of microwave signal, improve test result accuracy and reliability; Test adapter circuit plate of the present invention can form a complete phase-locked loop circuit with chip under test, the function such as R frequency divider, Fractional-N frequency device, locking instruction of chip under test is tested, test adapter circuit plate output signal is the microwave signal of locking, can detect the various functions of tested phase-locked chip intuitively; Make test result more perfect, improve the functional reliability that later stage QFN encapsulates phase-locked chip; The invention solves on QFN, prior art encapsulates that the parasitic parameter that test probe that phase-locked chip testing exists produces affect the test result of device, chip is directly firmly pressed in test on pad and can there is pad and wear and tear, chip damage and test result very imperfection, have a strong impact on QFN and encapsulate the problems such as the functional reliability of phase-locked chip.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is that the present invention tests adapter circuit plate circuit theory schematic diagram.
Embodiment
A kind of QFN encapsulates phase-locked apparatus for testing chip, it comprises test fixture 1, test adapter circuit plate 3 is fixed by screws on base plate 4, size is slightly covered on the pad of the phase demodulation chip testing adapter circuit plate 3 than encapsulating large conductive rubber (2) with chip under test, chip under test is pressed on conductive rubber (2) by the hold down gag of test fixture (1), test fixture pressure 1 is being tested on adapter circuit plate 3, and with screw, it is fastening; The position that in test fixture 1, chip under test is placed is corresponding with conductive rubber 2 position; Chip under test is placed in test fixture 1, and by the hold down gag of test fixture 1 chip under test is pressed on the phase demodulation chip bonding pad in test adapter circuit plate 3; Described chip under test refers to phase demodulation chip.
The thickness of conductive rubber 2 is 0.15 millimeter, to reduce chip under test pin and the distance of the pad of the phase demodulation chip of test adapter circuit plate 3, reduces parasitic parameter, ensures microwave signal normal transmission.
Test adapter circuit plate 3 comprises toggle switch, toggle switch controls pin with the frequency divider of chip under test and is connected, the output terminal of chip under test is connected with the input end of loop filter, the output terminal of loop filter is connected with the input end of wideband voltage controlled oscillator, the output terminal of wideband voltage controlled oscillator is connected with the input end of power splitter, first output terminal of power splitter is connected with the rf inputs of chip under test, and the second output terminal of power splitter exports radiofrequency signal.
During test, the R of phase demodulation chip is set, Fractional-N frequency ratio by toggle switch, changes output frequency, feed back to phase demodulation chip radio frequency input end by the output terminal of power splitter, by the locking deixis of the instruction level detection phase demodulation chip of phase demodulation chip indication end.
Claims (3)
1. a QFN encapsulates phase-locked apparatus for testing chip, it comprises test fixture (1), it is characterized in that: test adapter circuit plate (3) is fixed on base plate (4), conductive rubber (2) covers on the pad of the phase demodulation chip of test adapter circuit plate (3), and chip under test is pressed on conductive rubber (2) by the hold down gag of test fixture (1).
2. a kind of QFN according to claim 1 encapsulates phase-locked apparatus for testing chip, it is characterized in that: the thickness of conductive rubber (2) is 0.15 millimeter.
3. a kind of QFN according to claim 1 encapsulates phase-locked ring core built-in testing device, it is characterized in that: test adapter circuit plate (3) comprises toggle switch, toggle switch controls pin with the frequency divider of chip under test and is connected, the output terminal of chip under test is connected with the input end of loop filter, the output terminal of loop filter is connected with the voltage-controlled end of wideband voltage controlled oscillator, the output terminal of wideband voltage controlled oscillator is connected with the input end of power splitter, first output terminal of power splitter is connected with the rf inputs of chip under test, and the second output terminal of power splitter exports radiofrequency signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510524444.XA CN105158604A (en) | 2015-08-25 | 2015-08-25 | QFN packaged phase-locked chip test device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510524444.XA CN105158604A (en) | 2015-08-25 | 2015-08-25 | QFN packaged phase-locked chip test device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105158604A true CN105158604A (en) | 2015-12-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510524444.XA Pending CN105158604A (en) | 2015-08-25 | 2015-08-25 | QFN packaged phase-locked chip test device |
Country Status (1)
| Country | Link |
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| CN (1) | CN105158604A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110108907A (en) * | 2019-04-26 | 2019-08-09 | 中国电子科技集团公司第二十九研究所 | A kind of BGA package product radio frequency performance test fixture |
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| JPS57125363A (en) * | 1981-01-27 | 1982-08-04 | Matsushita Electronics Corp | Test method of pll circuit |
| CN2804874Y (en) * | 2005-05-20 | 2006-08-09 | 郭红建 | Conductive measuring means |
| CN101577544A (en) * | 2009-06-15 | 2009-11-11 | 华亚微电子（上海）有限公司 | Phase-locked loop with collapse protection mechanism |
| CN102012470A (en) * | 2009-09-04 | 2011-04-13 | 日月光半导体（上海）股份有限公司 | Electrical test adapter plate of sealing base plate and method thereof |
| US20120262149A1 (en) * | 2011-04-18 | 2012-10-18 | International Business Machines Corporation | Loop parameter sensor using repetitive phase errors |
| CN103163447A (en) * | 2013-03-28 | 2013-06-19 | 苏州瀚瑞微电子有限公司 | Method for detecting flexible printed circuit (FPC) finished product |
| CN203708219U (en) * | 2014-02-21 | 2014-07-09 | 成都天奥电子股份有限公司 | 3.4G digital phase-locking frequency multiplier for CPT clock |
| CN104483618A (en) * | 2014-11-28 | 2015-04-01 | 惠州聚创汇智科技开发有限公司 | Circuit board testing device |
| CN104569786A (en) * | 2014-12-30 | 2015-04-29 | 北京航天测控技术有限公司 | Embedded test method of phase-locked loop circuits |
| CN205067614U (en) * | 2015-08-25 | 2016-03-02 | 贵州航天计量测试技术研究所 | QFN encapsulation phase locking chip testing arrangement |
-
2015
- 2015-08-25 CN CN201510524444.XA patent/CN105158604A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57125363A (en) * | 1981-01-27 | 1982-08-04 | Matsushita Electronics Corp | Test method of pll circuit |
| CN2804874Y (en) * | 2005-05-20 | 2006-08-09 | 郭红建 | Conductive measuring means |
| CN101577544A (en) * | 2009-06-15 | 2009-11-11 | 华亚微电子（上海）有限公司 | Phase-locked loop with collapse protection mechanism |
| CN102012470A (en) * | 2009-09-04 | 2011-04-13 | 日月光半导体（上海）股份有限公司 | Electrical test adapter plate of sealing base plate and method thereof |
| US20120262149A1 (en) * | 2011-04-18 | 2012-10-18 | International Business Machines Corporation | Loop parameter sensor using repetitive phase errors |
| CN103163447A (en) * | 2013-03-28 | 2013-06-19 | 苏州瀚瑞微电子有限公司 | Method for detecting flexible printed circuit (FPC) finished product |
| CN203708219U (en) * | 2014-02-21 | 2014-07-09 | 成都天奥电子股份有限公司 | 3.4G digital phase-locking frequency multiplier for CPT clock |
| CN104483618A (en) * | 2014-11-28 | 2015-04-01 | 惠州聚创汇智科技开发有限公司 | Circuit board testing device |
| CN104569786A (en) * | 2014-12-30 | 2015-04-29 | 北京航天测控技术有限公司 | Embedded test method of phase-locked loop circuits |
| CN205067614U (en) * | 2015-08-25 | 2016-03-02 | 贵州航天计量测试技术研究所 | QFN encapsulation phase locking chip testing arrangement |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110108907A (en) * | 2019-04-26 | 2019-08-09 | 中国电子科技集团公司第二十九研究所 | A kind of BGA package product radio frequency performance test fixture |
| CN110108907B (en) * | 2019-04-26 | 2021-10-22 | 中国电子科技集团公司第二十九研究所 | Radio frequency performance test fixture for BGA (ball grid array) packaged product |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151216 |
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| RJ01 | Rejection of invention patent application after publication |