CN113725108B - Drifting positioning measurement method and device for large-plate fan-out type packaging chip - Google Patents
Drifting positioning measurement method and device for large-plate fan-out type packaging chip Download PDFInfo
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- G—PHYSICS
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Abstract
The application relates to a drift positioning measurement method of a fan-out type package chip of a large plate, which comprises the following steps: the method comprises the steps of constructing an error compensation model, wherein the error compensation model comprises the steps of acquiring first data acquired by a laser interferometer, obtaining straightness and perpendicularity related information of a motion platform according to the first data, and constructing the error compensation model according to calculation of the first data; the drift positioning measurement comprises the steps of obtaining second data acquired by a machine vision system, wherein the second data comprise image information of a chip, obtaining third data acquired by a grating ruler carried on a X, Y, Z shaft of the motion platform, and the third data are used for feeding back real-time position information of the motion platform, obtaining error information of the chip according to the image information and the third data, and carrying out error compensation on the chip according to the error information and the established error compensation model. The application can ensure that the positioning precision of the fan-out type package chip of the large plate can reach the micron level, and can meet the requirement of chip package positioning.
Description
Technical Field
The application relates to the field of intelligent detection of ceramic tiles, in particular to a drift positioning measurement method and device for a fan-out type package chip of a large plate.
Background
The chip generally needs to be subjected to the steps of temporary bonding, wafer reconstruction, plastic packaging, rewiring and bump manufacturing in the packaging process. Due to the problem of chip drift, the subsequent punching, wiring and other processes requiring accurate chip position information are affected, and finally the yield of chip packaging is affected.
Advanced packaging technology today is mainly divided into fan-in type packaging and fan-out type packaging, and in recent years, large-size panel-level fan-out type packaging has emerged with further development of the fan-out type packaging. The fan-out type package substrate of the large plate is generally 600mm x 600mm, the number of chips to be packaged placed on the substrate is very large, and meanwhile, the positioning accuracy is required to be in a micron level. In the packaging process of the large-plate fan-out packaging chip, due to the difference of thermal expansion coefficients between the plastic package frame and the epoxy resin, the chip can drift due to the fact that the heterogeneous materials are mismatched.
Understanding the drift problem, as shown in fig. 1, the solid line is the theoretical position of the drawing chip, the dotted line is the actual position of the chip after the chip is shifted, wherein the deflection angle is θ, the x-coordinate is shifted by d1 distance, and the y-axis is shifted by d2 distance.
Disclosure of Invention
The application aims to at least solve one of the defects in the prior art and provides a drift positioning measurement method and device for a fan-out type package chip of a large plate.
In order to achieve the above purpose, the present application adopts the following technical scheme:
specifically, a drift positioning measurement method of a large-plate fan-out type packaging chip is provided, which comprises the following steps:
an error compensation model is constructed, comprising,
acquiring first data acquired by a laser interferometer, acquiring straightness and verticality related information of a motion platform according to the first data,
calculating according to the first data so as to establish the error compensation model;
the drift location measurement, including,
acquiring second data acquired by the machine vision system, wherein the second data comprises image information of a large-plate fan-out type packaged chip,
acquiring third data acquired by a grating ruler carried on a X, Y, Z shaft of the motion platform, wherein the third data is used for feeding back real-time position information of the motion platform,
obtaining error information of the chip by combining the third data according to the image information, wherein the error information comprises the offset of the chip at the actual position and the central position when the chip is at the theoretical position and the deflection angle of the chip,
and according to the error information, combining the established error compensation model to carry out error compensation on the chip.
Further, the straightness and verticality related information of the motion platform is obtained specifically by the following method,
the Y axis and the Z axis of the motion platform are kept unchanged, data measured by the laser interferometer are recorded every first threshold distance through the X axis of the motion platform, repeated measurement is carried out for a plurality of times in an effective stroke through the motion platform, the positioning accuracy and the straightness of the X axis of the motion platform measured by the laser interferometer are recorded, the positioning accuracy and the straightness of the Y axis are measured similarly, the straightness of the motion platform measured by the laser interferometer is a reference axis measured by measuring the straightness of the first axis of the motion platform and fitting a straight line as the straightness, the straightness of the second axis is measured under the condition that the measurement reference of the first axis is unchanged, and the horizontal straightness of the X, Y axis of the motion platform is calculated to be theta through the fitted straight line.
Further, the calculating according to the first data further establishes the error compensation model, specifically comprising the following steps,
the positioning error model established by the positioning error generated by the motion platform is as follows,
the method comprises the steps of carrying out equidistant measurement on 11 measurement target points by a laser interferometer, establishing a positioning error model by the positioning error of a motion platform as follows,
δ x ＝a 1 x+b 1 (13)
δ y ＝a 2 y 2 +b 2 y+c 2 (14)
delta in x For X-axis positioning error, delta y Is Y-axis positioning error, x is displacement of the motion platform, a 1 、a 2 、b 1 、b 2 、c 2 Are all constants;
obtaining an error model of the second axis resulting from errors caused by the straightness of the first axis,
a fifth order polynomial is used to fit the straightness error curve of X, Y axis,
ε＝a 3 x 5 +b 3 x 4 +c 3 x 3 +d 3 x 2 +e 3 x+f 3 (15)
the motion platform positioning error model established by the straightness and the positioning accuracy of the motion platform is as follows:
Δ x ＝δ x +ε x (16)
Δ y ＝δ y +ε y (17)
wherein delta is x For positioning error, delta of x-axis y Positioning error of the y axis;
the actual coordinates of the motion platform are:
x actual (x ideal +Δ x )+(y ideal +Δ y )sinθ (18)
y actual ＝(y ideal +Δ y )cosθ(19)。
further, the second data acquisition mode specifically includes the following,
controlling an industrial camera of the machine vision system to move to an initial position;
the industrial camera is controlled to circularly collect images through the planned path until the complete images are collected;
the path is planned to follow the following rules,
the method comprises the steps of presetting a plurality of image acquisition areas for the industrial camera, and ensuring that the acquired images have overlapping parts when the industrial camera is positioned in the adjacent image acquisition areas in order to ensure that the images of all chips can be completely acquired.
Further, the obtaining the error information of the chip by combining the third data according to the image information specifically includes the following steps,
image preprocessing is carried out on the acquired image so as to reduce noise of the image;
carrying out edge detection on the preprocessed image through an edge detection operator to obtain a contour in the image;
classifying the detected outline according to each chip, and removing the outline of the incomplete chip;
reading pixel-level edges of each contour corresponding to original image positions by combining the third data, respectively obtaining gray values of a limited number of pixel points at the original image positions along the left and right sides of the gradient direction, performing polynomial fitting for three times by using the gray values of the limited number of pixel points, and taking inflection points of fitted curves as sub-pixel edge points;
classifying the obtained sub-pixel edge points according to the correspondence of each chip to form a plurality of sub-pixel edge point sets, and enabling each chip to correspond to only one sub-pixel edge point set;
and performing straight line fitting on the sub-pixel edge point set corresponding to each chip, and solving the error information of each chip.
Further, the first threshold distance is specifically 5mm.
The application also provides a drift positioning measurement device of the fan-out type package chip of the large plate, which comprises,
the error compensation model construction module comprises,
a motion platform data acquisition unit for acquiring first data acquired by the laser interferometer, obtaining straightness and verticality related information of the motion platform according to the first data,
the model building unit is used for calculating according to the first data so as to build the error compensation model;
the drift positioning measurement module comprises a drift positioning measurement module,
a chip data acquisition unit for acquiring second data acquired by the machine vision system, wherein the second data comprises image information of the large fan-out type packaged chip,
a moving platform position data acquisition unit for acquiring third data acquired by a grating ruler carried on a X, Y, Z shaft of the moving platform, wherein the third data is used for feeding back real-time position information of the moving platform,
an error information calculation unit for combining the third data according to the image information to obtain error information of the chip, wherein the error information comprises the offset of the chip at the actual position and the central position when the chip is at the theoretical position and the deflection angle of the chip,
and the error compensation unit is used for carrying out error compensation on the chip according to the error information and the established error compensation model.
The application also proposes a computer-readable storage medium storing a computer program which, when executed by a processor, implements the steps of the method according to any one of claims 1-6.
The beneficial effects of the application are as follows:
the application combines the advantages of software measurement and mechanical compensation, and by measuring the straightness, positioning accuracy and verticality of the motion platform in advance by utilizing the laser interferometer, an error compensation model is established, and the accumulated error generated in the process of collecting images by the camera is reduced. In the image positioning process, the contour of each chip is subjected to sub-pixel edge positioning through a sub-pixel edge detection algorithm, so that the positioning accuracy reaches the sub-pixel level. Meanwhile, accumulated errors can be effectively reduced through motion platform error compensation. The positioning accuracy of the large-plate fan-out packaging chip positioning system can reach the micron level by combining two advantages, and the requirements of chip packaging positioning can be met.
Drawings
The above and other features of the present disclosure will become more apparent from the detailed description of the embodiments illustrated in the accompanying drawings, in which like reference numerals designate like or similar elements, and which, as will be apparent to those of ordinary skill in the art, are merely some examples of the present disclosure, from which other drawings may be made without inventive effort, wherein:
FIG. 1 is a schematic diagram of the error principle of the drift positioning measurement method of a fan-out type package chip with a large plate according to the present application;
FIG. 2 is a flow chart showing the operation of the drift position measurement method of the fan-out type package chip of the large board of the application;
FIG. 3 illustrates a path of an industrial camera acquiring images of a drift location measurement method of a large fan-out type packaged chip of the present application;
FIG. 4 is a schematic diagram of the motion platform according to the present application;
FIG. 5 is a schematic diagram showing the X-axis positioning accuracy of the method for measuring the drift positioning of a fan-out type package chip of the present application;
FIG. 6 is a diagram showing the Y-axis positioning accuracy of the method for measuring the drift positioning of a fan-out type package chip of the present application;
FIG. 7 is a schematic diagram showing the perpendicularity measurement of a laser interferometer of the drift positioning measurement method of the fan-out type package chip of the large plate of the present application;
FIG. 8 is a diagram showing a camera coordinate system and a machine tool coordinate system of a drift positioning measurement method of a fan-out type package chip of a large board according to the present application;
fig. 9 shows the chip coordinates in the large-board coordinate system of the method for measuring the drift position of the large-board fan-out type packaged chip of the present application.
Detailed Description
The conception, specific structure, and technical effects produced by the present application will be clearly and completely described below with reference to the embodiments and the drawings to fully understand the objects, aspects, and effects of the present application. It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The same reference numbers will be used throughout the drawings to refer to the same or like parts.
Referring to fig. 1,2, 3 and 4, embodiment 1 of the present application proposes a drift positioning measurement method for a fan-out type package chip with a large board, comprising the following steps:
an error compensation model is constructed, comprising,
acquiring first data acquired by a laser interferometer, acquiring straightness and verticality related information of a motion platform according to the first data,
calculating according to the first data so as to establish the error compensation model;
the drift location measurement, including,
acquiring second data acquired by the machine vision system, wherein the second data comprises image information of a large-plate fan-out type packaged chip,
acquiring third data acquired by a grating ruler carried on a X, Y, Z shaft of the motion platform, wherein the third data is used for feeding back real-time position information of the motion platform,
obtaining error information of the chip by combining the third data according to the image information, wherein the error information comprises the offset of the chip at the actual position and the central position when the chip is at the theoretical position and the deflection angle of the chip,
and according to the error information, combining the established error compensation model to carry out error compensation on the chip.
With reference to fig. 4 in terms of hardware, the motion platform is mainly a marble platform and mainly comprises a movable X, Y and Z three-axis loaded high-precision grating ruler.
The machine vision system mainly comprises a camera, a light source and a computer control end.
The application adopts a single industrial camera to collect images and measure positioning of the fan-out packaged chips of the large plate. The camera in the image acquisition system shown in fig. 4 is mounted on the Z axis of the moving platform, focusing is performed on the camera by moving the Z axis, and the X and Y axes of the moving platform move the camera to a proper position. In order to ensure that an image with high single-pixel precision is acquired, the field of view of the acquired image is usually small, and a large image is acquired through an X-axis mobile camera and a Y-axis mobile camera of a mobile motion platform for a plurality of times.
As a preferred embodiment of the present application, the straightness and verticality related information of the motion platform is obtained specifically by,
the Y axis and the Z axis of the motion platform are kept unchanged, data measured by the laser interferometer are recorded every first threshold distance through the X axis of the motion platform, repeated measurement is carried out for a plurality of times in an effective stroke through the motion platform, the positioning accuracy and the straightness of the X axis of the motion platform measured by the laser interferometer are recorded, the positioning accuracy and the straightness of the Y axis are measured similarly, the straightness of the motion platform measured by the laser interferometer is a reference axis measured by measuring the straightness of the first axis of the motion platform and fitting a straight line as the straightness, the straightness of the second axis is measured under the condition that the measurement reference of the first axis is unchanged, and the horizontal straightness of the X, Y axis of the motion platform is calculated to be theta through the fitted straight line.
As shown in fig. 7, the 5529A-dynamic calibrator (laser interferometer) measures the perpendicularity of the motion platform by measuring the straightness of the first axis of the motion platform and fitting a straight line as a reference axis for measuring the perpendicularity, and measures the straightness of the second axis under the condition that the measurement reference of the first axis is unchanged, and obtains the perpendicularity of the X, Y axis of the motion platform as θ by fitting the straight line.
Before chip positioning measurement, the motion error of the motion platform is measured, and an error model is established for the position compensation of the subsequent chip positioning. The application uses a high-precision laser interferometer to measure the error of the motion platform. The specific measurement method is as follows: the Y axis and the Z axis of the motion platform are kept motionless, the data measured by the laser interferometer is recorded every 5mm through the X axis of the motion platform, repeated measurement is carried out for a plurality of times in the effective stroke through controlling the motion platform, and the positioning precision and the straightness of the X axis of the motion platform measured by the laser interferometer are recorded. And similarly, measuring the positioning progress and straightness of the Y axis and the verticality of the X and Y axes. And establishing a motion error model of the motion platform by using the measured positioning accuracy and verticality of the X and Y axes of the motion platform and the straightness of the X and Y axes. The error between the theoretical position and the actual position of the moving platform moving from any one position to the other position can be calculated through the error model.
As a preferred embodiment of the present application, the calculating and thus establishing the error compensation model according to the first data includes, in particular,
the positioning error model established by the positioning error generated by the motion platform is as follows,
and determining that the measuring stroke of the X axis and the Y axis is 500mm according to the size of the panel to be measured, and simultaneously taking 11 measuring target points for equidistant measurement according to the relevant regulations of national standard GB/T17421.2_2000. Repeated measurements were performed using a laser interferometer, the results of which are shown in fig. 5 and 6: the method comprises the steps of carrying out equidistant measurement on 11 measurement target points by a laser interferometer, establishing a positioning error model by the positioning error of a motion platform as follows,
δ x ＝a 1 x+b 1 (13)
δ y ＝a 2 y 2 +b 2 y+c 2 (14)
delta in x For X-axis positioning error, delta y Is Y-axis positioning error, x is displacement of the motion platform, a 1 、a 2 、b 1 、b 2 、c 2 Are all constants;
obtaining an error model of the second axis resulting from errors caused by the straightness of the first axis,
a fifth order polynomial is used to fit the straightness error curve of X, Y axis,
ε＝a 3 x 5 +b 3 x 4 +c 3 x 3 +d 3 x 2 +e 3 x+f 3 (15)
the motion platform positioning error model established by the straightness and the positioning accuracy of the motion platform is as follows:
Δ x ＝δ x +ε x (16)
Δ y ＝δ y +ε y (17)
wherein ε is x Substituting Y-axis displacement into (15) for X-axis positioning error due to Y-axis straightness to obtain X-axis positioning error ε due to Y-axis straightness x 。ε y The same is true.
Wherein delta is x For positioning error, delta of x-axis y Positioning error of the y axis;
the actual coordinates of the motion platform are:
x actual ＝(x ideal +Δ x )+(y ideal +Δ y )sinθ (18)
y actual ＝(y ideal +Δ y )cosθ(19)。
as a preferred embodiment of the present application, the second data acquisition mode specifically includes,
controlling an industrial camera of the machine vision system to move to an initial position;
the industrial camera is controlled to circularly collect images through the planned path until the complete images are collected;
the path is planned to follow the following rules,
the method comprises the steps of presetting a plurality of image acquisition areas for the industrial camera, and ensuring that the acquired images have overlapping parts when the industrial camera is positioned in the adjacent image acquisition areas in order to ensure that the images of all chips can be completely acquired.
As a preferred embodiment of the present application, the obtaining the error information of the chip by combining the third data according to the image information includes, in particular,
image preprocessing is carried out on the acquired image so as to reduce noise of the image;
carrying out edge detection on the preprocessed image through an edge detection operator to obtain a contour in the image;
classifying the detected outline according to each chip, and removing the outline of the incomplete chip;
reading pixel-level edges of each contour corresponding to original image positions by combining the third data, respectively obtaining gray values of a limited number of pixel points at the original image positions along the left and right sides of the gradient direction, performing polynomial fitting for three times by using the gray values of the limited number of pixel points, and taking inflection points of fitted curves as sub-pixel edge points;
classifying the obtained sub-pixel edge points according to the correspondence of each chip to form a plurality of sub-pixel edge point sets, and enabling each chip to correspond to only one sub-pixel edge point set;
and performing straight line fitting on the sub-pixel edge point set corresponding to each chip, and solving the error information of each chip.
Specifically, the method comprises the following steps of fitting the edges of the sub-pixels by adopting a least square method, wherein a linear edge mathematical model is as follows:
y＝ax+b (6)
the point set (x) of the straight edge of one chip 1 ，y 1 )，(x 2 ，y 2 )......(x n ，y n ) And (i=1, 2, …, n) is substituted into the formula (7) to obtain the residual square sum Q of the actual edge and the fitting edge.
The above formula derives a and b, makes the derivative zero, and calculates parameters a and b of the edge by the minimum residual square sum.
Fitting the four edges of the chip to obtain four edge lines of the chip, and solving intersection points A (x) a ，y a )、B(x b ，y b )、C(x c ，y c )、D(x d ，y d ). The center position of the chip (x 0 ，y 0 ) Is that
Wherein l width For the width of the image, l height Is the height of the image.
The minimum included angle between the four edge straight lines and two coordinate axes of the image coordinate system is calculated as theta 1 、θ 2 、θ 3 、θ 4 . The chip is offset by an angle of
As a preferred embodiment of the present application, the first threshold distance is specifically 5mm.
In particular, when the method provided by the application is applied,
camera calibration, as shown in fig. 8, P 0 (x 0 ，y 0 ) Is the coordinate of the center of the chip under the image coordinate system u-v, P 1 (x 1 ，y 1 ) Is the coordinates of the camera center point in the world coordinate system X-Y. The v-axis of the image coordinate system and the world coordinate axis Y cannot guarantee absolute parallelism in the camera installation process, and meanwhile, the physical size represented by a single pixel needs to be known in the process of converting the coordinates on the image coordinate system into the world coordinate system, so that the camera needs to be calibrated.
The camera declination is measured with the aid of a high-precision marmeter amplifier and a flat crystal. The flat crystal placing position is parallel to the Y axis of the moving platform, due to the interference of the straightness of the Y axis, the difference between the starting point measurement data and the reading of the ending point on the amplifier of the observation Mark measuring instrument in the movement process of the Y axis indicates that the flat crystal placing is parallel to the Y axis if the difference is smaller than 3um, the camera acquires images of 10 groups of flat crystal edges, the flat crystal edges are obtained by utilizing sub-pixel edge detection, and the deflection angle phi between the flat crystal edges and the v axis of a camera coordinate system is obtained 1 、φ 2 …φ 10 . The camera horizontal deflection angle phi 0 The method comprises the following steps:
the single pixel accuracy of the image is measured, calibrated herein using a standard calibration plate. The standard correction plates are randomly placed on the measurement platform, the camera is controlled to collect 10 identical round holes on the correction plates with different placement positions, the outlines of the 10 round holes are extracted, and the sub-pixel edges of the round holes are obtained through sub-pixel edge detection. Finally, calculating the radius ri of the circular hole in an ellipse fitting mode, wherein the physical dimension delta d represented by a single pixel of the camera is as follows:
wherein r is actual To correct the actual size of the circular holes in the plate.
Thus, the camera at point (x) is obtained from the formulas (11), (12), (15-20) ideal ，y ideal ) The actual position of the chip (x actual_1 ，ya ctual_1 ) The method comprises the following steps:
[x actual_1 y actual_1 1]＝[x actual y actual 1]
offset angle θ of chip actual The method comprises the following steps:
θ actual ＝θ 0 -φ 0 (24)
as shown in fig. 9, the black small rectangles are a plurality of chips to be detected on the substrate, and the black dots a (x a ，y a )、B(x b ，y b )、C(x c ，y c ) The circle center of the datum point on the base plate is phi, and the included angle between the large plate coordinate system and the motion platform coordinate system is phi. Point (X) 2 ，Y 2 ) For the actual position of the motion platform motion under the motion platform coordinate system, the chip position on the chip processing drawing is based on the coordinates under the large plate coordinate system, so that the chip coordinates need to be converted from the machine tool coordinate system to the large plate coordinate system.
The actual positions of the chip under the large plate coordinate system are as follows:
the application provides a drift positioning measuring device of a fan-out type package chip of a large plate, which comprises,
the error compensation model construction module comprises,
a motion platform data acquisition unit for acquiring first data acquired by the laser interferometer, obtaining straightness and verticality related information of the motion platform according to the first data,
the model building unit is used for calculating according to the first data so as to build the error compensation model;
the drift positioning measurement module comprises a drift positioning measurement module,
a chip data acquisition unit for acquiring second data acquired by the machine vision system, wherein the second data comprises image information of the large fan-out type packaged chip,
a moving platform position data acquisition unit for acquiring third data acquired by a grating ruler carried on a X, Y, Z shaft of the moving platform, wherein the third data is used for feeding back real-time position information of the moving platform,
an error information calculation unit for combining the third data according to the image information to obtain error information of the chip, wherein the error information comprises the offset of the chip at the actual position and the central position when the chip is at the theoretical position and the deflection angle of the chip,
and the error compensation unit is used for carrying out error compensation on the chip according to the error information and the established error compensation model.
The application also proposes a computer-readable storage medium storing a computer program which, when executed by a processor, implements the steps of the method according to any one of claims 1-6.
The modules described as separate components may or may not be physically separate, and components shown as modules may or may not be physical modules, i.e., may be located in one place, or may be distributed over a plurality of network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution in this embodiment.
In addition, each functional module in each embodiment of the present application may be integrated into one processing module, or each module may exist alone physically, or two or more modules may be integrated into one module. The integrated modules may be implemented in hardware or in software functional modules.
The integrated modules, if implemented in the form of software functional modules and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on this understanding, the present application may implement all or part of the flow of the method of the above embodiment, or may be implemented by a computer program to instruct related hardware, where the computer program may be stored in a computer readable storage medium, and when the computer program is executed by a processor, the computer program may implement the steps of each of the method embodiments described above. Wherein the computer program comprises computer program code which may be in source code form, object code form, executable file or some intermediate form etc. The computer readable medium may include: any entity or device capable of carrying the computer program code, a recording medium, a U disk, a removable hard disk, a magnetic disk, an optical disk, a computer Memory, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), an electrical carrier signal, a telecommunications signal, a software distribution medium, and so forth. It should be noted that the computer readable medium may include content that is subject to appropriate increases and decreases as required by jurisdictions in which such content is subject to legislation and patent practice, such as in certain jurisdictions in which such content is not included as electrical carrier signals and telecommunication signals.
While the present application has been described in considerable detail and with particularity with respect to several described embodiments, it is not intended to be limited to any such detail or embodiments or any particular embodiment, but is to be construed as providing broad interpretation of such claims by reference to the appended claims in view of the prior art so as to effectively encompass the intended scope of the application. Furthermore, the foregoing description of the application has been presented in its embodiments contemplated by the inventors for the purpose of providing a useful description, and for the purposes of providing a non-essential modification of the application that may not be presently contemplated, may represent an equivalent modification of the application.
The present application is not limited to the above embodiments, but is merely preferred embodiments of the present application, and the present application should be construed as being limited to the above embodiments as long as the technical effects of the present application are achieved by the same means. Various modifications and variations are possible in the technical solution and/or in the embodiments within the scope of the application.
Claims (5)
1. The drift positioning measurement method of the large fan-out type packaging chip is characterized by comprising the following steps of:
an error compensation model is constructed, comprising,
acquiring first data acquired by a laser interferometer, acquiring straightness and verticality related information of a motion platform according to the first data,
calculating according to the first data so as to establish the error compensation model;
the drift location measurement, including,
acquiring second data acquired by the machine vision system, wherein the second data comprises image information of a large-plate fan-out type packaged chip,
acquiring third data acquired by a grating ruler carried on a X, Y, Z shaft of the motion platform, wherein the third data is used for feeding back real-time position information of the motion platform,
obtaining error information of the chip by combining the third data according to the image information, wherein the error information comprises the offset of the chip at the actual position and the central position when the chip is at the theoretical position and the deflection angle of the chip,
according to the error information, combining the established error compensation model to carry out error compensation on the chip;
specifically, the straightness and verticality related information of the motion platform is obtained in a manner that,
keeping the Y axis and the Z axis of the motion platform unchanged, recording data measured by the laser interferometer once every a first threshold distance through the X axis of the motion platform, repeatedly measuring in an effective stroke through controlling the motion platform, recording the positioning precision and the straightness of the X axis of the motion platform measured by the laser interferometer, and similarly measuring the positioning precision and the straightness of the Y axis, wherein the straightness of the motion platform measured by the laser interferometer is a reference axis measured by measuring the straightness of the first axis of the motion platform and fitting a straight line as the straightness, measuring the straightness of the second axis under the condition that the measurement reference of the first axis is unchanged, and obtaining the horizontal straightness of the X, Y axis of the motion platform by fitting the straight line to be theta;
specifically, the calculating according to the first data further establishes the error compensation model, including the following,
the positioning error model established by the positioning error generated by the motion platform is as follows,
the method comprises the steps of carrying out equidistant measurement on 11 measurement target points by a laser interferometer, establishing a positioning error model by the positioning error of a motion platform as follows,
δ x ＝a 1 x+b 1 (13)
δ y ＝a 2 y 2 +b 2 y+c 2 (14)
delta in x For X-axis positioning error, delta y Is Y-axis positioning error, x is displacement of the motion platform, a 1 、a 2 、b 1 、b 2 、c 2 Are all constants;
obtaining an error model of the second axis resulting from errors caused by the straightness of the first axis,
a fifth order polynomial is used to fit the straightness error curve of X, Y axis,
ε＝a 3 x 5 +b 3 x 4 +c 3 x 3 +d 3 x 2 +e 3 x+f 3 (15)
the motion platform positioning error model established by the straightness and the positioning accuracy of the motion platform is as follows:
Δ x ＝δ x +ε x (16)
Δ y ＝δ y +ε y (17)
wherein delta is x For positioning error, delta of x-axis y Positioning error of the y axis;
the actual coordinates of the motion platform are:
x actual ＝(x ideal +Δ x )+(y ideal +Δ y )sinθ (18)
y actual ＝(y ideal +Δ y )cosθ (19)；
the step of combining the third data according to the image information to obtain error information of the chip comprises the following steps,
image preprocessing is carried out on the acquired image so as to reduce noise of the image;
carrying out edge detection on the preprocessed image through an edge detection operator to obtain a contour in the image;
classifying the detected outline according to each chip, and removing the outline of the incomplete chip;
reading pixel-level edges of each contour corresponding to original image positions by combining the third data, respectively obtaining gray values of a limited number of pixel points at the original image positions along the left and right sides of the gradient direction, performing polynomial fitting for three times by using the gray values of the limited number of pixel points, and taking inflection points of fitted curves as sub-pixel edge points;
classifying the obtained sub-pixel edge points according to the correspondence of each chip to form a plurality of sub-pixel edge point sets, and enabling each chip to correspond to only one sub-pixel edge point set;
performing straight line fitting on the sub-pixel edge point set corresponding to each chip to obtain error information of each chip,
specifically, the method comprises the following steps of fitting the edges of the sub-pixels by adopting a least square method, wherein a linear edge mathematical model is as follows:
y＝ax+b (6)
the point set (x) of the straight edge of one chip 1 ,y 1 ),(x 2 ,y 2 )……(x n ,y n ) (i=1, 2, …, n) is substituted into formula (7) to find the sum of squares Q of the residuals of the actual edge and the fitted edge,
the above derives a, b, makes the derivative zero, calculates the parameters a and b of the edge by the minimum residual square sum,
fitting the four edges of the chip to obtain four edge lines of the chip, and solving intersection points A (x) a ,y a )、B(x b ,y b )、C(x c ,y c )、D(x d ,y d ) Then the center position (x 0 ,y 0 ) Is that
Wherein l width For the width of the image, l height For the height of the image it is,
the minimum included angle between the four edge straight lines and two coordinate axes of the image coordinate system is calculated as theta 1 、θ 2 、θ 3 、θ 4 The chip is offset by an angle of
2. The method for measuring drift position of a fan-out package chip of claim 1, wherein the second data acquisition method comprises,
controlling an industrial camera of the machine vision system to move to an initial position;
the industrial camera is controlled to circularly collect images through the planned path until the complete images are collected;
the path is planned to follow the following rules,
the method comprises the steps of presetting a plurality of image acquisition areas for the industrial camera, and ensuring that the acquired images have overlapping parts when the industrial camera is positioned in the adjacent image acquisition areas in order to ensure that the images of all chips can be completely acquired.
3. The method for measuring drift position of a large fan-out package chip according to claim 1, wherein the first threshold distance is specifically 5mm.
4. The drift positioning measurement device of the fan-out type package chip of the large plate is characterized by comprising,
the error compensation model construction module comprises,
a motion platform data acquisition unit for acquiring first data acquired by the laser interferometer, obtaining straightness and verticality related information of the motion platform according to the first data,
the model building unit is used for calculating according to the first data so as to build the error compensation model;
the drift positioning measurement module comprises a drift positioning measurement module,
a chip data acquisition unit for acquiring second data acquired by the machine vision system, wherein the second data comprises image information of the large fan-out type packaged chip,
a moving platform position data acquisition unit for acquiring third data acquired by a grating ruler carried on a X, Y, Z shaft of the moving platform, wherein the third data is used for feeding back real-time position information of the moving platform,
an error information calculation unit for combining the third data according to the image information to obtain error information of the chip, wherein the error information comprises the offset of the chip at the actual position and the central position when the chip is at the theoretical position and the deflection angle of the chip,
the error compensation unit is used for carrying out error compensation on the chip according to the error information and the established error compensation model;
specifically, the straightness and verticality related information of the motion platform is obtained in a manner that,
keeping the Y axis and the Z axis of the motion platform unchanged, recording data measured by the laser interferometer once every a first threshold distance through the X axis of the motion platform, repeatedly measuring in an effective stroke through controlling the motion platform, recording the positioning precision and the straightness of the X axis of the motion platform measured by the laser interferometer, and similarly measuring the positioning precision and the straightness of the Y axis, wherein the straightness of the motion platform measured by the laser interferometer is a reference axis measured by measuring the straightness of the first axis of the motion platform and fitting a straight line as the straightness, measuring the straightness of the second axis under the condition that the measurement reference of the first axis is unchanged, and obtaining the horizontal straightness of the X, Y axis of the motion platform by fitting the straight line to be theta;
specifically, the calculating according to the first data further establishes the error compensation model, including the following,
the positioning error model established by the positioning error generated by the motion platform is as follows,
the method comprises the steps of carrying out equidistant measurement on 11 measurement target points by a laser interferometer, establishing a positioning error model by the positioning error of a motion platform as follows,
δ x ＝a 1 x+b 1 (13)
δ y ＝a 2 y 2 +b 2 y+c 2 (14)
delta in x For X-axis positioning error, delta y Is Y-axis positioning error, x is displacement of the motion platform, a 1 、a 2 、b 1 、b 2 、c 2 Are all constants;
obtaining an error model of the second axis resulting from errors caused by the straightness of the first axis,
a fifth order polynomial is used to fit the straightness error curve of X, Y axis,
ε＝a 3 x 5 +b 3 x 4 +c 3 x 3 +d 3 x 2 +e 3 x+f 3 (15)
the motion platform positioning error model established by the straightness and the positioning accuracy of the motion platform is as follows:
Δ x ＝δ x +ε x (16)
Δ y ＝δ y +ε y (17)
wherein delta is x For positioning error, delta of x-axis y Positioning error of the y axis;
the actual coordinates of the motion platform are:
x actual ＝(x ideal +Δ x )+(y ideal +Δ y )sinθ (18)
y actual ＝(y ideal +Δ y )cosθ (19)；
the step of combining the third data according to the image information to obtain error information of the chip comprises the following steps,
image preprocessing is carried out on the acquired image so as to reduce noise of the image;
carrying out edge detection on the preprocessed image through an edge detection operator to obtain a contour in the image;
classifying the detected outline according to each chip, and removing the outline of the incomplete chip;
reading pixel-level edges of each contour corresponding to original image positions by combining the third data, respectively obtaining gray values of a limited number of pixel points at the original image positions along the left and right sides of the gradient direction, performing polynomial fitting for three times by using the gray values of the limited number of pixel points, and taking inflection points of fitted curves as sub-pixel edge points;
classifying the obtained sub-pixel edge points according to the correspondence of each chip to form a plurality of sub-pixel edge point sets, and enabling each chip to correspond to only one sub-pixel edge point set;
performing straight line fitting on the sub-pixel edge point set corresponding to each chip to obtain error information of each chip,
specifically, the method comprises the following steps of fitting the edges of the sub-pixels by adopting a least square method, wherein a linear edge mathematical model is as follows:
y＝ax+b (6)
the point set (x) of the straight edge of one chip 1 ,y 1 ),(x 2 ,y 2 )……(x n ,y n ) (i=1, 2, …, n) is substituted into formula (7) to find the sum of squares Q of the residuals of the actual edge and the fitted edge,
the above derives a, b, makes the derivative zero, calculates the parameters a and b of the edge by the minimum residual square sum,
fitting the four edges of the chip to obtain four edge lines of the chip, and solving intersection points A (x) a ,y a )、B(x b ,y b )、C(x c ,y c )、D(x d ,y d ) Then the center position (x 0 ,y 0 ) Is that
Wherein l width For the width of the image, l height For the height of the image it is,
the minimum included angle between the four edge straight lines and two coordinate axes of the image coordinate system is calculated as theta 1 、θ 2 、θ 3 、θ 4 The chip is offset by an angle of
5. A computer readable storage medium storing a computer program, characterized in that the computer program when executed by a processor implements the steps of the method according to any of claims 1-3.
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