CN113692198B - Silicon-aluminum alloy built-in cooling structure and forming method thereof - Google Patents
Silicon-aluminum alloy built-in cooling structure and forming method thereof Download PDFInfo
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- CN113692198B CN113692198B CN202110988962.2A CN202110988962A CN113692198B CN 113692198 B CN113692198 B CN 113692198B CN 202110988962 A CN202110988962 A CN 202110988962A CN 113692198 B CN113692198 B CN 113692198B
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Abstract
The silicon powder and the aluminum powder are mixed in proportion and manufactured into a cooling structure with a cooling pipe arranged inside through an integral forming process, the cooling structure and the silicon-aluminum alloy powder are manufactured into a structure which is more compact through the integral forming process, namely, no gap exists between the silicon-aluminum alloy matrix and the cooling pipe, so that heat absorbed by the silicon-aluminum alloy matrix can enter the cooling pipe rapidly and is discharged from the cooling pipe, and the cooling structure is guaranteed to absorb heat rapidly to cool a target. In addition, the silicon-aluminum alloy material with low thermal expansion coefficient and high thermal conductivity can be prepared by adjusting the mixing ratio of the silicon powder and the aluminum powder, so that the silicon-aluminum alloy material has better heat dissipation efficiency compared with other heat conduction materials under the condition of the same volume, and the volume change of the silicon-aluminum alloy material is smaller at high temperature.
Description
Technical Field
The application relates to the technical field of electronic packaging materials for electronic information industry, in particular to a silicon-aluminum alloy built-in cooling structure and a forming method thereof.
Background
With the rapid development of aerospace and electronic industries in China, military high-power electronic devices are applied in wider fields. Due to the integrated development of electronic products and electronic systems, the packaging volume is smaller and smaller, and the density is higher and higher, so that the microminiaturization development of devices depends on the progress of the advanced electronic packaging technology, and the packaging technology becomes the key for the development of the semiconductor industry. The solution of heat dissipation for high power devices is the most critical and urgent goal. Therefore, the development of a novel electronic packaging material which has excellent performance, can meet the requirements of small volume and good heat dissipation of a high-power device packaging tube shell and does not influence the expansion and contraction performance of the packaging material at high temperature is urgently required so as to meet huge market demands and development space.
Disclosure of Invention
The invention aims to provide a method for forming a silicon-aluminum alloy built-in cooling structure with good thermal conductivity, thermal expansion coefficient and weldability.
In order to achieve at least one of the above objects, embodiments of the first aspect of the present application provide a method for forming a built-in cooling structure of a silicon aluminum alloy, including the following steps:
preparing a cooling pipe, injecting molten metal into the cooling pipe, and plugging two ends of the cooling pipe;
mixing silicon powder and aluminum powder according to a proportion to prepare mixed powder;
preparing an aluminum sheath, and paving mixed powder with a first preset thickness at the bottom of the aluminum sheath;
placing the cooling pipe filled with the molten metal on the mixed powder in the aluminum sheath;
laying a second mixed powder with a preset thickness into the aluminum sheath, and covering the cooling pipe filled with molten metal;
sealing the aluminum sheath, and putting the aluminum sheath into a manufacturing furnace;
increasing the pressure in the manufacturing furnace to a preset pressure, increasing the temperature in the manufacturing furnace to a first preset temperature, and preserving the heat for a preset time;
gradually reducing the temperature in the manufacturing furnace and reducing the pressure in the manufacturing furnace to manufacture a prefabricated part;
and (3) processing the preformed part, placing the processed preformed part at a second preset temperature, and discharging the molten metal from the cooling pipe to form the cooling structure.
In some embodiments, in the step of mixing silicon powder and aluminum powder in proportion to prepare the mixed powder, the mass percentage of the silicon powder in the mixed powder is 40% to 60%, and the mass percentage of the aluminum powder in the mixed powder is 40% to 60%.
In some embodiments, the step of mixing the silicon powder and the aluminum powder in proportion to prepare the mixed powder comprises the following specific steps:
mixing 25-30% of silicon powder and 70-75% of aluminum powder by mass percent to prepare first material mixed powder;
mixing 45-55% of silicon powder and 45-55% of aluminum powder by mass percent to prepare second material mixed powder;
mixing 65-75% of silicon powder and 25-35% of aluminum powder by mass percent to prepare third material mixed powder;
the step of preparing the aluminum sheath, which is to lay the first mixed powder with the preset thickness at the bottom of the aluminum sheath, specifically comprises the following steps:
preparing an aluminum sheath, and paving a third material mixed powder and a second material mixed powder at the bottom of the aluminum sheath in sequence to form a first mixed powder layer with a preset thickness;
the step of laying the second mixed powder with preset thickness into the aluminum sheath and covering the cooling pipe filled with molten metal specifically comprises the following steps:
and sequentially paving the second material mixed powder and the first material mixed powder into the aluminum sheath to form a second mixed powder layer with preset thickness, wherein the second material mixed powder covers the cooling pipe filled with the molten metal.
In some embodiments, the step of raising the pressure in the manufacturing furnace to a preset pressure, raising the temperature in the manufacturing furnace to a first preset temperature, and keeping the temperature for a preset time includes the following specific steps:
argon is filled into the manufacturing furnace to increase the pressure in the manufacturing furnace to 100 MPa;
raising the temperature in the manufacturing furnace to 400 ℃, and preserving the heat for 1 hour;
the temperature in the manufacturing furnace was raised to 500 ℃ and maintained for 5 hours.
In some of these embodiments, the step of gradually reducing the temperature and reducing the pressure inside the manufacturing furnace, and the step of forming the preform comprises the specific steps of:
reducing the temperature in the manufacturing furnace to 400 ℃, and preserving the heat for 1 hour;
reducing the temperature in the manufacturing furnace to 350 ℃, discharging molten metal from a cooling pipe, and preserving heat for 2 hours;
reducing the temperature in the manufacturing furnace to 200 ℃, preserving the heat for 3 hours, and recovering argon;
reducing the temperature in the manufacturing furnace to 150 ℃, and preserving the heat for 1 hour;
reducing the temperature in the manufacturing furnace to 100 ℃, and preserving the heat for 3 hours;
the preform was removed and cooled to room temperature.
Embodiments of a second aspect of the present application provide a cooling structure, a silicon aluminum alloy substrate; the cooling pipe is embedded in the silicon-aluminum alloy matrix; the silicon-aluminum alloy matrix and the cooling pipe are integrally cast and molded by adopting the molding method of any one of the above.
In some embodiments, the silicon aluminum alloy matrix comprises the following components in percentage by mass:
40 to 60 percent of aluminum;
40 to 60 percent of silicon.
In some of these embodiments, the silicon aluminum alloy substrate comprises a first layer, a second layer, and a third layer disposed in that order;
the first layer comprises the following components in percentage by mass:
70-75% of aluminum;
25 to 30 percent of silicon;
the second layer comprises the following components in percentage by mass:
45 to 55 percent of aluminum;
45% -55% of silicon;
the third layer comprises the following components in percentage by mass:
25 to 35 percent of aluminum;
65 to 75 percent of silicon.
In some of these embodiments, the cooling tube is embedded within the second layer.
In some of these embodiments, the cooling tube has a cross-sectional area, in a cross-section through the axis of the cooling tube, that is no more than 40% of the cross-sectional area of the silicon aluminum alloy substrate.
The above technical scheme of this application has following advantage: the silicon powder and the aluminum powder are mixed in proportion and manufactured into the cooling structure with the built-in cooling pipe through the integrated forming process, the cooling structure and the silicon-aluminum alloy powder are manufactured into a more compact structure through the integrated forming process, namely, no gap exists between the silicon-aluminum alloy matrix and the cooling pipe, so that the heat absorbed by the silicon-aluminum alloy matrix can quickly enter the cooling pipe and is discharged from the cooling pipe, and the cooling structure can quickly absorb heat to cool a target. In addition, the silicon-aluminum alloy material with low thermal expansion coefficient and high thermal conductivity can be prepared by adjusting the mixing ratio of the silicon powder and the aluminum powder, so that the silicon-aluminum alloy material has better heat dissipation efficiency compared with other heat conduction materials under the condition of the same volume, and the volume change of the silicon-aluminum alloy material is smaller at high temperature, therefore, a silicon-aluminum alloy matrix prepared from the silicon-aluminum alloy material can be smaller under the condition of meeting the heat dissipation requirement on one hand, so that the heat dissipation of a small electronic part can be realized, the volume of the electronic part cannot be overlarge, and on the other hand, the volume change of the silicon-aluminum alloy matrix is smaller at high temperature, the deformation and the tearing caused by the violent change of the temperature cannot occur, and the service life of the product is ensured.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, which are provided for illustrative purposes only, and the proportion and number of parts in the drawings do not necessarily correspond to those of an actual product. Wherein:
FIG. 1 is a schematic cross-sectional view of a Si-Al alloy internal cooling structure according to the present application from a first perspective;
FIG. 2 is a schematic cross-sectional view of a first embodiment of a Si-Al alloy internal cooling structure according to the present application from a second perspective;
FIG. 3 is a schematic cross-sectional structural view of a second embodiment of a built-in cooling structure of silicon-aluminum alloy according to a second perspective.
Wherein, the correspondence between the reference numbers and the part names of fig. 1 to 3 is:
the silicon-aluminum alloy cooling structure comprises a silicon-aluminum alloy base body 10, a first layer 11, a second layer 12, a third layer 13 and a cooling pipe 20.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The following discussion provides a number of embodiments of the application. While each embodiment represents a single combination of applications, the different embodiments of the present application can be substituted for, or combined in combination with, the present application, and thus, the present application is also to be construed as encompassing all possible combinations of the same and/or different embodiments recited. Thus, if one embodiment comprises A, B, C and another embodiment comprises a combination of B and D, then this application should also be considered to comprise an embodiment that comprises A, B, C, D in all other possible combinations, although this embodiment may not be explicitly recited in the text below.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, however, the present application may be practiced in other ways than those described herein, and therefore the scope of the present application is not limited by the specific embodiments disclosed below.
The forming method of the silicon-aluminum alloy built-in cooling structure provided by the embodiment of the first aspect of the application comprises the following steps:
and step S10, preparing a cooling pipe, injecting molten metal into the cooling pipe, and sealing two ends of the cooling pipe.
And step S20, mixing the silicon powder and the aluminum powder according to the proportion to prepare mixed powder.
Step S30, preparing an aluminum sheath, and paving a first mixed powder with a preset thickness at the bottom of the aluminum sheath.
And step S40, placing the cooling pipe filled with the molten metal on the mixed powder in the aluminum sheath.
And step S50, paving a second mixed powder with a preset thickness into the aluminum sheath, and covering the cooling pipe filled with molten metal.
Step S60, the aluminum sheath is sealed and placed in a manufacturing furnace.
And step S70, the pressure in the manufacturing furnace is raised to a preset pressure, the temperature in the manufacturing furnace is raised to a first preset temperature, and the temperature is kept for a preset time.
Step S80, the temperature in the manufacturing furnace is gradually decreased, and the pressure in the manufacturing furnace is decreased to form a preform.
And step S90, the pre-formed piece is processed, the processed pre-formed piece is placed at a second preset temperature, and the molten metal is discharged from the cooling pipe to form a cooling structure. Specifically, the aluminum sheath is cut, and then molten metal is released at the temperature of 300 ℃ to form a cooling structure, so that the cooling structure is guaranteed to have high tensile strength and compactness.
According to the forming method of the silicon-aluminum alloy built-in cooling structure, silicon powder and aluminum powder are mixed in proportion and are manufactured into the cooling structure with the built-in cooling pipe through the integrated forming process, the cooling structure and the silicon-aluminum alloy powder are manufactured into a more compact structure through the integrated forming process, namely, no gap exists between the silicon-aluminum alloy matrix and the cooling pipe, so that heat absorbed by the silicon-aluminum alloy matrix can quickly enter the cooling pipe and is discharged from the cooling pipe, and the cooling structure is guaranteed to quickly absorb heat to cool a target. In addition, the silicon-aluminum alloy material with low thermal expansion coefficient and high thermal conductivity can be prepared by adjusting the mixing ratio of the silicon powder and the aluminum powder, so that the silicon-aluminum alloy material has better heat dissipation efficiency compared with other heat conduction materials under the condition of the same volume, and the volume change of the silicon-aluminum alloy material is smaller at high temperature, therefore, the silicon-aluminum alloy matrix prepared from the silicon-aluminum alloy material is adopted, on one hand, under the condition of meeting the heat dissipation requirement, the cooling structure can be smaller, so that the heat dissipation of a small electronic part can be realized, the overlarge volume of the electronic part cannot be caused, on the other hand, the volume change of the silicon-aluminum alloy matrix is smaller at high temperature, the deformation and the tearing caused by the violent change of the temperature cannot occur, and the service life of the product is ensured.
In one embodiment of the present application, in step S20: the mass percentage of the silicon powder in the mixed powder is 40-60%, and the mass percentage of the aluminum powder is 40-60%. Preferably, the mass percent of the silicon powder is 50%, and the mass percent of the aluminum powder is 50%.
The silicon powder and the aluminum powder in the proportion are mixed to prepare the silicon-aluminum alloy matrix with low thermal expansion coefficient and high thermal conductivity, on one hand, under the condition of meeting the heat dissipation requirement, the cooling structure can be smaller, so that heat dissipation of a small electronic part can be realized, the volume of the electronic part cannot be overlarge, on the other hand, the volume change of the silicon-aluminum alloy matrix at high temperature is smaller, the electronic part cannot be extruded by the expanded silicon-aluminum alloy matrix, and the service life of the electronic part is ensured.
In one embodiment of the present application, step S20 includes the following specific steps:
step S21, mixing 25-30% of silicon powder and 70-75% of aluminum powder by mass percent to prepare first material mixed powder. Preferably, the mass percent of the silicon powder is 27% and the mass percent of the aluminum powder is 73%.
And step S22, mixing 45-55% of silicon powder and 45-55% of aluminum powder by mass percent to prepare second material mixed powder. Preferably, the mass percent of the silicon powder is 50%, and the mass percent of the aluminum powder is 50%.
Step S23, mixing 65-75% of silicon powder and 25-35% of aluminum powder by mass percent to prepare third material mixed powder. Preferably, the mass percentage of the silicon powder is 70 percent, and the mass percentage of the aluminum powder is 30 percent.
Step S30 specifically includes: preparing an aluminum sheath, and paving a third material mixed powder and a second material mixed powder at the bottom of the aluminum sheath in sequence to form a first mixed powder layer with a preset thickness.
Step S50 specifically includes: and sequentially paving the second material mixed powder and the first material mixed powder into the aluminum sheath to form a second mixed powder layer with preset thickness, wherein the second material mixed powder covers the cooling pipe filled with the molten metal.
The first material mixed powder forms a first layer of the silicon-aluminum alloy matrix, the second material mixed powder forms a second layer of the silicon-aluminum alloy matrix, and the third material mixed powder forms a third layer of the silicon-aluminum alloy matrix. The content of the aluminum element in the first layer is high, so that the first layer has good weldability and excellent heat conductivity, the cooling structure can be effectively welded on an electronic part, and in addition, the first layer is ensured to have low thermal expansion coefficient through the proportion of the aluminum element and the silicon element. The content of the aluminum element and the silicon element in the second layer is similar, and the second layer is ensured to have the characteristics of balanced high thermal conductivity, lower thermal expansion coefficient and the like through the proportion of the aluminum element and the silicon element; the third layer has a low thermal expansion coefficient due to the high content of the silicon element, the electronic part cannot be extruded by the third layer expanding at high temperature, the service life of the electronic part is ensured, and in addition, the third layer has good thermal conductivity due to the proportion of the aluminum element and the silicon element. The cooling structure made of the gradient silicon-aluminum alloy not only meets the weldability requirement of users, but also solves the technical problems of low welding performance, high thermal expansion coefficient, low thermal conductivity and the like of the material through the structure and material proportioning design.
The parameters of the first, second and third layers are shown in the following table:
in one embodiment of the present application, step S70 includes the following specific steps:
step S71, argon gas is filled into the manufacturing furnace to raise the pressure in the manufacturing furnace to 100 MPa.
Step S72, the temperature in the manufacturing furnace is raised to 400 ℃ and kept for 1 hour.
Step S73, the temperature in the manufacturing furnace is raised to 500 ℃ and kept for 5 hours.
In one embodiment of the present application, step S80 includes the following specific steps:
and step S81, reducing the temperature in the manufacturing furnace to 400 ℃, and keeping the temperature for 1 hour.
And step S82, reducing the temperature in the manufacturing furnace to 350 ℃, and keeping the temperature for 2 hours.
Step S83, the temperature in the manufacturing furnace is reduced to 200 ℃, and the temperature is kept for 3 hours, and argon gas is recovered.
In step S84, the temperature in the manufacturing furnace is lowered to 150 ℃ and kept for 1 hour.
In step S85, the temperature in the manufacturing furnace is lowered to 100 ℃ and kept for 3 hours.
In step S86, the preform is taken out and cooled to room temperature.
The mixed powder is sintered at the first preset temperature for a long time to form a densified silicon-aluminum alloy matrix, the volume of the silicon-aluminum alloy matrix can be changed in the cooling process of the silicon-aluminum alloy matrix, and the gradual change of the temperature enables the volume of the silicon-aluminum alloy matrix to be changed gradually, so that the condition that the performance of the silicon-aluminum alloy matrix is unstable due to the fact that the silicon-aluminum alloy matrix is deformed too fast due to too fast temperature change is avoided, and the stability of the performance of the manufactured cooling structure is guaranteed.
As shown in fig. 1 to 3, embodiments of the second aspect of the present application provide a silicon aluminum alloy built-in cooling structure, a silicon aluminum alloy substrate 10, and a cooling pipe 20.
The cooling pipe 20 is embedded in the silicon-aluminum alloy matrix 10.
The silicon-aluminum alloy base body 10 and the cooling pipe 20 are integrally cast and molded by the molding method described in any one of the above.
The application provides a built-in cooling structure of silicon-aluminum alloy, can make the silicon-aluminum alloy material that has low coefficient of thermal expansion and high thermal conductivity through the proportion of mixing of adjustment silica flour and aluminite powder, thereby make silicon-aluminum alloy material compare in other heat conduction materials have better radiating efficiency silicon-aluminum alloy base member 10 under the condition of same volume, and silicon-aluminum alloy material's volume change is less under high temperature, therefore, adopt the silicon-aluminum alloy base member 10 that above-mentioned silicon-aluminum alloy material made, on the one hand, under the condition that satisfies the heat dissipation requirement, the cooling structure can be done littleer, thereby can be to the heat dissipation of miniature electron spare, can not lead to the volume of electron spare too big, on the other hand, the volume change of silicon-aluminum alloy base member 10 is less under high temperature, the electron spare can not be extruded to expanded silicon-aluminum alloy base member 10, the life of electron spare has been guaranteed. In addition, the cooling structure with the built-in cooling pipe 20 is manufactured by adopting an integral forming process, the combination between the silicon-aluminum alloy matrix 10 and the cooling pipe 20 is tighter, namely no gap exists between the silicon-aluminum alloy matrix 10 and the cooling pipe 20, so that the heat absorbed by the silicon-aluminum alloy matrix 10 can quickly enter the cooling pipe 20 and is discharged from the cooling pipe 20, and the cooling structure can quickly absorb the heat to cool the target. Silicon aluminum alloy base member 10 absorptive heat, thereby silicon aluminum alloy base member 10's outside flows to inside gradually, cooling tube 20 set up the inside and external environment intercommunication that can make silicon aluminum alloy base member 10, silicon aluminum alloy base member 10's heat radiating area has been increased promptly, thereby make the inside heat of silicon aluminum alloy base member 10 distribute to the air through cooling tube 20's cavity in, and then make silicon aluminum alloy base member 10's temperature reduce fast, guaranteed that cooling structure can absorb the heat fast and cool down the target.
As shown in fig. 2, in an embodiment of the present application, the silicon aluminum alloy substrate 10 is made of a single silicon aluminum alloy, and the silicon aluminum alloy substrate 10 includes the following components by mass percent:
40 to 60 percent of aluminum.
40 to 60 percent of silicon.
Preferably, the silicon-aluminum alloy matrix 10 includes the following components by mass:
and 50% of aluminum.
50% of silicon.
The silicon powder and the aluminum powder in the proportion are mixed to prepare the silicon-aluminum alloy matrix 10 with good weldability, low thermal expansion coefficient and high thermal conductivity, on one hand, under the condition of meeting the heat dissipation requirement, the cooling structure can be made smaller, so that heat dissipation of a small electronic part can be realized, the volume of the electronic part cannot be overlarge, on the other hand, the volume change of the silicon-aluminum alloy matrix 10 at high temperature is smaller, the electronic part cannot be extruded by the expanded silicon-aluminum alloy matrix 10, and the service life of the electronic part is ensured.
In a particular embodiment of the present application, the distance D between the cooling tube 20 and the contact surface between the silicon aluminum alloy substrate 10 and the electronic component is greater than 0.5 cm.
As shown in fig. 3, in one embodiment of the present application, a silicon aluminum alloy substrate 10 includes a first layer 11, a second layer 12, and a third layer 13, which are provided in this order.
The first layer 11 comprises the following components in percentage by mass:
70 to 75 percent of aluminum.
25 to 30 percent of silicon.
The second layer 12 comprises the following components in percentage by mass:
45 to 55 percent of aluminum.
45 to 55 percent of silicon.
The third layer 13 comprises the following components in percentage by mass:
25 to 35 percent of aluminum.
65 to 75 percent of silicon.
The first layer 11 has a high content of aluminum, so that the first layer 11 has good weldability and excellent thermal conductivity, the cooling structure can be effectively welded on an electronic part, and in addition, the first layer 11 has a low thermal expansion coefficient through the proportion of the aluminum and the silicon. The content of the aluminum element and the silicon element in the second layer 12 is similar, and the second layer 12 is ensured to have the characteristics of balanced high thermal conductivity, low thermal expansion coefficient and the like through the proportion of the aluminum element and the silicon element; the content of the silicon element in the third layer 13 is high, so that the third layer 13 has a very low thermal expansion coefficient, the third layer 13 expanding at a high temperature cannot extrude an electronic part, the service life of the electronic part is ensured, and in addition, the third layer 13 is ensured to have good thermal conductivity through the proportion of the aluminum element and the silicon element. The cooling structure made of the gradient silicon-aluminum alloy not only meets the requirement of weldability of users, but also solves the technical problems of low welding performance, high thermal expansion coefficient, low thermal conductivity and the like of the material through the design of structure and material proportion, and because the contents of aluminum elements and silicon elements in the first layer 11, the second layer 12 and the third layer 13 are in gradient change and the change between adjacent layers after being heated is small, the problems of bulging, tensile crack and the like of the first layer 11, the second layer 12 and the third layer 13 in the using process are solved.
In a preferred embodiment of the present application, the first layer comprises the following components in percentage by mass:
73% of aluminum.
27% of silicon.
The second layer comprises the following components in percentage by mass:
and 50% of aluminum.
50% of silicon.
The third layer comprises the following components in percentage by mass:
30% of aluminum.
70% of silicon.
As shown in fig. 3, in one embodiment of the present application, the cooling tube 20 is embedded within the second layer 12.
Since the thermal expansion coefficient of the first layer 11 is greater than that of the second layer 12 and the third layer 13, the thinner the first layer 11 is, the better the welding requirements are satisfied; because the coefficient of thermal expansion and the thermal conductivity of the second layer 12 are relatively balanced, the cooling pipe 20 is arranged in the second layer 12, so that the heat can be effectively dissipated from the cooling pipe 20 at the position, and the cooling effect of the cooling structure is ensured. The thickness of the second layer 12 is greater than the thickness of the first layer 11.
As shown in fig. 1 to 3, in one embodiment of the present application, the cross-sectional area of the cooling pipe 20 in a cross-section passing through the axis of the cooling pipe is not more than 40% of the cross-sectional area of the silicon aluminum alloy base body 10. The cross section is the cross section with the largest area of the silicon-aluminum alloy matrix, so that the cooling structure is ensured to have good reliability.
In one embodiment of the present application, the molten metal is molten tin and the cooling tube 20 is a copper tube. The melting point of tin is relatively low (typically 275 c) and heating the tin to the melting point does not affect the base material. And the copper tube is non-toxic and does not remain in the copper tube during disposal. In the process of manufacturing the cooling structure, the tin metal in the copper pipe becomes liquid in the copper pipe under the condition of high temperature, so that the copper pipe has expansion performance, the copper pipe is started and supported, and the copper pipe is prevented from being deformed due to pressure increase.
As shown in fig. 1, in an embodiment of the present application, the cooling pipe 20 is S-shaped or serpentine, which increases a contact area between the cooling pipe 20 and the silicon-aluminum alloy substrate 10, so that heat absorbed by the silicon-aluminum alloy substrate 10 can quickly enter the cooling pipe 20 and be discharged from the cooling pipe 20, thereby ensuring that the cooling structure can quickly absorb heat to cool a target.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application. In this application, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In the description herein, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.
Claims (7)
1. A forming method of a built-in cooling structure of a silicon-aluminum alloy is characterized by comprising the following steps:
preparing a cooling pipe, injecting molten metal into the cooling pipe, and plugging two ends of the cooling pipe;
mixing silicon powder and aluminum powder according to a ratio to prepare mixed powder;
specifically, 25-30% of silicon powder and 70-75% of aluminum powder in percentage by mass are mixed to prepare first material mixed powder;
mixing 45-55% of silicon powder and 45-55% of aluminum powder by mass percent to prepare second material mixed powder;
mixing 65-75% of silicon powder and 25-35% of aluminum powder by mass percent to prepare third material mixed powder;
preparing an aluminum sheath, and paving a third material mixed powder and a second material mixed powder at the bottom of the aluminum sheath in sequence to form a first mixed powder layer with a preset thickness;
placing the cooling pipe filled with the molten metal on the mixed powder in the aluminum sheath;
sequentially laying second material mixed powder and first material mixed powder into the aluminum sheath to form a second mixed powder layer with preset thickness, wherein the second material mixed powder covers the cooling pipe filled with molten metal;
sealing the aluminum sheath, and putting the aluminum sheath into a manufacturing furnace;
filling argon into the manufacturing furnace to increase the pressure in the manufacturing furnace to 100Mpa so as to increase the pressure in the manufacturing furnace to a preset pressure, increasing the temperature in the manufacturing furnace to a first preset temperature, and preserving heat for a preset time; wherein the temperature in the manufacturing furnace is raised to 400 ℃, and the temperature is kept for 1 hour; raising the temperature in the manufacturing furnace to 500 ℃, and preserving the heat for 5 hours;
gradually reducing the temperature within the manufacturing furnace, wherein,
reducing the temperature in the manufacturing furnace to 400 ℃, and preserving the heat for 1 hour;
reducing the temperature in the manufacturing furnace to 350 ℃, and preserving the heat for 2 hours;
reducing the temperature in the manufacturing furnace to 200 ℃, preserving the heat for 3 hours, and recovering argon;
reducing the temperature in the manufacturing furnace to 150 ℃, and preserving the heat for 1 hour;
reducing the temperature in the manufacturing furnace to 100 ℃, and preserving the heat for 3 hours; reducing the pressure in the manufacturing furnace to manufacture a prefabricated part; taking out the preform and cooling to room temperature;
and (3) processing the preformed piece, placing the processed preformed piece at a second preset temperature, and discharging molten metal from the cooling pipe to form the cooling structure.
2. The method for forming a cooling structure with a built-in Si-Al alloy according to claim 1,
in the step of mixing silicon powder and aluminum powder according to a proportion to prepare mixed powder, the mass percentage of the silicon powder in the mixed powder is 40-60%, and the mass percentage of the aluminum powder in the mixed powder is 40-60%.
3. A silicon-aluminum alloy built-in cooling structure is characterized in that,
a silicon-aluminum alloy substrate; and
the cooling pipe is embedded in the silicon-aluminum alloy matrix;
the silicon-aluminum alloy base body and the cooling pipe are integrally cast by the molding method as set forth in claim 2.
4. The silicon-aluminum alloy built-in cooling structure according to claim 3,
the silicon-aluminum alloy matrix comprises the following components in percentage by mass:
40 to 60 percent of aluminum;
40 to 60 percent of silicon.
5. The Si-Al alloy built-in cooling structure of claim 3,
the silicon-aluminum alloy matrix comprises a first layer, a second layer and a third layer which are arranged in sequence;
the first layer comprises the following components in percentage by mass:
70-75% of aluminum;
25 to 30 percent of silicon;
the second layer comprises the following components in percentage by mass:
45 to 55 percent of aluminum;
45% -55% of silicon;
the third layer comprises the following components in percentage by mass:
25 to 35 percent of aluminum;
65 to 75 percent of silicon.
6. The Si-Al alloy built-in cooling structure of claim 5,
the cooling pipe is embedded in the second layer.
7. The silicon-aluminum alloy built-in cooling structure according to claim 3,
the cross-sectional area of the cooling tube, in a cross-section passing through the axis of the cooling tube, is no more than 40% of the cross-sectional area of the Si-Al alloy substrate.
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Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61172709A (en) * | 1985-01-28 | 1986-08-04 | Takaoka Kogyo Kk | Manufacture of resin mold for synthetic resin molding |
| JPS625621A (en) * | 1985-07-02 | 1987-01-12 | Fuji Electric Co Ltd | Cooler of liquid-cooled coil |
| US6276433B1 (en) * | 1999-10-25 | 2001-08-21 | General Electric Company | Liquid metal cooled directional solidification process |
| CN101265516B (en) * | 2008-04-23 | 2010-06-02 | 浙江佰耐钢带有限公司 | Steel band quenching technique and cooling medium used for the same |
| JP5750237B2 (en) * | 2010-05-25 | 2015-07-15 | 株式会社Uacj | Method for producing aluminum alloy heat exchanger |
| CN102069172B (en) * | 2011-02-17 | 2012-12-26 | 北京科技大学 | Composite casting method of aluminum cooling plate |
| CN202151038U (en) * | 2011-07-04 | 2012-02-22 | 遵义航天新力精密铸锻有限公司 | Composite material heat sink |
| CN102358924B (en) * | 2011-09-30 | 2013-06-12 | 合肥工业大学 | Method for preparing gradient silicon-aluminum alloy electronic packaging material through rapid hot pressing |
| CN103420564A (en) * | 2012-05-23 | 2013-12-04 | 信义电子玻璃（芜湖）有限公司 | Tin liquid cooler |
| CN103951162B (en) * | 2014-05-10 | 2017-06-13 | 蚌埠玻璃工业设计研究院 | A kind of easy attack sites cooling device of Flat Glass Furnace pool wall |
| CN204425876U (en) * | 2015-02-27 | 2015-06-24 | 湖南恒裕新材料科技发展有限公司 | A kind of heat abstractor with composite construction |
| CN106086494B (en) * | 2016-06-08 | 2017-12-22 | 航天材料及工艺研究所 | A kind of preparation method of silico-aluminum used for electronic packaging |
| CN106906388B (en) * | 2017-04-06 | 2018-05-11 | 合肥工业大学 | A kind of preparation method of silumin |
| CN108305853B (en) * | 2018-01-26 | 2019-10-25 | 中国电子科技集团公司第三十八研究所 | A kind of assembling of microwave module solid and encapsulating structure based on silico-aluminum box body |
| CN109590674A (en) * | 2018-10-24 | 2019-04-09 | 百路达（厦门）工业有限公司 | A kind of deep hole processing method of metalwork |
| CN110303161B (en) * | 2019-07-31 | 2021-04-06 | 哈尔滨铸鼎工大新材料科技有限公司 | Gradient silicon-aluminum-silicon carbide electronic packaging composite material and preparation method thereof |
| CN110729251B (en) * | 2019-11-12 | 2021-09-10 | 泰州铸鼎新材料制造有限公司 | Built-in flow channel electronic packaging module based on gradient silicon-aluminum alloy and forming method thereof |
| CN111168023A (en) * | 2019-12-23 | 2020-05-19 | 天津市航宇嘉瑞科技股份有限公司 | Cooling water tank for rapidly solidifying high-purity aluminum-silicon alloy |
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Denomination of invention: A silicon aluminum alloy built-in cooling structure and its forming method Effective date of registration: 20230925 Granted publication date: 20220719 Pledgee: Heilongjiang Xinzheng financing guarantee Group Co.,Ltd. Pledgor: Harbin Ding Ding Institute of new Mstar Technology Ltd. Registration number: Y2023230000081 |