CN113692155A

CN113692155A - Power supply and electric equipment

Info

Publication number: CN113692155A
Application number: CN202110888026.4A
Authority: CN
Inventors: 常明亮; 汪经伟; 官继红
Original assignee: Shenzhen Megmeet Electrical Co Ltd
Current assignee: Shenzhen Megmeet Electrical Co Ltd
Priority date: 2021-08-03
Filing date: 2021-08-03
Publication date: 2021-11-23

Abstract

The embodiment of the invention relates to the technical field of power supply heat dissipation, and particularly discloses a power supply and electric equipment, wherein the power supply comprises: a high voltage component; a low voltage component; the water cooling shell comprises a water cooling shell body and an extension part, wherein the extension part extends from the water cooling shell body, the water cooling shell body wraps a high-pressure assembly, the extension part contains part of low-pressure assemblies, the water cooling shell body is provided with a cooling channel penetrating through the water cooling shell body, the cooling channel is arranged around the high-pressure assembly, and cooling liquid is infused into the cooling channel; and the encapsulating layer wraps the water-cooling shell body and the high-pressure assembly, and is formed after the encapsulating material high-pressure encapsulating water-cooling shell body is solidified. By the mode, the power supply can be cooled, the oil leakage risk caused by oil cooling is avoided, and the noise trouble caused by air cooling by using the fan is avoided.

Description

Power supply and electric equipment

Technical Field

The embodiment of the invention relates to the technical field of power supply heat dissipation, in particular to a power supply and electric equipment.

Background

The power supply is a device for converting energy in other forms into electric energy, the electric energy is generated by a magnetic electricity generation principle, renewable energy sources such as solar energy and non-renewable energy sources such as coal and oil residue are used for generating power sources, and common power supplies are dry batteries (direct current) and household 110V-220V alternating current power supplies. With the development of science and technology, the demand of power supplies is getting bigger and bigger, but the cooling and heat dissipation of power supplies are always important problems in power supply design, and the service life and the normal operation of the power supplies are affected by overhigh heat.

The cooling modes commonly used at present are mainly oil cooling and air cooling. Oil cooling is to cool the power supply by using oil, the common material is dimethyl silicone oil, and the cooling purpose is mainly realized by immersing a heating device in the oil or arranging an oil cooling pipe around the heating device. And the air cooling mainly transfers heat to the outside in the form of air flow by installing a heat dissipation device such as a fan.

In the process of implementing the embodiment of the present invention, the inventors found that: at present, the existing microwave power supply usually adopts an air cooling type or an oil cooling type for heat dissipation. Oil cooling has the oil leak risk when using, inconvenient transportation, and air-cooled is fast in the heat dissipation, but with high costs, the noise is big to use back fan for a long time and can appear damaging, trouble such as overheated, especially in the great occasion of dust volume, the dust can be along with the fan rotation easily enters into the inside corruption components and parts of power, leads to the power life-span short, easily breaks down.

Disclosure of Invention

The embodiment of the invention mainly solves the technical problem of providing a power supply and electric equipment, which can avoid respective defects of oil cooling and air cooling, such as oil leakage risk, noise trouble and the like.

In order to solve the above technical problem, one technical solution adopted by the embodiments of the present invention is: the utility model provides a power supply, includes high-pressure subassembly, low pressure subassembly, water-cooling shell and encapsulating layer, include water-cooling shell body and certainly the extension that water-cooling shell body extended and obtained, water-cooling shell body parcel high-pressure subassembly, the partial low pressure subassembly is acceptd to the extension, water-cooling shell body is provided with and runs through the cooling channel of water-cooling shell body, cooling channel centers on high-pressure subassembly sets up, cooling channel infuses the coolant liquid, encapsulating layer parcel water-cooling shell body and high-pressure subassembly, the encapsulating layer is formed after encapsulating material high pressure embedment water-cooling shell body solidifies.

Optionally, the extension part comprises a bottom plate, a first side wall and a second side wall extending from the edge of the bottom plate, and the bottom plate is abutted with the low-voltage assembly; the low-voltage assembly comprises a circuit main board located above the extension portion, and a rectifier bridge and an IGBT module which are arranged on one surface of the circuit main board facing the extension portion, wherein the rectifier bridge is abutted to the first side wall, and the IGBT module is abutted to the second side wall.

Optionally, at least one of the first side wall and the second side wall is provided with at least one inclined block, and an included angle between an inclined surface of the inclined block and the side wall provided with the inclined block is an acute angle.

Optionally, the height of the upper surface of the rectifier bridge is greater than the height of the upper surface of the first side wall, and the height of the upper surface of the IGBT module is greater than the height of the upper surface of the second side wall.

Optionally, the rectifier bridge and the IGBT module are connected to the circuit board through pins, and the pins are dispensed at intervals.

Optionally, the water-cooling shell body is provided with a first through hole and a second through hole, the first through hole and the second through hole are respectively connected with two ends of the cooling channel, the first through hole is connected with a first water nozzle, and the second through hole is connected with a second water nozzle.

Optionally, the power supply further includes a housing, and the housing accommodates the potting layer, the water-cooling shell, the high-voltage component, and the low-voltage component.

Optionally, a plurality of drainage holes are formed in the bottom surface of the housing.

Optionally, a first mounting column is arranged on a first outer surface of the water-cooling shell body, a second mounting column is arranged on a second outer surface of the water-cooling shell body, and the first outer surface and the second outer surface are arranged oppositely; the shell is provided with a first mounting hole and a second mounting hole, the first mounting hole is sleeved with the first mounting column, and the second mounting hole is sleeved with the second mounting column.

According to an aspect of an embodiment of the present invention, there is provided an electric device including the power supply of any one of the above.

The embodiment of the invention has the beneficial effects that: the embodiment of the invention comprises the following steps: high pressure subassembly, low pressure subassembly, water-cooling shell and potting layer. The water cooling shell is used for realizing a cooling function and comprises a water cooling shell body and an extension part, the water cooling shell body wraps the high-pressure assembly and the cooling channel, the extension part accommodates part of the low-pressure assembly, and the heat emitted by the high-pressure assembly during working is higher than that emitted by the low-pressure assembly, so that the two parts are processed in a blocking manner; the water-cooling shell still includes cooling channel, cooling channel centers on high-pressure subassembly sets up further cooling treatment to high-pressure subassembly, the embedment layer parcel water-cooling shell body and high-pressure subassembly, the embedment layer is formed after the embedment material high pressure embedment water-cooling shell body solidifies, and the embedment layer has sealed waterproof and promotes radiating effect. The embodiment of the invention can effectively dissipate heat, avoids oil leakage risk caused by oil cooling, does not need air cooling and avoids noise trouble caused by a fan.

Drawings

FIG. 1 is an exploded view of a power supply according to an embodiment of the present invention;

FIG. 2 is a schematic diagram illustrating a power supply according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of a low voltage component in a power supply according to an embodiment of the invention;

FIG. 4 is a schematic diagram of a water-cooled housing in a power supply according to an embodiment of the invention;

FIG. 5 is a schematic view of an installation of a low voltage module and a water-cooled housing in a power supply according to an embodiment of the invention;

fig. 6 is a schematic diagram of a housing in a power supply according to an embodiment of the invention.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. If in the embodiments of the present application there is a description referring to "first", "second", etc., the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present application.

Referring to fig. 1 and 2, the power supply 1 includes: high pressure component 10, low pressure component 20, water cooled housing 30, potting layer (not shown), and outer housing 40. High pressure subassembly 10, low pressure subassembly 20, water-cooling shell 30 and potting layer are all acceptd in shell 40, and water-cooling shell 30 top-down covers high pressure subassembly 10 to water-cooling shell 30 part extends to the lower part in the region that low pressure subassembly 20 is located, low pressure subassembly 20 mainly used realizes power 1's control function, and the heat that low pressure subassembly 20 during operation gived off is lower than the heat that high pressure subassembly 10 during operation gived off, water-cooling shell 30 top-down covers high pressure subassembly 10, is favorable to promoting the cooling of high pressure subassembly 10, and low pressure subassembly 20 realizes the heat dissipation through contacting with water-cooling shell 30, realizes giving out heat differently according to high pressure subassembly 10 and low pressure subassembly 20, and water-cooling shell 30 adopts different contact radiating mode, not only is favorable to realizing the heat balance of high pressure subassembly 10 and low pressure subassembly 20, also is favorable to optimizing the structure of water-cooling shell 30.

Referring to fig. 3, the low-voltage component 20 includes a circuit board 21, a rectifier bridge 22 and an IGBT module 23, the circuit board 21 is fixed in the housing 40, and the rectifier bridge 22 and the IGBT module 23 are disposed on a surface of the circuit board 21 facing the water-cooling housing 30, so that the rectifier bridge 22 and the IGBT module 23 are disposed in an inverted manner, and the rectifier bridge 22 and the IGBT module 23 can directly contact the water-cooling housing 30. The rectifier bridge 22 and the IGBT module 23 are main heat sources of the low-voltage component 20, and the rectifier bridge 22 and the IGBT module 23 are in direct contact with the water-cooling shell 30, which is beneficial to heat dissipation of the rectifier bridge 22 and the IGBT module 23, and is further beneficial to heat dissipation of the low-voltage component 20.

In some embodiments, the IGBT module 23 is a modular semiconductor product formed by packaging an IGBT (Insulated Gate Bipolar Transistor) and a FWD (free wheeling Diode) through a specific circuit bridge. Rectifier bridge 22 with IGBT module 23 all through pin 24 with circuit board 21 connects, pin 24 is the interval point glue can strengthen waterproof nature, prevent creepage, do benefit to the embedment.

In some embodiments, the low voltage module 20 further includes a control module 25 disposed on a surface of the circuit board 21 adjacent to the housing 40, which facilitates maintenance, inspection and repair of the power supply.

Referring to fig. 3 and 4, the water-cooled shell 30 includes a water-cooled shell body 31 and an extension portion 32 extending from the water-cooled shell body 31. Water-cooling shell body 31 top-down parcel high voltage component 10, water-cooling shell body 31 is provided with and runs through the cooling channel of water-cooling shell body 31, cooling channel centers on high voltage component 10 sets up, cooling channel infuses coolant liquid, and the heat of water-cooling shell body 31 can be taken away fast to cooling channel, can improve the radiating efficiency of water-cooling shell body 31. Further, the water-cooling shell body 31 is provided with a first through hole 34 and a second through hole 35, the first through hole 34 and the second through hole 35 are respectively connected with two ends of the cooling channel, the first through hole 34 is connected with a first water nozzle 341, and the second through hole 35 is connected with a second water nozzle 351.

In some embodiments, the water-cooled shell 31 may be made of aluminum material, which has the characteristics of low density, fast heat dissipation, corrosion resistance, etc.

The extension portion 32 includes a bottom plate 321, a first sidewall 322 and a second sidewall 323 extending from the edge of the bottom plate 321, wherein the bottom plate 321 abuts against the low pressure assembly 20. The extension portion 32 is located below the circuit main board 21, the first side wall 322 abuts against the rectifier bridge 22, the second side wall 323 abuts against the IGBT module 23, heat of the IGBT module 23 can be directly transmitted to the second side wall 323, heat of the rectifier bridge 22 can be directly transmitted to the first side wall 322, then transmitted to the water-cooling shell body 31 through the second side wall 323 and the first side wall 322, and finally heat is taken away by cooling liquid in the cooling channel.

It should be noted that, in some embodiments, at least one of the first side wall 322 and the second side wall 323 is provided with at least one inclined block 3221, an included angle between an inclined surface of the inclined block 3221 and the side wall is an acute angle, where the first side wall 322 and the second side wall 323 are located below the low-voltage component 20, and the inclined block 3221 is beneficial to draining water droplets formed by cooling downward, so as to avoid the water droplets accumulating on the first side wall 322 and the second side wall 323, and causing the water droplets to contact the rectifier bridge 22 and the IGBT module 23, thereby causing a risk of short circuit between the IGBT module 23 and the rectifier bridge 22.

In some embodiments, the height of the upper surface of the rectifier bridge 22 facing the extension is greater than the height of the upper surface of the first sidewall 322, and the height of the upper surface of the IGBT module 23 is greater than the height of the upper surface of the second sidewall 323, so as to prevent water formed on the sidewalls during cooling from falling onto the upper surfaces of the rectifier bridge 22 and the IGBT module 23 and damaging the instrument.

In some embodiments, the second sidewall 323 extends with a fixing plate 3231 for mounting a pressing bar (not shown) for fixing the IGBT module 23.

To above-mentioned encapsulating layer, encapsulating layer parcel water-cooling shell body 31 and high-pressure subassembly 10, the encapsulating layer is formed for encapsulating material high pressure embedment water-cooling shell body 31 solidifies the back, the encapsulating layer has fixed, insulating, heat conduction's function for the encapsulating layer not only plays the effect of sealing water-cooling shell body 31 one side, still is favorable to water-cooling shell body 31's further heat dissipation.

In some embodiments, the potting layer encases portions of low-pressure components 20 to aid in securing and dissipating heat from low-pressure components 20.

Referring to fig. 5 and 6, the housing 40 accommodates the potting layer, the water-cooling shell 30, the high-pressure component 10, and the low-pressure component 20. The outer shell 40 is provided with a first inserting hole 41 and a second inserting hole 42, and the first water nozzle 341 and the second water nozzle 351 are respectively inserted into the first inserting hole 41 and the second inserting hole 42 and extend outwards.

It will be appreciated that in some embodiments, the bottom surface of the housing 40 is provided with a plurality of drainage holes 43, and water generated by cooling may flow out through the drainage holes 43.

In some embodiments, the first outer surface 36 of the water-cooled shell body 31 is provided with a first mounting post 361, and the second outer surface 37 of the water-cooled shell body 31 is provided with a second mounting post 371, wherein the first outer surface 36 and the second outer surface 37 are oppositely disposed. The housing 40 is provided with a first mounting hole 44 and a second mounting hole 45, the first mounting hole 44 is sleeved on the first mounting column 361, the second mounting hole 45 is sleeved on the second mounting column 371, and the high-voltage component 10 is connected with the housing 40 by the above method.

In some embodiments, the housing 40 has 2 support plates, namely a first support plate 46 and a second support plate 47, extending toward the low voltage assembly 20, the first support plate 46 is provided with a third mounting hole 461, and the second support plate 47 is provided with a fourth mounting hole 471. The extension portion 32 extends toward the circuit board 21 to form a third mounting post 324 and a fourth mounting post 325 (as shown in fig. 4). Four corners of the circuit board 21 are respectively provided with a through hole, two through holes far away from the high-voltage component 10 are a third through hole 211 and a fourth through hole 212, two through holes near the high-voltage component 10 are a fifth through hole 213 and a sixth through hole 214, the third through hole 211 and the fourth through hole 212 are respectively connected with a third mounting hole 461 and a fourth mounting hole 471 through screws, the fifth through hole 213 and the sixth through hole 214 are respectively connected with a third mounting column 324 and a fourth mounting column 325 through screws, and the connection between the low-voltage component 20 and the housing 40 is realized through the above method.

In some embodiments, the housing 40 includes a first housing 48 and a second housing 49, the first housing 48 is connected to the second housing 49 by screws, an extension plate 481 extends to both sides of the first housing 48, and a plurality of through holes 4811 are provided on the extension plate 481 for installing the fixed power supply 1.

In other embodiments, the connection mode of the first housing 48 and the second housing 49 is not limited to screw connection, and may be integrally molded. The housing 40 is not limited to the first housing 48 and the second housing 49, and may be formed by connecting a plurality of connecting plates, as long as the housing 40 can accommodate and fix the components.

In the embodiment of the present invention, the power supply 1 includes: the high-pressure assembly 10, the low-pressure assembly 20 and the water-cooling shell 30, the water-cooling shell 30 is used for realizing a cooling function, the water-cooling shell 30 comprises a water-cooling shell body 31 and an extension part 32, the water-cooling shell body 31 wraps the high-pressure assembly 10 and a cooling channel, the extension part 32 accommodates part of the low-pressure assembly 20, and the heat emitted by the high-pressure assembly 10 during working is higher than that emitted by the low-pressure assembly 20, so that the two parts are processed in a blocking manner; the water-cooled shell 30 further comprises a cooling channel arranged around the high-voltage component 10 for further cooling of the high-voltage component 10. The embodiment of the invention can effectively dissipate heat and avoid inherent defects of the conventional oil cooling and air cooling technology, such as oil leakage risk and noise trouble.

The invention further provides an embodiment of an electric device, the electric device includes the power supply 1, and for the structure of the power supply 1, reference may be made to the above embodiment, which is not described herein again.

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A power supply, comprising:

a high voltage component;

a low voltage component;

the water cooling shell comprises a water cooling shell body and an extension part, wherein the extension part extends from the water cooling shell body, the water cooling shell body wraps a high-pressure assembly, the extension part contains part of low-pressure assemblies, the water cooling shell body is provided with a cooling channel penetrating through the water cooling shell body, the cooling channel is arranged around the high-pressure assembly, and cooling liquid is infused into the cooling channel;

and the encapsulating layer wraps the water-cooling shell body and the high-pressure assembly, and is formed after the encapsulating material high-pressure encapsulating water-cooling shell body is solidified.

2. The power supply of claim 1,

the extension part comprises a bottom plate, a first side wall and a second side wall, wherein the first side wall and the second side wall are extended from the edge of the bottom plate;

the low-voltage assembly comprises a circuit main board located above the extension portion, and a rectifier bridge and an IGBT module which are arranged on one surface of the circuit main board facing the extension portion, wherein the rectifier bridge is abutted to the first side wall, and the IGBT module is abutted to the second side wall.

3. The power supply of claim 2, wherein at least one of the first and second side walls is provided with at least one ramp, the ramp having a ramp surface that forms an acute angle with the side wall on which the ramp is provided.

4. The power supply of claim 2, wherein the height of the rectifier bridge upper surface is greater than the height of the first sidewall upper surface, and the height of the IGBT module upper surface is greater than the height of the second sidewall upper surface.

5. The power supply of claim 2, wherein the rectifier bridge and the IGBT module are connected to the circuit board through pins, and the pins are dispensing at intervals.

6. The power supply according to claim 1, wherein the water-cooled shell body is provided with a first through hole and a second through hole, the first through hole and the second through hole are respectively connected with two ends of the cooling channel, the first through hole is connected with a first water nozzle, and the second through hole is connected with a second water nozzle.

7. The power supply of claim 6, further comprising an enclosure housing the potting layer, water cooled shell, high voltage components, and low voltage components.

8. The power supply of claim 7, wherein the bottom surface of the housing is provided with a plurality of drain holes.

9. The power supply of claim 7,

a first mounting column is arranged on the first outer surface of the water-cooling shell body, a second mounting column is arranged on the second outer surface of the water-cooling shell body, and the first outer surface and the second outer surface are oppositely arranged;

the shell is provided with a first mounting hole and a second mounting hole, the first mounting hole is sleeved with the first mounting column, and the second mounting hole is sleeved with the second mounting column.

10. An electrical consumer, characterized in that it comprises a power supply according to any one of claims 1-9.