CN106376215A - Coldplate with integrated DC link capacitor for cooling thereof - Google Patents
Coldplate with integrated DC link capacitor for cooling thereof Download PDFInfo
- Publication number
- CN106376215A CN106376215A CN201610570105.XA CN201610570105A CN106376215A CN 106376215 A CN106376215 A CN 106376215A CN 201610570105 A CN201610570105 A CN 201610570105A CN 106376215 A CN106376215 A CN 106376215A
- Authority
- CN
- China
- Prior art keywords
- capacitor device
- bus capacitor
- coldplate
- board member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- Inverter Devices (AREA)
- Electric Propulsion And Braking For Vehicles (AREA)
Abstract
The invention relates to a coldplate with an integrated DC link capacitor for cooling thereof. The invention discloses a coldplate for use with an inverter of an electric vehicle. The coldplate includes a coldplate member. The coldplate includes a bag-shaped portion configured to receive a DC link capacitor of the inverter therein. The bag-shaped portion is sized to surround the DC link capacitor when the DC link capacitor is received within the bag-shaped portion to thereby provide physical integration of the DC link capacitor in the coldplate member.
Description
Cross-Reference to Related Applications
The application is that the part of No. 14/288,857 U. S. application that on May 28th, 2014 submits to continues；This U.S. Shen
Please require the rights and interests of No. 61/993,767 U.S. Provisional Application of on May 15th, 2014 submission；No. 14/288,857 U.S.
The disclosure of application and No. 61/993,767 U.S. Provisional Application is hereby incorporated by reference in its entirety accordingly by quoting.
Technical field
It relates to the coldplate of the electric component of inverter for cooling down electric vehicle.
Background
Completely or partially it is referred to herein as " electronic traffic work by the motorized vehicles that electro-motor provides power
Tool " (for example, complete electric vehicle (ev), the hybrid electric vehicles (hev), the electronic friendship of plug-in hybrid
Logical instrument (phev) etc.).
Electric vehicle includes inverter, and this inverter is used for high voltage (hv) battery supplied by the vehicles
Direct current (dc) voltage conversion becomes exchange (ac) voltage for providing power for motor.This inverter includes switch module, for example,
Integrated grid bipolar transistor (igbt) module and the DC bus capacitor device (dc link capacitor) with thin film capacitor.
When dc control source is converted into ac voltage output, due to the switching manipulation of igbt power model, DC bus capacitor device thin
Membrane capacitance produces heat.This produced heat should be dissipated inverter is remained valid run.This is produced
Heat can be used the coldplate that the part as inverter provides to dissipate.
Due to heat produced by the result of the operation especially as DC bus capacitor device, except can be by current and electronic
The coldplate of the standard that the inverter of the vehicles is used together is provided beyond radiating, there is the demand for other radiating.
General introduction
A kind of coldplate being used together for the inverter with electric vehicle includes cooling down board member.This coldplate
Including pocket (pocket), this pocket is configured to receive wherein the DC bus capacitor device of inverter.Pocket is set
Size with when DC bus capacitor device is accepted in pocket surround DC bus capacitor device, thus providing DC bus capacitor device to exist
Physical integration in cooling board member.
Coldplate can also include the second cooling board member.Cooling board member is suitable for being linked together with coldplate structure
Form the manifold of neighbouring pocket, with admitting fluid, this fluid is when DC bus capacitor device is received within pocket between part
For cooling down DC bus capacitor device.
Coldplate can also include the Embedding Material being received within pocket.When DC bus capacitor device be received within bag-shaped
When in portion, Embedding Material surrounds DC bus capacitor device.When DC bus capacitor device is received within pocket, Embedding Material is straight
Stream side capacitors provide heat transfer, electric insulation and mechanical support.
Pocket can have the depth of the height corresponding to DC bus capacitor device.Pocket can have corresponding to direct current
The shape of the shape of side capacitors.
Pocket includes base plate and one or more wall.Base plate be arranged on cooling board member side on, and wall from
This laterally outer base plate extension from pocket of cooling board member, therefore pocket is outwardly open from this side of cooling board member.
A kind of assembly for electric vehicle includes inverter and coldplate.Inverter includes DC bus capacitor device.
Coldplate includes the cooling board member with pocket.DC bus capacitor device is received within pocket and by this pocket bag
Enclose, thus being integrated physically within coldplate.
DC bus capacitor device can be the exposed DC bus capacitor device of no encapsulating housing.
Coldplate can also include the Embedding Material being received within pocket.Embedding Material surrounds straight as encapsulation unit
Stream side capacitors, or the thin film capacitor that can directly surround the stacking of DC bus capacitor device.
Brief description
Fig. 1 shows the perspective view of the assembly including the coldplate of electric vehicle and inverter；
Fig. 2 shows the sectional view of assembly；
Fig. 3 shows the cross-sectional view of assembly；And
Fig. 4 shows the exploded view of coldplate.
Describe in detail
Disclosed herein is the detailed embodiment of the present invention；However, it should be understood that disclosed embodiment is only permissible
In a variety of manners and can preferred form of this implement the present invention example.Accompanying drawing is not necessarily to scale；Some features can be amplified or minimum
Change to illustrate the details of particular elements.Therefore, particular structural details disclosed herein and function detail should not be construed and be limited
Property processed, but as just for instructing those of skill in the art differently using the representative basis of the present invention.
With reference to Fig. 1, Fig. 2, Fig. 3 and Fig. 4, description is used in the electric component of the inverter of cooling electric vehicle
The more detailed description of the embodiment of coldplate using.Simultaneously and contribute to understanding for ease of explanation, run through accompanying drawing, herein
The identical Ref. No. having used is used for identical part and feature.
As it was previously stated, the dc control source of the hv battery supplied by the vehicles is changed by the inverter of electric vehicle
Become to provide the ac voltage output of power for the motor for the vehicles.Inverter includes switch module and has thin film capacitor
DC bus capacitor device.The thin film capacitor of DC bus capacitor device produces heat because it operates.This produced heat can make
It is used as coldplate that the part of inverter provides dissipating.However, except when front in use can be by the cooling of standard
Plate is provided beyond radiating, there is the demand of the extra radiating for DC bus capacitor device.
This demand is met according to the coldplate of the disclosure.Coldplate meets this demand by having pocket, and this is bag-shaped
Portion is dimensioned to generally surround this DC bus capacitor device when DC bus capacitor device is accepted in pocket to carry
For physical integration in coldplate for the DC bus capacitor device, to promote the drive of the heat by the operation generation of DC bus capacitor device
Dissipate.
Referring now to Fig. 1, Fig. 2, Fig. 3 and Fig. 4, respectively illustrate the coldplate 12 with electric vehicle and inverter
14 perspective view of assembly 10, sectional view and cross-sectional view, and the exploded view of coldplate.
Inverter 14 includes integrated grid bipolar transistor (igbt) switch module 16 and DC bus capacitor device 18.Igbt opens
Close module 16 and DC bus capacitor device 18 is arranged to via busbar 26 and telecommunication each other.Igbt switch module 16 and DC side
Capacitor 18 is used for the dc input voltage from hv battery is converted into the ac output voltage for providing power for electro-motor.
As seen in Figures 2 and 3, DC bus capacitor device 18 includes the multiple thin film capacitors 20 being configured to stack.
As seen in Fig. 1, Fig. 2 and Fig. 3, the DC bus capacitor device 18 including the thin film capacitor 20 of its stacking forms generally square
The prism of shape, but other polygonal prism shapes can be used.
Coldplate 12 includes the first cooling board member 22 (that is, coldplate body) and the second cooling board member 24 (that is, cools down
Plate lid).Coldplate body 22 includes top side and bottom side.Igbt switch module 16 and DC bus capacitor device 18 are installed to cooling
In the top side of plate body 22.The bottom side of coldplate body 22 and coldplate lid 24 are suitable for being linked together to form cooling
Plate 12.
Serve as heat extractor or radiator and heat extractor can also be referred to as or the coldplate 12 of radiator extracts, removes
And/or disperse the heat that (being referred to as " dispersing ") is produced by igbt switch module 16 and DC bus capacitor device 18.Thus, cool down
Plate body 22 and coldplate lid 24 can include any material for promoting this cooling known in the art, such as metal.
Coldplate body 22 includes the pocket 28 in the top side of coldplate body.Pocket 28 is from coldplate body
22 top side is open out.Pocket 28 is configured to receive the DC bus capacitor device of the thin film capacitor 20 including its stacking
18.Pocket 28 is dimensioned to generally surround DC bus capacitor device when DC bus capacitor device is accepted in pocket
18, thus providing physical integration in coldplate 12 for the DC bus capacitor device.DC bus capacitor device 18 being somebody's turn to do in coldplate 12
Physical integration enhances the function at the aspect dispersing the heat being produced by DC bus capacitor device for the coldplate.
Coldplate body 22 and coldplate lid 24 may adapt to be linked together to form chamber, manifold or passage 30
(being referred to as " passage ").The bottom side adjacent to coldplate body 22 for the passage 30, the lower section of the pocket 28 in coldplate body 22.
Passage 30 is used for receiving coolant (not shown), and this coolant is used for cooling and is received in the DC bus capacitor device in pocket 28
18.Treat that the coolant through passage 30 circulation can include any fluid for promoting this cooling as known in the art,
Such as water.Thus, coldplate lid 24 can include cooling liquid inlet 32 and cooling liquid outlet 34, cooling liquid inlet 32 and cold
But liquid outlet 34 is received within the pocket 28 of coldplate body 22 with promotion for making coolant pass through passage 30 to circulate
The cooling of DC bus capacitor device 18.Coldplate 12 also includes coolant sealing member 40, and this coolant sealing member 40 is positioned at cooling
Between plate body 22 and coldplate lid 24, for sealing passage 30.
The pocket 28 of coldplate body 22 includes one or more walls 38 that base plate 36 and the base plate from pocket extend.
The base plate 36 of pocket 28 is arranged in a part for the top side of coldplate body 22.The wall 38 of pocket 28 is from coldplate originally
The top side emersion of body 22.The wall 38 of pocket 28 is configured so that pocket has the shape of the prism of general rectangular, should
The shape of the prism of general rectangular corresponds to the general rectangular of thin film capacitor 20 of stacking of DC bus capacitor device 18
The shape of prism.Pocket 28 can have the height of the thin film capacitor 20 of the essentially equal to stacking of DC bus capacitor device 18
Depth.
According to the disclosure, and as shown in Figures 2 and 3, DC bus capacitor device 18 is " exposed " capacitor.I.e., directly
Stream side capacitors 18 do not have packed (that is, " embedding ") in the housing of its own.Therefore, the thin-film electro of DC bus capacitor device 18
Container 20 is to expose.DC bus capacitor device 18 in this naked state is received within the pocket 28 of coldplate body 22
Interior.Need not polylogia, DC bus capacitor device 18 keeps exposed, is received within the pocket 28 of coldplate body 22 simultaneously.Driving
Dissipate by DC bus capacitor device 18 produce hot when the operation of coldplate 12 can occur in this condition.
However, the pocket 28 of coldplate body 22 is also adapted to receive Embedding Material so that in DC bus capacitor device 18
When being received within pocket, this Embedding Material generally surrounds exposed DC bus capacitor device 18 (more specifically, generally wrapping
Enclose the thin film capacitor of DC bus capacitor device).Thus, such Embedding Material can provide heat for DC bus capacitor device 18
Transmission, electric insulation and/or mechanical support.This Embedding Material can be as known in the art to be suitable for any such purpose
Any material, (such as liquogel).In this way, DC bus capacitor device 18 by " embedding " in pocket 28.Bag-shaped
In portion 28, the such Embedding Material providing and/or pocket itself enable DC bus capacitor device 18 to be integrated into coldplate body
In 22 and be installed to coldplate body 22, and do not use single housing and/or securing member, thus decreasing and coldplate 12
Relevant cost, and improve the cooling of DC bus capacitor device.
Therefore, in the embodiment according to the coldplate of the disclosure, the pocket 28 of coldplate body 22 connects wherein
Receive DC bus capacitor device 18.DC bus capacitor device 18 can be exposed DC bus capacitor device.Pocket 28 can also be wherein
Receive Embedding Material 42.Embedding Material 42 in pocket 28 generally surrounds DC bus capacitor device 18.When DC bus capacitor device
When being exposed DC bus capacitor device, the Embedding Material 42 in pocket 28 generally surrounds the thin-film electro of DC bus capacitor device 18
Container 20.Cooling passage 30 can neighbouring pocket 28 (for example, below pocket 28).To be received in pocket 28
The busbar 26 that DC bus capacitor device 18 is electrically connected with igbt switch module 16 extend in pocket 28 with DC bus capacitor
Device makes electrical contact with.
As according to foregoing teachings easily it is apparent that it has been described that for cool down DC bus capacitor device coldplate reality
Apply scheme.Such embodiment includes coldplate, and this coldplate has pocket, and this pocket is dimensioned with direct current
This DC bus capacitor device is generally surrounded to provide DC bus capacitor device in coldplate when side capacitors are accepted in pocket
In physical integration to promote the dispersing of heat being produced by the operation of DC bus capacitor device.Such embodiment also includes
DC bus capacitor device and pocket, this DC bus capacitor device being received in pocket is exposed DC bus capacitor device, and
This pocket includes Embedding Material, and this Embedding Material includes the DC bus capacitor device of its thin film capacitor.
Although the foregoing describing exemplary, do not mean that these embodiments describe all of the present invention
Possible form.More properly, used in this specification, vocabulary is descriptive vocabulary rather than restricted vocabulary, and
It should be understood that can make a variety of changes without departing from the spirit and scope of the present invention.Furthermore it is possible to combine the embodiment party of various enforcements
The feature of case is to form the other embodiments of the present invention.
Claims (15)
1. a kind of coldplate, it is used for being used together with the inverter of electric vehicle, and described coldplate includes:
Cooling board member, described cooling board member includes pocket, and described pocket is configured to receive described inverter wherein
DC bus capacitor device, described pocket is dimensioned with when described DC bus capacitor device is received within described pocket
Surround described DC bus capacitor device, thus providing physical integration in described cooling board member for the described DC bus capacitor device.
2. coldplate as claimed in claim 1, also includes:
Second cooling board member；And
Wherein, described cooling board member is suitable for being linked together to be formed adjacent to described bag-shaped between described cooling board member
The manifold in portion, with admitting fluid, described fluid is used for cooling down when described DC bus capacitor device is received within described pocket
Described DC bus capacitor device.
3. coldplate as claimed in claim 1, also includes:
It is received within the Embedding Material in described pocket, when described DC bus capacitor device is received within described pocket,
Described Embedding Material surrounds described DC bus capacitor device.
4. coldplate as claimed in claim 3, wherein:
When described DC bus capacitor device is received within described pocket, described Embedding Material carries for described DC bus capacitor device
For heat transfer, electric insulation and mechanical support.
5. coldplate as claimed in claim 1, wherein:
Described pocket has the depth of the height corresponding to described DC bus capacitor device.
6. coldplate as claimed in claim 1, wherein:
Described pocket has the shape of the shape corresponding to described DC bus capacitor device.
7. coldplate as claimed in claim 1, wherein:
Described pocket includes base plate and one or more wall, and the described base plate of described pocket is arranged on described coldplate structure
On the side of part, and the described wall of described pocket from described cooling board member described laterally from the institute of described pocket
State base plate to extend, therefore described pocket is outwardly open from the described side of described cooling board member.
8. a kind of assembly for electric vehicle, described assembly includes:
Inverter, it includes DC bus capacitor device；
Coldplate, it includes the cooling board member with pocket；And
Wherein, described DC bus capacitor device is received within described pocket, thus being integrated physically within described coldplate.
9. assembly as claimed in claim 8, wherein:
Described DC bus capacitor device is the exposed DC bus capacitor device of no encapsulating housing.
10. assembly as claimed in claim 8, wherein:
Described coldplate also includes the Embedding Material being received within described pocket, and described Embedding Material surrounds described DC side
Capacitor.
11. assemblies as claimed in claim 10, wherein:
Described Embedding Material provides heat transfer, electric insulation and mechanical support for described DC bus capacitor device.
12. assemblies as claimed in claim 10, wherein:
Described DC bus capacitor device includes the thin film capacitor stacking；And
Described Embedding Material surrounds the thin film capacitor of the described stacking of described DC bus capacitor device.
13. assemblies as claimed in claim 8, wherein:
Described pocket includes base plate and one or more wall, and the described backplane of described pocket is in described cooling board member
Side on, and the described wall of described pocket from described cooling board member described laterally from described in described pocket
Base plate extends, and therefore described pocket is outwardly open from the described side of described cooling board member.
14. assemblies as claimed in claim 8, wherein:
Described coldplate also includes the second cooling board member；And
Described cooling board member is suitable for being linked together to form neighbouring described pocket between described cooling board member
Manifold, to receive the fluid for cooling down described DC bus capacitor device.
15. assemblies as claimed in claim 8, wherein:
Described pocket has the shape of the shape corresponding to described DC bus capacitor device.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/805,664 | 2015-07-22 | ||
| US14/805,664 US9615490B2 (en) | 2014-05-15 | 2015-07-22 | Coldplate with integrated DC link capacitor for cooling thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106376215A true CN106376215A (en) | 2017-02-01 |
| CN106376215B CN106376215B (en) | 2018-10-26 |
Family
ID=56890602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610570105.XA Active CN106376215B (en) | 2015-07-22 | 2016-07-19 | The coldplate with integrated DC side capacitors for cooling down DC bus capacitor device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106376215B (en) |
| GB (1) | GB2542468B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021057951A1 (en) * | 2019-09-27 | 2021-04-01 | Valeo Siemens Eautomotive (Shenzhen) Co., Ltd. | Electronic device and heat sink of the electronic device |
| CN113330679A (en) * | 2019-02-18 | 2021-08-31 | 日产自动车株式会社 | Power conversion device |
| CN113692155A (en) * | 2021-08-03 | 2021-11-23 | 深圳麦格米特电气股份有限公司 | Power supply and electric equipment |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11462997B2 (en) * | 2018-09-03 | 2022-10-04 | Milspec Technologies Pty Ltd | DC to DC converter for a vehicle alternator |
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| US9030822B2 (en) * | 2011-08-15 | 2015-05-12 | Lear Corporation | Power module cooling system |
| US8971041B2 (en) * | 2012-03-29 | 2015-03-03 | Lear Corporation | Coldplate for use with an inverter in an electric vehicle (EV) or a hybrid-electric vehicle (HEV) |
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- 2016-07-19 CN CN201610570105.XA patent/CN106376215B/en active Active
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| US20090009980A1 (en) * | 2007-07-06 | 2009-01-08 | Gm Global Technology Operations, Inc. | Capacitor with direct dc connection to substrate |
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| WO2021057951A1 (en) * | 2019-09-27 | 2021-04-01 | Valeo Siemens Eautomotive (Shenzhen) Co., Ltd. | Electronic device and heat sink of the electronic device |
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Also Published As
| Publication number | Publication date |
|---|---|
| GB2542468A (en) | 2017-03-22 |
| CN106376215B (en) | 2018-10-26 |
| GB2542468B (en) | 2017-12-13 |
| GB201612283D0 (en) | 2016-08-31 |
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