CN113687179B - 一种半导体器件的自动化测试装置 - Google Patents
一种半导体器件的自动化测试装置 Download PDFInfo
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- CN113687179B CN113687179B CN202111253219.9A CN202111253219A CN113687179B CN 113687179 B CN113687179 B CN 113687179B CN 202111253219 A CN202111253219 A CN 202111253219A CN 113687179 B CN113687179 B CN 113687179B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 37
- 238000012360 testing method Methods 0.000 title claims abstract description 35
- 238000005057 refrigeration Methods 0.000 claims abstract description 64
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 40
- 210000001503 joint Anatomy 0.000 claims abstract description 26
- 239000007787 solid Substances 0.000 claims abstract 2
- 238000009529 body temperature measurement Methods 0.000 claims description 9
- 239000011111 cardboard Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 description 24
- 230000000694 effects Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 9
- 238000001514 detection method Methods 0.000 description 8
- 238000003032 molecular docking Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
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CN202111253219.9A CN113687179B (zh) | 2021-10-27 | 2021-10-27 | 一种半导体器件的自动化测试装置 |
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CN202111253219.9A CN113687179B (zh) | 2021-10-27 | 2021-10-27 | 一种半导体器件的自动化测试装置 |
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CN113687179A CN113687179A (zh) | 2021-11-23 |
CN113687179B true CN113687179B (zh) | 2021-12-21 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103472087A (zh) * | 2013-03-15 | 2013-12-25 | 深圳市彩煌实业发展有限公司 | 热电材料塞贝克系数测量装置及方法 |
CN104483358A (zh) * | 2015-01-05 | 2015-04-01 | 哈尔滨师范大学 | 半导体热电致冷材料电学参数综合监测装置 |
CN105242148A (zh) * | 2015-10-31 | 2016-01-13 | 武汉理工大学 | 一种热电模块特性测试装置 |
CN105548761A (zh) * | 2015-12-23 | 2016-05-04 | 苏州创瑞机电科技有限公司 | 基于半导体制冷片的高低温老化测试设备 |
CN112540100A (zh) * | 2020-11-30 | 2021-03-23 | 桂林电子科技大学 | 一种基于珀尔帖效应的微焊点热迁移装置及其测试方法 |
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2021
- 2021-10-27 CN CN202111253219.9A patent/CN113687179B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103472087A (zh) * | 2013-03-15 | 2013-12-25 | 深圳市彩煌实业发展有限公司 | 热电材料塞贝克系数测量装置及方法 |
CN104483358A (zh) * | 2015-01-05 | 2015-04-01 | 哈尔滨师范大学 | 半导体热电致冷材料电学参数综合监测装置 |
CN105242148A (zh) * | 2015-10-31 | 2016-01-13 | 武汉理工大学 | 一种热电模块特性测试装置 |
CN105548761A (zh) * | 2015-12-23 | 2016-05-04 | 苏州创瑞机电科技有限公司 | 基于半导体制冷片的高低温老化测试设备 |
CN112540100A (zh) * | 2020-11-30 | 2021-03-23 | 桂林电子科技大学 | 一种基于珀尔帖效应的微焊点热迁移装置及其测试方法 |
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Denomination of invention: An automatic testing device for semiconductor devices Effective date of registration: 20220705 Granted publication date: 20211221 Pledgee: Rudong sub branch of Bank of China Ltd. Pledgor: Nantong Hongjinbei Electronic Technology Co.,Ltd. Registration number: Y2022980009843 |
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Address after: 226400 group 4, Jincheng village, Hekou Town, Rudong County, Nantong City, Jiangsu Province Patentee after: Nantong Hongjinbei Textile Technology Co.,Ltd. Address before: 226400 group 4, Jincheng village, Hekou Town, Rudong County, Nantong City, Jiangsu Province Patentee before: Nantong Hongjinbei Electronic Technology Co.,Ltd. |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A Test automation Device for Semiconductor Devices Effective date of registration: 20230704 Granted publication date: 20211221 Pledgee: Rudong sub branch of Bank of China Ltd. Pledgor: Nantong Hongjinbei Textile Technology Co.,Ltd. Registration number: Y2023980047366 |
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Granted publication date: 20211221 Pledgee: Rudong sub branch of Bank of China Ltd. Pledgor: Nantong Hongjinbei Textile Technology Co.,Ltd. Registration number: Y2023980047366 |