CN113671353A - Socket structure - Google Patents
Socket structure Download PDFInfo
- Publication number
- CN113671353A CN113671353A CN202110992664.0A CN202110992664A CN113671353A CN 113671353 A CN113671353 A CN 113671353A CN 202110992664 A CN202110992664 A CN 202110992664A CN 113671353 A CN113671353 A CN 113671353A
- Authority
- CN
- China
- Prior art keywords
- probe
- triangular base
- socket
- base
- socket structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009826 distribution Methods 0.000 claims abstract description 7
- 238000009827 uniform distribution Methods 0.000 claims description 6
- 239000000523 sample Substances 0.000 abstract description 118
- 238000012360 testing method Methods 0.000 abstract description 17
- 238000000034 method Methods 0.000 abstract description 15
- 239000000758 substrate Substances 0.000 abstract description 6
- 230000002441 reversible effect Effects 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000005452 bending Methods 0.000 description 14
- 230000001360 synchronised effect Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 description 2
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to a socket structure, belonging to the technical field of semiconductor test; the socket structure comprises a substrate, a triangular base capable of sliding on the substrate and an even distribution frame capable of moving up and down; one side of the triangular base is provided with a notch, the inner side surface of the notch is provided with a conductive layer, the conductive layer penetrates through the base plate from the lower part of the triangular base through a conducting wire to be connected with the outside, the other side of the triangular base is provided with an insulating plate, the uniform frame is composed of a plurality of parallel insulating columns with the same interval, and the direction of the insulating columns is vertical to the direction of the rack; the socket structure provided by the invention is matched with the probe structure, so that the alignment difficulty of the probe and the socket is reduced, the probe is not easy to damage, the reversible disassembly and assembly process is realized, the repeatability test is facilitated, and the problem of short circuit caused by discharge between the probes under a large current can be solved.
Description
This application is a divisional application of the patent application for "a probe and socket structure".
Application date of the original case: 2020-11-29.
Original application No.: 2020113659506.
the name of the original invention is: a probe and socket structure.
Technical Field
The invention discloses a socket structure, and belongs to the technical field of semiconductor testing.
Background
With the development of semiconductor technology and MEMS technology, the integrated circuit chip structure is becoming more and more complex. In order to ensure the electrical quality of the integrated circuit, testing is required prior to chip packaging. During the test, the probe can be inserted into the socket for testing. However, as the size of the probe is gradually reduced, the alignment between the probe and the socket becomes difficult at the micron or even submicron size, and if the probe is inserted hard (the socket is not adjusted and fixed with the probe), the probe is easily damaged, and meanwhile, the probe is bent due to the insertion, so that the distance between two adjacent probes is too short, and during the high-power chip testing process, the problem of short circuit caused by the discharge between the probes is easily caused due to too large current.
Meanwhile, the precision measurement technology tells us that the repeated test of the probe is very important if the test result has a larger confidence interval, namely the test result is more reliable and reliable, and multiple measurements are needed, and the repeated test of the probe and the socket is very difficult to assemble and disassemble under the micron-scale or even submicron-scale size without damaging the probe.
The invention patent 'Probe device of vertical Probe card' with application No. 201711115635.6 relates to a method for mounting probes, which makes probes bend in the same direction by moving an intermediate guide plate, and although the problem of 'difficult capping' is solved, the technical scheme can successfully limit the distance between the probes, thereby solving the problem of short circuit caused by discharge between the probes under high current. However, this method lacks a structure for precisely positioning the intermediate guide plate, so that when the intermediate guide plate is moved, the bending degree of the probe easily exceeds the elastic deformation range, the probe is not recoverable, and the probe mounting and dismounting are not reversible, so that the repeated test of mounting and dismounting the uniform probe cannot be performed.
Disclosure of Invention
Aiming at the problems, the invention discloses a probe and socket structure, which is characterized in that through the mechanism arrangement of a triangular base and a uniform frame, and the steps of inserting, aligning and contacting are matched at the same time, so that the aligning difficulty of the probe and the socket is reduced, the probe is not easy to damage, the assembling and disassembling process is reversible, the repeatability test is facilitated, the distance between the probes can be limited, and the problem of short circuit caused by discharge between the probes under large current is solved.
The purpose of the invention is realized as follows:
a probe and socket structure comprises a probe structure and a socket structure which are matched with each other,
the probe structure comprises a limiting plate and probes which penetrate through the limiting plate and are distributed in an array mode, the probes can rotate around the probes, gears are arranged above the limiting plate, a rack frame is arranged on the same plane with the gears, the rack frame is composed of a plurality of parallel racks, the racks are meshed with the gears, bending structures are arranged below the probes, and the bending structures of all the probes bend in the same direction;
the socket structure comprises a substrate, a triangular base capable of sliding on the substrate and an even distribution frame capable of moving up and down; one side of the triangular base is provided with an opening, the inner side face of the opening is provided with a conducting layer, the conducting layer penetrates through the base plate from the lower portion of the triangular base through a conducting wire to be connected with the outside, the other side of the triangular base is provided with an insulating plate, the equal-division frame is composed of a plurality of parallel insulating columns with the same interval, and the direction of each insulating column is perpendicular to the direction of the rack.
According to the probe and socket structure, the bearing is arranged between the probe and the limiting plate, the outer ring of the bearing is in interference fit with the limiting plate, and the inner ring of the bearing is in interference fit with the probe.
According to the probe and socket structure, in the rack frame, the two ends of a plurality of parallel racks are respectively provided with the synchronous plates, the outer end part of one synchronous plate is provided with the lead screw, the lead screw is provided with the nut capable of rotating around the lead screw, the nut is installed inside the hollow shaft motor, the hollow shaft motor operates to drive the nut to rotate, and then the synchronous plates are driven to translate, and finally the probe is driven to rotate.
Above-mentioned probe and socket structure, be provided with the slide on the base plate, the triangle body base is sat on the slide to can move on the slide, the slide both ends are provided with spacing portion for inject the orbit of triangle body base, the base plate is provided with the wire guide in the middle of two adjacent slides, the wire stretches out from the wire guide, connects the outside.
The utility model provides a probe structure, includes the limiting plate, runs through the limiting plate and becomes array distribution's probe, the probe can be around self rotation, and the probe is provided with the gear above the limiting plate, on with the gear coplanar, is provided with the rack frame, the rack frame comprises the rack of a plurality of parallels, rack and gear engagement, the below of probe is provided with curved structure, and the curved structure of all probes is crooked to same direction.
A socket structure comprises a base plate, a triangular base capable of sliding on the base plate and an even distribution frame capable of moving up and down; one side of the triangular base is provided with an opening, the inner side face of the opening is provided with a conducting layer, the conducting layer penetrates through the base plate from the lower portion of the triangular base through a conducting wire to be connected with the outside, the other side of the triangular base is provided with an insulating plate, the equal-division frame is composed of a plurality of parallel insulating columns with the same interval, and the direction of each insulating column is perpendicular to the direction of the rack.
A probe and socket matching method comprises the following steps:
step a, operating a hollow shaft motor to enable a bending structure below a probe to be consistent with the direction of an insulating column in an equalizing frame;
b, inserting the probe structure to a fixed depth towards the socket structure;
c, operating a hollow shaft motor to enable the probe to rotate around the hollow shaft motor, wherein the bent structure below the probe points to the conductive layer on the inner side surface of the opening in the triangular base;
d, moving the uniform frame downwards to enable the insulating columns in the uniform frame to be in contact with the insulating plate on the triangular base, and further enabling the bent structure below the probe to be in contact with the conductive layer;
step e, testing the probe;
step f, moving the equalizing frame upwards to separate the insulating columns in the equalizing frame from the insulating plates on the triangular base;
step g, operating a hollow shaft motor to enable the probe to rotate around the hollow shaft motor, and enabling the bending structure below the probe to be consistent with the direction of the insulating column in the uniform distribution frame;
and h, pulling the probe structure out of the socket structure.
Has the advantages that:
first, owing to be provided with can be on the base plate gliding triangle base, consequently only need the probe fall into between two triangle bases can, consequently reduced the alignment degree of difficulty between probe and the socket, simultaneously, because the probe is at the in-process of inserting or contactless triangle base, or slightly contact with triangle base, consequently avoided the condition of "hard inserting", make the probe not fragile, be favorable to carrying out the repeatability test.
The second, because the probe below is provided with curved structure, and crooked direction receives rack frame's restriction, bends to same direction forever, just so can ensure that the distance between the probe is restricted, can not reach the distance that discharges, in addition, the triangle base is provided with the insulation board, can make equally insulating between two probes, discharges between the probe under the avoiding heavy current and cause the problem of short circuit.
Thirdly, under the structure of the probe and the socket, the matching method of the probe and the socket is matched, the assembling and disassembling processes of the probe are reciprocal, and in the assembling and disassembling process of the probe, because the bending direction of the bending structure is consistent with the direction of the insulating column in the uniform frame, the bending structure cannot interfere with the notch on the triangular base, the probe is further ensured not to be damaged in the assembling and disassembling process, and the repeated test is also facilitated.
Drawings
FIG. 1 is a schematic diagram of the matching relationship between the probe structure and the socket structure of the present invention.
FIG. 2 is a first schematic diagram of the probe structure of the present invention.
FIG. 3 is a schematic diagram of the probe structure of the present invention.
Fig. 4 is a schematic view of the socket structure of the present invention.
FIG. 5 is a flow chart of a method for mating a probe and a socket according to the present invention.
In the figure: 1-1 limiting plate, 1-2 probe, 1-3 gear, 1-4 rack frame, 1-4-1 rack, 1-4-2 synchronous plate, 1-4-3 lead screw, 1-4-4 nut, 1-4-5 hollow shaft motor, 1-5 bearing, 2-1 base plate, 2-1-1 slideway, 2-1-2 limiting part, 2-1-3 wire hole, 2-2 triangular base, 2-2-1 conducting layer, 2-2-2 conducting wire, 2-2-3 insulating plate and 2-3 uniform frame.
Detailed Description
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
Detailed description of the invention
The following are specific embodiments of the probe and socket structure of the present invention.
The probe and socket structure in this embodiment includes a probe structure and a socket structure that are matched with each other, and the matching relationship is shown in fig. 1;
the probe structure is shown in fig. 2 and fig. 3, and comprises a limiting plate 1-1 and probes 1-2 which penetrate through the limiting plate 1-1 and are distributed in an array, wherein the probes 1-2 can rotate around themselves, a gear 1-3 is arranged above the limiting plate 1-1 of the probe 1-2, a rack frame 1-4 is arranged on the same plane with the gear 1-3, the rack frame 1-4 is composed of a plurality of parallel racks 1-4-1, the racks 1-4-1 are meshed with the gear 1-3, a bending structure is arranged below the probe 1-2, and the bending structures of all the probes 1-2 bend in the same direction;
the socket structure is shown in fig. 4 and comprises a base plate 2-1, a triangular base 2-2 capable of sliding on the base plate 2-1 and an even distribution frame 2-3 capable of moving up and down; one side of the triangular base 2-2 is provided with a notch, the inner side surface of the notch is provided with a conducting layer 2-2-1, the conducting layer 2-2-1 penetrates through the base plate 2-1 from the lower part of the triangular base 2-2 through a conducting wire 2-2-2 to be connected with the outside, the other side of the triangular base 2-2 is provided with an insulating plate 2-2-3, the uniform frame 2-3 is composed of a plurality of parallel insulating columns with the same interval, and the direction of the insulating columns is perpendicular to the direction of the rack 1-4-1.
Detailed description of the invention
The following are specific embodiments of the probe and socket structure of the present invention.
In the probe and socket structure according to the first embodiment, it is further limited that a bearing 1-5 is disposed between the probe 1-2 and the limiting plate 1-1, an outer ring of the bearing 1-5 is in interference fit with the limiting plate 1-1, and an inner ring of the bearing 1-5 is in interference fit with the probe 1-2, as shown in fig. 2.
Detailed description of the invention
The following are specific embodiments of the probe and socket structure of the present invention.
The probe and socket structure according to the present embodiment is further defined in the rack frames 1 to 4 in addition to the first embodiment, both ends of a plurality of parallel racks 1-4-1 are provided with synchronous plates 1-4-2, the outer end part of one synchronous plate 1-4-2 is provided with a screw rod 1-4-3, the screw rod 1-4-3 is provided with a nut 1-4-4 which can rotate around itself, the nut 1-4-4 is arranged inside the hollow shaft motor 1-4-5, the hollow shaft motor 1-4-5 operates to drive the nut 1-4-4 to rotate, thereby driving the synchronous plate 1-4-2 to translate and finally driving the probe 1-2 to rotate, as shown in fig. 3.
Detailed description of the invention
The following are specific embodiments of the probe and socket structure of the present invention.
In the probe and socket structure of the present embodiment, on the basis of the first specific embodiment, it is further limited that a slide 2-1-1 is disposed on a substrate 2-1, a triangular base 2-2 sits on the slide 2-1-1 and can move on the slide 2-1-1, two ends of the slide 2-1-1 are provided with limiting portions 2-1-2 for limiting a moving track of the triangular base 2-2, the substrate 2-1 is provided with a wire guide 2-1-3 between two adjacent slides 2-1-1, and the wire 2-2-2 extends out of the wire guide 2-1-3 and is connected to the outside, as shown in fig. 4.
Detailed description of the invention
The following are specific embodiments of the probe structure of the present invention.
The probe structure in the embodiment, as shown in fig. 2 and fig. 3, includes a limiting plate 1-1 and probes 1-2 penetrating through the limiting plate 1-1 and distributed in an array, the probes 1-2 can rotate around themselves, the probes 1-2 are provided with gears 1-3 above the limiting plate 1-1, a rack frame 1-4 is provided on the same plane with the gears 1-3, the rack frame 1-4 is composed of a plurality of parallel racks 1-4-1, the racks 1-4-1 are engaged with the gears 1-3, a bending structure is provided below the probes 1-2, and the bending structures of all the probes 1-2 are bent in the same direction.
Detailed description of the invention
The following is a specific embodiment of the socket structure of the present invention.
As shown in fig. 4, the socket structure of the present embodiment includes a base plate 2-1, a triangular base 2-2 capable of sliding on the base plate 2-1, and an even distribution frame 2-3 capable of moving up and down; one side of the triangular base 2-2 is provided with a notch, the inner side surface of the notch is provided with a conducting layer 2-2-1, the conducting layer 2-2-1 penetrates through the base plate 2-1 from the lower part of the triangular base 2-2 through a conducting wire 2-2-2 to be connected with the outside, the other side of the triangular base 2-2 is provided with an insulating plate 2-2-3, the uniform frame 2-3 is composed of a plurality of parallel insulating columns with the same interval, and the direction of the insulating columns is perpendicular to the direction of the rack 1-4-1.
Detailed description of the invention
The following are specific embodiments of the probe and socket matching method of the present invention.
A flow chart of the probe and socket matching method in this embodiment is shown in fig. 5, and the probe and socket matching method includes the following steps:
step a, a hollow shaft motor 1-4-5 is operated, so that the direction of a bending structure below a probe 1-2 is consistent with that of an insulating column in an equalizing frame 2-3;
b, inserting the probe structure to a fixed depth towards the socket structure;
step c, operating a hollow shaft motor 1-4-5 to enable the probe 1-2 to rotate around the hollow shaft motor, wherein the bent structure below the probe 1-2 points to the conducting layer 2-2-1 on the inner side surface of the opening in the triangular base 2-2;
d, moving the uniform distribution frame 2-3 downwards to enable the insulating columns in the uniform distribution frame 2-3 to be in contact with the insulating plates 2-2-3 on the triangular base 2-2, and further enabling the bent structure below the probe 1-2 to be in contact with the conducting layer 2-2-1;
step e, testing the probe 1-2;
step f, moving the uniform distribution frame 2-3 upwards to separate the insulating columns in the uniform distribution frame 2-3 from the insulating plates 2-2-3 on the triangular base 2-2;
step g, operating a hollow shaft motor 1-4-5 to enable a probe 1-2 to rotate around the hollow shaft motor, and enabling a bending structure below the probe 1-2 to be consistent with the direction of an insulating column in an equalizing frame 2-3;
and h, pulling the probe structure out of the socket structure.
It should be noted that all the technical features listed in the above embodiments can be arranged and combined without contradiction, and those skilled in the art can exhaust the results of each arrangement and combination according to the mathematical knowledge of the arrangement and combination learned in the high-school stage, and all the results of the arrangement and combination should be understood as being disclosed in the present application.
Claims (2)
1. A socket structure is characterized by comprising a base plate (2-1), a triangular base (2-2) capable of sliding on the base plate (2-1) and an even distribution frame (2-3) capable of moving up and down; one side of the triangular base (2-2) is provided with a notch, the inner side face of the notch is provided with a conducting layer (2-2-1), the conducting layer (2-2-1) penetrates through the base plate (2-1) from the lower portion of the triangular base (2-2) through a conducting wire (2-2-2) to be connected with the outside, the other side of the triangular base (2-2) is provided with an insulating plate (2-2-3), the uniform distribution frame (2-3) is composed of a plurality of insulating columns which are parallel and have the same interval, and the direction of the insulating columns is perpendicular to the direction of the rack (1-4-1).
2. The socket structure according to claim 1, wherein a slideway (2-1-1) is arranged on the base plate (2-1), the triangular base (2-2) is seated on the slideway (2-1-1) and can move on the slideway (2-1-1), two ends of the slideway (2-1-1) are provided with limiting parts (2-1-2) for limiting the running track of the triangular base (2-2), the base plate (2-1) is provided with a wire guide hole (2-1-3) between two adjacent slideways (2-1-1), and the wire (2-2-2) extends out of the wire guide hole (2-1-3) and is connected with the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110992664.0A CN113671353B (en) | 2020-11-29 | 2020-11-29 | Socket structure |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110992664.0A CN113671353B (en) | 2020-11-29 | 2020-11-29 | Socket structure |
| CN202011365950.6A CN112526320B (en) | 2020-11-29 | 2020-11-29 | Probe and socket structure |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011365950.6A Division CN112526320B (en) | 2020-11-29 | 2020-11-29 | Probe and socket structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113671353A true CN113671353A (en) | 2021-11-19 |
| CN113671353B CN113671353B (en) | 2022-05-17 |
Family
ID=74994708
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110992664.0A Active CN113671353B (en) | 2020-11-29 | 2020-11-29 | Socket structure |
| CN202011365950.6A Active CN112526320B (en) | 2020-11-29 | 2020-11-29 | Probe and socket structure |
| CN202110992579.4A Active CN113625018B (en) | 2020-11-29 | 2020-11-29 | Probe structure |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011365950.6A Active CN112526320B (en) | 2020-11-29 | 2020-11-29 | Probe and socket structure |
| CN202110992579.4A Active CN113625018B (en) | 2020-11-29 | 2020-11-29 | Probe structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (3) | CN113671353B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115308678A (en) * | 2022-10-10 | 2022-11-08 | 哈尔滨汇鑫仪器仪表有限责任公司 | Full-automatic function detection production line of intelligent electric energy meter |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114034894B (en) * | 2021-11-19 | 2022-04-26 | 法特迪精密科技（苏州）有限公司 | Vertical probe card device and detection method thereof |
| CN114966143B (en) * | 2022-06-13 | 2023-01-31 | 法特迪精密科技（苏州）有限公司 | Electromagnetic drive rotary probe and fixed socket structure |
| CN114966142B (en) * | 2022-06-13 | 2023-01-31 | 法特迪精密科技（苏州）有限公司 | Matching method of electromagnetic drive rotary probe and fixed socket |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB915706A (en) * | 1960-06-27 | 1963-01-16 | Amp Inc | Electrical test probe receptacles |
| US6292003B1 (en) * | 1998-07-01 | 2001-09-18 | Xilinx, Inc. | Apparatus and method for testing chip scale package integrated circuits |
| US20130021049A1 (en) * | 2009-11-30 | 2013-01-24 | Nasser Barabi | Systems and Methods for Conforming Device Testers to Integrated Circuit Device Profiles |
| US20160054385A1 (en) * | 2014-08-25 | 2016-02-25 | Teradyne, Inc. | Capacitive opens testing of low profile components |
| CN207338684U (en) * | 2017-11-06 | 2018-05-08 | 苏州万瑞达电气有限公司 | A kind of pcb board connects electrical Detachable connection structure |
| WO2019216503A1 (en) * | 2018-05-11 | 2019-11-14 | (주) 마이크로프랜드 | Semiconductor device test socket |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1046774A (en) * | 1962-04-27 | 1966-10-26 | Glass Developments Ltd | Improvements in ultrasonic flaw detection equipment |
| US4423376A (en) * | 1981-03-20 | 1983-12-27 | International Business Machines Corporation | Contact probe assembly having rotatable contacting probe elements |
| CN2463964Y (en) * | 2001-01-20 | 2001-12-05 | 凯豊工业股份有限公司 | Battery lead head testing device |
| TWI225155B (en) * | 2003-02-11 | 2004-12-11 | Taiwan Semiconductor Mfg | Probe card |
| TWI235834B (en) * | 2004-06-16 | 2005-07-11 | Star Techn Inc | Apparatus for probing multi-dies |
| JP2008309608A (en) * | 2007-06-14 | 2008-12-25 | Ricoh Co Ltd | Inspection apparatus |
| CN102135419B (en) * | 2010-01-23 | 2015-02-11 | 鸿富锦精密工业（深圳）有限公司 | Micro-motion measuring device |
| CN204479617U (en) * | 2015-03-11 | 2015-07-15 | 法特迪精密科技（苏州）有限公司 | For the test Connection Block of chip scale of mass production test |
| CN205594072U (en) * | 2016-03-30 | 2016-09-21 | 昆明理工大学 | Hold formula resistance measurement appearance |
| CN207366592U (en) * | 2017-09-30 | 2018-05-15 | 芜湖欣宏电子科技有限公司 | A kind of full-automatic testing gauge for circuit board |
| CN207624663U (en) * | 2017-12-19 | 2018-07-17 | 广州市赛保检测技术有限公司 | A kind of electrical detection facility for wafer inspection |
| US10693437B1 (en) * | 2018-01-24 | 2020-06-23 | Christos Tsironis | High gamma on-wafer load pull test system |
| US10637122B1 (en) * | 2018-07-18 | 2020-04-28 | Christos Tsironis | Slide screw tuners with offset tuning probes and method |
| CN209168082U (en) * | 2018-12-17 | 2019-07-26 | 同共科技(赤壁)有限公司 | A kind of circuit board burning device |
| CN210954167U (en) * | 2019-06-18 | 2020-07-07 | 湖北雷特防雷检测有限公司 | Resistance tester |
-
2020
- 2020-11-29 CN CN202110992664.0A patent/CN113671353B/en active Active
- 2020-11-29 CN CN202011365950.6A patent/CN112526320B/en active Active
- 2020-11-29 CN CN202110992579.4A patent/CN113625018B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB915706A (en) * | 1960-06-27 | 1963-01-16 | Amp Inc | Electrical test probe receptacles |
| US6292003B1 (en) * | 1998-07-01 | 2001-09-18 | Xilinx, Inc. | Apparatus and method for testing chip scale package integrated circuits |
| US20130021049A1 (en) * | 2009-11-30 | 2013-01-24 | Nasser Barabi | Systems and Methods for Conforming Device Testers to Integrated Circuit Device Profiles |
| US20160054385A1 (en) * | 2014-08-25 | 2016-02-25 | Teradyne, Inc. | Capacitive opens testing of low profile components |
| CN207338684U (en) * | 2017-11-06 | 2018-05-08 | 苏州万瑞达电气有限公司 | A kind of pcb board connects electrical Detachable connection structure |
| WO2019216503A1 (en) * | 2018-05-11 | 2019-11-14 | (주) 마이크로프랜드 | Semiconductor device test socket |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115308678A (en) * | 2022-10-10 | 2022-11-08 | 哈尔滨汇鑫仪器仪表有限责任公司 | Full-automatic function detection production line of intelligent electric energy meter |
| CN115308678B (en) * | 2022-10-10 | 2023-01-24 | 哈尔滨汇鑫仪器仪表有限责任公司 | Full-automatic function detection production line of intelligent electric energy meter |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113625018A (en) | 2021-11-09 |
| CN113671353B (en) | 2022-05-17 |
| CN112526320A (en) | 2021-03-19 |
| CN113625018B (en) | 2022-05-06 |
| CN112526320B (en) | 2021-09-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113671353B (en) | Socket structure | |
| CN112462107B (en) | Probe and socket matching method | |
| WO2014017426A1 (en) | Probe unit, circuit board inspection device, and manufacturing method for probe units | |
| CN117192301A (en) | Integrated liquid cooling plate airtight insulation detection equipment and detection method | |
| US4371013A (en) | Methods of straightening backplane-supported pins | |
| CN112462105B (en) | Probe adaptor and socket structure for synchronous or quasi-synchronous test and key structure | |
| CN112462106B (en) | Probe adapter and socket matching method for synchronous test or similar synchronous test | |
| CN210716737U (en) | Automatic testing arrangement of many probes of electric wave | |
| CN215881346U (en) | Tensioning and positioning device for FPC (Flexible printed Circuit) substrate | |
| CN210956603U (en) | Laser trimming device for middle measuring table | |
| CN110261253B (en) | Bending performance testing device of automobile charger interface | |
| CN114966143B (en) | Electromagnetic drive rotary probe and fixed socket structure | |
| CN111478142A (en) | Method for improving assembly precision of conductive slip ring | |
| KR100946681B1 (en) | Apparatus for supplying a chip with power for testing a chip | |
| CN114966142B (en) | Matching method of electromagnetic drive rotary probe and fixed socket | |
| CN220752138U (en) | Chip test fixture | |
| CN113624117B (en) | Blade root size detection device and method for turbine rotor blade | |
| CN220751423U (en) | Crystal grain thrust testing device | |
| CN218036972U (en) | Test tool for integrated circuit chip | |
| CN214173194U (en) | Thickness detection device | |
| CN219891368U (en) | Circuit board test equipment | |
| KR200177337Y1 (en) | Semiconductor dummy wafer inspection apparatus | |
| CN210322116U (en) | Device for measuring pressure value of hydrogen fuel galvanic pile during press mounting | |
| EP4105761A1 (en) | Automated system and method for inserting memory modules into motherboards | |
| CN115855375A (en) | Water conservancy foundation leakage detection positioning device and using method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 215000 Suzhou Industrial Park, Suzhou City, Jiangsu Province, No. 200 Xingpu Road, 5 # 101, 102, 201, 202 Patentee after: Suzhou Fatedi Technology Co.,Ltd. Country or region after: China Address before: 215000 Suzhou Industrial Park, Suzhou City, Jiangsu Province, No. 200 Xingpu Road, 5 # 101, 102, 201, 202 Patentee before: FTDEVICE TECHNOLOGY (SUZHOU) CO.,LTD. Country or region before: China |