CN204479617U - For the test Connection Block of chip scale of mass production test - Google Patents
For the test Connection Block of chip scale of mass production test Download PDFInfo
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- CN204479617U CN204479617U CN201520138268.1U CN201520138268U CN204479617U CN 204479617 U CN204479617 U CN 204479617U CN 201520138268 U CN201520138268 U CN 201520138268U CN 204479617 U CN204479617 U CN 204479617U
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- chip positioning
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Abstract
The utility model discloses a kind of test Connection Block for the test of chip scale of mass production, comprise the setting up and down and test bench main element (2) be separated from each other and chip positioning parts (1), test bench main element comprises main body (202) setting up and down, guide housing (201), be provided with m group in main body in order to detect the spring probe unit (204) of m chips (3), often organize spring probe unit and run through the upper and lower end face of main body; Chip positioning parts (1) comprise pedestal (102), and the upper surface of pedestal has m chip positioning chamber (101), m group spring probe unit and m chip positioning chamber (101) one_to_one corresponding up and down.The utility model test bench main element and chip positioning isolation of components, provide enough spaces, can to arrange in limited space multiple test station, meet simultaneously to the demand that multiple chips is tested, improve the testing efficiency of chip, when alleviating chip production, test the bottleneck that link runs into.
Description
Technical field
The utility model relates to a kind of chip testing field, particularly relates to a kind of test Connection Block for the test of chip scale of mass production.
Background technology
Traditional die is in production test procedure, chip testing adopts the structure of socket, during each detection, only single chips is tested, the normally intact of chip functions can be guaranteed although it is so, its test mode can also meet the Production requirement of chip, but when chip large-scale mass production, easily occurs bottleneck in the test link of chip.
Utility model content
For overcoming above-mentioned shortcoming, the purpose of this utility model is to provide a kind of and can detects multiple chips simultaneously, break through the test Connection Block for the test of chip scale of mass production of test link bottleneck.
In order to reach above object, the technical solution adopted in the utility model is: a kind of test Connection Block for the test of chip scale of mass production, for detecting m chips, m is the natural number of >=2, comprise setting up and down and the test bench main element be separated from each other and chip positioning parts, described test bench main element can move to close or away from chip positioning parts direction, described test bench main element comprises main body setting up and down, guide housing, be provided with between described guide housing and main body and organize the first guide-localization unit and multiple linking springs more, m group is provided with in order to detect the spring probe unit of m chips in described main body, described spring probe unit of often organizing runs through in main body, lower surface, the m group through hole unit passed for m group spring probe unit is provided with bottom described guide housing, described chip positioning parts comprise pedestal, and the upper surface of described pedestal has m chip positioning chamber, described m group spring probe unit and m the upper and lower one_to_one corresponding in chip positioning chamber.Test bench main element in the utility model and chip positioning isolation of components, test for multiple chips simultaneously and provide enough spaces, to reach the peak use rate in space; Many groups of the first guide-localization unit are in order to ensure that test bench main element is in chip positioning component movement process, guide housing can fluctuate below main body and the lower end of m group spring probe unit can be each passed through and its m group through hole unit one to one, ensures that m group spring probe unit can contact with m chips and then detects; Multiple linking springs is in order to ensure that guide housing to be floated downward in process and because moving too quickly and defective chip positioning element, in floating-upward process, can not can not damaged main body because moving too quickly; M group spring probe unit in test bench main element and the m chips positioning chamber one_to_one corresponding in chip positioning parts, to arrange in limited space m test station, meet simultaneously to the demand that m chips is tested, the structure can tested m chips while of this kind of, effectively can improve the testing efficiency of chip, when alleviating chip production, test the bottleneck that link runs into.
Be provided with between described test bench main element and chip positioning parts and organize the second guide-localization unit more as further improvement of the utility model.When second guide-localization unit is in order to ensure test bench main element to chip positioning component movement, many groups spring probe unit can accurately insert multiple chip positioning chamber of depositing chip, avoid test bench main element to misplace to during chip positioning component movement, the phenomenon then causing spring probe unit lower end impaired occurs.
Preferably, often organize described second guide-localization unit and comprise projection and groove, described projection and groove cooperatively interact.Have the simple advantage of structure, in addition, multiple projection makes guide-localization more accurate with coordinating of multiple groove.
As further improvement of the utility model be, in order to the problem that the utilization factor solving pedestal upper surface is less, the madial wall in described each chip positioning chamber is stepped, the upper end bore in described each chip positioning chamber is greater than lower end bore, larger upper end, described chip positioning accent footpath forms described groove, described chip is arranged on less lower end, chip positioning accent footpath, and described projection is arranged on the bottom of guide housing.Groove is arranged in chip positioning chamber, by chip deposit and the groove of guide-localization is set together, comparatively ingenious, such pedestal can be arranged more chip positioning chamber, namely can detect more chip simultaneously, considerably increase the utilization factor of pedestal upper surface.
Preferably, the upper surface of described main body is fixedly installed cover plate, and the described upper end of spring probe unit of often organizing is through described cover plate.Cover plate in order to the fixing upper end often organizing spring probe unit, and can protect the upper end of m group test probe unit to a certain extent.
Preferably, often organize described first guide-localization unit to comprise and to be arranged on main body, cover plate mutually corresponding and to there are two pilot holes of same central shaft and be arranged on the guidepost of guide housing upper surface, described guidepost is through two pilot holes, and the described top passing two pilot holes is provided with limited block.Limited block ensures that guide housing can float back and forth up and down to close or away from main body direction in certain stroke.
That, in order to solve at present when detecting a collection of chip, only can detect a kind of chip of kind, comparatively single problem, described m chips is provided with at least two types as further improvement of the utility model.Often organize spring probe unit chip in order to detect every chips, because in the utility model, m chips has at least two types, then corresponding, the specification of spring probe unit is also provided with at least two kinds of specifications, this ensures that there spring probe unit when detecting a collection of chip, two groups or more chip can be detected, make this test Connection Block except can test the chip of many same kind simultaneously, the demand simultaneously can also tested many dissimilar chips, the bottleneck that link runs into is tested during further alleviation chip production.
Accompanying drawing explanation
Fig. 1 is the perspective view at this example top;
Fig. 2 is the perspective view bottom this example;
Fig. 3 is the three dimensional sectional view of this example;
Fig. 4 is the two-dimentional cut-open view of this example;
Fig. 5 is the side cross-sectional view of this example.
In figure:
1-chip positioning parts; 101-chip positioning chamber; 102-pedestal; 103-groove; 2-test bench main element; 201-guide housing; 202-main body; 203-cover plate; 204-spring probe unit; 205-linking springs; 206-is protruding; 207-guidepost; 208-limited block; 3-chip.
Embodiment
Below in conjunction with accompanying drawing, preferred embodiment of the present utility model is described in detail, to make advantage of the present utility model and feature can be easier to be readily appreciated by one skilled in the art, thus more explicit defining is made to protection domain of the present utility model.
See a kind of test Connection Block for the test of chip scale of mass production shown in accompanying drawing 1-5, for detecting six chips 3, comprise setting up and down and the test bench main element 2 be separated from each other and chip positioning parts 1, test bench main element 2 can move to close or away from chip positioning parts 1 direction, test bench main element 2 comprises main body 202 setting up and down, guide housing 201, be provided with between guide housing 201 and main body 202 and organize the first guide-localization unit and multiple linking springs 205 more, when needs detect six chips 3, six groups are provided with in order to detect the spring probe unit 204 of six chips 3 in main body 202, often organizing spring probe unit 204 runs through in main body 202, lower surface, the six groups of through hole unit passed for six groups of spring probe unit 204 are provided with bottom guide housing 201, chip positioning parts 1 comprise pedestal 102, and the upper surface of pedestal 102 has six for depositing 101, six groups, chip positioning chamber spring probe unit 204 and six chips positioning chamber about 101 one_to_one corresponding of chip 3.The quantity in spring probe unit 204, through hole unit and chip positioning chamber 101 is determined according to the actual demand of chip 3.To detect ten chips 3 simultaneously, then accordingly, the quantity in spring probe unit 204, through hole unit and chip positioning chamber 101 is ten.
Be provided with between test bench main element 2 and chip positioning parts 1 and organize the second guide-localization unit more.Often group second guide-localization unit in the present embodiment comprises protruding 206 and groove 103, and protruding 206 cooperatively interact with groove 103.Certainly the guiding-positioning structure of other modes can be taked, as the structure of guide pin bushing, guide pillar.As protruding 206 and the preferred structure of groove 103 be, the madial wall in each chip positioning chamber 101 is stepped, the upper end bore in each chip positioning chamber 101 is greater than lower end bore, the upper end that chip positioning chamber 101 bore is larger forms groove 103, originally pedestal 102 upper surface should will be arranged on and groove 103 between multiple chip positioning chamber 101 changes into and is arranged in chip positioning chamber 101, considerably increase the utilization factor of pedestal 102 upper surface, more chips positioning chamber 101 can be set in the upper surface of the pedestal 102 saved, chip 3 is arranged on the less lower end of chip positioning chamber 101 bore, accordingly, projection 206 is arranged on the bottom of guide housing 201, such guarantee multiple protruding 206 and multiple groove 103 can cooperatively interact and can play guide effect.Wherein, groove 103 can respectively be set to six with protruding 206, consistent with the quantity in chip positioning chamber 101; Groove 103 2 ~ 6 can certainly be arranged, as long as can be made to play guide effect with protruding 206.
The upper surface of main body 202 is fixedly installed to fix six groups of spring probe unit 204 upper ends and in order to protect the cover plate 203 of six groups of spring probe unit 204, often organizes the upper end of spring probe unit 204 through cover plate 203.
Often organize the first guide-localization unit to comprise and to be arranged on main body 202, cover plate 203 mutually corresponding and to there are two pilot holes of same central shaft and be arranged on the guidepost 207 of guide housing 201 upper surface, guidepost 207 is through two pilot holes, and the top through two pilot holes is provided with limited block 208.
Wherein, in order to ensure that this test Connection Block can detect two or more chip 3, then the spring probe quantity of at least one group of spring probe unit 204 is different from the spring probe quantity that other organize spring probe unit 204.
During test; first six chips 3 to be detected are put into six chip positioning chambeies 102 respectively; then test bench main element 2 entirety moves downward; namely move near the direction of chip positioning parts 1; now; form between the guide housing 201 of test bench main element 2 and main body 202 and there is certain distance; linking springs 205 between guide housing 201 and main body 202 is in the state of being stretched; the lower end of six groups of spring probe unit 204 is hidden in guide housing 201; do not stretch out guide housing 201, guide housing 201 protects the lower end of six groups of spring probe unit 204.Move downward in process, first the lower surface of guide housing 201 contacts with pedestal 102 upper surface, more specifically, that multiple protruding 206 of guide housing 201 embeds multiple grooves 103 of pedestals 102 and contacts, both surface of contact interact, the correspondence position of correcting test bench main element 2 and chip positioning parts 1, after continuing to press down, the obstruction that guide housing 201 is subject to pedestal 102 upper surface moves upward then, linking springs 205 by compression, six groups of through hole unit bottom guide housing 201 are stretched out in the lower end of six groups of spring probe unit 204 simultaneously, contact with six chips 3 and test, after completing test, test bench main element 2 moves upward, namely move to the direction away from chip positioning parts 1, both are separated.Take out six chips 3 of test, put into the chip testing that six chips 3 do not surveyed carry out a new round.Wherein, if need the chip 3 testing same kind simultaneously, then six groups of spring probe unit 204 are arranged to same specification, if need to test with a collection of chip 3 to two groups or more type simultaneously, then six groups of spring probe unit 204 are arranged to two groups or more specification, the specification of spring probe unit 204 is determined according to chip 3.
Above embodiment is only for illustrating technical conceive of the present utility model and feature; its object is to allow person skilled in the art understand content of the present utility model and to be implemented; protection domain of the present utility model can not be limited with this; all equivalences done according to the utility model Spirit Essence change or modify, and all should be encompassed in protection domain of the present utility model.
Claims (7)
1. the test Connection Block for the test of chip scale of mass production, for detecting m chips (3), m is the natural number of >=2, it is characterized in that: comprise the setting up and down and test bench main element (2) be separated from each other and chip positioning parts (1), described test bench main element (2) can be moved to close or away from chip positioning parts (1) direction
Described test bench main element (2) comprises main body (202) setting up and down, guide housing (201), be provided with between described guide housing (201) and main body (202) and organize the first guide-localization unit and multiple linking springs (205) more, m group is provided with in order to detect the spring probe unit (204) of m chips (3) in described main body (202), described spring probe unit (204) of often organizing runs through in main body (202), lower surface, described guide housing (201) bottom is provided with the m group through hole unit passed for m group spring probe unit (204),
Described chip positioning parts (1) comprise pedestal (102), the upper surface of described pedestal (102) has m chip positioning chamber (101), described m group spring probe unit (204) and m chip positioning chamber (101) one_to_one corresponding up and down.
2. the test Connection Block for the test of chip scale of mass production according to claim 1, is characterized in that: be provided with between described test bench main element (2) and chip positioning parts (1) and organize the second guide-localization unit more.
3. the test Connection Block for the test of chip scale of mass production according to claim 2, it is characterized in that: often organize described second guide-localization unit and comprise projection (206) and groove (103), described projection (206) and groove (103) cooperatively interact.
4. the test Connection Block for the test of chip scale of mass production according to claim 3, it is characterized in that: the madial wall of described each chip positioning chamber (101) is stepped, the upper end bore of described each chip positioning chamber (101) is greater than lower end bore, the upper end that described chip positioning chamber (101) bore is larger forms described groove (103), described chip (3) is arranged on the less lower end of chip positioning chamber (101) bore, and described projection (206) is arranged on the bottom of guide housing (201).
5. according to the test Connection Block for the test of chip scale of mass production in claim 1-4 described in any one, it is characterized in that: the upper surface of described main body (202) is fixedly installed cover plate (203), the described upper end of spring probe unit (204) of often organizing is through described cover plate (203).
6. the test Connection Block for the test of chip scale of mass production according to claim 5, it is characterized in that: often organize described first guide-localization unit and comprise that to be arranged on main body (202), cover plate (203) upper mutually corresponding and have two pilot holes of same central shaft and be arranged on the guidepost (207) of guide housing (201) upper surface, described guidepost (207) is through two pilot holes, and the described top passing two pilot holes is provided with limited block (208).
7. the test Connection Block for the test of chip scale of mass production according to claim 1, is characterized in that: described m chips (3) is provided with at least two types.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520138268.1U CN204479617U (en) | 2015-03-11 | 2015-03-11 | For the test Connection Block of chip scale of mass production test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520138268.1U CN204479617U (en) | 2015-03-11 | 2015-03-11 | For the test Connection Block of chip scale of mass production test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204479617U true CN204479617U (en) | 2015-07-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520138268.1U Expired - Fee Related CN204479617U (en) | 2015-03-11 | 2015-03-11 | For the test Connection Block of chip scale of mass production test |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204479617U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109580999A (en) * | 2018-12-21 | 2019-04-05 | 富芯微电子有限公司 | A kind of chip test fixture |
| CN113625018A (en) * | 2020-11-29 | 2021-11-09 | 法特迪精密科技（苏州）有限公司 | Probe structure |
| CN114472252A (en) * | 2020-11-28 | 2022-05-13 | 法特迪精密科技（苏州）有限公司 | Probe fixing method for testing probe cleaning method |
| TWI803913B (en) * | 2020-08-05 | 2023-06-01 | 日商歐姆龍股份有限公司 | Socket, socket unit, inspection jig and inspection jig unit |
-
2015
- 2015-03-11 CN CN201520138268.1U patent/CN204479617U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109580999A (en) * | 2018-12-21 | 2019-04-05 | 富芯微电子有限公司 | A kind of chip test fixture |
| CN109580999B (en) * | 2018-12-21 | 2024-03-22 | 富芯微电子有限公司 | Chip test fixture |
| TWI803913B (en) * | 2020-08-05 | 2023-06-01 | 日商歐姆龍股份有限公司 | Socket, socket unit, inspection jig and inspection jig unit |
| JP7452317B2 (en) | 2020-08-05 | 2024-03-19 | オムロン株式会社 | Sockets, socket units, inspection jigs and inspection jig units |
| CN114472252A (en) * | 2020-11-28 | 2022-05-13 | 法特迪精密科技（苏州）有限公司 | Probe fixing method for testing probe cleaning method |
| CN113625018A (en) * | 2020-11-29 | 2021-11-09 | 法特迪精密科技（苏州）有限公司 | Probe structure |
| CN113625018B (en) * | 2020-11-29 | 2022-05-06 | 法特迪精密科技（苏州）有限公司 | Probe structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150715 Termination date: 20160311 |
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| CF01 | Termination of patent right due to non-payment of annual fee |