CN109580999A - A kind of chip test fixture - Google Patents
A kind of chip test fixture Download PDFInfo
- Publication number
- CN109580999A CN109580999A CN201811572142.XA CN201811572142A CN109580999A CN 109580999 A CN109580999 A CN 109580999A CN 201811572142 A CN201811572142 A CN 201811572142A CN 109580999 A CN109580999 A CN 109580999A
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- test
- chip
- groups
- probe
- bench
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- 238000012360 testing method Methods 0.000 title claims abstract description 211
- 239000000523 sample Substances 0.000 claims abstract description 69
- 238000003780 insertion Methods 0.000 claims abstract description 4
- 230000037431 insertion Effects 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 239000010931 gold Substances 0.000 claims description 10
- 229910052737 gold Inorganic materials 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000000178 monomer Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 9
- 238000005259 measurement Methods 0.000 description 7
- 230000006378 damage Effects 0.000 description 3
- 230000000451 tissue damage Effects 0.000 description 3
- 231100000827 tissue damage Toxicity 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001595 contractor effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0425—Test clips, e.g. for IC's
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
Abstract
The present invention discloses a kind of chip test fixture, including test bench, the upper surface of the test bench is fixedly installed with two groups of fixed plates, and the front surface and rear surface of fixed plate are provided with test probe, insertion is equipped with contact pin on the inside of the upper surface of the test bench, the lower surface of the test bench is fixedly installed with two groups of support legs, the upper surface of the test bench is provided with signal wire, the lower surface of the test bench and the lower end corresponding position of contact pin are provided with fuse；The present invention is fixed test probe by the way that reset spring is arranged in test needle guard, it can be improved the measuring stability and reliability of test fixture when to chip testing, and it avoids chip to fall off during the test problem, and it can be tested for the IC chip of different-thickness, various sizes of chip can be surveyed, multiple test stations are set, can satisfy the single of multiple monomer chips and survey, and can satisfy the chip testing condition under different temperatures.
Description
Technical field
The invention belongs to semiconductor integrated circuit detection fields, are related to test fixture, and specifically TVS/TSS chip testing is pressed from both sides
Tool.
Background technique
Chip test fixture is the fixture that a kind of pair of IC chip is tested, and IC chip can be fixed, and complete
It tests at the energization of IC chip, to determine whether IC chip is powered normally, quality of IC chip is screened with this.
There are certain drawbacks in existing chip test fixture, existing chip test fixture is right when in use when in use
The fixed effect of IC chip is general, and IC chip is easy to appear the case where falling off during the test, and existing chip testing is pressed from both sides
For tool when testing IC chip, the size of single fixture test chip is relatively more fixed, is not able to satisfy various sizes of core
The test of piece, furthermore existing chip test fixture protective value is general, and test station is brought than relatively limited to actual use
Certain influence.
Summary of the invention
It, can be compared with the purpose of the present invention is to provide a kind of chip test fixture, specifically TVS/TSS chip test fixture
Good is fixed IC chip, effectively avoids the case where IC chip falls off during the test, and by resetting bullet
Spring is capable of the height of the measuring head of flexibly adjustment test probe, can test the IC chip of different-thickness, can survey
Various sizes of chip, the chip size between 1.1 to 6.0 can be tested, and be each provided with ten before and after every group of fixed plate
Two groups of test probes and contact pin, to can satisfy the test of 24 monomer chips before and after every group of fixed plate, entirely
Test fixture shares 48 test stations, therefore can satisfy the test of the chip of different sizes, and having preferably makes
With effect, every group of test probe is arranged in pairs or groups one group of fuse, and an end of signal wire is connected to protection diode, and protection diode can be with
TSS and TVS is selected according to actual measurement situation, thus entire test fixture has preferable using effect dduring test, energy
It is enough preferably to provide protection to IC chip, parallel connection is used between every group of test probe, therefore will not phase between each test station
Mutually interference, when there is test tissue damage, other test probes also can satisfy the measurement to IC chip, and multiple stations can be into
Row selection, to will not be impacted to test in individually test tissue damage, by applying plating on the surface of test probe
Gold plating, gold coatings can increase the high temperature resistance of test probe, so as to meet the test under high temperature and low temperature, side
Just test it is different at a temperature of IC chip performance so that the function of the chip test fixture is more comprehensive.
The purpose of the present invention can be achieved through the following technical solutions:
A kind of chip test fixture, including test bench, the upper surface of the test bench are fixedly installed with two groups of fixed plates, and
The front surface and rear surface of fixed plate are provided with test probe, and insertion is equipped with contact on the inside of the upper surface of the test bench
Needle, the lower surface of the test bench are fixedly installed with two groups of support legs, and the upper surface through the test bench is provided with signal wire；
The lower surface of the test bench and the lower end corresponding position of contact pin are provided with fuse, described to test the upper of probe
Portion periphery is equipped with test needle guard, and tests between the inner surface of needle guard and the outer surface for testing probe and be enclosed with reset spring.
Further, the quantity of the test probe of the front surface of fixed plate described in every group and rear surface is 12 groups, and
The quantity of contact pin with test the quantity of probe it is identical, it is described test probe lower end with test probe pin upper ends position above and below it is right
It answers, test probe described in 12 groups is parallel with one another to signal wire.
Further, fixed plate described in two groups is arranged in parallel, and two groups of fixed plates are vertical setting with test bench, two groups of institutes
It states fixed plate and passes through screw and be fixedly connected with test bench.
Further, the lower surface of two groups of support legs and test bench described in two groups of several groups is vertical setting, and support leg
It include two quarter butts and a support plate, two quarter butts are arranged in parallel, and are vertically arranged with support plate.
Further, between the quantity of the fuse fuse consistent and all with the test quantity of probe mutually
It is connected in parallel to signal wire, the surface of the test probe is coated with gold coatings.
Further, the measuring head of the test probe is flexibly connected by reset spring with test needle guard.
Further, the signal wire includes two black lines and two red lines, one end of two black lines and two red lines
It is connected separately with one group of protection diode, and the other end of two black lines and two red lines is fixed by wire clamp
Beneficial effects of the present invention: by the way that reset spring is arranged inside test needle guard, reset spring plays to be stretched the present invention
Contracting effect, tests retractility of the probe by reset spring, can preferably be fixed to IC chip, effectively avoid surveying
The case where IC chip falls off during examination, and pass through reset spring and be capable of the height that flexibly adjustment tests the measuring head of probe
Degree, can test the IC chip of different-thickness, can survey various sizes of chip, the chip size between 1.1 to 6.0
It can be tested；
12 groups of test probes and contact pin are each provided with before and after every group of fixed plate, thus the front and back energy of every group of fixed plate
Enough meet the test of 24 monomer chips, entire test fixture shares 48 test stations, therefore can satisfy not
The test of the chip of same size has preferable using effect, every group of test probe one group of fuse of collocation, and signal wire
One end is connected to protection diode, and protection diode can select TSS and TVS according to actual measurement situation, thus dduring test
Entire test fixture has preferable using effect, preferably can provide protection to IC chip；
It using parallel connection between every group of test probe, therefore will not be interfered with each other between each test station, test occur and visit
When needle damages, other test probes also can satisfy the measurement to IC chip, and multiple stations can be selected, thus single
Test will not be impacted when testing tissue damage；
By coating gold coatings on the surface of test probe, gold coatings can increase the heat-resisting quantity of test probe
Can, so as to meet the test under high temperature and low temperature, the performance of the IC chip at a temperature of facilitating test different, so that the core
The function of built-in testing fixture is more comprehensive.
Detailed description of the invention
In order to facilitate the understanding of those skilled in the art, the present invention will be further described below with reference to the drawings.
Fig. 1 is overall structure of the present invention；
Fig. 2 is the bottom view of test bench of the present invention；
Fig. 3 is the enlarged drawing in the area Tu1Zhong A of the present invention.
In figure: 1, test bench；2, fixed plate；3, probe is tested；4, contact pin；5, support leg；6, signal wire；7, insure
Silk；8, needle guard is tested；9, reset spring；10, protection diode.
Specific embodiment
As shown in Figure 1-3, a kind of chip test fixture, including test bench 1, the upper surface of test bench 1 are fixedly installed with two
Group fixed plate 2, and the front surface of fixed plate 2 and rear surface are provided with test probe 3, insertion on the inside of the upper surface of test bench 1
Contact pin 4 is installed, the lower surface of test bench 1 is fixedly installed with two groups of support legs 5, and the upper surface through test bench 1 is provided with
Signal wire 6；
The lower surface of test bench 1 and the lower end corresponding position of contact pin 4 are provided with fuse 7, test outside the top of probe 3
It encloses and test needle guard 8 is installed, and test between the inner surface of needle guard 8 and the outer surface for testing probe 3 and be enclosed with reset spring 9,
Reset spring 9 can will test 3 homing of probe when testing 3 pull-up of probe, so that test probe 3 can be to core
Piece is tested.
Further, the quantity of the test probe 3 of the front surface and rear surface of every group of fixed plate 2 is 12 groups, and is connect
The quantity of contact pilotage 4 is identical as the test quantity of probe 3, and lower end and test 3 upper end position of probe for testing probe 3 are corresponding up and down,
12 groups of test probes 3 are parallel with one another to signal wire 6.
Further, two groups of fixed plates 2 are arranged in parallel, and two groups of fixed plates 2 are vertical setting with test bench 1, and two groups solid
Fixed board 2 is fixedly connected by screw with test bench 1.
Further, two groups of two groups of support legs 5 of several groups and the lower surface of test bench 1 are vertical setting, and support leg 5 is wrapped
Two quarter butts and a support plate are included, two quarter butts are arranged in parallel, and are vertically arranged with support plate, and support leg 5 passes through
Quarter butt increases the height of test bench 1, avoids occurring the situation of short circuit in test chip galvanization.
Further, between the quantity of fuse 7 fuse 7 consistent and all with the test quantity of probe 3 mutually simultaneously
It is coupled to signal wire 6, the surface of test probe 3 is coated with gold coatings, and fuse 7 plays the role of fuse protection, surveys in chip
Protection can be provided to chip during examination, prevent chip from burning out, gold coatings can satisfy the high temperature resistant condition of test probe 3,
So that the fixture can satisfy it is different at a temperature of chip test.
Further, the measuring head for testing probe 3 is flexibly connected by reset spring 9 with test needle guard 8.
Further, signal wire 6 includes two black lines and two red lines, one end difference of two black lines and two red lines
It is connected with one group of protection diode 10, and the other end of two black lines and two red lines is fixed by wire clamp, wire clamp is to signal
The end of line 6 carries out unified fixation, facilitates signal wire 6 being linked into output end, protection diode 10 can select TVS or
TSS cooperation fuse 7 can play preferable protective effect in test.
IC chip to be tested is placed on test bench 1, according to IC chip by a kind of chip test fixture when in use
Size, fixed plate 2 front-rear position select test station, pull up test needle guard 8, test probe 3 test
Head is in tensional state, IC chip is placed on station to be measured, the bottom of IC chip by 9 pull-up of reset spring, reset spring 9
Portion is contacted with contact pin 4, and the measuring head of test probe 3 pushes in the reseting procedure of reset spring 9, thus to the upper of IC chip
Portion is fixed, and test probe 3 cooperates contact pin 4, so that the Current Voltage to IC chip is tested, each test probe 3
All concatenated with signal wire 6, thus the test data of 6 acceptance test probe 3 of signal wire, by the way that signal wire 6 is external to output end,
The data of IC chip can be measured, to during the test, raise by support leg 5 to determine whether IC chip is qualified
The height of test bench 1 avoids short circuit occur in test IC chip galvanization, tests and have reset spring 9 inside needle guard 8, rise
To telescopic action, the IC chip of different-thickness can be tested, can survey various sizes of chip, between 1.1 to 6.0
Chip size can be tested, and the front and back of every group of fixed plate 2 is each provided with 12 groups of test probes 3 and contact pin 4, thus often
The front and back of group fixed plate 2 can satisfy the test of 24 monomer chips, and entire test fixture shares 48 test works
Position, therefore can satisfy the test of the chip of different sizes, there is preferable using effect, every group of collocation of test probe 3 one
Group fuse 7, and an end of signal wire 6 is connected to protection diode 10, protection diode 10 can be selected according to actual measurement situation
With TSS and TVS, thus entire test fixture has preferable using effect dduring test, can preferably mention to IC chip
For protection.
The present invention plays telescopic action by the way that reset spring 9, reset spring 9 are arranged inside test needle guard 8, tests probe
3 pass through the retractility of reset spring 9, can preferably be fixed to IC chip, effectively avoid IC core during the test
The case where piece falls off, and pass through reset spring 9 and be capable of the height that flexibly adjustment tests the measuring head of probe 3, it can be right
The IC chip of different-thickness is tested, and various sizes of chip can be surveyed, and the chip size between 1.1 to 6.0 can carry out
Test；The front and back of every group of fixed plate 2 is each provided with 12 groups of test probes 3 and contact pin 4, thus the front and back of every group of fixed plate 2
It can satisfy the test of 24 monomer chips, entire test fixture shares 48 test stations, therefore can satisfy
The test of the chip of different sizes has preferable using effect, every group of one group of fuse 7 of collocation of test probe 3, and signal
One end of line 6 is connected to protection diode 10, and protection diode 10 can select TSS and TVS according to actual measurement situation, thus
Entire test fixture has preferable using effect during test, preferably can provide protection to IC chip；Every group of test is visited
Using parallel connection between needle 3, therefore will not be interfered with each other between each test station, when there is the test damage of probe 3, other tests
Probe 3 also can satisfy the measurement to IC chip, and multiple stations can be selected, thus when individually test probe 3 damages
Test will not be impacted；By coating gold coatings on the surface of test probe 3, gold coatings can increase test probe
3 high temperature resistance, so as to meet the test under high temperature and low temperature, the property of the IC chip at a temperature of facilitating test different
Can, so that the function of the chip test fixture is more comprehensive.
Above content is only to structure of the invention example and explanation, affiliated those skilled in the art couple
Described specific embodiment does various modifications or additions or is substituted in a similar manner, without departing from invention
Structure or beyond the scope defined by this claim, is within the scope of protection of the invention.
Claims (7)
1. a kind of chip test fixture, which is characterized in that including test bench (1), the upper surface of the test bench (1) is fixedly mounted
There are two groups of fixed plates (2), and the front surface of fixed plate (2) and rear surface are provided with test probe (3), the test bench (1)
Upper surface on the inside of insertion be equipped with contact pin (4), the lower surface of the test bench (1) is fixedly installed with two groups of support legs (5),
The upper surface of the test bench (1) is provided with signal wire (6)；
The lower surface of the test bench (1) and the lower end corresponding position of contact pin (4) are provided with fuse (7), and the test is visited
The top peripheral of needle (3) be equipped with test needle guard (8), and test needle guard (8) inner surface and test probe (3) outer surface it
Between be enclosed with reset spring (9).
2. a kind of chip test fixture according to claim 1, which is characterized in that the preceding table of fixed plate described in every group (2)
The quantity of the test probe (3) of face and rear surface is respectively 12 groups, and the quantity of the quantity of contact pin (4) and test probe (3)
Identical, the lower end of test probe (3) and test probe (3) upper end position are corresponding up and down, test probe (3) described in 12 groups
It is parallel with one another to signal wire (6).
3. a kind of chip test fixture according to claim 1, which is characterized in that fixed plate described in two groups (2) is set in parallel
It sets, and two groups of fixed plates (2) are vertical setting with test bench (1), fixed plate described in two groups (2) passes through screw and test bench
(1) it is fixedly connected.
4. a kind of chip test fixture according to claim 1, which is characterized in that two groups of support legs described in two groups of several groups
(5) lower surface with test bench (1) is vertical setting, and support leg (5) includes two quarter butts and a support plate, and two
Quarter butt is arranged in parallel, and is vertically arranged with support plate.
5. a kind of chip test fixture according to claim 1, which is characterized in that the quantity and survey of the fuse (7)
It is parallel with one another to signal wire (6), the test probe (3) between the consistent and all fuse (7) of the quantity of exploration needle (3)
Surface be coated with gold coatings.
6. a kind of chip test fixture according to claim 1, it is characterised in that: the measuring head of test probe (3)
It is flexibly connected by reset spring (9) with test needle guard (8).
7. a kind of chip test fixture according to claim 1, which is characterized in that the signal wire (6) includes two
One end of black line and two red lines, two black lines and two red lines is connected separately with one group of protection diode (10), and two black
The other end of line and two red lines is fixed by wire clamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811572142.XA CN109580999B (en) | 2018-12-21 | 2018-12-21 | Chip test fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811572142.XA CN109580999B (en) | 2018-12-21 | 2018-12-21 | Chip test fixture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109580999A true CN109580999A (en) | 2019-04-05 |
| CN109580999B CN109580999B (en) | 2024-03-22 |
Family
ID=65931305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811572142.XA Active CN109580999B (en) | 2018-12-21 | 2018-12-21 | Chip test fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109580999B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101223449A (en) * | 2005-03-25 | 2008-07-16 | 威世通用半导体公司 | Apparatus, system and method for testing electronic elements |
| CN204479617U (en) * | 2015-03-11 | 2015-07-15 | 法特迪精密科技（苏州）有限公司 | For the test Connection Block of chip scale of mass production test |
| CN104897934A (en) * | 2014-01-28 | 2015-09-09 | 旺矽科技股份有限公司 | Spring probe |
| CN106226562A (en) * | 2016-07-11 | 2016-12-14 | 无锡宏纳科技有限公司 | Spring downward cake core test fixture |
| CN206671370U (en) * | 2017-03-30 | 2017-11-24 | 中国振华集团云科电子有限公司 | A kind of multi-functional clamp for chip capacitor electric performance test |
| CN108037443A (en) * | 2017-12-27 | 2018-05-15 | 江苏凯尔生物识别科技有限公司 | Test marking machine with barcode scanning device |
| CN108593973A (en) * | 2018-05-02 | 2018-09-28 | 江苏匠心信息科技有限公司 | A kind of chip testing slot based on graphene |
| CN108627762A (en) * | 2018-06-08 | 2018-10-09 | 深圳瑞波光电子有限公司 | A kind of test system |
| CN209803185U (en) * | 2018-12-21 | 2019-12-17 | 富芯微电子有限公司 | Chip test fixture |
-
2018
- 2018-12-21 CN CN201811572142.XA patent/CN109580999B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101223449A (en) * | 2005-03-25 | 2008-07-16 | 威世通用半导体公司 | Apparatus, system and method for testing electronic elements |
| CN104897934A (en) * | 2014-01-28 | 2015-09-09 | 旺矽科技股份有限公司 | Spring probe |
| CN204479617U (en) * | 2015-03-11 | 2015-07-15 | 法特迪精密科技（苏州）有限公司 | For the test Connection Block of chip scale of mass production test |
| CN106226562A (en) * | 2016-07-11 | 2016-12-14 | 无锡宏纳科技有限公司 | Spring downward cake core test fixture |
| CN206671370U (en) * | 2017-03-30 | 2017-11-24 | 中国振华集团云科电子有限公司 | A kind of multi-functional clamp for chip capacitor electric performance test |
| CN108037443A (en) * | 2017-12-27 | 2018-05-15 | 江苏凯尔生物识别科技有限公司 | Test marking machine with barcode scanning device |
| CN108593973A (en) * | 2018-05-02 | 2018-09-28 | 江苏匠心信息科技有限公司 | A kind of chip testing slot based on graphene |
| CN108627762A (en) * | 2018-06-08 | 2018-10-09 | 深圳瑞波光电子有限公司 | A kind of test system |
| CN209803185U (en) * | 2018-12-21 | 2019-12-17 | 富芯微电子有限公司 | Chip test fixture |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109580999B (en) | 2024-03-22 |
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