CN109580999B - Chip test fixture - Google Patents
Chip test fixture Download PDFInfo
- Publication number
- CN109580999B CN109580999B CN201811572142.XA CN201811572142A CN109580999B CN 109580999 B CN109580999 B CN 109580999B CN 201811572142 A CN201811572142 A CN 201811572142A CN 109580999 B CN109580999 B CN 109580999B
- Authority
- CN
- China
- Prior art keywords
- test
- seat
- chip
- groups
- probes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 225
- 239000000523 sample Substances 0.000 claims abstract description 76
- 238000000576 coating method Methods 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 description 8
- 238000005259 measurement Methods 0.000 description 7
- 238000007792 addition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0425—Test clips, e.g. for IC's
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
Abstract
The invention discloses a chip test fixture, which comprises a test seat, wherein two groups of fixing plates are fixedly arranged on the upper surface of the test seat, test probes are arranged on the front surface and the rear surface of the fixing plates, contact pins are embedded and arranged on the inner side of the upper surface of the test seat, two groups of supporting legs are fixedly arranged on the lower surface of the test seat, signal wires penetrate through the upper surface of the test seat, and fuses are arranged on the positions, corresponding to the lower ends of the contact pins, of the lower surface of the test seat; according to the invention, the reset spring is arranged in the test needle sleeve to fix the test probe, so that the test stability and reliability of the test fixture can be improved during chip test, the problem of falling of chips in the test process is avoided, the IC chips with different thicknesses can be tested, chips with different sizes can be tested, a plurality of test stations are arranged, the single test of a plurality of single chips can be satisfied, and the chip test conditions at different temperatures can be satisfied.
Description
Technical Field
The invention belongs to the field of semiconductor integrated circuit detection, and relates to a test fixture, in particular to a TVS/TSS chip test fixture.
Background
The chip test fixture is a fixture for testing an IC chip, and can fix the IC chip and complete the power-on test of the IC chip to determine whether the power-on of the IC chip is normal, so as to screen the quality of the IC chip.
The existing chip test clamp has certain defects when in use, the existing chip test clamp has a general fixing effect on an IC chip when in use, the IC chip is easy to fall off in the test process, the size of a single clamp test chip is relatively fixed when the existing chip test clamp tests the IC chip, the test of chips with different sizes cannot be met, the protection performance of the existing chip test clamp is general, a test station is relatively limited, and certain influence is brought to practical use.
Disclosure of Invention
The invention aims to provide a chip test fixture, in particular to a TVS/TSS chip test fixture, which can better fix an IC chip, effectively avoid the situation that the IC chip falls off in the test process, flexibly adjust the height of a test head of a test probe through a reset spring, test IC chips with different thicknesses, test chips with different sizes, test the chip size between 1.1 and 6.0, twelve groups of test probes and contact pins are respectively arranged in front of and behind each group of fixing plates, thus the front and the back of each group of fixing plates can meet the test of twenty-four single chips, the whole test fixture has forty-eight test stations in total, can meet the test of chips with different sizes, has better use effect, and is matched with one group of fuses, and one end of signal line connects to the protection diode, the protection diode can select TSS and TVS according to actual measurement condition, therefore whole test fixture possesses better result of use in the test period, can be better provide the protection to the IC chip, adopt parallelly connected between every group test probe, consequently can not mutual interference between each test station, when the test probe damage appears, other test probes also can satisfy the measurement to the IC chip, a plurality of stations can select, thereby can not influence the test when single test probe damages, through the surface coating gilding coating at test probe, gilding coating can increase the high temperature resistance of test probe, thereby can satisfy the test under the high temperature and the low temperature, the performance of the IC chip under the different temperatures of convenient test, make the function of this chip test fixture more comprehensive.
The aim of the invention can be achieved by the following technical scheme:
the chip test fixture comprises a test seat, wherein two groups of fixing plates are fixedly arranged on the upper surface of the test seat, test probes are arranged on the front surface and the rear surface of each fixing plate, contact pins are embedded and arranged on the inner side of the upper surface of the test seat, two groups of supporting legs are fixedly arranged on the lower surface of the test seat, and signal wires penetrate through the upper surface of the test seat;
the lower surface of test seat and the lower extreme corresponding position of contact pin are provided with the fuse, test needle cover is installed to the upper portion periphery of test probe, and wraps up between the internal surface of test needle cover and the surface of test probe has reset spring.
Further, the number of the test probes on the front surface and the rear surface of each group of the fixing plate is twelve groups respectively, the number of the contact pins is the same as that of the test probes, the lower ends of the test probes vertically correspond to the upper ends of the test probes, and the twelve groups of the test probes are mutually connected in parallel to the signal wires.
Further, two groups of fixed plates are arranged in parallel, and the two groups of fixed plates are perpendicular to the test seat, and the two groups of fixed plates are fixedly connected with the test seat through screws.
Further, two groups of supporting legs are perpendicular to the lower surface of the test seat, and each supporting leg comprises two short rods and a supporting plate, and the two short rods are arranged in parallel and perpendicular to the supporting plate.
Further, the number of the fuses is identical to that of the test probes, all the fuses are mutually connected in parallel to the signal line, and the surfaces of the test probes are coated with gold-plated coatings.
Further, the test head of the test probe is movably connected with the test needle sleeve through a reset spring.
Further, the signal line comprises two black lines and two red lines, one ends of the two black lines and the two red lines are respectively connected with a group of protection diodes, and the other ends of the two black lines and the two red lines are fixed through wire clamps
The invention has the beneficial effects that: according to the invention, the reset spring is arranged in the test needle sleeve, and plays a role in stretching, the test probe can better fix the IC chip through the elasticity of the reset spring, so that the situation that the IC chip falls off in the test process is effectively avoided, the height of the test head of the test probe can be flexibly adjusted through the reset spring, the IC chips with different thicknesses can be tested, chips with different sizes can be tested, and the chip size between 1.1 and 6.0 can be tested;
twelve groups of test probes and contact pins are respectively arranged at the front and the back of each group of fixing plates, so that the front and the back of each group of fixing plates can meet the test of twenty-four single chips, the whole test fixture has forty-eight test stations, therefore, the test of chips with different sizes can be met, the use effect is better, each group of test probes is matched with one group of fuses, one end of a signal wire is connected to a protection diode, and the protection diode can select TSS and TVS according to actual measurement conditions, so that the whole test fixture has better use effect during the test and can provide protection for IC chips better;
the test probes of each group are connected in parallel, so that the test probes cannot interfere with each other, when the test probes are damaged, other test probes can also meet the measurement of the IC chip, and a plurality of stations can be selected, so that the test cannot be influenced when a single test probe is damaged;
through the surface coating gilding coating at test probe, gilding coating can increase test probe's high temperature resistance to can satisfy the test under high temperature and the low temperature, the IC chip's under the different temperatures of convenient test performance makes the function of this chip test fixture more comprehensive.
Drawings
The present invention is further described below with reference to the accompanying drawings for the convenience of understanding by those skilled in the art.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a bottom view of the test seat of the present invention;
fig. 3 is an enlarged view of region a of fig. 1 in accordance with the present invention.
In the figure: 1. a test seat; 2. a fixing plate; 3. a test probe; 4. a contact pin; 5. supporting feet; 6. a signal line; 7. a fuse; 8. a test needle sleeve; 9. a return spring; 10. the diode is protected.
Detailed Description
As shown in fig. 1-3, a chip test fixture comprises a test seat 1, wherein two groups of fixing plates 2 are fixedly arranged on the upper surface of the test seat 1, test probes 3 are arranged on the front surface and the rear surface of each fixing plate 2, contact pins 4 are embedded and arranged on the inner side of the upper surface of the test seat 1, two groups of supporting legs 5 are fixedly arranged on the lower surface of the test seat 1, and signal wires 6 are arranged on the upper surface of the test seat 1 in a penetrating manner;
the lower surface of test seat 1 and the lower extreme corresponding position of contact pin 4 are provided with fuse 7, and test needle cover 8 is installed to the upper portion periphery of test probe 3, and wraps up between the internal surface of test needle cover 8 and the surface of test probe 3 and have reset spring 9, and reset spring 9 can be when test probe 3 draws up, returns test probe 3 normal position to make test probe 3 can test the chip.
Further, the number of the test probes 3 on the front surface and the rear surface of each set of the fixing plate 2 is twelve, the number of the contact pins 4 is the same as the number of the test probes 3, the lower ends of the test probes 3 are vertically corresponding to the upper ends of the test probes 3, and the twelve sets of test probes 3 are mutually connected in parallel to the signal line 6.
Further, two sets of fixed plates 2 are arranged in parallel, and two sets of fixed plates 2 are arranged perpendicularly to the test seat 1, and two sets of fixed plates 2 are fixedly connected with the test seat 1 through screws.
Further, the lower surface of a plurality of two sets of supporting legs 5 and test seat 1 is perpendicular setting, and supporting legs 5 is including two quarter butt and a supporting plate to two quarter butt parallel arrangement to set up perpendicularly with the supporting plate, the supporting legs 5 increases the height of test seat 1 through the quarter butt, avoids the condition that short circuit appears in the test chip in the power on process.
Further, the number of the fuses 7 is consistent with that of the test probes 3, all the fuses 7 are mutually connected with the signal wires 6 in parallel, the surfaces of the test probes 3 are coated with gold-plated coatings, the fuses 7 play a role in fusing protection, protection can be provided for chips during chip testing, the chips are prevented from burning out, the gold-plated coatings can meet the high-temperature resistant condition of the test probes 3, and the clamp can meet the testing of the chips at different temperatures.
Further, the test head of the test probe 3 is movably connected with the test needle sleeve 8 through a return spring 9.
Further, the signal wire 6 comprises two black wires and two red wires, one ends of the two black wires and the two red wires are respectively connected with a group of protection diodes 10, the other ends of the two black wires and the two red wires are fixed through wire clamps, the wire clamps uniformly fix the end heads of the signal wire 6, the signal wire 6 is conveniently connected to the output end, and the protection diodes 10 can be selected for TVS or TSS matched with fuses 7 to play a good protection role in testing.
When the chip test fixture is used, an IC chip to be tested is placed on a test seat 1, a test station is selected at the front and rear positions of a fixing plate 2 according to the size of the IC chip, a test needle sleeve 8 is pulled upwards, a test head of a test probe 3 is pulled up through a return spring 9, the return spring 9 is in a stretching state, the IC chip is placed at the station to be tested, the bottom of the IC chip is contacted with a contact needle 4, the test head of the test probe 3 is pressed down in the resetting process of the return spring 9, the upper part of the IC chip is fixed, the test probe 3 is matched with the contact needle 4, the current and voltage of the IC chip are tested, each test probe 3 is connected in series with a signal wire 6, the signal wire 6 receives test data of the test probe 3, the data of the IC chip can be measured by externally connecting the signal wire 6 to an output end, and whether the IC chip is qualified or not is judged, in the test process, the height of the test seat 1 is raised through the supporting legs 5, short circuit is avoided in the process of electrifying test IC chips, the test needle sleeve 8 is internally provided with the reset spring 9 which plays a role of extension and contraction, IC chips with different thicknesses can be tested, chips with different sizes can be tested, the chip size between 1.1 and 6.0 can be tested, twelve groups of test probes 3 and contact needles 4 are respectively arranged in front of and behind each group of fixing plates 2, thus the front and behind each group of fixing plates 2 can meet the test of twenty-four single chips, the whole test fixture has forty-eight test stations, therefore, the test of chips with different sizes can be met, the test fixture has better use effect, each group of test probes 3 is matched with one group of fuses 7, one end of the signal wire 6 is connected to the protection diode 10, the protection diode 10 can select TSS and TVS according to actual measurement conditions, therefore, the whole test fixture has a good use effect during the test period, and can better protect the IC chip.
According to the invention, the reset spring 9 is arranged in the test needle sleeve 8, the reset spring 9 plays a role in stretching, the test probe 3 can fix the IC chip well through the elasticity of the reset spring 9, the situation that the IC chip falls off in the test process is effectively avoided, the height of the test head of the test probe 3 can be flexibly adjusted through the reset spring 9, the IC chips with different thicknesses can be tested, the chips with different sizes can be tested, and the chip size between 1.1 and 6.0 can be tested; twelve groups of test probes 3 and contact pins 4 are respectively arranged in front of and behind each group of fixing plates 2, so that the front and behind each group of fixing plates 2 can meet the test of twenty-four single chips, the whole test fixture has forty-eight test stations, therefore, the test of chips with different sizes can be met, the test fixture has a good use effect, each group of test probes 3 is matched with one group of fuses 7, one end of a signal wire 6 is connected to a protection diode 10, and the protection diode 10 can select TSS and TVS according to actual measurement conditions, so that the whole test fixture has a good use effect during the test, and can provide protection for IC chips better; the test probes 3 of each group are connected in parallel, so that the test stations cannot interfere with each other, when the test probes 3 are damaged, other test probes 3 can also meet the measurement of an IC chip, and a plurality of stations can be selected, so that the test cannot be influenced when a single test probe 3 is damaged; through the surface coating gilding coating at test probe 3, gilding coating can increase the high temperature resistance of test probe 3 to can satisfy the test under the high temperature and the low temperature, the IC chip's under the different temperatures of convenient test performance makes the function of this chip test fixture more comprehensive.
The foregoing is merely illustrative of the structures of this invention and various modifications, additions and substitutions for those skilled in the art can be made to the described embodiments without departing from the scope of the invention or from the scope of the invention as defined in the accompanying claims.
Claims (4)
1. The chip test fixture is characterized by comprising a test seat (1), wherein two groups of fixing plates (2) are fixedly arranged on the upper surface of the test seat (1), test probes (3) are arranged on the front surface and the rear surface of each fixing plate (2), contact pins (4) are embedded and arranged on the inner side of the upper surface of the test seat (1), two groups of supporting pins (5) are fixedly arranged on the lower surface of the test seat (1), and signal wires (6) penetrate through the upper surface of the test seat (1);
a fuse (7) is arranged at a position, corresponding to the lower end of the contact pin (4), of the lower surface of the test seat (1), a test needle sleeve (8) is arranged on the periphery of the upper part of the test probe (3), and a reset spring (9) is wrapped between the inner surface of the test needle sleeve (8) and the outer surface of the test probe (3);
the number of the fuses (7) is consistent with that of the test probes (3), all the fuses (7) are mutually connected in parallel to the signal wire (6), and the surface of the test probes (3) is coated with a gold-plated coating; the signal wire (6) comprises two black wires and two red wires, one ends of the two black wires and the two red wires are respectively connected with a group of protection diodes (10), and the other ends of the two black wires and the two red wires are fixed through wire clamps; the protection diode (10) is selected from TSS or TVS;
the number of the test probes (3) on the front surface and the rear surface of each group of the fixing plate (2) is twelve groups, the number of the contact pins (4) is the same as the number of the test probes (3), the lower ends of the test probes (3) correspond to the upper ends of the test probes (3) up and down, and the twelve groups of the test probes (3) are mutually connected to the signal wires (6) in parallel.
2. The chip testing fixture according to claim 1, wherein two groups of fixing plates (2) are arranged in parallel, the two groups of fixing plates (2) are arranged perpendicular to the test seat (1), and the two groups of fixing plates (2) are fixedly connected with the test seat (1) through screws.
3. The chip testing fixture according to claim 1, wherein the two groups of supporting legs (5) are arranged perpendicular to the lower surface of the test seat (1), and the supporting legs (5) comprise two short rods and a supporting plate, and the two short rods are arranged in parallel and perpendicular to the supporting plate.
4. The die test jig of claim 1, wherein: the test head of the test probe (3) is movably connected with the test needle sleeve (8) through a reset spring (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811572142.XA CN109580999B (en) | 2018-12-21 | 2018-12-21 | Chip test fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811572142.XA CN109580999B (en) | 2018-12-21 | 2018-12-21 | Chip test fixture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109580999A CN109580999A (en) | 2019-04-05 |
| CN109580999B true CN109580999B (en) | 2024-03-22 |
Family
ID=65931305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811572142.XA Active CN109580999B (en) | 2018-12-21 | 2018-12-21 | Chip test fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109580999B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101223449A (en) * | 2005-03-25 | 2008-07-16 | 威世通用半导体公司 | Apparatus, system and method for testing electronic elements |
| CN204479617U (en) * | 2015-03-11 | 2015-07-15 | 法特迪精密科技（苏州）有限公司 | For the test Connection Block of chip scale of mass production test |
| CN104897934A (en) * | 2014-01-28 | 2015-09-09 | 旺矽科技股份有限公司 | Spring probe |
| CN106226562A (en) * | 2016-07-11 | 2016-12-14 | 无锡宏纳科技有限公司 | Spring downward cake core test fixture |
| CN206671370U (en) * | 2017-03-30 | 2017-11-24 | 中国振华集团云科电子有限公司 | A kind of multi-functional clamp for chip capacitor electric performance test |
| CN108037443A (en) * | 2017-12-27 | 2018-05-15 | 江苏凯尔生物识别科技有限公司 | Test marking machine with barcode scanning device |
| CN108593973A (en) * | 2018-05-02 | 2018-09-28 | 江苏匠心信息科技有限公司 | A kind of chip testing slot based on graphene |
| CN108627762A (en) * | 2018-06-08 | 2018-10-09 | 深圳瑞波光电子有限公司 | A kind of test system |
| CN209803185U (en) * | 2018-12-21 | 2019-12-17 | 富芯微电子有限公司 | Chip test fixture |
-
2018
- 2018-12-21 CN CN201811572142.XA patent/CN109580999B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101223449A (en) * | 2005-03-25 | 2008-07-16 | 威世通用半导体公司 | Apparatus, system and method for testing electronic elements |
| CN104897934A (en) * | 2014-01-28 | 2015-09-09 | 旺矽科技股份有限公司 | Spring probe |
| CN204479617U (en) * | 2015-03-11 | 2015-07-15 | 法特迪精密科技（苏州）有限公司 | For the test Connection Block of chip scale of mass production test |
| CN106226562A (en) * | 2016-07-11 | 2016-12-14 | 无锡宏纳科技有限公司 | Spring downward cake core test fixture |
| CN206671370U (en) * | 2017-03-30 | 2017-11-24 | 中国振华集团云科电子有限公司 | A kind of multi-functional clamp for chip capacitor electric performance test |
| CN108037443A (en) * | 2017-12-27 | 2018-05-15 | 江苏凯尔生物识别科技有限公司 | Test marking machine with barcode scanning device |
| CN108593973A (en) * | 2018-05-02 | 2018-09-28 | 江苏匠心信息科技有限公司 | A kind of chip testing slot based on graphene |
| CN108627762A (en) * | 2018-06-08 | 2018-10-09 | 深圳瑞波光电子有限公司 | A kind of test system |
| CN209803185U (en) * | 2018-12-21 | 2019-12-17 | 富芯微电子有限公司 | Chip test fixture |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109580999A (en) | 2019-04-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW546865B (en) | Closed-grid bus architecture for wafer interconnect structure | |
| CN109116140B (en) | Test method for PBGA (printed circuit board array) packaged device | |
| US8310253B1 (en) | Hybrid probe card | |
| US6822466B1 (en) | Alignment/retention device for connector-less probe | |
| US11467210B2 (en) | TSV testing using test circuits and grounding means | |
| CN109580999B (en) | Chip test fixture | |
| CN209803185U (en) | Chip test fixture | |
| CN102288639A (en) | Power semiconductor light-emitting diode (LED) thermal resistance rapid batch screening device and method | |
| TWI386650B (en) | Rf chip test method | |
| US20110031990A1 (en) | Socketless Integrated Circuit Contact Connector | |
| CN205720446U (en) | The test structure of contact resistance and the test structure of device resistance | |
| CN207198265U (en) | Hand-held contact point tester | |
| Rumi et al. | The impact of impregnating resins in ensuring the reliability of inverter-fed machines | |
| CN203720217U (en) | Probe card possessing wire jumper structure | |
| TW201243351A (en) | Signal testing device | |
| US9018965B2 (en) | Method and system to verify the reliability of electronic devices | |
| US10775428B2 (en) | System and device for automatic signal measurement | |
| CN110554301A (en) | Method for detecting machine resistance of electric measuring machine and printed circuit board electric measuring machine | |
| CN104764909A (en) | Convenient and fast chip testing base capable of being used for extremely-low temperature measuring | |
| CN209432955U (en) | A kind of bridge-type module test device and test macro | |
| CN211061641U (en) | Electric measuring machine for printed circuit board | |
| US20110254579A1 (en) | Semiconductor test method and semiconductor test system | |
| CN208477024U (en) | A kind of rectifier bridge aging board, rectifier bridge aging board component | |
| CN102540047A (en) | Assessment method for test coverage | |
| CN208125876U (en) | A kind of triode Kelvin test suite |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |