CN113635466A - Diamond wire slicing device - Google Patents
Diamond wire slicing device Download PDFInfo
- Publication number
- CN113635466A CN113635466A CN202110954709.5A CN202110954709A CN113635466A CN 113635466 A CN113635466 A CN 113635466A CN 202110954709 A CN202110954709 A CN 202110954709A CN 113635466 A CN113635466 A CN 113635466A
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- Prior art keywords
- main roller
- eccentric
- main
- fixed
- material receiving
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- 229910003460 diamond Inorganic materials 0.000 title abstract description 56
- 239000010432 diamond Substances 0.000 title abstract description 56
- 239000000463 material Substances 0.000 claims abstract description 33
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 33
- 239000010703 silicon Substances 0.000 claims abstract description 33
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 32
- 238000009434 installation Methods 0.000 abstract 1
- 230000009466 transformation Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention provides a diamond wire slicing device, which comprises a frame main body, wherein a cutting chamber is arranged in the frame main body, and the diamond wire slicing device also comprises: the two eccentric fixed bearing boxes are fixed on the outer side wall of the frame main body, and main roller fixed rods in the two eccentric fixed bearing boxes are eccentrically arranged towards the direction away from each other; the two eccentric movable bearing boxes are fixed on the other outer side wall of the rack main body, are respectively arranged opposite to the two eccentric fixed bearing boxes and are respectively eccentrically connected with the two main roller fixed rods; two main running rollers, two main running rollers overlap respectively and locate two main roller dead levers to locate in the cutting chamber, the interval between two main running rollers is used for holding the material receiving box that size less than or equal to 182mm silicon side. The device only improves to fixed bearing case and loose bearing case on the basis that does not change the frame main part, and bearing case installation adjustment is convenient, reforms transform fast, and is with low costs.
Description
Technical Field
The invention relates to a diamond wire slicing device.
Background
With the rapid development of the semiconductor industry, the requirements for the cutting technology of silicon wafers are higher and higher. At present, the diamond wire multi-wire slicing machine is developed to large size, thin wire and thin slice. However, the environment in the cutting chamber of the existing diamond wire slicer can only meet the cutting of the silicon side with the conventional size (156-158.75mm), and the silicon side with the size larger than the range can not be cut normally.
Disclosure of Invention
In view of the above, the present invention provides a diamond wire slicing machine, which is used to solve the problem that the conventional diamond wire slicing machine cannot slice large-sized silicon.
In order to solve the technical problems, the invention adopts the following technical scheme:
the diamond wire slicing machine comprises a rack main body, wherein a cutting chamber and two eccentric fixed bearing boxes are arranged in the rack main body, the two eccentric fixed bearing boxes are fixed on the outer side wall of the rack main body, and main roller fixing rods in the two eccentric fixed bearing boxes are eccentrically arranged towards the direction away from each other; the two eccentric movable bearing boxes are fixed on the other outer side wall of the rack main body, are respectively arranged opposite to the two eccentric fixed bearing boxes and are respectively eccentrically connected with the two main roller fixed rods; two main rollers, two main rollers overlap respectively locate two on the main roller dead lever to locate in the cutting chamber, the interval between two main rollers is used for holding the material receiving box of splendid attire diameter or length of side less than or equal to 182mm silicon side.
According to the diamond wire slicing machine provided by the embodiment of the invention, the original movable bearing box and the main roller fixing rod (main roller shaft) of the fixed bearing box are eccentrically arranged, and the distance between the two main rollers is increased under the condition that the original slicing machine is not required to be greatly changed. Therefore, the silicon square with the size larger than 158.75mm can be cut normally by slightly changing the original equipment, and the performance and the practicability of the diamond wire multi-wire slicing machine are improved.
According to one embodiment of the invention, the distance between the two main roller fixing rods is larger than 380mm and smaller than or equal to 430 mm. The interaxial distance in the range can be compatible with silicon with the size of 155-182mm, different interaxial distances can be adjusted according to requirements, and the use is more flexible.
Preferably, the diameter of the main roller is in the range of 217-224.5 mm. The size can ensure that enough space is left between the upper steel wire rope and the lower steel wire rope wound on the two main rollers, so that the receiving box and the large-size silicon cube can be conveniently accommodated.
According to one embodiment of the invention, the shaft distance between the two main roller fixing rods is 430mm, and the diameter of the main roller wheel is 224.5 mm. The size can realize cutting of 182mm silicon square.
According to one embodiment of the invention, the device further comprises the material receiving box, and a first distance is arranged between the outer side wall of the material receiving box and the main roller.
According to one embodiment of the invention, a second distance is arranged between the bottom of the material receiving box and the lower edge of the main roller, and a third distance is arranged between the upper end edge of the material receiving box and the upper edge of the main roller.
According to an embodiment of the invention, the second pitch is in the range of 3-5 mm.
The technical scheme of the invention at least has one of the following beneficial effects:
according to the diamond wire slicing device provided by the embodiment of the invention, under the condition that a main body of a cutting machine frame is not changed, an eccentric shaft design is adopted for the main roller fixing rods in the cutting chamber, the left fixing rod and the right fixing rod are respectively deviated to two sides by a certain amount, and the shaft distance between the main roller fixing rods on the two sides is increased, so that the distance between the two main roller wheels respectively arranged on the two main roller fixing rods is increased, and silicon cubes with larger sizes can be accommodated. The whole change of device is less, and the practicality strengthens greatly, has promoted the performance and the practicality of the multi-thread slicer of buddha's warrior attendant line.
Drawings
FIG. 1a is a schematic structural diagram of a slicing apparatus of the prior art;
FIG. 1b is a schematic view of another angle of a slicing apparatus of the prior art;
FIG. 2 is a schematic structural diagram of a diamond wire slicing apparatus according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a diamond wire slicing apparatus according to an embodiment of the present invention.
Reference numerals:
the conventional diamond wire slicing apparatus 100; a left side main roller 110; a right side main roller 120; a material receiving box 130; a regular-sized silicon block 140; an upper wire mesh 151; a lower wire net 152; a driving motor 160; a stationary bearing housing 170; a main roller fixing lever 180; a movable bearing housing 190;
the diamond wire slicing apparatus 200 of the present invention; a first main roller 210; a second main roller 220; a large-sized material receiving box 230; a large-size silicon block 240; an upper diamond wire mesh 251; a lower diamond wire mesh 252; a motor 260; an eccentric fixed bearing housing 270; a first main roller fixing lever 280; a second main roller fixing lever 290; an eccentric movable bearing housing 300.
Detailed Description
In order to facilitate understanding of the technical solution of the present invention, a diamond wire slicing apparatus of the related art will be described below.
Referring to fig. 1a-1b, fig. 1a shows a prior art diamond wire slicing apparatus, and as shown in fig. 1a, the apparatus 100 includes a left side main roller 110, a right side main roller 120, a take-up box 130, a regular-sized silicon block 140, a wire mesh of diamond wires, a workpiece plate, and a plastic plate. Wherein, the distance between the center points of the left side main roller wheel 110 and the right side main roller wheel 120 is 380mm, the material receiving box 130 is positioned between the left side main roller wheel 110 and the right side main roller wheel 120, and the silicon cube 140 with the conventional size can be placed in the material receiving box 130. The wire mesh of diamond wires is passed around the left and right main rollers 110 and 120, respectively, to form an upper wire mesh 151 and a lower wire mesh 152. Wherein the lower edge of the material receiving box 130 is positioned above the lower wire mesh 152 with a certain gap, and the upper edge is positioned below the upper wire mesh 151 with a certain gap. Thereby avoiding the contact between the material receiving box 130 and diamond wires and influencing the normal cutting of the diamond wires.
Referring to fig. 1b, fig. 1b shows a schematic top view of a diamond wire slicing apparatus of the prior art. As shown in fig. 1b, the slicing apparatus further includes a driving motor 160, a fixed bearing housing 170, a main roller fixing lever 180 and a movable bearing housing 190 in addition to the structure described above in fig. 1 a. Referring to fig. 1a, the left main roller wheel 110 and the right main roller wheel 120 are respectively sleeved on the periphery of two main roller fixing rods 180, and two ends of the two main roller fixing rods 180 are respectively fixed inside a cutting chamber of the diamond wire slicing device through a fixed bearing box 170 and a movable bearing box 190, and under the driving of the transmission motor 160, the two main roller fixing rods 180 respectively drive the left main roller wheel 110 and the right main roller wheel 120 to rotate coaxially, that is, the centers of the mounting holes of the fixed bearing box 170 and the movable bearing box 190 for mounting the bearings are concentric with the center of the bearing box.
During slicing, the material receiving box 130 is fixed between the left side main roller wheel 110 and the right side main roller wheel 120, the silicon cube 140 needs to be placed in the material receiving box 130 during cutting, and the size of the existing silicon cube 140 is in the range of 156-158.75mm, so that the space between the left side main roller wheel 110 and the right side main roller wheel 120 and the size of the material receiving box 130 of the existing diamond wire slicing device are designed aiming at the silicon cube 140 with the size in the range of 156-158.75 mm. With the development of the slicing requirement of the silicon cube 140 towards large size and thin slice, the size of the large size silicon cube 140 can reach 166-182mm, and if the large size silicon cube 140 is applied to the existing diamond wire splicing device, the interference with the left main roller 110 and the right main roller 120 in size can be formed, and then the large size silicon wafer cannot be cut normally. Moreover, if the scale of the whole diamond wire slicing device is enlarged according to the existing equipment, and the diamond wire slicing device with larger size is manufactured, the manufacturing cost is high, the whole volume is increased, and the occupied space is large.
Based on the technical problems found by the inventor, the inventor develops the diamond wire slicing device provided by the invention to solve the technical problems in the prior art.
The diamond wire slicing apparatus 200 according to the present invention will be described in detail with reference to specific embodiments.
Referring to fig. 2, fig. 2 shows a schematic structural view of the diamond wire slicing apparatus of the present application. As shown in fig. 2, the diamond wire slicing apparatus includes: the first main roller 210, the second main roller 220, the large-size material receiving box 230 (compatible with 155 and 182 sizes of silicon squares), and the large-size silicon square 240, such as 182mm size silicon square, diamond wire mesh, etc. Wherein, the distance between the first and second main rollers 210 and 220 is 430 mm. The connection relationship of other structures is the same as that in fig. 1, and the description in fig. 1 may be referred to specifically, which is not repeated herein.
Referring to fig. 3, fig. 3 is a schematic structural view of another angle of the diamond wire slicing apparatus according to the embodiment of the present invention. As shown in fig. 3, the diamond wire slicing apparatus includes a motor 260, an eccentric fixed bearing housing 270, a first main roller fixing lever 280, a second main roller fixing lever 290 and an eccentric movable bearing housing 300. Referring to fig. 2, the first main roller 210 is disposed around the first main roller fixing rod 280, and the second main roller 220 is disposed around the second main roller fixing rod 290. The first and second main roller fixing levers 280 and 290 are respectively connected to a motor 260 and rotated by the motor 260. Both ends of the first main roller fixing lever 280 and the second main roller fixing lever 290 are fixed in the cutting chamber of the diamond wire slicing apparatus through an eccentric fixed bearing housing 270 and an eccentric movable bearing housing 300, respectively. That is, as shown in fig. 3, an eccentric stationary bearing housing 270 and an eccentric movable bearing housing 300 are oppositely disposed and fixed to the outer sidewalls of the housing main body, respectively. Wherein, and the first main roller fixing lever 280 and the second main roller fixing lever 290 are eccentrically disposed, as shown in fig. 3, the first main roller fixing lever 280 and the second main roller fixing lever 290 are separated from the eccentric fixed bearing housing 270 and the eccentric movable bearing housing 300 toward each other, thereby realizing that the distance between the center points of the first main roller fixing lever 280 and the second main roller fixing lever 290 is increased from 380mm to 430mm without changing the overall structure of the cutting chamber.
Therefore, according to the diamond wire slicing device 200 of the embodiment of the invention, the distance between the center points of the two main roller fixing rods can be increased from 380mm to 430mm by offsetting the main roller fixing rods to one side of the bearing box by a certain amount. Therefore, the size of the material receiving box can be adjusted to adapt to the cutting of silicon with a larger size range, such as the cutting of the silicon with the size of 166-182mm, and the performance and the practicability of the diamond wire slicing device are improved. Meanwhile, on the basis that the frame main body of the diamond wire slicing device is not changed, only the fixed bearing box and the movable bearing box are improved, the bearing boxes are convenient to install and adjust, the transformation speed is high, the period is short, the transformation cost is low, the left bearing box and the right bearing box meet the interchangeability requirement, and the spare part cost and the later maintenance cost are reduced.
In one embodiment of the present invention, the distance between the first main roller fixing rod 280 and the second main roller fixing rod 290 can be adjusted between 380mm and 430mm according to the actual production requirement, so as to adapt to the cutting of silicon wafers with different sizes.
In one embodiment of the invention, the diameter of the main roller wheel ranges from 217 mm to 224.5 mm. The diameter range of the main roller is 217-224.5 mm, so that the effective space range between the upper diamond wire mesh 251 and the lower diamond wire mesh 252 shown in FIG. 2 can be met, and a large-size material receiving box 230 can be accommodated in the space. Meanwhile, the large-sized material receiving box 230 is ensured to have enough margin with the upper diamond wire net 251 and the lower diamond wire net 252, and the diamond wire can still be normally used even if the diamond wire has a proper amount of deformation.
Preferably, the distance between the shafts of the two main roller fixing rods is 430mm, and the diameter of the main roller wheel is 224.5 mm. The structure can ensure the distance between the main rollers and the distance between the upper diamond wire and the lower diamond wire, and avoid the interference between the large-size material receiving box 230 and the wire mesh.
In the embodiment of the present application, a second distance is provided between the bottom of the large-sized material receiving box 230 and the lower edge of the main roller, and preferably, the second distance may be between 3 mm and 5 mm.
In addition, when the upper diamond wire net 251 is used for a long time, the tension is reduced, and a wire bow may be generated, so that a third distance is provided between the upper end edge of the material receiving box and the upper edge of the main roller. The third distance is greater than the distance the wire bow descends after bending. So as to ensure a large enough space between the large-size material receiving box 230 and the diamond wire, and avoid the interference between the wire bow and the large-size material receiving box 230, and further ensure the smoothness of the silicon square processing.
In some embodiments of the present invention, the size of the large sized receiving box 230 is modified such that a first distance is provided between the outer sidewall of the receiving box and the main roller. Not only can accommodate the silicon square with the maximum size of 182mm, but also avoids the interference between the material receiving box and the main roller. In addition, the size of the large-size material receiving box 230 needs to be changed, so that a sufficient free space is kept between the inner wall of the large-size material receiving box 230 and the large-size silicon block 240, and the interference between the large-size silicon block 240 and the inner wall of the large-size material receiving box 230 is avoided.
According to diamond wire section device of this application embodiment, both promoted diamond wire section device's performance and practicality. Meanwhile, on the basis that the frame main body of the diamond wire slicing device is not changed, only the fixed bearing box and the movable bearing box are improved, the bearing boxes are convenient to install and adjust, the transformation speed is high, the period is short, the transformation cost is low, the left bearing box and the right bearing box meet the interchangeability requirement, and the spare part cost and the later maintenance cost are reduced.
It should be noted that other structures and operations of the diamond wire slicing apparatus according to the embodiments of the present invention are understood and easily implemented by those skilled in the art, and thus will not be described in detail.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (7)
1. The utility model provides a buddha's warrior attendant line section device, includes the frame main part, the inside cutting chamber that is equipped with of frame main part, its characterized in that still includes:
the two eccentric fixed bearing boxes (270), the two eccentric fixed bearing boxes (270) are fixed on the outer side wall of the rack main body, and main roller fixing rods in the two eccentric fixed bearing boxes (270) are eccentrically arranged towards the direction away from each other;
the two eccentric movable bearing boxes (300) are fixed on the other outer side wall of the rack main body, the two eccentric movable bearing boxes (300) are respectively arranged opposite to the two eccentric fixed bearing boxes (300), and the two eccentric movable bearing boxes (300) are respectively connected with the two main roller fixed rods in an eccentric mode;
the two main rollers are respectively sleeved on the two main roller fixing rods and arranged in the cutting chamber, and the distance between the two main rollers is used for accommodating a material receiving box (230) with the diameter or the side length smaller than or equal to 182mm in silicon.
2. The apparatus of claim 1, wherein an inter-axle distance between the two main roller fixing bars is equal to or greater than 380mm and equal to or less than 430 mm.
3. The device as claimed in claim 2, wherein the diameter of the main roller wheel is in the range of 217-224.5 mm.
4. The apparatus as claimed in claim 3, wherein the distance between the shafts of the two main roller fixing bars is 430mm, and the diameter of the main roller wheel is 224.5 mm.
5. The device according to claim 4, further comprising the material receiving box, wherein a first distance is arranged between the outer side wall of the material receiving box (230) and the primary roller.
6. The device according to claim 4, characterized in that a second distance is provided between the bottom of the material receiving box (230) and the lower edge of the main roller, and a third distance is provided between the upper end edge of the material receiving box (230) and the upper edge of the main roller.
7. The apparatus of claim 6, wherein the second pitch is in a range of 3-5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110954709.5A CN113635466A (en) | 2021-08-19 | 2021-08-19 | Diamond wire slicing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110954709.5A CN113635466A (en) | 2021-08-19 | 2021-08-19 | Diamond wire slicing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113635466A true CN113635466A (en) | 2021-11-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110954709.5A Pending CN113635466A (en) | 2021-08-19 | 2021-08-19 | Diamond wire slicing device |
Country Status (1)
| Country | Link |
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| CN (1) | CN113635466A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114211631A (en) * | 2021-12-14 | 2022-03-22 | 宇晶机器（长沙）有限公司 | Device capable of adjusting width of cutting wire net and adjusting method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170239842A1 (en) * | 2016-02-19 | 2017-08-24 | Auo Crystal Corporation | Ingot slicing wire saw, roller module thereof, and method for slicing ingot |
| CN111195990A (en) * | 2020-02-25 | 2020-05-26 | 青岛高测科技股份有限公司 | Device for adjusting wire mesh center of cutting area of slicing machine and adjusting method |
| CN213034993U (en) * | 2020-06-02 | 2021-04-23 | 无锡上机数控股份有限公司 | Novel crisp and hard material slicing mechanism |
-
2021
- 2021-08-19 CN CN202110954709.5A patent/CN113635466A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170239842A1 (en) * | 2016-02-19 | 2017-08-24 | Auo Crystal Corporation | Ingot slicing wire saw, roller module thereof, and method for slicing ingot |
| CN111195990A (en) * | 2020-02-25 | 2020-05-26 | 青岛高测科技股份有限公司 | Device for adjusting wire mesh center of cutting area of slicing machine and adjusting method |
| CN213034993U (en) * | 2020-06-02 | 2021-04-23 | 无锡上机数控股份有限公司 | Novel crisp and hard material slicing mechanism |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114211631A (en) * | 2021-12-14 | 2022-03-22 | 宇晶机器（长沙）有限公司 | Device capable of adjusting width of cutting wire net and adjusting method thereof |
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Application publication date: 20211112 |
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