CN112705644A - Forming device with trimming function for integrated circuit lead production - Google Patents
Forming device with trimming function for integrated circuit lead production Download PDFInfo
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- CN112705644A CN112705644A CN202011486560.4A CN202011486560A CN112705644A CN 112705644 A CN112705644 A CN 112705644A CN 202011486560 A CN202011486560 A CN 202011486560A CN 112705644 A CN112705644 A CN 112705644A
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- 238000009966 trimming Methods 0.000 title claims abstract description 44
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 238000009987 spinning Methods 0.000 claims abstract description 18
- 238000005452 bending Methods 0.000 claims abstract description 9
- 230000005540 biological transmission Effects 0.000 claims description 8
- 229910000831 Steel Inorganic materials 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 239000010959 steel Substances 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 3
- 238000010924 continuous production Methods 0.000 abstract description 2
- 208000012886 Vertigo Diseases 0.000 description 13
- 238000003466 welding Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4896—Mechanical treatment, e.g. cutting, bending
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses a forming device with a trimming function for integrated circuit lead production, which comprises a lower frame device, wherein an upper frame device used for compressing the upper surface of an integrated circuit lead is arranged above the lower frame device, an adjusting device used for adjusting the height is arranged on the upper frame device, a trimming device used for supporting the adjusting device is arranged on the outer side of the lower frame device, and two spinning devices used for bending the integrated circuit lead are symmetrically arranged on the front and back of the inner side of the trimming device. According to the invention, through the arrangement of moving, positioning and clamping, the integrated circuit can continuously advance, so that the continuous production of the integrated circuit is ensured, and the efficiency is improved; through the arrangement of the spinning device, the lead wire is pressed down through wheel type rotation, so that the bending of the lead wire of the integrated circuit in the moving process is ensured, and the production speed of the lead wire of the integrated circuit is accelerated; and the lead is spun for the second time through the arrangement of the trimming device, so that the lead is ensured to be formed and fixed.
Description
Technical Field
The invention relates to the technical field of integrated circuit lead production, in particular to a forming device with a trimming function for integrated circuit lead production.
Background
An integrated circuit is a new type of semiconductor device developed in the late 50 s to 60 s of the 20 th century. It is made up through such technological steps as oxidation, photoetching, diffusion, epitaxy and aluminium evaporation, and integrates the semiconductor, resistor and capacitor elements and connecting wires between them, which are all needed by a circuit with certain functions, on a small silicon chip, and then welding the electronic devices in a tube. The packaging shell has various forms such as round shell type, flat type or dual in-line type. The integrated circuit technology includes chip manufacturing technology and design technology, and is mainly embodied in capabilities of processing equipment, processing technology, packaging test, batch production and design innovation. The leads are the communication routes between the integrated circuit and the outside, and often need different shapes to ensure avoidance and leave enough space to avoid the interference of the integrated circuit and other components.
However, in the prior art, the forming device for producing the leads of the integrated circuit is generally carried out in a static pressure mode, that is, the integrated circuit is relatively static, which causes the following problems: 1. the integrated circuit can not continuously move without moving, positioning and clamping, and the continuous and uninterrupted production of the integrated circuit can not be carried out, so that the efficiency is reduced; 2. the arrangement of a spinning device is not provided, the lead cannot be pressed down through wheel type rotation, the bending of the lead of the integrated circuit in the moving process cannot be ensured, and the production speed of the lead of the integrated circuit is slowed down; 3. the lead wire can not be spun for the second time without the arrangement of a trimming device, the forming and fixing of the lead wire can not be ensured, and the production effect of the lead wire of the integrated circuit is reduced.
Disclosure of Invention
The present invention is directed to a forming device with trimming function for integrated circuit lead production to solve the above problems.
The invention realizes the purpose through the following technical scheme:
a forming device with a trimming function for integrated circuit lead production comprises a lower frame device, wherein an upper frame device used for pressing the upper surface of an integrated circuit lead is arranged above the lower frame device, an adjusting device used for adjusting the height is arranged on the upper frame device, a trimming device used for supporting the adjusting device is arranged on the outer side of the lower frame device, and two spinning devices used for bending the integrated circuit lead are symmetrically arranged on the front and back of the inner side of the trimming device; the lower frame device comprises a first support, two first conveying rollers are symmetrically arranged in the first support, a first conveying belt is arranged between the first conveying rollers, a first motor is arranged in front of the first support, a plurality of lower positioning dies are uniformly distributed on the surface of the first conveying belt, a first avoidance groove is formed in the middle of each lower positioning die, and two positioning grooves are symmetrically formed in the top of each lower positioning die; the upper frame device comprises a second support, two second conveying rollers are symmetrically arranged in the second support, a second conveying belt is arranged between the second conveying rollers, a second motor is arranged in front of the second support, a plurality of upper positioning dies are uniformly distributed on the surface of the second conveying belt, a second avoidance groove is formed in the middle of each upper positioning die, and two connecting seats are symmetrically arranged at the top of the second support; the trimming device comprises a third support, two support plates are symmetrically arranged in the third support, a third motor is arranged below the support plates, and a trimming wheel is arranged at the top of the third motor; the spinning device comprises a fourth motor, a transmission shaft is installed on the fourth motor, and a spinning wheel is installed on the transmission shaft.
Preferably: the adjusting device comprises two first screw rods which are symmetrically arranged, a handle is arranged at the top of each first screw rod, and a first threaded sleeve is installed on each first screw rod.
According to the arrangement, the handle rotates the first screw rod, and the second support is pushed to move up and down under the support of the first threaded sleeve.
Preferably: the adjusting device comprises two second screw rods which are symmetrically arranged, and second screw sleeves are mounted on the second screw rods.
According to the arrangement, the second screw rod is pushed to drive the second support to move up and down by rotating the second threaded sleeve.
Preferably: the first bracket, the second bracket and the third bracket are all made of Q345 steel material.
So set up, Q345 steel material has guaranteed that the first support, the second support and the third support are durable firmly.
Preferably: the first motor is connected with the first support through a bolt, the second motor is connected with the second support through a bolt, the third motor is connected with the third support through a bolt, and the fourth motor is connected with the third support through a bolt.
So set up, bolted connection is convenient for dismouting maintenance first motor the second motor the third motor with the fourth motor.
Preferably: the lower positioning die and the first conveying belt are riveted together, and the upper positioning die and the second conveying belt are riveted together.
So set up, the riveting has guaranteed down the locating die with it is firm reliable to go up the locating die.
Preferably: the connecting seat and the second bracket are welded together, and the support plate and the third bracket are welded together.
So set up, the welding has guaranteed the connecting seat with the backup pad is firm reliable.
Preferably: the length of the first conveying belt is larger than that of the second conveying belt, and the number of the lower positioning dies is at least 4 more than that of the upper positioning dies.
So set up, be convenient for get at first conveyer belt both ends and put integrated circuit.
Preferably: the first threaded sleeve and the third support are welded together, the first screw rod is rotatably connected with the connecting seat, and the first screw rod is in threaded connection with the first threaded sleeve.
So set up, the welding has guaranteed first swivel nut is firm reliable, rotates to connect and threaded connection has guaranteed first screw rod is nimble rotatory.
Preferably: the second threaded sleeve is rotatably connected with the third support, the second screw rod is fixedly connected with the connecting seat, and the second screw rod is in threaded connection with the second threaded sleeve.
According to the arrangement, the second threaded sleeve is flexibly rotated through rotating connection, the second screw rod is firm and reliable through fixed connection, and the second threaded sleeve is pushed to move through threaded connection.
The working principle is as follows: firstly, the first screw rod is rotated by the handle, the second support is pushed to move up and down under the support of the first screw sleeve, or the second screw sleeve is rotated to push the second screw rod to drive the second support to move up and down, so that the gap between the upper positioning die and the lower positioning die is just equal to the thickness of a lead, then the integrated circuit is inserted into the lower positioning die, and the lead extends out of the positioning groove, the first support supports the first motor to drive the first conveying roller to rotate, the first conveying belt drives the lower positioning die to move, meanwhile, the second support supports the second motor to drive the second conveying roller to rotate, the second conveying belt drives the upper positioning die to move and is inserted into the lower positioning die, the lead in the positioning groove is pressed, and the integrated circuit moves under the positioning clamping of the upper positioning die and the lower positioning die, the third support supports the fourth motor, the rotary pressing wheel is driven by the transmission shaft to vertically rotate to press down a lead, the third motor is driven by the supporting plate to horizontally rotate and transversely press the lead, and the right angle of bending of the lead is guaranteed.
Compared with the prior art, the invention has the following beneficial effects:
1. by moving the positioning and clamping device, the integrated circuit can continuously move, the continuous production of the integrated circuit is ensured, and the efficiency is improved;
2. through the arrangement of the spinning device, the lead wire is pressed down through wheel type rotation, so that the bending of the lead wire of the integrated circuit in the moving process is ensured, and the production speed of the lead wire of the integrated circuit is accelerated;
3. through the arrangement of the trimming device and secondary spinning of the lead, the lead is guaranteed to be formed and fixed, and the production effect of the lead of the integrated circuit is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram of a forming device with trimming function for integrated circuit lead production according to the present invention;
FIG. 2 is a schematic view of a lead frame assembly of a trimming apparatus for integrated circuit lead production according to the present invention;
FIG. 3 is a top isometric view of a racking device of a forming device with trimming functionality for integrated circuit lead production in accordance with the present invention;
FIG. 4 is a bottom isometric view of an racking device of a forming device with trimming for integrated circuit lead production in accordance with the present invention;
FIG. 5 is a left side view of a trimming apparatus of a forming apparatus having a trimming function for integrated circuit lead production in accordance with the present invention;
FIG. 6 is a schematic diagram of a spinning apparatus of a forming apparatus with trimming function for integrated circuit lead production according to the present invention;
FIG. 7 is a schematic view of an adjusting device of embodiment 1 of a shaping device with trimming function for integrated circuit lead production according to the present invention;
fig. 8 is a schematic diagram of an adjusting device of embodiment 2 of the forming device with trimming function for integrated circuit lead production according to the invention.
The reference numerals are explained below:
1. a racking device; 101. a first bracket; 102. a first conveying roller; 103. a first motor; 104. a first conveyor belt; 105. a lower positioning die; 106. a first avoidance slot; 107. positioning a groove; 2. a racking device; 201. a second bracket; 202. a second conveying roller; 203. a second motor; 204. a second conveyor belt; 205. an upper positioning die; 206. a second avoidance slot; 207. a connecting seat; 3. a dressing device; 301. a third support; 302. a support plate; 303. a third motor; 304. a dressing wheel; 4. a spinning device; 401. a fourth motor; 402. a drive shaft; 403. a spinning wheel; 5. an adjustment device; 501. a first screw; 502. a handle; 503. a first threaded sleeve; 504. a second screw; 505. a second threaded sleeve.
Detailed Description
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The invention will be further described with reference to the accompanying drawings in which:
example 1
As shown in fig. 1-7, a forming device with trimming function for integrated circuit lead production comprises a lower frame device 1, an upper frame device 2 for compressing the upper surface of the integrated circuit lead is arranged above the lower frame device 1, an adjusting device 5 for adjusting the height is arranged on the upper frame device 2, a trimming device 3 for supporting the adjusting device 5 is arranged outside the lower frame device 1, and two spinning devices 4 for bending the integrated circuit lead are symmetrically arranged in front and back of the inner side of the trimming device 3; the lower frame device 1 comprises a first support 101, two first conveying rollers 102 are symmetrically arranged in the first support 101, a first conveying belt 104 is arranged between the first conveying rollers 102, a first motor 103 is arranged in front of the first support 101, a plurality of lower positioning dies 105 are uniformly distributed on the surface of the first conveying belt 104, a first avoidance groove 106 is formed in the middle of each lower positioning die 105, and two positioning grooves 107 are symmetrically formed in the tops of the lower positioning dies 105; the racking device 2 comprises a second support 201, two second conveying rollers 202 are symmetrically arranged in the second support 201, a second conveying belt 204 is arranged between the second conveying rollers 202, a second motor 203 is arranged in front of the second support 201, a plurality of upper positioning dies 205 are uniformly distributed on the surface of the second conveying belt 204, a second avoidance groove 206 is formed in the middle of each upper positioning die 205, and two connecting seats 207 are symmetrically arranged at the top of the second support 201; the trimming device 3 comprises a third bracket 301, two support plates 302 are symmetrically arranged in the third bracket 301, a third motor 303 is arranged below the support plates 302, and a trimming wheel 304 is arranged at the top of the third motor 303; the spinning device 4 includes a fourth motor 401, a transmission shaft 402 is mounted on the fourth motor 401, and a spinning wheel 403 is mounted on the transmission shaft 402.
Preferably: the adjusting device 5 comprises two first screw rods 501 which are symmetrically arranged, a handle 502 is arranged at the top of each first screw rod 501, a first threaded sleeve 503 is arranged on each first screw rod 501, and the first screw rods 501 are rotated through the handles 502 to push the second support 201 to move up and down under the support of the first threaded sleeves 503; the first support 101, the second support 201 and the third support 301 are made of Q345 steel materials, and the Q345 steel materials ensure that the first support 101, the second support 201 and the third support 301 are firm and durable; the first motor 103 is connected with the first support 101 through a bolt, the second motor 203 is connected with the second support 201 through a bolt, the third motor 303 is connected with the third support 301 through a bolt, and the fourth motor 401 is connected with the third support 301 through a bolt, so that the first motor 103, the second motor 203, the third motor 303 and the fourth motor 401 can be conveniently dismounted, mounted and maintained through the bolt connection; the lower positioning die 105 and the first conveying belt 104 are riveted together, the upper positioning die 205 and the second conveying belt 204 are riveted together, and riveting ensures that the lower positioning die 105 and the upper positioning die 205 are stable and reliable; the connecting seat 207 and the second bracket 201 are welded together, the supporting plate 302 and the third bracket 301 are welded together, and the welding ensures that the connecting seat 207 and the supporting plate 302 are firm and reliable; the length of the first conveying belt 104 is greater than that of the second conveying belt 204, and the number of the lower positioning dies 105 is at least 4 more than that of the upper positioning dies 205, so that the integrated circuits can be conveniently picked and placed at two ends of the first conveying belt 104; the first screw sleeve 503 and the third support 301 are welded together, the first screw rod 501 is rotatably connected with the connecting seat 207, the first screw rod 501 is in threaded connection with the first screw sleeve 503, the first screw sleeve 503 is firmly and reliably ensured by welding, and the first screw rod 501 is flexibly rotated by the rotary connection and the threaded connection.
Example 2
As shown in fig. 8, embodiment 2 differs from embodiment 1 in that: the adjusting device 5 comprises two second screw rods 504 which are symmetrically arranged, a second threaded sleeve 505 is arranged on each second screw rod 504, and the second screw rods 504 are pushed to drive the second support 201 to move up and down by rotating the second threaded sleeves 505; the second screw sleeve 505 is rotatably connected with the third support 301, the second screw rod 504 is fixedly connected with the connecting seat 207, the second screw rod 504 is in threaded connection with the second screw sleeve 505, the second screw sleeve 505 is ensured to rotate flexibly through the rotating connection, the second screw rod 504 is ensured to be firm and reliable through the fixed connection, and the second screw sleeve 505 is ensured to push the second screw rod 504 to move through the threaded connection.
The working principle is as follows: firstly, a first screw 501 is rotated by a handle 502, a second support 201 is pushed to move up and down under the support of a first screw 503, or a second screw 505 is rotated to push a second screw 504 to drive the second support 201 to move up and down, so that the gap between an upper positioning die 205 and a lower positioning die 105 is just equal to the thickness of a lead, then the integrated circuit is inserted into the lower positioning die 105, and the lead extends out of a positioning groove 107, the first support 101 supports a first motor 103 to drive a first conveying roller 102 to rotate, the lower positioning die 105 is driven to move by a first conveying belt 104, meanwhile, the second support 201 supports a second motor 203 to drive a second conveying roller 202 to rotate, the upper positioning die 205 is driven to move by a second conveying belt 204 and is inserted into the lower positioning die 105 to press the lead in the positioning groove 107, the integrated circuit moves under the positioning clamping of the upper positioning die 205 and the lower positioning die 105, the third support 301 supports a fourth motor 401 to drive a spinning wheel 403 to vertically rotate through a transmission shaft 402 to press the, the supporting plate 302 supports the third motor 303 to drive the trimming wheel 304 to horizontally rotate and transversely press the lead, so that the lead is bent at a right angle.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.
Claims (10)
1. A forming device with trimming function for integrated circuit lead production is characterized in that: the integrated circuit lead bending device comprises a lower frame device, wherein an upper frame device used for compressing the upper surface of an integrated circuit lead is arranged above the lower frame device, an adjusting device used for adjusting the height is arranged on the upper frame device, a trimming device used for supporting the adjusting device is arranged on the outer side of the lower frame device, and two spinning devices used for bending the integrated circuit lead are symmetrically arranged on the inner side of the trimming device in the front-back direction;
the lower frame device comprises a first support, two first conveying rollers are symmetrically arranged in the first support, a first conveying belt is arranged between the first conveying rollers, a first motor is arranged in front of the first support, a plurality of lower positioning dies are uniformly distributed on the surface of the first conveying belt, a first avoidance groove is formed in the middle of each lower positioning die, and two positioning grooves are symmetrically formed in the top of each lower positioning die;
the upper frame device comprises a second support, two second conveying rollers are symmetrically arranged in the second support, a second conveying belt is arranged between the second conveying rollers, a second motor is arranged in front of the second support, a plurality of upper positioning dies are uniformly distributed on the surface of the second conveying belt, a second avoidance groove is formed in the middle of each upper positioning die, and two connecting seats are symmetrically arranged at the top of the second support;
the trimming device comprises a third support, two support plates are symmetrically arranged in the third support, a third motor is arranged below the support plates, and a trimming wheel is arranged at the top of the third motor;
the spinning device comprises a fourth motor, a transmission shaft is installed on the fourth motor, and a spinning wheel is installed on the transmission shaft.
2. The forming device with trimming function for lead production of integrated circuit as claimed in claim 1, wherein: the adjusting device comprises two first screw rods which are symmetrically arranged, a handle is arranged at the top of each first screw rod, and a first threaded sleeve is installed on each first screw rod.
3. The forming device with trimming function for lead production of integrated circuit as claimed in claim 1, wherein: the adjusting device comprises two second screw rods which are symmetrically arranged, and second screw sleeves are mounted on the second screw rods.
4. The forming device with trimming function for lead production of integrated circuit as claimed in claim 1, wherein: the first bracket, the second bracket and the third bracket are all made of Q345 steel material.
5. The forming device with trimming function for lead production of integrated circuit as claimed in claim 1, wherein: the first motor is connected with the first support through a bolt, the second motor is connected with the second support through a bolt, the third motor is connected with the third support through a bolt, and the fourth motor is connected with the third support through a bolt.
6. The forming device with trimming function for lead production of integrated circuit as claimed in claim 1, wherein: the lower positioning die and the first conveying belt are riveted together, and the upper positioning die and the second conveying belt are riveted together.
7. The forming device with trimming function for lead production of integrated circuit as claimed in claim 1, wherein: the connecting seat and the second bracket are welded together, and the support plate and the third bracket are welded together.
8. The forming device with trimming function for lead production of integrated circuit as claimed in claim 1, wherein: the length of the first conveying belt is larger than that of the second conveying belt, and the number of the lower positioning dies is at least 4 more than that of the upper positioning dies.
9. The forming device with trimming function for lead production of integrated circuit as claimed in claim 2, wherein: the first threaded sleeve and the third support are welded together, the first screw rod is rotatably connected with the connecting seat, and the first screw rod is in threaded connection with the first threaded sleeve.
10. The forming device with trimming function for lead production of integrated circuit as claimed in claim 3, wherein: the second threaded sleeve is rotatably connected with the third support, the second screw rod is fixedly connected with the connecting seat, and the second screw rod is in threaded connection with the second threaded sleeve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011486560.4A CN112705644A (en) | 2020-12-16 | 2020-12-16 | Forming device with trimming function for integrated circuit lead production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011486560.4A CN112705644A (en) | 2020-12-16 | 2020-12-16 | Forming device with trimming function for integrated circuit lead production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112705644A true CN112705644A (en) | 2021-04-27 |
Family
ID=75543438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011486560.4A Withdrawn CN112705644A (en) | 2020-12-16 | 2020-12-16 | Forming device with trimming function for integrated circuit lead production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112705644A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114939624A (en) * | 2022-06-17 | 2022-08-26 | 先之科半导体科技(东莞)有限公司 | Automatic cutting equipment of mixed anode diode pin |
-
2020
- 2020-12-16 CN CN202011486560.4A patent/CN112705644A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114939624A (en) * | 2022-06-17 | 2022-08-26 | 先之科半导体科技(东莞)有限公司 | Automatic cutting equipment of mixed anode diode pin |
| CN114939624B (en) * | 2022-06-17 | 2022-12-06 | 先之科半导体科技(东莞)有限公司 | Automatic cutting equipment of mixed anode diode pin |
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Application publication date: 20210427 |
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| WW01 | Invention patent application withdrawn after publication |