CN113632253A - 热电转换材料的芯片的制造方法 - Google Patents

热电转换材料的芯片的制造方法 Download PDF

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Publication number
CN113632253A
CN113632253A CN202080025034.XA CN202080025034A CN113632253A CN 113632253 A CN113632253 A CN 113632253A CN 202080025034 A CN202080025034 A CN 202080025034A CN 113632253 A CN113632253 A CN 113632253A
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CN
China
Prior art keywords
thermoelectric conversion
conversion material
thermoelectric
chip
resin
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Pending
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CN202080025034.XA
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English (en)
Chinese (zh)
Inventor
加藤邦久
森田亘
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Lintec Corp
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Lintec Corp
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Publication of CN113632253A publication Critical patent/CN113632253A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202080025034.XA 2019-03-28 2020-03-26 热电转换材料的芯片的制造方法 Pending CN113632253A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019064635 2019-03-28
JP2019-064635 2019-03-28
PCT/JP2020/013547 WO2020196709A1 (ja) 2019-03-28 2020-03-26 熱電変換材料のチップの製造方法

Publications (1)

Publication Number Publication Date
CN113632253A true CN113632253A (zh) 2021-11-09

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CN202080025034.XA Pending CN113632253A (zh) 2019-03-28 2020-03-26 热电转换材料的芯片的制造方法

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JP (1) JP7458375B2 (ja)
CN (1) CN113632253A (ja)
WO (1) WO2020196709A1 (ja)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6388185B1 (en) * 1998-08-07 2002-05-14 California Institute Of Technology Microfabricated thermoelectric power-generation devices
JP2000183412A (ja) 1998-12-16 2000-06-30 Sharp Corp 積層材料の製造方法および製造装置
US7531739B1 (en) 2004-10-15 2009-05-12 Marlow Industries, Inc. Build-in-place method of manufacturing thermoelectric modules
JP5831554B2 (ja) 2011-11-08 2015-12-09 富士通株式会社 熱電変換素子及びその製造方法
JP5992208B2 (ja) 2012-05-30 2016-09-14 富士フイルム株式会社 熱電変換素子の製造方法
JP6672562B2 (ja) * 2015-08-20 2020-03-25 リンテック株式会社 ペルチェ冷却素子及びその製造方法
JP6709040B2 (ja) * 2015-11-18 2020-06-10 日東電工株式会社 半導体装置の製造方法
US11895919B2 (en) 2018-08-28 2024-02-06 Lintec Corporation Production method for chip made of thermoelectric conversion material and method for manufacturing thermoelectric conversion module using chip obtained by said production method

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JPWO2020196709A1 (ja) 2020-10-01
JP7458375B2 (ja) 2024-03-29
WO2020196709A1 (ja) 2020-10-01

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