JPWO2020196709A1 - - Google Patents

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Publication number
JPWO2020196709A1
JPWO2020196709A1 JP2021509566A JP2021509566A JPWO2020196709A1 JP WO2020196709 A1 JPWO2020196709 A1 JP WO2020196709A1 JP 2021509566 A JP2021509566 A JP 2021509566A JP 2021509566 A JP2021509566 A JP 2021509566A JP WO2020196709 A1 JPWO2020196709 A1 JP WO2020196709A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021509566A
Other versions
JP7458375B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2020196709A1 publication Critical patent/JPWO2020196709A1/ja
Application granted granted Critical
Publication of JP7458375B2 publication Critical patent/JP7458375B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2021509566A 2019-03-28 2020-03-26 熱電変換材料のチップの製造方法 Active JP7458375B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019064635 2019-03-28
JP2019064635 2019-03-28
PCT/JP2020/013547 WO2020196709A1 (ja) 2019-03-28 2020-03-26 熱電変換材料のチップの製造方法

Publications (2)

Publication Number Publication Date
JPWO2020196709A1 true JPWO2020196709A1 (ja) 2020-10-01
JP7458375B2 JP7458375B2 (ja) 2024-03-29

Family

ID=72611564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021509566A Active JP7458375B2 (ja) 2019-03-28 2020-03-26 熱電変換材料のチップの製造方法

Country Status (3)

Country Link
JP (1) JP7458375B2 (ja)
CN (1) CN113632253A (ja)
WO (1) WO2020196709A1 (ja)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6388185B1 (en) * 1998-08-07 2002-05-14 California Institute Of Technology Microfabricated thermoelectric power-generation devices
JP2000183412A (ja) 1998-12-16 2000-06-30 Sharp Corp 積層材料の製造方法および製造装置
US7531739B1 (en) 2004-10-15 2009-05-12 Marlow Industries, Inc. Build-in-place method of manufacturing thermoelectric modules
WO2013069347A1 (ja) 2011-11-08 2013-05-16 富士通株式会社 熱電変換素子及びその製造方法
JP5992208B2 (ja) 2012-05-30 2016-09-14 富士フイルム株式会社 熱電変換素子の製造方法
JP6672562B2 (ja) * 2015-08-20 2020-03-25 リンテック株式会社 ペルチェ冷却素子及びその製造方法
JP6709040B2 (ja) * 2015-11-18 2020-06-10 日東電工株式会社 半導体装置の製造方法
WO2020045379A1 (ja) 2018-08-28 2020-03-05 リンテック株式会社 熱電変換材料のチップの製造方法及びその製造方法により得られたチップを用いた熱電変換モジュールの製造方法

Also Published As

Publication number Publication date
WO2020196709A1 (ja) 2020-10-01
JP7458375B2 (ja) 2024-03-29
CN113632253A (zh) 2021-11-09

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