JPWO2020196709A1 - - Google Patents
Info
- Publication number
- JPWO2020196709A1 JPWO2020196709A1 JP2021509566A JP2021509566A JPWO2020196709A1 JP WO2020196709 A1 JPWO2020196709 A1 JP WO2020196709A1 JP 2021509566 A JP2021509566 A JP 2021509566A JP 2021509566 A JP2021509566 A JP 2021509566A JP WO2020196709 A1 JPWO2020196709 A1 JP WO2020196709A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/851—Thermoelectric active materials comprising inorganic compositions
- H10N10/852—Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019064635 | 2019-03-28 | ||
JP2019064635 | 2019-03-28 | ||
PCT/JP2020/013547 WO2020196709A1 (ja) | 2019-03-28 | 2020-03-26 | 熱電変換材料のチップの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020196709A1 true JPWO2020196709A1 (ja) | 2020-10-01 |
JP7458375B2 JP7458375B2 (ja) | 2024-03-29 |
Family
ID=72611564
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021509566A Active JP7458375B2 (ja) | 2019-03-28 | 2020-03-26 | 熱電変換材料のチップの製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7458375B2 (ja) |
CN (1) | CN113632253A (ja) |
WO (1) | WO2020196709A1 (ja) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6388185B1 (en) * | 1998-08-07 | 2002-05-14 | California Institute Of Technology | Microfabricated thermoelectric power-generation devices |
JP2000183412A (ja) | 1998-12-16 | 2000-06-30 | Sharp Corp | 積層材料の製造方法および製造装置 |
US7531739B1 (en) | 2004-10-15 | 2009-05-12 | Marlow Industries, Inc. | Build-in-place method of manufacturing thermoelectric modules |
WO2013069347A1 (ja) | 2011-11-08 | 2013-05-16 | 富士通株式会社 | 熱電変換素子及びその製造方法 |
JP5992208B2 (ja) | 2012-05-30 | 2016-09-14 | 富士フイルム株式会社 | 熱電変換素子の製造方法 |
JP6672562B2 (ja) * | 2015-08-20 | 2020-03-25 | リンテック株式会社 | ペルチェ冷却素子及びその製造方法 |
JP6709040B2 (ja) * | 2015-11-18 | 2020-06-10 | 日東電工株式会社 | 半導体装置の製造方法 |
WO2020045379A1 (ja) | 2018-08-28 | 2020-03-05 | リンテック株式会社 | 熱電変換材料のチップの製造方法及びその製造方法により得られたチップを用いた熱電変換モジュールの製造方法 |
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2020
- 2020-03-26 WO PCT/JP2020/013547 patent/WO2020196709A1/ja active Application Filing
- 2020-03-26 JP JP2021509566A patent/JP7458375B2/ja active Active
- 2020-03-26 CN CN202080025034.XA patent/CN113632253A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2020196709A1 (ja) | 2020-10-01 |
JP7458375B2 (ja) | 2024-03-29 |
CN113632253A (zh) | 2021-11-09 |
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