CN113629045A - 三相逆变功率模块的嵌入式封装结构及其增材制造工艺 - Google Patents
三相逆变功率模块的嵌入式封装结构及其增材制造工艺 Download PDFInfo
- Publication number
- CN113629045A CN113629045A CN202110903745.9A CN202110903745A CN113629045A CN 113629045 A CN113629045 A CN 113629045A CN 202110903745 A CN202110903745 A CN 202110903745A CN 113629045 A CN113629045 A CN 113629045A
- Authority
- CN
- China
- Prior art keywords
- copper
- aluminum nitride
- nitride ceramic
- chip
- freewheeling diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
- H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M7/53—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M7/537—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
- H02M7/5387—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
- H02M7/53871—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration with automatic control of output voltage or current
- H02M7/53875—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration with automatic control of output voltage or current with analogue control of three-phase output
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
- Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110903745.9A CN113629045B (zh) | 2021-08-06 | 2021-08-06 | 三相逆变功率模块的增材制造工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110903745.9A CN113629045B (zh) | 2021-08-06 | 2021-08-06 | 三相逆变功率模块的增材制造工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN113629045A true CN113629045A (zh) | 2021-11-09 |
CN113629045B CN113629045B (zh) | 2023-03-10 |
Family
ID=78383272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110903745.9A Active CN113629045B (zh) | 2021-08-06 | 2021-08-06 | 三相逆变功率模块的增材制造工艺 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN113629045B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117238901A (zh) * | 2023-11-16 | 2023-12-15 | 西安西电电力系统有限公司 | 压接式igbt结构及功率组件 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007234690A (ja) * | 2006-02-28 | 2007-09-13 | Hitachi Ltd | パワー半導体モジュール |
CN101188224A (zh) * | 2007-10-12 | 2008-05-28 | 上海大学 | 高散热多芯片集成大功率白光发光二极管模块及其制备方法 |
JP2009177038A (ja) * | 2008-01-28 | 2009-08-06 | Hitachi Ltd | パワー半導体モジュール |
CN106449402A (zh) * | 2016-11-22 | 2017-02-22 | 南通沃特光电科技有限公司 | 一种具体石墨烯散热结构的功率器件的制造方法 |
CN106997871A (zh) * | 2016-12-23 | 2017-08-01 | 杨杰 | 一种功率模块的封装结构 |
CN109887909A (zh) * | 2019-03-13 | 2019-06-14 | 黄山学院 | 基于石墨烯的ipm混合模块封装结构及加工工艺 |
CN110854103A (zh) * | 2019-11-09 | 2020-02-28 | 北京工业大学 | 一种嵌入式双面互连功率模块封装结构和制作方法 |
CN111261599A (zh) * | 2020-03-11 | 2020-06-09 | 黄山学院 | 基于石墨烯基封装衬板的大功率ipm的结构及加工工艺 |
WO2020159031A1 (ko) * | 2019-01-28 | 2020-08-06 | 이민희 | 전력 반도체 모듈 패키지 및 이의 제조방법 |
CN213184342U (zh) * | 2020-06-24 | 2021-05-11 | 东莞中之光电股份有限公司 | 一种陶瓷面led灯封装结构 |
CN113130455A (zh) * | 2021-04-20 | 2021-07-16 | 黄山学院 | 一种高热可靠性的多单元功率集成模块及其加工工艺 |
-
2021
- 2021-08-06 CN CN202110903745.9A patent/CN113629045B/zh active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007234690A (ja) * | 2006-02-28 | 2007-09-13 | Hitachi Ltd | パワー半導体モジュール |
CN101188224A (zh) * | 2007-10-12 | 2008-05-28 | 上海大学 | 高散热多芯片集成大功率白光发光二极管模块及其制备方法 |
JP2009177038A (ja) * | 2008-01-28 | 2009-08-06 | Hitachi Ltd | パワー半導体モジュール |
CN106449402A (zh) * | 2016-11-22 | 2017-02-22 | 南通沃特光电科技有限公司 | 一种具体石墨烯散热结构的功率器件的制造方法 |
CN106997871A (zh) * | 2016-12-23 | 2017-08-01 | 杨杰 | 一种功率模块的封装结构 |
WO2020159031A1 (ko) * | 2019-01-28 | 2020-08-06 | 이민희 | 전력 반도체 모듈 패키지 및 이의 제조방법 |
CN109887909A (zh) * | 2019-03-13 | 2019-06-14 | 黄山学院 | 基于石墨烯的ipm混合模块封装结构及加工工艺 |
CN110854103A (zh) * | 2019-11-09 | 2020-02-28 | 北京工业大学 | 一种嵌入式双面互连功率模块封装结构和制作方法 |
CN111261599A (zh) * | 2020-03-11 | 2020-06-09 | 黄山学院 | 基于石墨烯基封装衬板的大功率ipm的结构及加工工艺 |
CN213184342U (zh) * | 2020-06-24 | 2021-05-11 | 东莞中之光电股份有限公司 | 一种陶瓷面led灯封装结构 |
CN113130455A (zh) * | 2021-04-20 | 2021-07-16 | 黄山学院 | 一种高热可靠性的多单元功率集成模块及其加工工艺 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117238901A (zh) * | 2023-11-16 | 2023-12-15 | 西安西电电力系统有限公司 | 压接式igbt结构及功率组件 |
CN117238901B (zh) * | 2023-11-16 | 2024-03-08 | 西安西电电力系统有限公司 | 压接式igbt结构及功率组件 |
Also Published As
Publication number | Publication date |
---|---|
CN113629045B (zh) | 2023-03-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN107170714B (zh) | 一种低寄生电感功率模块及双面散热低寄生电感功率模块 | |
KR101836658B1 (ko) | 파워 모듈 및 그 제조 방법 | |
CN104170086B (zh) | 半导体装置及半导体装置的制造方法 | |
CN106206483B (zh) | 电源模块 | |
JP4613077B2 (ja) | 半導体装置、電極用部材および電極用部材の製造方法 | |
KR101905995B1 (ko) | 양면냉각형 파워모듈 | |
CN110854103B (zh) | 一种嵌入式双面互连功率模块封装结构和制作方法 | |
CN106208623B (zh) | 电源模块 | |
CN109887909B (zh) | 基于石墨烯的ipm混合模块封装结构及加工工艺 | |
CN110838480B (zh) | 一种碳化硅mosfet模块的封装结构和制作方法 | |
CN109817591B (zh) | 一种高功率密度igbt模块的双面水冷散热结构及加工工艺 | |
CN113130455B (zh) | 一种高热可靠性的多单元功率集成模块及其加工工艺 | |
CN111261599B (zh) | 基于石墨烯基封装衬板的大功率ipm的结构及加工工艺 | |
CN105161467A (zh) | 一种用于电动汽车的功率模块 | |
CN113629045B (zh) | 三相逆变功率模块的增材制造工艺 | |
CN202695428U (zh) | 一种igbt功率模块 | |
CN114334869B (zh) | 一种自动温度控制的igbt模块封装结构 | |
CN102693969B (zh) | 一种igbt功率模块 | |
CN108346628B (zh) | 一种功率模块及其制造方法 | |
CN208368501U (zh) | Igbt模块封装结构及冷却系统 | |
JP5485833B2 (ja) | 半導体装置、電極用部材および電極用部材の製造方法 | |
CN110676232A (zh) | 一种半导体器件封装结构及其制作方法、一种电子设备 | |
CN215644461U (zh) | 一种功率模块及电子设备 | |
CN219832657U (zh) | 一种叠层芯片的封装结构 | |
CN216928548U (zh) | Igbt模块用覆铜陶瓷板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20220630 Address after: 245061 No. 10, Wenfeng West Road, Huizhou District, Huangshan City, Anhui Province Applicant after: GOOGE THERMAL COOLING TECHNOLOGY CO.,LTD. Address before: 245061 No. 10, Wenfeng West Road, Chengbei Industrial Park, Huizhou District, Huangshan City, Anhui Province Applicant before: GOOGE THERMAL COOLING TECHNOLOGY CO.,LTD. Applicant before: Huangshan University |
|
TA01 | Transfer of patent application right | ||
CB02 | Change of applicant information |
Address after: 245061 No. 10, Wenfeng West Road, Huizhou District, Huangshan City, Anhui Province Applicant after: Huangshan Gujie Co.,Ltd. Address before: 245061 No. 10, Wenfeng West Road, Huizhou District, Huangshan City, Anhui Province Applicant before: GOOGE THERMAL COOLING TECHNOLOGY CO.,LTD. |
|
CB02 | Change of applicant information | ||
GR01 | Patent grant | ||
GR01 | Patent grant |