CN113619135B - Small-hole semi-cutting waste discharge process - Google Patents
Small-hole semi-cutting waste discharge process Download PDFInfo
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- CN113619135B CN113619135B CN202110914861.0A CN202110914861A CN113619135B CN 113619135 B CN113619135 B CN 113619135B CN 202110914861 A CN202110914861 A CN 202110914861A CN 113619135 B CN113619135 B CN 113619135B
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- diameter
- film
- adhesive tape
- waste discharge
- punching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/74—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/44—Cutters therefor; Dies therefor
- B26F2001/4472—Cutting edge section features
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Adhesive Tapes (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention provides a small-hole half-cutting waste discharge process, which enables an adhesive tape with a small hole to be quickly compounded with a release film, enables the small hole to discharge waste simply and quickly and ensures the yield of products. Which comprises the following steps: a, attaching a product release film to a process weak adhesion film; b, punching the surface of the weak adhesive film in the process to form first diameter small holes in rectangular array arrangement; c, removing waste edges of the process weak adhesive film, and leaving the process weak adhesive film corresponding to the first-diameter small hole; d, adhering a product adhesive tape to the surface of the release film corresponding to the weak adhesive film in the process with the first diameter; e, punching and forming a second diameter small hole on the surface of the product adhesive tape, wherein the second diameter small hole is concentrically arranged corresponding to the upper surface of the weak adhesive film in the process of the first diameter, the second diameter is larger than the first diameter, and the release film is continuous; f, adhering the second-diameter adhesive tape area under the height limiting roller through the external waste discharging film, and synchronously adhering the second-diameter adhesive tape area and the process weak adhesive film with the first diameter to discharge waste.
Description
Technical Field
The invention relates to the technical field of die cutting, in particular to a small-hole half-cutting waste discharge process.
Background
The upper surface of the release film 10 is compounded with an adhesive tape 20, a plurality of small holes 22 are distributed on the adhesive tape 20, the small holes 22 penetrate through the adhesive tape 20, the release film 10 is not provided with Kong Yin (see fig. 1), the existing manufacturing process is that the adhesive tape is independently punched and then compounded on the adhesive tape through the release film, multiple roller rotating operation is needed, the processing efficiency is low, and in actual operation, the small holes are difficult to discharge waste corresponding to the adhesive tape, so that small hole waste materials can be remained on the surface of a product, and subsequent operation is influenced.
Disclosure of Invention
Aiming at the problems, the invention provides a small-hole half-cutting waste discharge process, which enables an adhesive tape with a small hole to be quickly compounded with a release film, enables the small hole to discharge waste simply and quickly and ensures the yield of products.
A small-hole half-cutting waste discharge process is characterized by comprising the following steps:
a, attaching a product release film to a process weak adhesion film;
b, punching the surface of the weak adhesive film in the process to form first diameter small holes which are arranged in a rectangular array;
c, removing waste edges of the process weak adhesive film, and leaving the process weak adhesive film corresponding to the first-diameter small hole;
d, adhering a product adhesive tape to the surface of the release film corresponding to the process weak adhesive film with the first diameter;
e, punching and forming a second diameter small hole on the surface of the product adhesive tape, wherein the second diameter small hole is concentrically arranged corresponding to the upper surface of the weak adhesive film in the process of the first diameter, the second diameter is larger than the first diameter, and the release film is continuous;
f, attaching the second diameter adhesive tape area under the height limiting roller through the external waste discharging film, and synchronously attaching the second diameter adhesive tape area and the process weak adhesive film with the first diameter for waste discharging.
It is further characterized in that:
the waste discharge film is specifically a waste discharge PET film;
in the step d, after the adhesive tape of the product is attached, an upward convex structure is formed in the area, corresponding to the process weak adhesive film with the first diameter, of the adhesive tape, an oblique chamfered edge is formed at the periphery of the upward convex structure, and a spaced punching cavity is formed between the oblique chamfered edge and the bottom release film, so that the punching of the small holes with the second diameter in the step e is facilitated;
in the step e, the punching cutter with the small holes with the second diameter corresponds to the space for punching at intervals, so that the release film is prevented from being touched;
after the die cutting in the step e is finished, integrally separating the second diameter adhesive tape area from the adhesive tape, attaching the bottom of the second diameter adhesive tape to the first diameter process weak adhesive film, and enabling the second diameter adhesive tape area to protrude above the integral plane of the adhesive tape;
in the step f, an external waste discharging film is attached to the upper surface of the adhesive tape, a process weak adhesive film is attached to the lower surface of the adhesive tape, meanwhile, the viscosity of the adhesive tape is greater than that of the process weak adhesive film, and a height limiting roller drives the waste discharging film to adhere to the upper surface of the adhesive tape and then drives the process weak adhesive film to synchronously discharge waste;
the thickness of the process weak adhesive film ensures the smooth proceeding of the step f;
the punching cutter adopted in the step b is a circular cutter with the outer periphery being a straight edge and the inner edge being a bevel edge necking from bottom to top;
the punching cutter adopted in the step e is a circular cutter with the outer periphery being a straight edge and the inner edge being a bevel edge of a necking from bottom to top;
the second diameter is 0.1 mm-0.3 mm larger than the first diameter.
After the technical scheme is adopted, the manufacturing process of the whole product is realized by adding the process weak adhesive film, so that the first diameter of the process weak adhesive film is compounded in the adhesive tape area with the second diameter, then the waste film is discharged through the passing part and is adhered to the adhesive tape area with the second diameter under the height limiting roller, the adhesive tape area with the second diameter and the process weak adhesive film with the first diameter are synchronously adhered and discharged, the adhesive tape with the small hole is compounded with the release film, the waste discharge of the small hole is simple and quick, and the yield of the product is ensured.
Drawings
FIG. 1 is a block diagram of a product in which the present invention is useful;
FIG. 2 is a schematic of the process flow of the invention;
the names corresponding to the sequence numbers in the figure are as follows:
the adhesive tape comprises a release film 10, an adhesive tape 20, a second diameter adhesive tape area 21, a small hole 22, a process weak adhesive film attaching 30, an external waste discharging film 40, a height limiting roller 50, an interval punching cavity 60, a first punching cutter 70 and a second punching cutter 80.
Detailed Description
A small-hole half-cutting waste discharge process is shown in figure 2 and comprises the following steps:
a, attaching 30 a product release film 10 to a process weak adhesion film;
b, punching the surface of the weak adhesion film 30 to form first diameter small holes in rectangular array arrangement in the process;
c, removing the waste edges of the process weak adhesive film, and leaving the process weak adhesive film 30 corresponding to the first-diameter small hole;
d, adhering a product adhesive tape 20 to the surface of the release film corresponding to the weak adhesive film in the process with the first diameter;
e, punching and forming a second diameter small hole on the surface of the product adhesive tape 20, wherein the second diameter small hole is concentrically arranged corresponding to the upper surface of the weak adhesive film 30 in the process of the first diameter, the second diameter is larger than the first diameter, and the release film is continuous;
f attaching the second diameter tape region 21 under the height limiting roller 50 through the outer waste discharging film 40, which simultaneously attaches the second diameter tape region 21 together with the first diameter process weak adhesive film 30 for waste discharge.
In specific implementation, the waste discharge film is specifically a waste discharge PET film, the first diameter is 0.8mm, and the second diameter is 1mm;
in the step d, after the product adhesive tape 20 is attached, an area, corresponding to the first diameter process weak adhesive film 30, of the adhesive tape 20 forms an upward convex structure, an oblique chamfered edge is formed on the periphery of the upward convex structure, and an interval punching cavity 60 is formed between the oblique chamfered edge and the bottom release film 10, so that the punching of the second diameter small hole in the step e is facilitated;
in the step e, the punching cutter with the small holes with the second diameter corresponds to the interval punching space 60, so that the release film is prevented from being touched;
after the die cutting in the step e is finished, integrally separating the second diameter adhesive tape area 21 from the adhesive tape 20, attaching the weak adhesive film 30 with the first diameter to the bottom of the second diameter adhesive tape area 21, and enabling the second diameter adhesive tape area 21 to protrude above the integral plane of the adhesive tape 20;
the adhesive tape 20 is specifically a double-sided adhesive tape, in the step f, the external waste discharge film 40 is attached to the upper surface of the adhesive tape 20, the lower surface of the adhesive tape 20 is attached to the process weak adhesive film 30, meanwhile, the viscosity of the adhesive tape 20 is greater than that of the process weak adhesive film 30, and the height limiting roller 50 drives the waste discharge film 40 to adhere to the upper surface of the adhesive tape 20 and then drives the process weak adhesive film 30 to synchronously discharge waste;
the thickness of the process weak adhesion film 30 ensures the smooth proceeding of step f;
the first punching cutter 70 adopted in the step b is a circular cutter with the outer periphery being a straight edge and the inner edge being a bevel edge of a necking from bottom to top;
the second die cutter 80 used in step e is a circular ring cutter with a straight edge on the outer periphery and a bevel edge with a necking down from bottom to top on the inner periphery.
The working principle is as follows: the manufacturing process of whole product is through adding the weak adhesive film of process for the first diameter of the weak adhesive film of process is compound in the sticky tape region of second diameter, then through the portion waste film of arranging laminating second diameter sticky tape region under the limit for height running roller, it is synchronous laminating the waste discharge with the second diameter sticky tape region together with the weak adhesive film of process of first diameter, it makes the sticky tape that has the aperture quick with from the type membrane complex, the aperture is wasted discharge simply swiftly, ensures the yield of product.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. A small-hole half-cutting waste discharge process is characterized by comprising the following steps:
a, attaching a product release film to a process weak adhesion film;
b, punching the surface of the weak adhesive film in the process to form first diameter small holes which are arranged in a rectangular array;
c, removing waste edges of the process weak adhesive film, and leaving the process weak adhesive film corresponding to the first-diameter small hole;
d, adhering a product adhesive tape to the surface of the release film corresponding to the weak adhesive film in the process with the first diameter;
e, punching and forming a second diameter small hole on the surface of the product adhesive tape, wherein the second diameter small hole is concentrically arranged corresponding to the upper surface of the weak adhesive film in the process of the first diameter, the second diameter is larger than the first diameter, and the release film is continuous;
f, attaching a second diameter adhesive tape area under the height limiting roller through an external waste discharge film, and synchronously attaching the second diameter adhesive tape area and the first diameter process weak adhesive film for waste discharge;
in the step d, after the adhesive tape of the product is attached, an upward convex structure is formed in the area, corresponding to the process weak adhesive film with the first diameter, of the adhesive tape, an oblique chamfered edge is formed at the periphery of the upward convex structure, and a spaced punching cavity is formed between the oblique chamfered edge and the bottom release film, so that the punching of the small holes with the second diameter in the step e is facilitated;
in the step e, the punching cutter with the small holes with the second diameter corresponds to the space for punching at intervals, so that the release film is prevented from being touched;
after the die cutting in the step e is finished, integrally separating the second diameter adhesive tape area from the adhesive tape, attaching the bottom of the second diameter adhesive tape to the first diameter process weak adhesive film, and enabling the second diameter adhesive tape area to protrude above the integral plane of the adhesive tape;
the adhesive tape is specifically a double-sided adhesive tape, in the step f, the external waste discharging film is attached to the upper surface of the adhesive tape, the lower surface of the adhesive tape is attached to the process weak adhesive film, meanwhile, the viscosity of the adhesive tape is greater than the process weak adhesive film, and the height limiting roller drives the waste discharging film to adhere to the upper surface of the adhesive tape and then drives the process weak adhesive film to synchronously discharge waste.
2. A small hole half-cutting waste discharge process as claimed in claim 1, wherein: the waste discharge film is specifically a waste discharge PET film.
3. A small hole half-cutting waste discharge process as claimed in claim 1, wherein: the thickness of the process weak adhesive film ensures smooth progress of step f.
4. A small hole half-cutting waste discharge process as claimed in claim 1, wherein: the punching cutter adopted in the step b is a circular cutter with the outer periphery being a straight edge and the inner edge being a bevel edge necking from bottom to top.
5. The small-hole half-cutting waste discharge process as claimed in claim 4, characterized in that: the punching cutter adopted in the step e is a circular ring cutter with the outer periphery being a straight edge and the inner edge being a bevel edge necking from bottom to top.
6. A small hole half-cutting waste discharge process as claimed in claim 1, wherein: the second diameter is 0.1 mm-0.3 mm larger than the first diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110914861.0A CN113619135B (en) | 2021-08-10 | 2021-08-10 | Small-hole semi-cutting waste discharge process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110914861.0A CN113619135B (en) | 2021-08-10 | 2021-08-10 | Small-hole semi-cutting waste discharge process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113619135A CN113619135A (en) | 2021-11-09 |
| CN113619135B true CN113619135B (en) | 2023-03-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110914861.0A Active CN113619135B (en) | 2021-08-10 | 2021-08-10 | Small-hole semi-cutting waste discharge process |
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Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110229622A (en) * | 2019-05-31 | 2019-09-13 | 珠海中晟光电科技有限公司 | A kind of production technology of OCA optical cement |
| CN112171783B (en) * | 2019-07-05 | 2022-06-03 | 昊佰电子科技（上海）有限公司 | Small hole waste discharge method for die cutting of single-sided adhesive product |
| CN112621888A (en) * | 2019-09-24 | 2021-04-09 | 昊佰电子科技（上海）有限公司 | Processing method of double faced adhesive tape with shape like Chinese character hui |
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| CN113619135A (en) | 2021-11-09 |
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