CN113594333A - LED packaging structure and preparation method thereof - Google Patents
LED packaging structure and preparation method thereof Download PDFInfo
- Publication number
- CN113594333A CN113594333A CN202110784749.XA CN202110784749A CN113594333A CN 113594333 A CN113594333 A CN 113594333A CN 202110784749 A CN202110784749 A CN 202110784749A CN 113594333 A CN113594333 A CN 113594333A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 25
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000007787 solid Substances 0.000 claims abstract description 56
- 239000000084 colloidal system Substances 0.000 claims abstract description 20
- 239000003292 glue Substances 0.000 claims description 82
- 238000004519 manufacturing process Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 19
- 238000005520 cutting process Methods 0.000 claims description 16
- 239000010410 layer Substances 0.000 claims description 16
- 239000000843 powder Substances 0.000 claims description 15
- 238000012545 processing Methods 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 4
- 239000011241 protective layer Substances 0.000 claims description 4
- 238000007790 scraping Methods 0.000 claims description 4
- 239000013078 crystal Substances 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 13
- 238000005538 encapsulation Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 4
- 239000000499 gel Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 235000019557 luminance Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to the technical field of LED packaging, and provides an LED packaging structure and a preparation method thereof. By means of the arrangement of the solid fluorescent colloid, the light emitting brightness and the light emitting consistency of the product can be improved, and the product yield is ensured.
Description
Technical Field
The invention relates to the technical field of LED packaging, in particular to an LED packaging structure and a preparation method thereof.
Background
Compared with the prior generation of lighting products, the LED light source has the remarkable advantages of high luminous efficiency, high response speed, long service life, no toxic gas, no radiation, impact resistance, easy control and the like, and the application range and the market share of the LED light source are increasingly improved. .
The traditional white light LED package has different matching wavelengths due to the fact that the fluorescent powder is not well excited by light emitted by the LED, the luminous color gamut is the same, the display fingers Ra are different, and the luminous brightness is obviously different, for example, the brightness of Ra80 and Ra90 is obviously different when the white light LED package is under the same color gamut brightness.
If the above problems are solved by dispensing on the chip, the yield of the product is affected by the factors of different concentrations, different sizes and the like of the fluorescent powder in the dispensing process due to different sizes of the chip particles, and the batch manufacturing cannot be carried out.
Therefore, the present invention is directed to an LED package structure and a method for manufacturing the same to solve the above-mentioned problems.
Disclosure of Invention
In order to solve the problem of different display fingers Ra in the prior art, the invention provides the LED packaging structure and the preparation method thereof, which can shorten the difference between the brightness of different display fingers Ra under the condition of the same color gamut, ensure the consistency of light emission and meet the use requirement.
The invention provides a preparation method of an LED packaging structure, which comprises the steps of fixing a chip on a support; processing the solid fluorescent glue into solid fluorescent glue; fixing a solid fluorescent colloid above the chip; and performing packaging processing operation by using the packaging layer.
In one embodiment, the step of fixing the chip on the support further comprises: and fixing the chip on the support by using a die bonder, and arranging fixing glue between the chip and the support.
In one embodiment, the preparation method of the solid fluorescent glue comprises the following steps: stirring and mixing the fluorescent powder, the silica gel and the solvent to form a mixed film; extracting the mixed membrane to obtain a solid fluorescent glue block; baking the solid fluorescent glue block; and cutting the solid fluorescent glue block to obtain the solid fluorescent glue with a preset size.
In an embodiment, the extracting treatment of the mixed film refers to a film scraping operation of the mixed film, and the cutting treatment of the solid-state fluorescent glue block is to cut the solid-state fluorescent glue block by using a glue chopping machine.
In an embodiment, the predetermined size is a size of the solid fluorescent glue between 90% and 140% of a size of the chip.
In an embodiment, the step of processing the solid fluorescent glue into the solid fluorescent glue includes: placing a plurality of solid-state fluorescent glues on a blue film for film turning, then expanding the space between the plurality of solid-state fluorescent glues by using a crystal expanding machine, and then attaching a protective layer on the solid-state fluorescent glues to form the solid-state fluorescent colloid.
In one embodiment, the step of fixing the solid fluorescent colloid above the chip includes: and arranging fixing glue above the chip, fixing the solid fluorescent glue on the fixing glue by using a die bonder, and then baking at the baking temperature of 150-200 ℃.
In one embodiment, at least one phosphor is mixed in the encapsulation layer, and the color of the phosphor mixed in the encapsulation layer is different from the color of the solid phosphor colloid.
In one embodiment, the solid-state fluorescent colloid has a length and width in the range of 5um-2cm and a thickness in the range of 1um-1 cm.
The invention also provides an LED packaging structure which is manufactured by using the manufacturing method of the LED packaging structure in any one of the embodiments.
Based on the above, compared with the prior art, the LED package structure and the manufacturing method thereof provided by the invention have the advantages that by means of the design that the solid fluorescent colloid is arranged above the chip, the difference between the brightness of different display indicators (Ra) can be shortened under the condition of the same color gamut, the consistency of light emission is ensured, and the use requirements are met. The wavelength of the fluorescent powder between the same color gamut and different color display fingers can be shortened. In addition, the control problem of the dispensing yield and the color gamut concentration of the fluorescent powder above the chip is solved, so that the mass production is realized.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts; in the following description, the drawings are illustrated in a schematic view, and the drawings are not intended to limit the present invention.
FIG. 1 is a schematic flow chart of a method for fabricating an LED package structure according to the present invention;
FIG. 2 is a schematic flow chart of a method for preparing the solid fluorescent glue of the present invention;
fig. 3 is a schematic structural diagram of an LED package structure according to the present invention.
Reference numerals:
16 solid fluorescent glue 18 packaging layer 20 fixing glue
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments; the technical features designed in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other; all other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "lateral", "up", "down", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations and positional relationships based on those shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or component in question must have a particular orientation or be constructed and operated in a particular orientation, and therefore, should not be taken as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified. In addition, the term "comprises" and any variations thereof mean "including at least".
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integrally formed connection; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Referring to fig. 1, fig. 1 is a schematic flow chart of a manufacturing method of an LED package structure according to the present invention. To achieve at least one of the advantages or other advantages, an embodiment of the present invention provides a method for manufacturing an LED package structure. As shown in the figure, the preparation method comprises the following steps:
s100: fixing the chip on the bracket;
s200: processing the solid fluorescent glue into solid fluorescent glue;
s300: fixing a solid fluorescent colloid above the chip;
s400: and performing packaging processing operation by using the packaging layer.
In an embodiment, the chip is fixed on the support in step S100 by using a die bonder to fix the chip on the support, and a fixing adhesive is disposed between the chip and the support. The fixing glue can be die bond glue for bonding the chip and the bracket, and the thickness of the fixing glue can be in the range of 1-10 μm. In addition, the support may be dehumidified prior to securing the chip to the support.
In an embodiment, as shown in fig. 2, the method for preparing the solid fluorescent glue in step S200 includes the following steps:
s210: stirring and mixing the fluorescent powder, the silica gel and the solvent to form a mixed film;
s220: extracting the mixed membrane to obtain a solid fluorescent glue block;
s230: baking the solid fluorescent glue block;
s240: and cutting the solid fluorescent glue block to obtain the solid fluorescent glue with the preset size.
In an embodiment, the step S220 of extracting the mixed film refers to performing a scraping operation on the mixed film, that is, scraping the solid-state phosphor block on the mixed film after mixing. However, the present invention is not limited thereto. The operation of obtaining the solid-state phosphor block from the mixed film in any way should be an extraction process, such as cutting.
In an embodiment, the step S240 of cutting the solid-state phosphor paste block refers to cutting the solid-state phosphor paste block by using a glue cutting table to obtain a solid-state phosphor paste with a preset size. However, the present invention is not limited thereto. The solid-state fluorescent glue block can also be cut by laser cutting or water cutting. The solid-state fluorescent glue block is cut by the glue cutting machine table after a large number of tests, so that the problems of burning black silica gel in the laser cutting process and moisture in the silica gel in the water cutting process can be avoided, and therefore, the preferable mode is to cut the solid-state fluorescent glue block by the glue cutting machine table.
In an embodiment, the predetermined size in step S240 is that the size of the solid fluorescent glue is between 90% and 140% of the size of the chip, so as to prevent light from leaking out of the chip, and if light leaks out, the chip may cause adverse effects such as glare.
In an embodiment, since the distance between the solid-state fluorescent glue blocks with the preset size obtained by cutting the solid-state fluorescent glue blocks is too small, the processing of the solid-state fluorescent glue into the solid-state fluorescent glue in step S200 further includes the following steps: placing a plurality of solid-state fluorescent glues on a blue film for film turning, then expanding the space between the plurality of solid-state fluorescent glues by using a crystal expanding machine after the film turning, and then attaching a protective layer on the solid-state fluorescent glues to form the solid-state fluorescent glue. The protective layer may be a pe (po 1 yethy ene) film, which mainly protects the cut solid fluorescent glue, for example, to prevent the solid fluorescent glue from contacting with dirt, and to prevent the solid fluorescent glue from being adhered to other objects by static electricity.
In one embodiment, the step of fixing the solid fluorescent colloid above the chip in step S300 includes: setting fixing glue above the chip, fixing the solid fluorescent glue on the fixing glue by using a die bonder, and then baking at 150-200 ℃. The fixing glue is used for enhancing the connection between the solid fluorescent glue and the chip, can be made of silica gel, and the thickness of the fixing glue is controlled to be 1-10 mu m, so that the manufacturing process is facilitated.
In an embodiment, the encapsulation layer of step S400 may be formed by a material such as silicon gel, resin, epoxy resin, or the like. At least one fluorescent powder can be mixed in the packaging layer to match with the solid fluorescent colloid, so that the light emitting color of the product is changed. The fluorescent powder can be of a single type or multiple types, and can be matched with the solid fluorescent colloid to excite white light or other colors of light. In addition, the color of the phosphor mixed in the encapsulation layer should be different from that of the solid phosphor colloid as much as possible to avoid repeated use.
In one embodiment, the solid-state fluorescent colloid has a length and width in the range of 5um-2cm and a thickness in the range of 1um-1 cm.
In an embodiment, after the step S400 is completed, the transparent adhesive layer may be further used to cover the upper surface of the encapsulation layer to increase the mixed light beam, so as to improve the light brightness of the product.
Referring to fig. 3, fig. 3 is a schematic structural diagram of an LED package structure 10 according to the present invention. To achieve at least one of the advantages or other advantages, another embodiment of the present invention further provides an LED package structure 10. The LED package structure 10 is manufactured by any one of the above methods for manufacturing an LED package structure. As shown in the figure, the LED package structure 10 includes a support 12, a chip 14, a solid state phosphor gel 16, and an encapsulation layer 18.
The chip 14 is fixed to the support 12 for emitting light. In one embodiment, the chip 14 may be secured to the support 12 by a securing glue 20.
The solid fluorescent colloid 16 is fixed above the chip 14, changes the color of light emitted by the chip 14, and ensures the consistency of light emission.
The encapsulation layer 18 encapsulates the chip 14 and the solid fluorescent glue, and plays roles of protection, fixation and the like. In one embodiment, at least one phosphor may be mixed in the encapsulation layer 18 to match the solid phosphor gel 16 to change the color of the product.
By taking the 2700K color gamut, the display index Ra80 and the display index Ra90 as examples, the brightness difference of the traditional white light LED package is 9-15%, which is quite obvious, and the difference between the display index Ra80 and the display index Ra90 of the LED package structure 10 obtained by the preparation method of the patent can be reduced to 0.5-5%, which greatly improves the light emitting consistency.
It should be added that, based on the solid-state fluorescent glue process, multiple kinds of fluorescent powder are mixed, or a single fluorescent powder + a blue LED (or other color LEDs) is made into white light or other color lights, which all belong to the scope of the present invention.
In summary, the LED package structure 10 and the manufacturing method thereof provided by the present invention, by the design that the solid fluorescent colloid 16 is disposed above the chip 14, the difference between the luminances of different color indicators (Ra) can be shortened under the same color gamut, so as to ensure the uniformity of light emission and meet the use requirement; the wavelength of the fluorescent powder between the same color gamut and different color display fingers can be shortened. In addition, the control problem of the dispensing yield and the color gamut concentration of the fluorescent powder above the chip 14 in the traditional process is solved, so that the mass production is realized.
In addition, it will be appreciated by those skilled in the art that, although there may be many problems with the prior art, each embodiment or aspect of the present invention may be improved only in one or several respects, without necessarily simultaneously solving all the technical problems listed in the prior art or in the background. It will be understood by those skilled in the art that nothing in a claim should be taken as a limitation on that claim.
Although terms such as fluorescent glue, encapsulating layer, fixing glue etc. are used more often in this context, the possibility of using other terms is not excluded. These terms are used merely to more conveniently describe and explain the nature of the present invention; they are to be construed as being without limitation to any additional limitations that may be imposed by the spirit of the present invention.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A preparation method of an LED packaging structure is characterized by comprising the following steps:
fixing the chip on the bracket;
processing the solid fluorescent glue into solid fluorescent glue;
fixing the solid fluorescent colloid above the chip; and
and performing packaging processing operation by using the packaging layer.
2. The method for manufacturing an LED package structure according to claim 1, wherein: the step of securing the chip to the support further comprises: and fixing the chip on the support by using a die bonder, and arranging fixing glue between the chip and the support.
3. The method for manufacturing an LED package structure according to claim 1, wherein: the preparation method of the solid fluorescent glue comprises the following steps:
stirring and mixing the fluorescent powder, the silica gel and the solvent to form a mixed film;
extracting the mixed membrane to obtain a solid fluorescent glue block;
baking the solid fluorescent glue block; and
and cutting the solid fluorescent glue block to obtain the solid fluorescent glue with a preset size.
4. The method for manufacturing an LED package structure according to claim 3, wherein: the step of extracting the mixed film refers to the step of scraping the mixed film, and the step of cutting the solid-state fluorescent glue block refers to the step of cutting the solid-state fluorescent glue block by using a glue cutting machine.
5. The method for manufacturing an LED package structure according to claim 3, wherein: the preset size refers to that the size of the solid fluorescent glue is between 90% and 140% of the size of the chip.
6. The method for manufacturing an LED package structure according to claim 1, wherein: the step of processing the solid fluorescent glue into the solid fluorescent glue comprises the following steps: placing a plurality of solid-state fluorescent glues on a blue film for film turning, then expanding the space between the plurality of solid-state fluorescent glues by using a crystal expanding machine, and then attaching a protective layer on the solid-state fluorescent glues to form the solid-state fluorescent colloid.
7. The method for manufacturing an LED package structure according to claim 1, wherein: the step of fixing the solid fluorescent colloid above the chip comprises the following steps: and arranging fixing glue above the chip, fixing the solid fluorescent glue on the fixing glue by using a die bonder, and then baking at the baking temperature of 150-200 ℃.
8. The method for manufacturing an LED package structure according to claim 1, wherein: at least one fluorescent powder is mixed in the packaging layer, and the color of the fluorescent powder mixed in the packaging layer is different from that of the solid fluorescent colloid.
9. The method for manufacturing an LED package structure according to claim 1, wherein: the length and width range of the solid fluorescent colloid are 5um-2cm, and the thickness range is 1um-1 cm.
10. An LED packaging structure, characterized in that the LED packaging structure is manufactured by using the method for manufacturing the LED packaging structure according to any one of claims 1 to 9.
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| CN202110784749.XA CN113594333A (en) | 2021-07-12 | 2021-07-12 | LED packaging structure and preparation method thereof |
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| CN202110784749.XA CN113594333A (en) | 2021-07-12 | 2021-07-12 | LED packaging structure and preparation method thereof |
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| CN102290501A (en) * | 2011-08-08 | 2011-12-21 | 中外合资江苏稳润光电有限公司 | Method for manufacturing white light package element of LED (light emitting diode) daylight lamp |
| CN102637806A (en) * | 2012-04-13 | 2012-08-15 | 厦门多彩光电子科技有限公司 | Dispensing method applicable to flip chip |
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| CN111653658A (en) * | 2020-06-09 | 2020-09-11 | 福建天电光电有限公司 | Preparation process of light-emitting diode with C-stage PIS solid fluorescent film |
| CN111933781A (en) * | 2020-07-28 | 2020-11-13 | 佛山市国星光电股份有限公司 | LED device and LED lamp |
| CN212230457U (en) * | 2020-03-03 | 2020-12-25 | 漳州立达信光电子科技有限公司 | Packaging structure of light-emitting chip and light-emitting device |
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2021
- 2021-07-12 CN CN202110784749.XA patent/CN113594333A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102683542A (en) * | 2011-03-15 | 2012-09-19 | 展晶科技(深圳)有限公司 | Led packaging structure |
| CN102290501A (en) * | 2011-08-08 | 2011-12-21 | 中外合资江苏稳润光电有限公司 | Method for manufacturing white light package element of LED (light emitting diode) daylight lamp |
| CN102637806A (en) * | 2012-04-13 | 2012-08-15 | 厦门多彩光电子科技有限公司 | Dispensing method applicable to flip chip |
| CN109860376A (en) * | 2018-12-10 | 2019-06-07 | 广州市长明智汇科技有限公司 | A kind of packaging method without blue wave LED light source |
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| CN111933781A (en) * | 2020-07-28 | 2020-11-13 | 佛山市国星光电股份有限公司 | LED device and LED lamp |
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