CN113573885A - 纤维片以及使用其的层叠体、电路基板及电子基板 - Google Patents

纤维片以及使用其的层叠体、电路基板及电子基板 Download PDF

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Publication number
CN113573885A
CN113573885A CN202080021160.8A CN202080021160A CN113573885A CN 113573885 A CN113573885 A CN 113573885A CN 202080021160 A CN202080021160 A CN 202080021160A CN 113573885 A CN113573885 A CN 113573885A
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CN
China
Prior art keywords
resin
fiber sheet
fiber
layer
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080021160.8A
Other languages
English (en)
Chinese (zh)
Inventor
深尾朋宽
泽田知昭
阿部孝寿
道上恭佑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Publication of CN113573885A publication Critical patent/CN113573885A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/024—Woven fabric
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/51—Elastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Textile Engineering (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN202080021160.8A 2019-03-27 2020-03-26 纤维片以及使用其的层叠体、电路基板及电子基板 Pending CN113573885A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-061650 2019-03-27
JP2019061650 2019-03-27
PCT/JP2020/013827 WO2020196790A1 (ja) 2019-03-27 2020-03-26 繊維シート、並びに、それを用いた積層体、回路基板および電子基板

Publications (1)

Publication Number Publication Date
CN113573885A true CN113573885A (zh) 2021-10-29

Family

ID=72612037

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080021160.8A Pending CN113573885A (zh) 2019-03-27 2020-03-26 纤维片以及使用其的层叠体、电路基板及电子基板

Country Status (4)

Country Link
US (1) US12273996B2 (https=)
JP (1) JP7445831B2 (https=)
CN (1) CN113573885A (https=)
WO (1) WO2020196790A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7819969B2 (ja) * 2021-10-12 2026-02-25 エルジー エナジー ソリューション リミテッド 印刷回路基板、その製造方法およびこれを含む電池パック
KR102873182B1 (ko) * 2024-11-27 2025-10-22 한국전자기술연구원 신축성 기판 및 그 제조 방법

Citations (10)

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JPS59138439A (ja) * 1983-01-28 1984-08-08 日立化成工業株式会社 Ｓｍｃ成形用導電シ−ト
JPS6143661A (ja) * 1984-08-07 1986-03-03 Mitsui Petrochem Ind Ltd 熱硬化性樹脂組成物
US4997702A (en) * 1989-03-06 1991-03-05 Rogers Corporation Shape retaining flexible electrical circuit
US6228474B1 (en) * 1996-02-21 2001-05-08 Toray Industries, Inc. Epoxy resin composition for a fiber-reinforced composite material, yarn prepreg, and process and apparatus for preparing the same
CN1717429A (zh) * 2002-11-28 2006-01-04 三菱丽阳株式会社 预浸料用环氧树脂、预浸料、纤维增强复合材料及其制造方法
CN102272677A (zh) * 2008-11-07 2011-12-07 太阳控股株式会社 光固化性树脂组合物、其干膜及固化物以及使用它们的印刷电路板
US20150075852A1 (en) * 2013-03-13 2015-03-19 Panasonic Corporation Prepreg, metal-clad laminate, and printed wiring board
US20160157343A1 (en) * 2014-11-27 2016-06-02 Panasonic Intellectual Property Management Co., Ltd. Sheet-shaped stretchable structure, and resin composition for stretchable resin sheet and stretchable resin sheet used for the structure
WO2017138388A1 (ja) * 2016-02-12 2017-08-17 東洋紡株式会社 衣服型電子機器、および衣服型電子機器の製造方法
JP2018080281A (ja) * 2016-11-17 2018-05-24 大泰化工株式会社 繊維強化プラスチックシート

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JPS5698136A (en) * 1980-01-08 1981-08-07 Kanegafuchi Chem Ind Co Ltd Continuous manufacture of laminated substance
JP3935531B2 (ja) * 1996-08-07 2007-06-27 東邦テナックス株式会社 複合材料成形用中間体
JP4484830B2 (ja) 2006-02-07 2010-06-16 電気化学工業株式会社 回路基板
JP2009173726A (ja) 2008-01-23 2009-08-06 Panasonic Corp プリプレグ及びその製造方法とこれを用いたプリント配線板
US10441185B2 (en) * 2009-12-16 2019-10-15 The Board Of Trustees Of The University Of Illinois Flexible and stretchable electronic systems for epidermal electronics
JP6551422B2 (ja) 2015-01-14 2019-07-31 東洋紡株式会社 伸縮性電極および配線シート、生体情報計測用インターフェス
JP2016182698A (ja) 2015-03-25 2016-10-20 パナソニックＩｐマネジメント株式会社 フィルム材およびこれを用いた電子部品ならびに電子部品の製造方法
TWM516858U (zh) 2015-11-19 2016-02-11 金鼎聯合科技纖維股份有限公司 膠線改良結構
JP6863363B2 (ja) * 2016-03-08 2021-04-21 東洋紡株式会社 伸縮性導体シート、接着性のある伸縮性導体シート、布帛上への伸縮性導体からなる配線の形成方法
WO2018020981A1 (ja) * 2016-07-28 2018-02-01 Jsr株式会社 重合体、組成物、成形体、硬化物及び積層体
CN110431166A (zh) * 2017-03-22 2019-11-08 东丽株式会社 环氧树脂组合物、预浸料坯以及碳纤维增强复合材料
CN113692783B (zh) * 2019-04-18 2024-12-31 松下知识产权经营株式会社 伸缩性层叠体、伸缩性设备用材料、和伸缩性设备

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JPS59138439A (ja) * 1983-01-28 1984-08-08 日立化成工業株式会社 Ｓｍｃ成形用導電シ−ト
JPS6143661A (ja) * 1984-08-07 1986-03-03 Mitsui Petrochem Ind Ltd 熱硬化性樹脂組成物
US4997702A (en) * 1989-03-06 1991-03-05 Rogers Corporation Shape retaining flexible electrical circuit
US6228474B1 (en) * 1996-02-21 2001-05-08 Toray Industries, Inc. Epoxy resin composition for a fiber-reinforced composite material, yarn prepreg, and process and apparatus for preparing the same
CN1717429A (zh) * 2002-11-28 2006-01-04 三菱丽阳株式会社 预浸料用环氧树脂、预浸料、纤维增强复合材料及其制造方法
CN102272677A (zh) * 2008-11-07 2011-12-07 太阳控股株式会社 光固化性树脂组合物、其干膜及固化物以及使用它们的印刷电路板
US20150075852A1 (en) * 2013-03-13 2015-03-19 Panasonic Corporation Prepreg, metal-clad laminate, and printed wiring board
US20160157343A1 (en) * 2014-11-27 2016-06-02 Panasonic Intellectual Property Management Co., Ltd. Sheet-shaped stretchable structure, and resin composition for stretchable resin sheet and stretchable resin sheet used for the structure
WO2017138388A1 (ja) * 2016-02-12 2017-08-17 東洋紡株式会社 衣服型電子機器、および衣服型電子機器の製造方法
JP2018080281A (ja) * 2016-11-17 2018-05-24 大泰化工株式会社 繊維強化プラスチックシート

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徐铜文: "《膜化学与技术教程》", 31 December 2003, 中国科学技术大学出版社, pages: 36 *

Also Published As

Publication number Publication date
US12273996B2 (en) 2025-04-08
JPWO2020196790A1 (https=) 2020-10-01
JP7445831B2 (ja) 2024-03-08
US20220183154A1 (en) 2022-06-09
WO2020196790A1 (ja) 2020-10-01

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