CN113571429B - Die bonding method and die bonding machine - Google Patents
Die bonding method and die bonding machine Download PDFInfo
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- CN113571429B CN113571429B CN202111139330.5A CN202111139330A CN113571429B CN 113571429 B CN113571429 B CN 113571429B CN 202111139330 A CN202111139330 A CN 202111139330A CN 113571429 B CN113571429 B CN 113571429B
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
Abstract
The invention provides a die bonding method and a die bonding machine, wherein the die bonding method comprises the following steps: crystal taking step: controlling the swing arm to swing to a crystal taking position, jacking the crystal element on the blue film to a suction nozzle of the swing arm through the ejector pin, and then swinging the swing arm to a switching position; a movement control step: controlling the linear die bonder head to move linearly to a switching position; switching: when the swing arm suction nozzle and the linear die bonder are positioned at the switching position, controlling the die bonder suction nozzle to suck a wafer on the swing arm suction nozzle; a step of die bonding: firstly, the linear die bonding head is controlled to move linearly to a die bonding position, and then the die bonding suction nozzle of the linear die bonding head is controlled to bond the die onto the circuit board. The invention has the beneficial effects that: the wafer is relayed once at the switching position through the swing arm suction nozzle and the linear wafer fixing head, so that the moving stroke of the linear wafer fixing head is shortened.
Description
Technical Field
The invention relates to the technical field of die bonding, in particular to a die bonding method and a die bonding machine.
Background
In the current die bonding technical field, the biggest difficulty in manufacturing large-size circuit boards lies in how to realize high-speed transportation and transfer of wafers, the current mainstream method is swing arm type one-step transfer, namely a swing arm suction nozzle directly transfers to a circuit board die bonding point after a blue film wafer is taken, the whole process is completed at one step, the method has no problem on the small-size circuit boards, but once the circuit boards exceed 300mm, the method is not satisfactory. The linear motor is used for transferring once to complete die bonding, so that the fatal defect also exists, the efficiency of large-distance reciprocating movement is too low, the larger the circuit board is, the longer the movement distance is, and the production efficiency is lower.
Disclosure of Invention
The invention provides a die bonding method, which comprises the following steps:
crystal taking step: controlling the swing arm to swing to a crystal taking position, jacking a wafer on the blue film onto a suction nozzle of the swing arm through a thimble, mounting the blue film on a crystal-membered ring, swinging the swing arm to a switching position, and then executing a switching step;
a movement control step: controlling the linear die bonder head to move linearly to a switching position, and then executing a switching step;
switching: when the swing arm suction nozzle and the linear die bonder are positioned at the switching position, controlling the die bonder suction nozzle of the linear die bonder to suck a wafer on the swing arm suction nozzle, and then executing a wafer taking step and a die bonder step;
a step of die bonding: firstly, the linear die bonding head is controlled to move linearly to a die bonding position, then a die bonding suction nozzle of the linear die bonding head is controlled to bond a die on a circuit board, and then the movement control step is executed.
As a further improvement of the invention, in the step of taking crystal, when the swing arm swings to a crystal taking position, the swing arm suction nozzle is positioned below the crystal-membered ring, the blue film is installed on the crystal-membered ring, the wafer surface faces downwards, the wafer faces the swing arm suction nozzle, and the thimble positioned above the wafer ring pushes the wafer on the blue film downwards to the swing arm suction nozzle; in the switching step, the linear die bonding head is positioned above the swing arm suction nozzle, and the die bonding suction nozzle of the linear die bonding head is controlled to move downwards to suck the wafer on the swing arm suction nozzle or the swing arm suction nozzle is controlled to move upwards to enable the die bonding suction nozzle to suck the wafer on the swing arm suction nozzle.
As a further improvement of the invention, a first camera is further arranged at the crystal taking position, the first camera is positioned below the swing arm suction nozzle, the crystal taking alignment step is executed before the crystal taking step is executed, in the crystal taking alignment step, the first camera is aligned with the swing arm suction nozzle, if the first camera and the swing arm suction nozzle are not on the same straight line, the position of the first camera is adjusted to enable the first camera and the swing arm suction nozzle to be on the same straight line, then the first camera is aligned with the ejector pin, and if the first camera and the ejector pin are not on the same straight line, the position of the ejector pin is adjusted to enable the first camera and the ejector pin to be on the same straight line; when carrying out and getting brilliant step, control wafer ring shift position, first camera is shot and is judged whether wafer and thimble are on same straight line, if, swing arm suction nozzle swing to wafer ring below then, push up the wafer on the blue membrane to the swing arm suction nozzle through the thimble, if the wafer is not on same straight line with the thimble, the position of control wafer ring is finely tuned then, make wafer and thimble on same straight line, then, swing arm suction nozzle swing to wafer ring below, push up the wafer on the blue membrane to the swing arm suction nozzle through the thimble.
As a further improvement of the invention, a second camera is arranged at the switching position, when the swing arm and the linear die attach head are both positioned at the switching position, the linear die attach head is positioned above the swing arm suction nozzle, and the second camera is positioned below the swing arm suction nozzle; after the die on the swing arm suction nozzle is sucked by the die bonding suction nozzle for controlling the linear die bonding head, the swing arm swings from the switching position to the die taking position, at the moment, the swing arm suction nozzle is not at the switching position, the die on the linear die bonding head is photographed through the second camera, and the angle deviation value of the die is calculated according to the photographed picture to control the rotation of the linear die bonding head to carry out angle correction on the die.
As a further improvement of the invention, a third camera is arranged at the die bonding position, the die bonding method further comprises a die bonding contraposition step, in the die bonding contraposition step, the third camera and the die bonding suction nozzle are contrapositioned, so that the third camera and the die bonding suction nozzle are positioned on a straight line; in the die bonding step, the moving position of a die bonding table is controlled, the die bonding table is used for bearing a circuit board, a third camera shoots to judge whether the die bonding point of the circuit board and the third camera are on the same straight line, if yes, the linear die bonding head moves to the die bonding position in a linear mode, the die bonding suction nozzle and the die bonding point are located on the same straight line, if the die bonding point of the circuit board and the third camera are not on the same straight line, the position of the die bonding table is controlled to conduct fine adjustment, the die bonding point of the circuit board and the third camera are on the same straight line, then, the linear die bonding head moves to the die bonding position in a linear mode, the die bonding suction nozzle and the die bonding point are located on the same straight line, and then the die bonding suction nozzle of the linear die bonding head is controlled to bond the circuit board.
As a further improvement of the invention, in the die bonding step, in the downward movement process of the die bonding suction nozzle, the pressure applied to the die bonding suction nozzle is detected, and when the pressure change of the die bonding suction nozzle reaches a set value, the die bonding suction nozzle is controlled to bond the die onto the circuit board.
As a further improvement of the present invention, in the die bonding step, there are two ways of detecting the pressure applied to the die bonding suction nozzle, the first way is: detecting the current change of a motor, and judging that the pressure change of the die bonding suction nozzle reaches a set value when the current of the motor is larger than a preset value; the second mode is as follows: and detecting that the pressure applied to the die bonding suction nozzle reaches a set value through a pressure sensor.
The invention also provides a die bonder, which comprises a swing arm mechanism, a linear die bonder mechanism, a die-ring and an ejector pin, wherein the die-ring and the ejector pin are arranged at a die taking position, a blue film is arranged on the die-ring, a die is placed on the blue film, the ejector pin is positioned above the die-ring, a swing arm suction nozzle is upwards arranged on the swing arm, and when the swing arm swings to the die taking position, the swing arm suction nozzle is positioned below the die-ring; the swing arm mechanism comprises a swing arm and a swing arm driving mechanism, the swing arm driving mechanism is used for driving the swing arm to swing, and a swing arm suction nozzle is installed on the swing arm; the linear die bonding mechanism comprises a linear die bonding head and a linear die bonding head driving mechanism, and the linear die bonding head driving mechanism is used for driving the linear die bonding head to move; the linear die bonding head comprises a motor and a die bonding suction nozzle, the motor comprises a motor body and a motor spindle connected with the motor body, and the die bonding suction nozzle is connected with the motor spindle; when the swing arm swings to a crystal taking position, the crystal element on the blue film is jacked to the suction nozzle of the swing arm through the thimble; when the swing arm swings to the switching position and the linear die bonder head moves linearly to the switching position, the die bonder suction nozzle of the linear die bonder head sucks a wafer on the swing arm suction nozzle; when the linear die bonding head moves linearly to the die bonding position, the die bonding suction nozzle of the linear die bonding head bonds the die to the circuit board.
As a further improvement of the invention, the die bonder further comprises a first camera, a die bonder table and a third camera, wherein the first camera is used for photographing a wafer and a thimble on the blue film, the wafer ring is controlled to move, so that the swing arm suction nozzle, the wafer and the thimble are aligned, and the thimble is used for downwards ejecting the wafer on the blue film to the swing arm suction nozzle; the die bonding platform is arranged at a die bonding position, the die bonding platform is used for bearing a circuit board, the moving position of the die bonding platform is controlled at the die bonding position, a third camera takes a picture to judge whether the die bonding point of the circuit board and the third camera are on the same straight line, if so, the linear die bonding head moves to the die bonding position in a linear mode, the die bonding suction nozzle and the die bonding point are located on the same straight line, if not, the position of the die bonding platform is controlled to be finely adjusted, the die bonding point of the circuit board and the third camera are on the same straight line, then, the linear die bonding head moves to the die bonding position in a linear mode, the linear die bonding head is aligned with the die bonding point of the circuit board, and the linear die bonding head is used for die bonding the die to the circuit board; when the swing arm swings to a crystal taking position, the first camera is positioned below the swing arm suction nozzle; when the swing arm and the linear die bonder are positioned at the switching position, the linear die bonder is positioned above the swing arm suction nozzle; the third camera is positioned above the die bonding table.
As a further improvement of the invention, the die bonder further comprises a second camera, wherein after the die bonder suction nozzle of the linear die bonder sucks the wafer, the swing arm is controlled to swing from the switching position to the wafer taking position, and then the second camera is used for photographing the wafer on the linear die bonder and calculating the angle deviation value of the wafer to control the linear die bonder to rotate so as to perform angle correction on the wafer; when the swing arm and the linear die bonder head are located at the switching position, the second camera is located below the swing arm suction nozzle.
As a further improvement of the invention, the die bonder further comprises a pressure detection module, wherein during die bonding, the die bonding suction nozzle moves downwards, the pressure detection module is used for detecting the pressure applied to the die bonding suction nozzle, and when the pressure change of the die bonding suction nozzle reaches a set value, the die bonding suction nozzle is controlled to bond a die on the circuit board.
As a further improvement of the present invention, the pressure detection module is configured to detect a current change of the motor, and when the current of the motor is greater than a preset value, determine that the pressure change of the die bonding suction nozzle reaches a set value.
As a further improvement of the invention, the linear die bonding head further comprises a force transmission piece and a pressure sensor, the force transmission piece is driven to move along with the movement of the motor spindle, the pressure sensor is extruded by the force transmission piece when the force transmission piece moves, the pressure sensor generates pressure data, the pressure detection module judges whether the pressure data changes, when the pressure data changes, the pressure of the die bonding suction nozzle is controlled within a set value, and then the die bonding suction nozzle is controlled to blow and put down to perform die bonding.
As a further improvement of the invention, the number of the swing arms is at least two, the number of the linear die bonding heads is the same as that of the swing arms, each linear die bonding head is used for matching with the corresponding swing arm to complete wafer transfer, the number of the wafer-shaped rings and the number of the ejector pins are the same as that of the swing arms, and each ejector pin is matched with the corresponding swing arm to complete wafer taking at the corresponding wafer-shaped ring.
The invention has the beneficial effects that: the wafer is relayed once at the switching position through the swing arm suction nozzle and the linear wafer fixing head, so that the moving stroke of the linear wafer fixing head is shortened.
Drawings
FIG. 1 is a schematic diagram of the structural principle of the present invention;
FIG. 2 is a schematic view of a linear die attach head;
FIG. 3 is a partial cross-sectional view of a linear die attach head;
FIG. 4 is a front view of the die bonder;
FIG. 5 is a perspective view of a die bonder;
FIG. 6 is an enlarged view at A of FIG. 5;
FIG. 7 is a schematic view of the structure of the thimble.
Detailed Description
As shown in fig. 1, 4, 5, 6, and 7, the invention discloses a die bonder, which comprises a swing arm mechanism and a linear die bonder, wherein the swing arm mechanism comprises a swing arm 10 and a swing arm driving mechanism 13, the swing arm driving mechanism 13 is used for driving the swing arm 10 to swing, and a swing arm suction nozzle is installed on the swing arm 10; the linear die bonding mechanism comprises a linear die bonding head 20 and a linear die bonding head driving mechanism 21, and the linear die bonding head driving mechanism 21 is used for driving the linear die bonding head 20 to move; when the swing arm 10 swings to a crystal taking position, the crystal element on the blue film is jacked to a suction nozzle of the swing arm through the thimble 12; when the swing arm 10 swings to the switching position and the linear die bonder 20 moves linearly to the switching position, the die bonder suction nozzle 200 of the linear die bonder 20 sucks a die on the swing arm suction nozzle; when the linear die bonding head 20 moves linearly to the die bonding position, the die bonding suction nozzle 200 of the linear die bonding head 20 bonds the die onto the circuit board.
The die bonder further comprises a die-ring 11, an ejector pin 12, a first camera 30, a second camera 40, a die bonding table and a third camera 50, wherein the die-ring 11 and the ejector pin 12 are installed at a die taking position, a blue film is installed on the die-ring 11 and used for installing the blue film, a wafer is placed on the blue film, the ejector pin 12 is located above the die-ring 11, a swing arm suction nozzle is installed upwards on the swing arm 10, when the swing arm 10 swings to the die taking position, the swing arm suction nozzle is located below the die-ring 11, the wafer on the blue film and the ejector pin 12 are photographed through the first camera 30, the die-ring 11 is controlled to move, the swing arm suction nozzle, the wafer and the ejector pin 12 are aligned, and the ejector pin 12 downwardly ejects the wafer on the blue film to the swing arm suction nozzle. After the die bonding suction nozzle 200 of the linear die bonding head 20 sucks the die, the swing arm 10 is controlled to swing from the transfer position to the die taking position, and then the second camera 40 photographs the die on the linear die bonding head 20 and calculates the angle deviation value of the die to control the linear die bonding head 20 to rotate so as to perform angle correction on the die. The die bonding table is mounted at a die bonding position, the die bonding table is used for bearing a circuit board, the moving position of the die bonding table is controlled at the die bonding position, the third camera 50 takes a picture to judge whether the die bonding point of the circuit board and the third camera 50 are on the same straight line, if so, the linear die bonding head 20 moves to the die bonding position linearly, the linear die bonding head 20 and the die bonding point are located on the same straight line, if not, the position of the die bonding table is controlled to be finely adjusted, the die bonding point of the circuit board and the third camera 50 are on the same straight line, then, the linear die bonding head 20 moves to the die bonding position linearly, the linear die bonding head 20 is aligned with the die bonding point of the circuit board, and the linear die bonding head 20 is used for die bonding the die onto the circuit board.
When the swing arm 10 swings to a crystal taking position, the first camera 30 is located below the swing arm suction nozzle; when the swing arm 10 and the linear die bonder 20 are both located at the switching position, the linear die bonder 20 is located above the swing arm suction nozzle, and the second camera 40 is located below the swing arm suction nozzle; the third camera 50 is located above the die attach station.
As shown in fig. 2 and 3, the linear die bonding head 20 includes a motor 100, a die bonding suction nozzle 200, a force transmission member 300, and a pressure sensor 500, where the motor 100 includes a motor body 101 and a motor spindle 102 connected to the motor body 101, the die bonding suction nozzle 200 is connected to the motor spindle 102, the motor spindle 102 drives the force transmission member 300 to move when moving, and the force transmission member 300 squeezes the pressure sensor 500 when moving.
The linear die bonding head 20 further comprises a die bonding suction nozzle mounting sleeve 201, the die bonding suction nozzle mounting sleeve 201 is connected with the motor spindle 102, the die bonding suction nozzle 200 is connected with the die bonding suction nozzle mounting sleeve 201, the force transmission piece 300 is located above the die bonding suction nozzle mounting sleeve 201, and the die bonding suction nozzle mounting sleeve 201 can extrude the force transmission piece 300 when moving upwards, so that the force transmission piece 300 moves upwards.
The force transmission member 300 is a sleeve, the sleeve is sleeved on the outer surface of the motor spindle 102, and the sleeve can move along the motor spindle 102.
The motor 100 further comprises a motor mounting seat 103, the motor body 101 is mounted on the motor mounting seat 103, and the pressure sensor 500 is mounted on the motor mounting seat 103.
As a preferred embodiment of the present invention, the motor 100 is a micro stepping motor, and the pressure sensor 500 is a thin film pressure sensor.
The motor 100 is used for driving the die bonding suction nozzle 200 to move, thereby completing the die picking and die bonding actions. According to the invention, the gap existing in the axial direction of the motor spindle 102 is utilized, when the die bonding suction nozzle 200 sucks a die, the motor spindle 102 can generate weak axial backward movement, so that the force transmission piece 300 is squeezed, the force transmission piece 300 moves along with the force transmission piece, the force transmission piece 300 can squeeze the pressure sensor 500, and the pressure sensor 500 converts the pressure into pressure data.
The die bonder further comprises a pressure detection module, wherein the pressure detection module is used for detecting the pressure applied to the die bonding suction nozzle 200 in the downward moving process of the die bonding suction nozzle 200 during die bonding, and controlling the die bonding suction nozzle 200 to bond a die on a circuit board when the pressure of the die bonding suction nozzle 200 changes.
The pressure detection module is used for detecting the current change of the motor 100, and when the current of the motor 100 is larger than a preset value, the pressure of the die bonding suction nozzle 200 is judged to be changed.
During die bonding, when the linear die bonding head 20 is stressed during operation, the die bonding suction nozzle 200 moves backwards slightly, the motor spindle 102 moves backwards after being axially extruded due to the axial slight floating value of the motor spindle 102, the sleeve synchronously moves when the motor spindle 102 moves backwards, and the sleeve moves to extrude the film pressure sensor to form data feedback (pressure data).
When the size of the circuit board is larger, the circuit board may have unevenness, and in this case, in order to realize effective die bonding to the circuit board, when the die bonding suction nozzle 200 contacts the raised part of the circuit board, the pressure sensor 500 detects that the pressure data changes, and at this time, it is determined that the die bonding suction nozzle 200 has contacted the raised part of the circuit board, but the die bonding suction nozzle 200 may contact the raised part of the circuit board too tightly, and the pressure sensor 500 detects that the pressure data is larger than a normal range (set value), and at this time, the die bonding suction nozzle 200 cannot normally die bond the die onto the circuit board, so, in the present invention, the main control board controls the motor 100 to retract the die bonding suction nozzle 200 (the Z-axis movement of the die bonding suction nozzle 200 is automatically compensated by the die bonding position change), so that the pressure of the die bonding suction nozzle 200 is within the normal range (set value), then, the main control board controls the die bonding suction nozzle 200 to blow air to put down the wafer for die bonding, so that die bonding at the bulge of the circuit board is completed; when the die bonding suction nozzle 200 contacts the depression of the circuit board, the pressure sensor 500 detects that the pressure data changes, at this time, the die bonding suction nozzle 200 is judged to have contacted the depression of the circuit board, but because the Z-axis movement of the die bonding suction nozzle 200 is a fixed value, the die bonding suction nozzle 200 may have little or no contact with the depression of the circuit board, the pressure sensor 500 detects that the pressure data is smaller than a normal range (set value), at this time, the die bonding suction nozzle 200 cannot normally die-bond the wafer onto the circuit board, therefore, in the invention, the main control board controls the motor 100 to enable the suction nozzle 200 to continue to probe downwards, when the pressure of the suction nozzle 200 is within the normal range (set value), then, the main control board controls the die bonding suction nozzle 200 to blow and put down the wafer for die bonding, and therefore, the die bonding at the depression of the circuit board is completed; by the mode, the die bonding of the circuit board with larger size is completed.
As a preferred embodiment of the present invention, the number of the swing arms 10 is at least two, the number of the linear die bonding heads 20 is the same as that of the swing arms 10, each linear die bonding head 20 is used for matching with a corresponding swing arm 10 to complete wafer transfer, the number of the wafer-shaped rings 11 and the number of the ejector pins 12 are the same as that of the swing arms 10, and each ejector pin 12 matches with a corresponding swing arm 10 to complete wafer picking at the corresponding wafer-shaped ring 11. The die bonding is completed through the matching of the plurality of swing arms 10 and the plurality of linear die bonding heads 20, and the efficiency is improved.
The invention also discloses a die bonding method, which comprises the following steps:
crystal taking step: controlling the swing arm 10 to swing to a crystal taking position, jacking a wafer on a blue film onto a swing arm suction nozzle through a thimble 12, mounting the blue film on a crystal-membered ring 11, then swinging the swing arm 10 to a switching position, and then executing a switching step;
a movement control step: controlling the linear die bonder head 20 to move linearly to a switching position, and then executing a switching step;
switching: when the swing arm suction nozzle and the linear die bonder 20 are positioned at the switching position, controlling the die bonder suction nozzle 200 of the linear die bonder 20 to suck a wafer on the swing arm suction nozzle, and then executing a wafer taking step and a wafer bonding step;
a step of die bonding: firstly, the linear die bonding head 20 is controlled to move linearly to a die bonding position, then the die bonding suction nozzle 200 of the linear die bonding head 20 is controlled to bond a die on a circuit board, and then the movement control step is executed.
In the crystal taking step, when the swing arm 10 swings to a crystal taking position, the swing arm suction nozzle is positioned below the crystal-membered ring 11, the blue film is installed on the crystal-membered ring 11, the wafer faces downwards, the wafer faces the swing arm suction nozzle (because the wafer faces downwards and faces the swing arm suction nozzle, the traditional wafer film-inverting process is simplified, the wafer cost can be effectively reduced), the thimble 12 positioned above the crystal-membered ring 11 pushes the wafer on the blue film downwards, and the swing arm suction nozzle sucks the wafer; in the step 3, the linear die bonding head 20 is positioned above the swing arm suction nozzle, the die bonding suction nozzle 200 of the linear die bonding head 20 is controlled to move downwards to suck the wafer on the swing arm suction nozzle, at the moment, the die bonding suction nozzle 200 moves downwards, and the swing arm suction nozzle is not moved; or controlling the swing arm suction nozzle to move upwards to enable the die bonding suction nozzle 200 to suck the wafer on the swing arm suction nozzle, wherein the swing arm suction nozzle moves upwards to the position of the die bonding suction nozzle 200 at the moment, and the die bonding suction nozzle 200 does not move.
The crystal taking position is also provided with a first camera 30, the first camera 30 is positioned below the swing arm suction nozzle, the crystal taking alignment step is executed before the crystal taking step is executed, in the crystal taking alignment step, the first camera 30 and the swing arm suction nozzle are aligned, if the first camera 30 and the swing arm suction nozzle are not on the same straight line, the position of the first camera 30 is adjusted to enable the first camera 30 and the swing arm suction nozzle to be on the same straight line, then the first camera 30 and the ejector pin 12 are aligned, and if the first camera 30 and the ejector pin 12 are not on the same straight line, the position of the ejector pin 12 is adjusted to enable the first camera 30 and the ejector pin 12 to be on the same straight line; when the crystal taking step is executed, the movement position of the wafer ring 11 is controlled, at this time, a wafer on the blue film may be on the same straight line with the thimble 12, and the wafer may not be on the same straight line with the thimble 12, but the position of the wafer and the thimble 12 does not deviate too much, in the invention, whether the wafer and the thimble 12 are on the same straight line is judged by taking a picture through the first camera 30, if so, the swing arm suction nozzle swings to the lower side of the wafer ring 11, the wafer on the blue film is pushed to the swing arm suction nozzle through the thimble 12, if not, the position of the wafer ring 11 is controlled to be finely adjusted, so that the wafer and the thimble 12 are on the same straight line, then, the swing arm swings to the lower side of the wafer ring 11, and the thimble 12 pushes the wafer on the blue film to the swing arm suction nozzle.
The switching position is also provided with a second camera 40, when the swing arm 10 and the linear die bonder 20 are both positioned at the switching position, the linear die bonder 20 is positioned above the swing arm suction nozzle, and the second camera 40 is positioned below the swing arm suction nozzle; after the die on the swing arm suction nozzle is sucked by the die bonding suction nozzle 200 for controlling the linear die bonding head 20, the swing arm 10 swings from the transfer position to the die taking position, at the moment, the swing arm 10 cannot block the second camera 40, so that the die on the linear die bonding head 20 is photographed by the second camera 40, when the angle of the die is found out to be incorrect, the linear die bonding head 20 is controlled to rotate (for example, the die bonding suction nozzle 200 for controlling the linear die bonding head 20 rotates) so as to correct the angle of the die, so that the die on the circuit board is aligned, and the angle correction process can be completed at the transfer position or can be completed in the process that the linear die bonding head 20 moves from the transfer position to the die bonding position.
The die bonding position is also provided with a third camera 50, the die bonding method further comprises a die bonding contraposition step, and in the die bonding contraposition step, the third camera 50 and the die bonding suction nozzle 200 are contrapositioned, so that the third camera 50 and the die bonding suction nozzle 200 are positioned on the same straight line. In the die bonding step, the moving position of the die bonding table is controlled, the die bonding table is used for bearing the circuit board, the die bonding point of the circuit board and the third camera 50 are possibly on the same straight line due to the moving of the die bonding table, and the die bonding point of the circuit board and the third camera 50 are also possibly not on the same straight line (even if the die bonding point of the circuit board and the third camera 50 are not on the same straight line, the positions of the die bonding point of the circuit board and the third camera 50 are not deviated too much), then, in the invention, whether the die bonding point of the circuit board and the third camera 50 are on the same straight line is judged by photographing through the third camera 50, if so, the linear die bonding head 20 moves to the die bonding position in a linear mode, so that the linear die bonding head 20 and the die bonding point are on the same straight line, and if not, the position of the die bonding table is controlled to be finely adjusted, the die bonding point of the circuit board and the third camera 50 are on the same straight line, then the linear die bonding head 20 moves linearly to the die bonding position, the linear die bonding head 20 and the die bonding point are located on the same straight line, and then the die bonding suction nozzle 200 of the linear die bonding head 20 is controlled to bond the die onto the circuit board.
In the die bonding step, in the process that the die bonding suction nozzle 200 moves downwards, the pressure applied to the die bonding suction nozzle 200 is detected, and when the pressure change of the die bonding suction nozzle 200 reaches a set value, the die bonding suction nozzle 200 is controlled to bond the die onto the circuit board.
As an embodiment of the present invention, in the die bonding step, there are two ways of detecting the pressure applied to the die bonding suction nozzle 200, the first way: detecting the current change of the motor 100, and judging that the pressure change of the die bonding suction nozzle 200 reaches a set value when the current of the motor 100 is larger than a preset value; the second mode is as follows: the pressure sensor 500 detects that the pressure applied to the die bonding suction nozzle 200 reaches a set value.
When the wafer fixing device works, the swing arm 10 swings to the wafer taking position, the wafer is sucked through the swing arm suction nozzle, then the swing arm 10 swings 180 degrees to the switching position, the linear wafer fixing head 20 linearly moves to the switching position leftwards, the wafer on the swing arm suction nozzle is sucked through the linear wafer fixing head 20, then the linear wafer fixing head 20 linearly moves to the wafer fixing position rightwards, the wafer is fixed on a circuit board through the linear wafer fixing head 20, the wafer is subjected to one-time relay at the switching position through the swing arm suction nozzle and the linear wafer fixing head 20, the stroke of the linear wafer fixing head 20 is shortened, and a larger circuit board can be fixed through the wafer fixing method and the wafer fixing machine, so that higher efficiency is generated.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (14)
1. A die bonding method is characterized by comprising the following steps:
crystal taking step: controlling the swing arm (10) to swing to a crystal taking position, jacking a wafer on a blue film to a swing arm suction nozzle through a thimble (12), mounting the blue film on a crystal-membered ring (11), swinging the swing arm (10) to a switching position, and then executing a switching step;
a movement control step: controlling the linear die bonder head (20) to move linearly to a switching position, and then executing a switching step;
switching: when the swing arm suction nozzle and the linear die bonding head (20) are both positioned at the switching position, controlling the die bonding suction nozzle (200) of the linear die bonding head (20) to suck the die on the swing arm suction nozzle, then executing the die taking step by the swing arm (10) and executing the die bonding step by the linear die bonding head (20);
a step of die bonding: firstly, the linear die bonding head (20) is controlled to move linearly to a die bonding position, then the die bonding suction nozzle (200) of the linear die bonding head (20) is controlled to bond a die on a circuit board, and then the movement control step is executed.
2. The die bonding method according to claim 1, wherein in the die bonding step, when the swing arm (10) swings to the die bonding position, the swing arm suction nozzle is located below the die-ring (11), the blue film is mounted on the die-ring (11), the die surface faces downward, the die surface faces the swing arm suction nozzle, and the thimble (12) located above the die-ring (11) pushes the die on the blue film downward onto the swing arm suction nozzle; in the switching step, the linear die bonding head (20) is positioned above the swing arm suction nozzle, and the die bonding suction nozzle (200) of the linear die bonding head (20) is controlled to move downwards to suck the wafer on the swing arm suction nozzle or the swing arm suction nozzle is controlled to move upwards to enable the die bonding suction nozzle (200) to suck the wafer on the swing arm suction nozzle.
3. The die bonding method according to claim 2, wherein a first camera (30) is further arranged at the die taking position, the first camera (30) is positioned below the swing arm suction nozzle, the die taking and aligning step is performed before the die taking step, in the die taking and aligning step, the first camera (30) and the swing arm suction nozzle are aligned, if the first camera (30) and the swing arm suction nozzle are not on the same straight line, the position of the first camera (30) is adjusted to enable the first camera (30) and the swing arm suction nozzle to be on the same straight line, then the first camera (30) is aligned with the ejector pin (12), and if the first camera (30) and the ejector pin (12) are not on the same straight line, the position of the ejector pin (12) is adjusted to enable the first camera (30) and the ejector pin (12) to be on the same straight line; when the crystal taking step is executed, the movement position of the crystal-membered ring (11) is controlled, the first camera (30) shoots to judge whether the wafer and the thimble (12) are on the same straight line, if so, the swing arm suction nozzle swings to the position below the crystal-membered ring (11), the wafer on the blue film is jacked to the swing arm suction nozzle through the thimble (12), if not, the position of the crystal-membered ring (11) is controlled to be finely adjusted, the wafer and the thimble (12) are on the same straight line, then, the swing arm suction nozzle swings to the position below the crystal-membered ring (11), and the wafer on the blue film is jacked to the swing arm suction nozzle through the thimble (12).
4. The die bonding method according to claim 2, wherein a second camera (40) is further arranged at the switching position, when the swing arm (10) and the linear die bonding head (20) are both located at the switching position, the linear die bonding head (20) is located above the swing arm suction nozzle, and the second camera (40) is located below the swing arm suction nozzle; after a wafer on the swing arm suction nozzle is sucked by the wafer fixing suction nozzle (200) controlling the linear wafer fixing head (20), the swing arm (10) swings from the switching position to the wafer taking position, the swing arm suction nozzle is not at the switching position at the moment, the wafer on the linear wafer fixing head (20) is photographed through the second camera (40), and the angle deviation value of the wafer is calculated according to the photographed picture to control the linear wafer fixing head (20) to rotate so as to perform angle correction on the wafer.
5. The die bonding method according to claim 2, wherein a third camera (50) is further arranged at the die bonding position, the die bonding method further comprises a die bonding alignment step, in the die bonding alignment step, the third camera (50) is aligned with the die bonding suction nozzle (200), so that the third camera (50) and the die bonding suction nozzle (200) are positioned on a straight line; in the die bonding step, the moving position of a die bonding table is controlled, the die bonding table is used for bearing a circuit board, a third camera (50) shoots to judge whether the die bonding point of the circuit board and the third camera (50) are on the same straight line, if yes, the linear die bonding head (20) moves to the die bonding position linearly, the die bonding suction nozzle (200) and the die bonding point are located on the same straight line, if the die bonding point of the circuit board and the third camera (50) are not on the same straight line, the position of the die bonding table is controlled to be finely adjusted, the die bonding point of the circuit board and the third camera (50) are located on the same straight line, then, the linear die bonding head (20) moves to the die bonding position linearly, the die bonding suction nozzle (200) and the die bonding point are located on the same straight line, and then the die bonding suction nozzle (200) of the linear die bonding head (20) is controlled to bond the circuit board.
6. The die bonding method according to claim 1, wherein in the die bonding step, the pressure applied to the die bonding suction nozzle (200) is detected during the downward movement of the die bonding suction nozzle (200), and when the pressure change of the die bonding suction nozzle (200) reaches a set value, the die bonding suction nozzle (200) is controlled to bond the die to the circuit board.
7. The die bonding method according to claim 6, wherein in the die bonding step, two ways are adopted for detecting the pressure applied to the die bonding suction nozzle (200), wherein the first way is that: detecting the current change of the motor (100), and judging that the pressure change of the die bonding suction nozzle (200) reaches a set value when the current of the motor (100) is greater than a preset value; the second mode is as follows: the pressure sensor (500) detects that the pressure applied to the die bonding suction nozzle (200) reaches a set value.
8. A die bonder is characterized by comprising a swing arm mechanism, a linear die bonder mechanism, a die-ring (11) and an ejector pin (12), wherein the die-ring (11) and the ejector pin (12) are installed at a die taking position, the die-ring (11) is used for installing a blue film, a die is placed on the blue film, the ejector pin (12) is positioned above the die-ring (11), a swing arm suction nozzle is upwards installed on the swing arm (10), and when the swing arm (10) swings to the die taking position, the swing arm suction nozzle is positioned below the die-ring (11); the swing arm mechanism comprises a swing arm (10) and a swing arm driving mechanism (13), the swing arm driving mechanism (13) is used for driving the swing arm (10) to swing, and a swing arm suction nozzle is installed on the swing arm (10); the linear die bonding mechanism comprises a linear die bonding head (20) and a linear die bonding head driving mechanism (21), and the linear die bonding head driving mechanism (21) is used for driving the linear die bonding head (20) to move; the linear die bonding head (20) comprises a motor (100) and a die bonding suction nozzle (200), the motor (100) comprises a motor body (101) and a motor spindle (102) connected with the motor body (101), and the die bonding suction nozzle (200) is connected with the motor spindle (102); when the swing arm (10) swings to a crystal taking position, the crystal element on the blue film is jacked to a suction nozzle of the swing arm through a thimble (12); when the swing arm (10) swings to the switching position and the linear die bonding head (20) moves linearly to the switching position, the die on the swing arm suction nozzle is sucked by the die bonding suction nozzle (200) of the linear die bonding head (20); when the linear die bonding head (20) moves to the die bonding position linearly, the die bonding suction nozzle (200) of the linear die bonding head (20) bonds the die to the circuit board.
9. The die bonder of claim 8, further comprising a first camera (30), a die bonder table, and a third camera (50), wherein the first camera (30) photographs the wafer and the thimble (12) on the blue film, the movement of the wafer ring (11) is controlled, the swing arm suction nozzle, the wafer and the thimble (12) are aligned, and the thimble (12) pushes the wafer on the blue film downward onto the swing arm suction nozzle; the die bonding table is arranged at a die bonding position, the die bonding table is used for bearing a circuit board, the moving position of the die bonding table is controlled at the die bonding position, a third camera (50) takes a picture to judge whether the die bonding point of the circuit board and the third camera (50) are on the same straight line, if so, the linear die bonding head (20) moves to the die bonding position in a straight line manner, the die bonding suction nozzle (200) and the die bonding point are positioned on the same straight line, if the die bonding point of the circuit board and the third camera (50) are not positioned on the same straight line, the position of the die bonding table is controlled to be finely adjusted, the die bonding point of the circuit board and the third camera (50) are positioned on the same straight line, then, the linear die bonding head (20) moves to the die bonding position in a straight line manner, the linear die bonding head (20) is aligned to the die bonding point of the circuit board, and the die bonding head (20) bonds a die to the circuit board; when the swing arm (10) swings to a crystal taking position, the first camera (30) is positioned below the swing arm suction nozzle; when the swing arm (10) and the linear die bonding head (20) are both positioned at the switching position, the linear die bonding head (20) is positioned above the swing arm suction nozzle; the third camera (50) is positioned above the die bonding table.
10. The die bonder of claim 8, further comprising a second camera (40), wherein after the die bonder suction nozzle (200) of the linear die bonder head (20) sucks the die, the swing arm (10) is controlled to swing from the transfer position to the die pick-up position, and then the second camera (40) photographs the die on the linear die bonder head (20) and calculates an angle deviation value of the die to control the linear die bonder head (20) to rotate so as to perform angle correction on the die; when the swing arm (10) and the linear die bonder head (20) are located at the transfer position, the second camera (40) is located below the swing arm suction nozzle.
11. The die bonder of claim 8, further comprising a pressure detection module, wherein during die bonding, the die bonder nozzle (200) moves downward, the pressure detection module is used for detecting the pressure applied to the die bonder nozzle (200), and when the pressure change of the die bonder nozzle (200) reaches a set value, the die bonder nozzle (200) is controlled to bond a die to a circuit board.
12. The die bonder of claim 11, wherein the pressure detection module is configured to detect a current change of the motor (100), and determine that the pressure change of the die bonder nozzle (200) reaches a set value when the current of the motor (100) is greater than a preset value.
13. The die bonder of claim 11, wherein the linear die bonder head (20) further comprises a force transmission member (300) and a pressure sensor (500), the motor spindle (102) drives the force transmission member (300) to move along with the force transmission member, the force transmission member (300) squeezes the pressure sensor (500) when moving, the pressure sensor (500) generates pressure data, the pressure detection module determines whether the pressure data changes, and when the pressure data changes, the pressure of the die bonder nozzle (200) is controlled within a set value, and then the die bonder nozzle (200) is controlled to blow down a die for die bonding.
14. The die bonder of claim 9, wherein the number of the swing arms (10) is at least two, the number of the linear die bonder heads (20) is the same as that of the swing arms (10), each linear die bonder head (20) is used for matching with the corresponding swing arm (10) to complete die transfer, the number of the die rings (11) and the number of the ejector pins (12) are the same as that of the swing arms (10), and each ejector pin (12) is matched with the corresponding swing arm (10) to complete die picking at the corresponding die ring (11).
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Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9006035D0 (en) * | 1990-03-16 | 1990-05-09 | Emhart Deutschland | Die eject system for die bonder |
| JPH06342815A (en) * | 1993-06-02 | 1994-12-13 | Nec Yamaguchi Ltd | Die bonder |
| JP2009027105A (en) * | 2007-07-24 | 2009-02-05 | Shibuya Kogyo Co Ltd | Bonding device |
| JP2014056980A (en) * | 2012-09-13 | 2014-03-27 | Hitachi High-Tech Instruments Co Ltd | Die bonder and bonding method |
| CN107305916B (en) * | 2016-04-22 | 2018-11-23 | 中山市泓昌光电科技有限公司 | A kind of chip mounter and its processing technology of CSP encapsulation LED |
| CN206584956U (en) * | 2017-03-27 | 2017-10-24 | 江苏新智达新能源设备有限公司 | A kind of Lan Moqujing die bonds mechanism |
| CN209993573U (en) * | 2019-07-22 | 2020-01-24 | 江苏新智达新能源设备有限公司 | Blue membrane wafer solid brilliant device step by step |
| CN111092141A (en) * | 2020-03-04 | 2020-05-01 | 山东才聚电子科技有限公司 | Solid crystal picking and packaging device |
| CN111370350B (en) * | 2020-03-19 | 2021-04-16 | 深圳新益昌科技股份有限公司 | Die bonder |
| CN212263741U (en) * | 2020-04-23 | 2021-01-01 | 深圳市大成自动化设备有限公司 | Transfer device and die bonder |
| CN112928054A (en) * | 2021-03-11 | 2021-06-08 | 无锡昌鼎电子有限公司 | 12-inch wafer swing arm die bonding device and using method |
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