CN113544860A - 具有光学元件的像素化led阵列 - Google Patents
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Abstract
磷光体转换LED阵列中的每个pcLED像素包括在磷光体层上方的发光表面上的光学元件。在用于制得这种像素化LED阵列的方法中,在完成制作工艺时,牺牲磷光体载体衬底的薄层被保留作为磷光体像素的输出表面上的光学元件。
Description
相关申请的交叉引用
本申请要求2019年3月19日提交的美国专利申请第16/358085号和2018年12月31日提交的美国临时专利申请第62/787006号的优先权的权益,这些申请中的每一个以其全部内容通过引用并入本文。
技术领域
本发明一般地涉及磷光体转换发光二极管。
背景技术
半导体发光二极管和激光二极管(本文统称为“LED”)属于当前可用的最有效的光源。LED的发射光谱通常在由器件的结构和由构成该器件的半导体材料的成分确定的波长处表现为单个窄峰。通过适当选取器件结构和材料体系,LED可以设计成在紫外、可见、或红外波长处操作。
LED可以与一种或多种波长转换材料(本文一般称为“磷光体”)组合,该一种或多种波长转换材料吸收由LED发射的光并作为响应发射更长波长的光。对于这种磷光体转换LED(“pcLED”),由LED发射的、被磷光体吸收的光的比例取决于由LED发射的光的光路中的磷光体材料的量,例如取决于设置在LED上或周围的磷光体层中的磷光体材料的浓度、和该层的厚度。
磷光体转换LED可以被设计成使得由LED发射的所有光被一种或多种磷光体吸收,在该情况下,来自pcLED的发射完全来自磷光体。在这种情况下,磷光体可以被选择为例如在窄光谱区域中发射不由LED直接有效地生成的光。
替代地,pcLED可以被设计成使得由LED发射的光的仅一部分被磷光体吸收,在该情况下,来自pcLED的发射是由LED发射的光和由磷光体发射的光的混合。通过适当选取LED、磷光体、和磷光体成分,这种pcLED可以被设计成发射例如具有期望色温和期望显色性质的白光。
发明内容
本说明书公开了磷光体转换LED阵列——其中每个pcLED像素包括在磷光体层上方的发光表面上的光学元件——以及用于制得这种阵列的方法。在所公开的方法中,当完成制作工艺时,牺牲磷光体载体衬底的薄层被保留作为磷光体像素的输出表面上的光学元件。
例如,磷光体载体衬底的这个剩余薄层允许在去除牺牲载体衬底期间在端点检测中有更大的公差,而不影响pcLED的光学性质(诸如色点)。这可以导致较高的制造良率。
进一步,载体衬底材料和载体衬底表面的纹理(光洁度)和几何形状可以用于以期望的方式影响pcLED的外观和输出。例如,载体衬底材料可以是透明玻璃、透明晶体、有色玻璃、或半透明材料。保留在磷光体像素上的磷光体载体衬底的部分可以被图案化或者以其他方式配置或选择以用作例如微透镜或元透镜、光提取元件、二向色滤光器、关态白色漫射器层、偏振器,或用作任何其他适合的光学元件。
牺牲载体衬底的保留部分可以具有例如垂直于磷光体层上的发光表面的约5微米至约50微米的厚度。
当结合首先简要描述的所附附图来参考本发明的以下更详细的描述时,本发明的其他实施例、特征和优点对于本领域技术人员将变得更加清楚。
附图说明
图1示出了示例pcLED的示意性截面视图。
图2A和图2B分别示出了pcLED阵列的示意性截面视图和示意性俯视图。
图3A示出了其上可以安装pcLED阵列的电子板的示意性俯视图,并且图3B相似地示出了安装在图3A的电子板上的pcLED阵列。
图4A示出了相对于波导和投影透镜布置的pcLED阵列的示意性截面视图。图4B示出了相似于图4A的布置的布置,而没有波导。
图5A、图5B、图5C、图5D、图5E和图5F是示意性地示出用于制作像素化pcLED阵列的示例方法中的诸阶段的局部截面视图,其中每个pcLED像素包括在磷光体像素上方的发光表面上的光学元件,该光学元件由牺牲磷光体载体衬底的保留部分形成。
具体实施方式
以下详细描述应该参考附图来阅读,在附图中遍及不同的图,完全相同的附图标记指代类似的元件。不一定按比例的附图描绘了选择性实施例并且不旨在限制本发明的范围。详细描述通过示例的方式、不通过限制的方式说明了本发明的原理。
图1示出了包括设置在衬底104上的半导体二极管结构102——在本文中一起被认为是“LED”——和设置在LED上的磷光体层106的单独pcLED 100的示例。半导体二极管结构102通常包括设置在n型和p型层之间的有源区。跨二极管结构施加适合的正向偏压导致从有源区发射光。发射的光的波长由有源区的成分和结构确定。
LED可以是例如发射蓝光、紫光、或紫外光的III族-氮化物LED。也可以使用由任何其他适合的材料体系形成并发射任何其他适合波长的光的LED。其他适合的材料体系可以包括例如III族-磷化物材料、III族-砷化物材料、和II-VI族材料。
取决于来自pcLED的期望的光输出,可以使用任何适合的磷光体材料。
图2A-图2B分别示出了包括设置在衬底202上的磷光体像素106的pcLED 100的阵列200的截面视图和俯视图。这种阵列可以包括以任何适合的方式布置的任何适合数量的pcLED。在所图示的示例中,该阵列被描绘为单片地形成在共享衬底上,但是替代地,pcLED的阵列可以由分开的单独的pcLED形成。衬底202可以可选地包括用于驱动LED的CMOS电路,并且可以由任何适合的材料形成。
如图3A-图3B中所示,pcLED阵列200可以安装在电子板300上,该电子板300包括电源和控制模块302、传感器模块304、和LED附着区306。电源和控制模块302可以接收来自外部源的电源和控制信号以及来自传感器模块304的信号,基于这些信号,电源和控制模块302控制LED的操作。传感器模块304可以从任何适合的传感器、例如从温度或光传感器接收信号。替代地,pcLED阵列200可以安装在与电源和控制模块以及传感器模块分开的板上(未示出)。
单独的pcLED可以可选地合并或布置成与相邻于磷光体层而定位或设置在磷光体层上的透镜或其它光学元件组合。这种光学元件——其示例在下面更详细地提及——可以被称为“初级光学元件”。另外,如图4A-图4B中所示,pcLED阵列200(例如,安装在电子板300上)可以与次级光学元件(诸如波导、透镜或两者)组合布置,供预期的应用使用。在图4A中,由pcLED 100发射的光被波导402收集并引导至投影透镜404。例如,投影透镜404可以是菲涅耳透镜。这种布置可能适合于例如在汽车前灯中使用。在图4B中,由pcLED 100发射的光由投影透镜404直接收集,而不使用中间波导。当pcLED可以间隔得足够靠近彼此时,这种布置可能特别适合,并且也可以在汽车前灯以及相机闪光应用中使用。例如,微LED显示应用可以使用与图4A-图4B中所描绘的光学布置相似的光学布置。一般地,取决于期望的应用,光学元件的任何适合布置都可以与本文描述的pcLED组合使用。
如上所总结,本说明书公开了像素化pcLED阵列,其中每个pcLED像素包括在磷光体像素上方的发光表面上的光学元件,该光学元件由在制造工艺期间使用的牺牲磷光体载体衬底的保留部分形成。在制造工艺期间,多数或大部分牺牲磷光体载体衬底被去除。
图5A-图5F的局部截面视图示意性地示出了用于制作这种像素化pcLED阵列的示例方法中的诸阶段。在图5A中,磷光体层500沉积在磷光体载体衬底505上。例如,磷光体层500可以包括分散在粘合剂(诸如硅树脂粘合剂)中的磷光体颗粒。在这种情况下,可以在这个阶段部分地或完全地固化粘合剂。可以使用任何适合的磷光体材料。适合的磷光体材料可以包括例如YAG、LuAG、硅酸盐、BOSE、β-SiAlON、SCASN、BSSN、KSiF:Mn、SLA、和量子点。例如,磷光体层500可以具有约20微米至约500微米的厚度。
磷光体载体衬底505可以例如由透明玻璃、着色(彩色)玻璃、晶体材料、半透明材料、偏振材料、偏振旋转材料、或用作二向色滤光器的材料形成。如果得到的阵列将用作移动电话闪光,则用户可能期望在以其他方式看起来鲜艳的磷光体的顶部上具有半透明层。可选地,磷光体载体505可以由可透氧的材料形成,从而允许氧扩散到完成的pcLED像素中的磷光体像素中并通过该磷光体像素。适合的可透氧材料可以包括例如多孔材料,诸如多孔玻璃、穿孔玻璃、和玻璃纤维增强塑料。
例如,磷光体载体衬底505可以具有约50微米至约200微米、通常约100微米的厚度。可以使用磷光体载体505的任何适合的厚度。
其上沉积磷光体层的磷光体载体衬底505的表面可以被预图案化,以为得到的pcLED像素提供期望的光学效果。例如,预图案化可为每个得到的pcLED像素形成透镜(例如,菲涅耳透镜),提供增强从pcLED像素到空气中的光提取的特征(例如,凹槽、脊、突起、或其他纹理特征),或散射光以为每个pcLED像素提供关态白色漫射器层。
随后,如图5B中所示,通过形成穿过磷光体层500并进入但不完全穿过磷光体载体衬底505的沟槽520来限定(单一化)单独的磷光体像素,以形成磷光体像素515的阵列。例如,这可以通过锯切来完成,但可以使用任何适合的单一化方法。磷光体像素可以例如通过磷光体层500中形成的交叉沟槽来形成为矩形(例如,正方形)阵列。
沟槽520可具有例如约5微米至约200微米的宽度。沟槽520可以穿透磷光体载体衬底505到例如衬底厚度的约四分之一或更多的深度,但必须比衬底厚度更浅,以保持像素不分开。沟槽520可以彼此间隔例如约5微米至约200微米。
随后,如图5C中所示,磷光体像素阵列中的每个磷光体像素515被附着到半导体LED阵列中的对应LED 525。例如,LED 525可以由衬底530支撑,该衬底530可以由任何适合的材料形成。可以通过任何适合的方法将磷光体像素附着到LED。如果磷光体像素包括分散在粘合剂中的磷光体颗粒,则它们可以例如通过固化或进一步固化粘合剂以形成与LED的接合而附着到单独的LED。替代地,或者另外,分开的黏合剂层可以用于将磷光体像素附着到LED。
随后,如图5D中所示,去除磷光体载体505的足够的厚度,使得磷光体像素515不再通过磷光体载体互连,并且磷光体像素和LED的侧壁535被暴露用于侧面涂层(接下来描述)。每个单独的磷光体像素在其上方的光输出表面上保留磷光体载体505的一部分537。例如,在这个步骤可以去除磷光体载体505的约50微米至约200微米的厚度。磷光体载体505的保留部分537可以具有例如约5微米至约50微米的厚度。
随后,如图5E中所示,在磷光体像素的顶部和侧面以及LED的侧面上沉积反射或散射材料540。例如,反射或散射材料540可以是或包括光散射材料,诸如嵌入在硅树脂中的TiO2颗粒、一个或多个反射金属层、或者由高折射率材料和低折射率材料的交替层的堆叠形成的一个或多个DBR结构。例如,可以通过气相沉积或溅射来沉积反射金属层。例如,可以通过原子层沉积来沉积DBR结构。
随后,如图5F中所示,通过任何适合的方法——例如通过机械研磨或抛光——从磷光体像素的上方的光输出表面去除多余的反射或散射材料540。可选地,磷光体载体505的另外的部分(例如,约1微米至约45微米)与材料或结构540的多余部分一起被去除。如上所述,磷光体载体505的一部分545保留在每个磷光体像素的上方的光输出表面上。保留部分545可以具有例如约5微米至约10微米的厚度,或任何其他适合的厚度。
反射或散射材料540的剩余部分在磷光体像素和LED上形成侧壁550,从而将单独的pcLED像素彼此光学隔离。
取决于pcLED的预期应用和它们的尺寸,图5F中所示的得到的像素化阵列可以维持实质上完整,作为阵列转移到另一衬底,或者分成分开的pcLED。
与去除所有牺牲磷光体载体505以暴露磷光体像素的顶部的工艺相比,将磷光体载体部分545保留在磷光体像素的顶部输出表面上放宽了制造公差。这是因为保留的磷光体载体部分545的厚度的变化通常对pcLED像素的性能几乎不具有影响。相反,磷光体像素的厚度的变化可以显著影响pcLED像素的输出,因为如上所解释的,由LED发射的光被磷光体像素吸收并转换成更长波长的光的量取决于LED光通过磷光体像素的路径长度,并因此取决于磷光体像素的高度。因此,如果去除所有牺牲磷光体载体505,则必须以足够的精度控制去除工艺的终点,以便不影响磷光体像素。那可能是挑战性的。
进一步,在去除所有牺牲磷光体载体505的工艺中,不可以容易地控制磷光体像素的表面光洁度以实现期望的效果,诸如例如,影响光提取或输出辐射图案。
如上所解释的,在pcLED的制造工艺期间,将磷光体载体部分545保留在磷光体像素的顶部输出表面上允许将初级光学器件结合到pcLED像素中。与分开制备这种初级光学器件并随后附着到pcLED像素的工艺相比,这可能是有利的。例如,随后将初级光学器件附着到pcLED像素可能需要附加的工艺步骤,可能需要使用可以溢出到pcLED像素的其他部分上的黏合剂或胶,并且将需要将初级光学器件与pcLED像素对齐。使用保留的磷光体载体部分545作为初级光学器件避免了这些困难。
取决于磷光体材料的粘度,保留的磷光体载体部分545(光学元件)可以在光学元件和膜之间保留空气结构,并且由此增强折射率对比度并最大化光学性能。
本公开是说明性的并且不是限制性的。根据本公开,进一步的修改对于本领域技术人员将是清楚的,并且旨在落入所附权利要求的范围内。
Claims (19)
1.一种制作磷光体转换LED阵列的方法,所述方法包括:
在载体衬底的第一表面上形成磷光体层;
形成沟槽,所述沟槽完全延伸穿过所述磷光体层并且部分地但不完全穿过所述载体衬底,以限定多个间隔开的磷光体像素;
将对应的LED附着到每个磷光体像素,以形成布置在所述载体衬底的第一表面上的磷光体转换LED阵列;
从所述载体衬底的与所述第一表面相对的第二表面去除所述载体衬底的足够的部分,以到达并打开所述沟槽,并因此暴露由所述沟槽限定的磷光体像素侧壁;以及
在去除所述载体衬底的足够的部分以到达并打开所述沟槽之后,将所述载体衬底的一部分保留在每个磷光体像素的光输出表面上。
2.如权利要求1所述的方法,其中所述载体衬底的第一表面被图案化,使得所述载体衬底在所述每个磷光体像素的光输出表面上的保留部分是透镜。
3.如权利要求1所述的方法,其中所述载体衬底的第一表面被图案化,使得所述载体衬底在所述每个磷光体像素的光输出表面上的保留部分增强了从所述磷光体像素的光提取。
4.如权利要求1所述的方法,其中所述载体衬底的第一表面被图案化,使得所述载体衬底在所述每个磷光体像素的光输出表面上的保留部分散射光,使得当所述磷光体转换LED不操作时,所述光输出表面在白光照明下呈现白色。
5.如权利要求1所述的方法,其中所述载体衬底由玻璃形成,所述玻璃在所述磷光体转换LED的输出波长处基本上是透明的。
6.如权利要求1所述的方法,其中所述载体衬底由彩色玻璃形成。
7.如权利要求1所述的方法,其中所述载体衬底由在白光照明下是半透明的材料形成。
8.如权利要求1所述的方法,其中所述载体衬底由晶体材料形成。
9.如权利要求1所述的方法,其中所述载体衬底的保留部分是二向色滤光器。
10.如权利要求1所述的方法,其中所述载体衬底的保留部分可透氧。
11.如权利要求1所述的方法,其中所述载体衬底的保留部分使光偏振。
12.如权利要求1所述的方法,其中所述载体衬底的保留部分旋转光的偏振。
13.如权利要求1所述的方法,包括在暴露所述磷光体像素的侧壁之后,在所述磷光体像素的侧壁上沉积光散射或反射材料。
14.如权利要求13所述的方法,包括在所述磷光体像素的侧壁上沉积光散射或反射材料之后,从每个磷光体像素上的所述载体衬底的保留部分的光输出表面去除散射或反射材料。
15.如权利要求14所述的方法,包括在从每个磷光体像素上的所述载体衬底的保留部分的光输出表面去除散射或反射材料之后,从每个磷光体像素去除所述载体衬底的保留部分中的一些而不是全部。
16.如权利要求13所述的方法,其中所述载体衬底的第一表面被图案化,使得所述载体衬底在所述每个磷光体像素的光输出表面上的保留部分是透镜。
17.如权利要求13所述的方法,其中所述载体衬底的第一表面被图案化,使得所述载体衬底在所述每个磷光体像素的光输出表面上的保留部分散射光,使得当所述磷光体转换LED不操作时,所述光输出表面在白光照明下呈现白色。
18.如权利要求13所述的方法,其中所述载体衬底由在白光照明下是半透明的材料形成。
19.如权利要求13所述的方法,其中所述载体衬底的保留部分是多孔的并可透氧的。
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WO2020141349A1 (en) | 2020-07-09 |
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