CN113540053B - High-power-density ceramic eutectic LED packaging structure - Google Patents
High-power-density ceramic eutectic LED packaging structure Download PDFInfo
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- CN113540053B CN113540053B CN202110811025.XA CN202110811025A CN113540053B CN 113540053 B CN113540053 B CN 113540053B CN 202110811025 A CN202110811025 A CN 202110811025A CN 113540053 B CN113540053 B CN 113540053B
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- 239000000919 ceramic Substances 0.000 title claims abstract description 29
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 28
- 230000005496 eutectics Effects 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 238000007789 sealing Methods 0.000 claims description 18
- 238000005538 encapsulation Methods 0.000 claims description 12
- 230000000694 effects Effects 0.000 abstract description 2
- 239000000428 dust Substances 0.000 description 26
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000007774 longterm Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention relates to the technical field of LED packaging and discloses a high-power-density ceramic eutectic LED packaging structure, which comprises a ceramic substrate, wherein an LED chip is fixedly arranged at the top of the ceramic substrate, a fixing frame is fixedly arranged at the top of the ceramic substrate, a mounting groove is formed in the top of the fixing frame, a connecting frame is movably arranged in the mounting groove, a packaging outer cover is fixedly arranged at the top of the connecting frame, the packaging outer cover is pressed into the mounting groove, a bottom inserting column is inserted into the jack, when the packaging outer cover is pressed to the position of a limiting abutting block and the position of a limiting clamping hole are opposite, a spring rebounds and drives the limiting abutting block to clamp into the inside of the limiting clamping hole, when the limiting abutting block extends to the outer side of the limiting clamping hole, a secondary limiting block is pressed to extend to the outer side of a top hole, and the secondary limiting abutting block clamped into the inside of the limiting clamping hole can be subjected to a secondary fixing effect by utilizing a secondary limiting block and an elastic bottom block, so that the connecting frame is arranged in the mounting groove to package the LED chip.
Description
Technical Field
The invention relates to the technical field of LED packaging, in particular to a high-power-density ceramic eutectic LED packaging structure.
Background
The LED industry is one of the most recently attracting industries, and has been developed to date, the LED product has the advantages of energy saving, power saving, high efficiency, fast reaction time, long life cycle, no mercury, environmental protection benefit, and the like, when the LED lamp is produced, the LED chip on the substrate needs to be packaged, and the packaging housing is generally bonded on the substrate through the bonding adhesive to realize the packaging of the LED chip, but after the LED lamp is used for a long time, the bonding adhesive for connection may be corroded by the moisture of the external air, so that the bonding adhesive is insufficient, and at this time, the packaging housing bonded by the bonding adhesive may be separated to a certain extent due to the insufficient bonding adhesive.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the invention provides a high-power-density ceramic eutectic LED packaging structure, which solves the problems.
(II) technical scheme
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a high power density ceramic eutectic LED packaging structure, which comprises a ceramic substrate, ceramic substrate's top fixed mounting has the LED chip, ceramic substrate's top fixed mounting has the fixed frame, the mounting groove has been seted up at the top of fixed frame, the inside movable mounting of mounting groove has the link, the top fixed mounting of link has the encapsulation dustcoat, four spacing draw-in holes have been seted up to the outer wall symmetry of fixed frame, the outer wall of fixed frame corresponds spacing draw-in hole's fixed mounting has four fixed cover pieces, circular through-hole has been seted up at the top of fixed cover piece, the internally movable of circular through-hole on the fixed cover piece has the secondary stopper, two rectangle recesses have been seted up to the outer wall symmetry of link, the inside fixed mounting of rectangle recess on the link has two sleeves, the inside movable mounting of sleeve has the spacing piece of supporting together with spacing draw-in hole joint, the spacing piece of supporting is formed by two cylindrical pieces and two elastic round platform shape piece combination, the top hole together with the secondary stopper joint has been seted up to the outer wall of spacing piece.
Preferably, the inner wall of the sleeve is provided with four connecting sliding grooves, the outer wall of the limiting support block is fixedly provided with a connecting sliding block which is movably connected with the sleeve, and the connecting sliding block is a cross-shaped block.
Preferably, a spring is fixedly arranged in the sleeve, and the outer wall of the connecting sliding block is fixedly connected with one end of the spring.
Preferably, bottom inserting columns are fixedly arranged at four corners of the inside of the mounting groove, and four jacks which are movably connected with the bottom inserting columns are formed at the top of the connecting frame.
Preferably, an elastic bottom block with elasticity is fixedly arranged at the top of the secondary limiting block, and the elastic bottom block is of a hemispherical structure.
Preferably, the outer wall symmetry of link has seted up two louvres, and the inside movable mounting in louvre has the inside casing, and the outer wall symmetry fixed mounting of inside casing has two connecting blocks, and the connecting block passes through bolt and link threaded connection together.
Preferably, the inside movable mounting of inside casing has the dust guard, and the dust guard is the rectangular plate of downward sloping, and circular change groove has been seted up to the inner wall symmetry of inside casing, and the outer wall fixed mounting of dust guard has the pivot that links together with circular change groove swing joint of inside casing inner wall.
Preferably, the outer wall of the dust-proof plate is fixedly provided with two elastic pressing blocks with elasticity, and the elastic pressing blocks are of spherical structures.
Preferably, the outer wall of the connecting frame is fixedly provided with four elastic sealing gaskets, the cross section of each sealing gasket is triangular, and the sealing gaskets and the inner wall of the mounting groove are mutually pressed.
(III) beneficial effects
Compared with the prior art, the invention provides the high-power density ceramic eutectic LED packaging structure, which has the following beneficial effects:
1. this high power density ceramic eutectic LED packaging structure, through at telescopic inside movable mounting with spacing card hole joint spacing support the piece together, when encapsulating the LED chip, press the encapsulation dustcoat to the mounting groove inside, the link of the bottom of encapsulation dustcoat slides and gets into the inside of mounting groove, the bottom inserted post inserts the inside of jack, the link is initially spacing, the inside movable mounting of sleeve is spacing support the piece and is pushed down to the inside slip of sleeve at the inner wall of mounting groove this moment, the spring is compressed, when pressing the position of encapsulation dustcoat to spacing support the piece and the position of spacing card hole relatively, the spring is kick-backed and drive spacing support the piece and slide to the inside of card into spacing card hole this moment, spacing support the piece and be made up by two cylindrical pieces and two elastic round platform shape pieces, when spacing support the piece card and advance spacing card hole inside, two of spacing support the piece have elastic round platform shape piece deformation and play the fixed action with spacing card hole's inner wall in order to spacing support the piece this moment, when spacing support the piece and extend to the outside of spacing card hole, the position of jack and secondary position and secondary adhesive tape piece are pressed down to the inside the position of spacing card hole when pressing the encapsulation cover and the position of spacing piece is the inside opposite to the spacing card hole, the inside the LED chip is difficult to be connected to take place at the inside of the bottom of the spacing card hole of the bottom of the spacing piece and the bottom of the LED chip is sealed.
2. This high power density ceramic eutectic LED packaging structure, through the inside movable mounting of the circular through-hole on fixed cover piece, when the LED lamp breaks down and needs to maintain after long-term use, the pulling card is at the inside secondary stopper in top hole, the inside that the secondary stopper drove the elasticity bottom block and break away from the top hole, press the card at the inside spacing piece of supporting in spacing card hole this moment, spacing piece to the inside direction slip of sleeve that supports, the spring is compressed, spacing piece that supports breaks away from the inside in spacing card hole and retract into telescopic inside pulling link and break away from the inside of mounting groove in order to dismantle the encapsulation dustcoat, thereby be convenient for maintain the LED chip.
3. This high power density ceramic eutectic LED packaging structure has four sealed pads that have elasticity through the outer wall fixed mounting at the link, and the cross section of sealed pad is triangle-shaped so that sealed pad gets into the inside of mounting groove, when the link was fixed in the inside of mounting groove, the inner wall that has elastic sealed pad and mounting groove was pressfitting each other this moment, and sealed pad is the rubber material that has elasticity to utilize sealed pad to play certain sealed effect when stabilizing the link of installing in the mounting groove inside.
4. This high power density ceramic eutectic LED packaging structure, through at the inside movable mounting of the louvre of link outer wall has the inside casing, the LED lamp is when using, and the inside heat of encapsulation dustcoat flows to the external world through the louvre, and the inside movable mounting of inside casing has the dust guard simultaneously, and the dust guard is the rectangular plate of downward sloping, when utilizing the louvre to be convenient for encapsulate the inside heat flow direction external of dustcoat, the dust guard of downward sloping can carry out certain interception in order to avoid the dust to get into the inside of encapsulation dustcoat through the inside casing.
5. This high power density ceramic eutectic LED packaging structure, through the pivot that has the circular change groove swing joint inside with the inside at the outer wall fixed mounting of dust guard, long-term use the back at the LED, can adhere more dust on the dust guard, rotatory bolt and pulling inside that the inside casing takes off discrete hot hole this moment, dismantle the inside casing after, upwards pull inside rotatable dust guard of inside casing, produce the clearance between the dust guard of mutual contact, utilize cleaning tool to clear up the dust of adhesion on the dust guard this moment, thereby be convenient for clear up the dust guard.
Drawings
FIG. 1 is a schematic perspective view of the structure of the present invention;
FIG. 2 is a perspective view of the structure of the present invention;
FIG. 3 is a partial schematic view of FIG. 2A;
FIG. 4 is a partial schematic view of B in FIG. 2;
FIG. 5 is a partial schematic view of FIG. 2C;
FIG. 6 is a schematic perspective view of a secondary stopper in the structure of the present invention;
FIG. 7 is a schematic perspective view of an inner frame in a configuration of the present invention;
fig. 8 is a partial schematic view of C in fig. 7.
In the figure: 1. a ceramic substrate; 2. a fixed frame; 3. a connecting frame; 4. packaging the outer cover; 5. an LED chip; 6. a mounting groove; 7. a jack; 8. a sealing gasket; 9. limiting clamping holes; 10. fixing the sleeve block; 11. a secondary limiting block; 12. a sleeve; 13. the connecting chute; 14. a spring; 15. the connecting slide block; 16. limiting abutting blocks; 17. a top hole; 18. a heat radiation hole; 19. an inner frame; 20. a rotating shaft; 21. a dust-proof plate; 22. an elastic pressing block; 23. an elastic bottom block; 24. a connecting block; 25. and (5) bottom plug posts.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-8, a high power density ceramic eutectic LED package structure comprises a ceramic substrate 1, wherein the ceramic substrate 1 is in a rectangular structure, two rectangular plates are symmetrically and fixedly arranged on the outer wall of the ceramic substrate 1, two circular threaded through holes are formed in the tops of the rectangular plates, an LED chip 5 is fixedly arranged on the tops of the ceramic substrate 1, a fixing frame 2 is fixedly arranged on the tops of the ceramic substrate 1, the fixing frame 2 is in a rectangular annular structure, a mounting groove 6 is formed in the top of the fixing frame 2, the mounting groove 6 is in a rectangular annular groove, bottom inserting posts 25 are fixedly arranged at four corners of the inside of the mounting groove 6, the bottom inserting posts 25 are in a cylindrical structure, a connecting frame 3 is movably arranged in the inside of the mounting groove 6, the connecting frame 3 is in a rectangular annular structure, four insertion holes 7 which are movably connected with the bottom inserting posts 25 are formed in the tops of the connecting frame 3, the insertion holes 7 are circular through holes, the inner diameter of the jack 7 is the same as the outer diameter of the bottom plug post 25, four elastic sealing gaskets 8 are fixedly arranged on the outer wall of the connecting frame 3, the cross section of each sealing gasket 8 is triangular, each sealing gasket 8 is made of elastic rubber, the sealing gasket 8 and the inner wall of the mounting groove 6 are mutually pressed, the top of the connecting frame 3 is fixedly provided with a packaging outer cover 4, the packaging outer cover 4 is of a rectangular hollow structure, four limit clamping holes 9 are symmetrically arranged on the outer wall of the fixing frame 2, the limit clamping holes 9 are circular through holes, the inside of the limit clamping holes 9 are mutually communicated with the inside of the mounting groove 6, four fixing sleeve blocks 10 are fixedly arranged on the outer wall of the fixing frame 2 corresponding to the position of the limit clamping holes 9, each fixing sleeve block 10 is an arc block, the fixing sleeve block 10 is positioned on the upper side of the limit clamping holes 9, the top of each fixing sleeve block 10 is provided with a circular through hole, the inside movable mounting of the circular through hole on the fixed sleeve block 10 has a secondary limiting block 11, the secondary limiting block 11 is formed by welding a cylindrical short rod and a cylindrical block, the outer diameter of the cylindrical short rod in the secondary limiting block 11 is the same as the inner diameter of the circular through hole on the fixed sleeve block 10, the top of the secondary limiting block 11 is fixedly mounted with an elastic bottom block 23, the elastic bottom block 23 is a hemispherical block, the elastic bottom block 23 is made of elastic rubber material, the outer wall of the connecting frame 3 is symmetrically provided with two rectangular grooves, the inside of the rectangular groove on the connecting frame 3 is fixedly provided with two sleeves 12, the sleeves 12 are of cylindrical hollow structures, the outer wall of each sleeve 12 is provided with a circular opening, the inside movable mounting of each sleeve 12 is provided with a limiting block 16 which is clamped with a limiting clamping hole 9, each limiting block 16 is formed by combining two cylindrical blocks with two elastic round table blocks, the round table-shaped block in the limiting abutting block 16 is made of elastic rubber, the outer diameter of the cylindrical block in the limiting abutting block 16 is the same as the inner diameter of the limiting clamping hole 9, the limiting abutting block 16 is communicated with the inside of the limiting clamping hole 9 and extends to the outer side of the limiting clamping hole 9 all the time, four connecting sliding grooves 13 are formed in the inner wall of the sleeve 12, the connecting sliding grooves 13 are arc grooves, a spring 14 is fixedly arranged in the sleeve 12, a connecting sliding block 15 which is movably connected with the sleeve 12 is fixedly arranged on the outer wall of the limiting abutting block 16, the connecting sliding block 15 is a cross-shaped block, the outer wall of the connecting sliding block 15 is fixedly connected with one end of the spring 14, a jacking hole 17 which is clamped with the secondary limiting block 11 is formed in the outer wall of the limiting abutting block 16, the jacking hole 17 is opposite to the circular through hole on the fixed sleeve block 10, two radiating holes 18 are symmetrically formed in the outer wall of the connecting frame 3, the radiating holes 18 are rectangular through holes, an inner frame 19 is movably mounted in the radiating holes 18, the inner frame 19 is of a rectangular frame structure, two connecting blocks 24 are symmetrically and fixedly mounted on the outer wall of the inner frame 19, the connecting blocks 24 are rectangular blocks, the connecting blocks 24 are connected with the connecting frame 3 through bolts in a threaded mode, dust-proof plates 21 are movably mounted in the inner frame 19, the dust-proof plates 21 are rectangular plates inclined downwards, the number of the dust-proof plates 21 is set according to the height of the inner wall of the inner frame 19, round rotating grooves are symmetrically formed in the inner wall of the inner frame 19, a rotating shaft 20 which is movably connected with the round rotating grooves in the inner wall of the inner frame 19 is fixedly mounted on the outer wall of the dust-proof plates 21, the rotating shaft 20 is of a cylindrical structure, two elastic pressing blocks 22 with elasticity are fixedly mounted on the outer wall of the dust-proof plates 21, the elastic pressing blocks 22 are of a spherical structure, and the elastic pressing blocks 22 are made of elastic rubber materials.
Working principle: through the inside movable mounting of the sleeve 12 with limit block 16 that limit clamping hole 9 joint together, when encapsulating LED chip 5, press the encapsulation dustcoat 4 to the inside of mounting groove 6, the link 3 at the bottom of encapsulation dustcoat 4 slides and gets into the inside of mounting groove 6, the bottom inserted post 25 inserts the inside of jack 7, link 3 is initially spacing, the inside movable mounting of sleeve 12 is at this moment pushed down to the inside of sleeve 12 at the inner wall of mounting groove 6 to slide, spring 14 is compressed, when pressing the position of encapsulation dustcoat 4 to limit block 16 and the position of limit clamping hole 9 relatively, spring 14 rebound and drive limit block 16 to slide to block into the inside of limit clamping hole 9 at this moment, limit block 16 is by two cylindrical blocks and two elastic round platform shape pieces make up, when limit block 16 block is blocked into limit clamping hole 9 inside, two round platform shape piece deformation that have elasticity and with limit clamping hole 9 inner wall pressfitting in order to fix limit block 16, when limit block 16 is pressed down to the inner wall of mounting groove 6, the position of limit block 11 is extended to the inside of limit block 16 to the inside of limit block 11 at this moment and the second time, the position of limit block 17 is connected to the inside of limit block 11 to the inside of limit clamping hole 11 at this moment and the bottom of limit block 17 and the inside of limit block 16 is extended to the inside of limit clamping hole 9 by the second time, the limit block 17 is connected to the inside of limit block 17 and the inside of limit block is connected to the inside of limit block 17 to the inside of limit block 9 and the inside of the limit block is mounted to the inside of the limit block 17; through the internally movable mounting of the circular through hole on the fixed sleeve block 10 is provided with the secondary limiting block 11, when the LED lamp breaks down after long-term use and needs to be maintained, the secondary limiting block 11 clamped in the top hole 17 is pulled, the secondary limiting block 11 drives the elastic bottom block 23 to be separated from the inside of the top hole 17, at the moment, the limiting abutting block 16 clamped in the limiting clamping hole 9 is pressed, the limiting abutting block 16 slides towards the inner direction of the sleeve 12, the spring 14 is compressed, the limiting abutting block 16 is separated from the inside of the limiting clamping hole 9 and is retracted into the inner part of the sleeve 12, the connecting frame 3 is pulled to be separated from the inside of the mounting groove 6, and the packaging outer cover 4 is detached, so that the LED chip 5 is convenient to maintain; four elastic sealing gaskets 8 are fixedly arranged on the outer wall of the connecting frame 3, the cross section of each sealing gasket 8 is triangular so that the sealing gasket 8 enters the mounting groove 6, when the connecting frame 3 is fixed in the mounting groove 6, the elastic sealing gaskets 8 and the inner wall of the mounting groove 6 are pressed together, and the sealing gaskets 8 are made of elastic rubber materials, so that the sealing gaskets 8 play a certain sealing role while playing a role in stabilizing the connecting frame 3 arranged in the mounting groove 6; through the inner frame 19 is movably arranged in the radiating hole 18 of the outer wall of the connecting frame 3, when the LED lamp is used, heat in the packaging outer cover 4 flows to the outside through the radiating hole 18, meanwhile, the dustproof plate 21 is movably arranged in the inner frame 19, the dustproof plate 21 is a rectangular plate inclined downwards, and when the heat in the packaging outer cover 4 flows to the outside conveniently by using the radiating hole 18, the dust plate 21 inclined downwards can intercept external dust to a certain extent so as to prevent the dust from entering the packaging outer cover 4 through the inner frame 19; through the pivot 20 that is in the same place with the inside circular rotary groove swing joint of inside casing 19 at the outer wall fixed mounting of dust guard 21, after long-term use such as LED, probably more dust can adhere to on the dust guard 21, rotatory bolt and pulling inside casing 19 take off the inside of discrete hot hole 18 this moment, after dismantling inside casing 19, upwards pull inside casing 19 inside rotatable dust guard 21, produce the clearance between the dust guard 21 of mutual contact, utilize cleaning tool to clear up the dust that adheres to on the dust guard 21 this moment to the dust guard 21 is convenient for clear up.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (1)
1. The utility model provides a high power density ceramic eutectic LED packaging structure, includes ceramic substrate (1), the top fixed mounting of ceramic substrate (1) has LED chip (5), and the top fixed mounting of ceramic substrate (1) has fixed frame (2), and mounting groove (6) have been seted up at the top of fixed frame (2), and the inside movable mounting of mounting groove (6) has link (3), and the top fixed mounting of link (3) has encapsulation dustcoat (4), its characterized in that: four limit clamping holes (9) are symmetrically formed in the outer wall of the fixed frame (2), four fixed sleeve blocks (10) are fixedly arranged at positions, corresponding to the limit clamping holes (9), of the outer wall of the fixed frame (2), round through holes are formed in the tops of the fixed sleeve blocks (10), secondary limiting blocks (11) are movably arranged in the round through holes in the fixed sleeve blocks (10), two rectangular grooves are symmetrically formed in the outer wall of the connecting frame (3), two sleeves (12) are fixedly arranged in the rectangular grooves in the connecting frame (3), limit abutting blocks (16) which are clamped with the limit clamping holes (9) are movably arranged in the sleeves (12), each limit abutting block (16) is formed by combining two cylindrical blocks with two elastic round table-shaped blocks, and top holes (17) which are clamped with the secondary limiting blocks (11) are formed in the outer wall of each limit abutting block (16);
four connecting sliding grooves (13) are formed in the inner wall of the sleeve (12), a connecting sliding block (15) which is movably connected with the sleeve (12) is fixedly arranged on the outer wall of the limiting abutting block (16), and the connecting sliding block (15) is a cross-shaped block;
a spring (14) is fixedly arranged in the sleeve (12), and the outer wall of the connecting sliding block (15) is fixedly connected with one end of the spring (14);
bottom inserting columns (25) are fixedly arranged at four corners of the inside of the mounting groove (6), and four inserting holes (7) which are movably connected with the bottom inserting columns (25) are formed in the top of the connecting frame (3);
an elastic bottom block (23) with elasticity is fixedly arranged at the top of the secondary limiting block (11), and the elastic bottom block (23) is of a hemispherical structure;
two radiating holes (18) are symmetrically formed in the outer wall of the connecting frame (3), an inner frame (19) is movably mounted in the radiating holes (18), two connecting blocks (24) are symmetrically and fixedly mounted on the outer wall of the inner frame (19), and the connecting blocks (24) are connected with the connecting frame (3) through bolts in a threaded mode;
the inner part of the inner frame (19) is movably provided with a dust-proof plate (21), the dust-proof plate (21) is a rectangular plate inclined downwards, the inner wall of the inner frame (19) is symmetrically provided with circular rotating grooves, and the outer wall of the dust-proof plate (21) is fixedly provided with a rotating shaft (20) which is movably connected with the circular rotating grooves on the inner wall of the inner frame (19);
two elastic pressing blocks (22) with elasticity are fixedly arranged on the outer wall of the dust-proof plate (21), and the elastic pressing blocks (22) are of a spherical structure;
four elastic sealing gaskets (8) are fixedly arranged on the outer wall of the connecting frame (3), the cross section of each sealing gasket (8) is triangular, and the sealing gaskets (8) and the inner wall of the mounting groove (6) are mutually pressed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110811025.XA CN113540053B (en) | 2021-07-19 | 2021-07-19 | High-power-density ceramic eutectic LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110811025.XA CN113540053B (en) | 2021-07-19 | 2021-07-19 | High-power-density ceramic eutectic LED packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113540053A CN113540053A (en) | 2021-10-22 |
| CN113540053B true CN113540053B (en) | 2023-08-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110811025.XA Active CN113540053B (en) | 2021-07-19 | 2021-07-19 | High-power-density ceramic eutectic LED packaging structure |
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| CN111446350A (en) * | 2020-04-13 | 2020-07-24 | 合肥念萍电子商务有限公司 | Support assembly for packaging L ED chip |
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| JP2021026920A (en) * | 2019-08-06 | 2021-02-22 | 東莞嘉盛照明科技有限公司 | Ceiling light mounting structure |
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| CN112563187A (en) * | 2020-11-18 | 2021-03-26 | 马鞍山安慧智电子科技有限公司 | LED packaging substrate and manufacturing process thereof |
| CN213576870U (en) * | 2020-11-06 | 2021-06-29 | 福建辉日照明电器有限公司 | Novel LED lamp |
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