CN113540053A - High-power-density ceramic eutectic LED packaging structure - Google Patents
High-power-density ceramic eutectic LED packaging structure Download PDFInfo
- Publication number
- CN113540053A CN113540053A CN202110811025.XA CN202110811025A CN113540053A CN 113540053 A CN113540053 A CN 113540053A CN 202110811025 A CN202110811025 A CN 202110811025A CN 113540053 A CN113540053 A CN 113540053A
- Authority
- CN
- China
- Prior art keywords
- wall
- block
- limiting
- frame
- mounting groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
Abstract
The invention relates to the technical field of LED packaging, and discloses a high-power-density ceramic eutectic LED packaging structure which comprises a ceramic substrate, wherein an LED chip is fixedly mounted at the top of the ceramic substrate, a fixed frame is fixedly mounted at the top of the ceramic substrate, a mounting groove is formed in the top of the fixed frame, a connecting frame is movably mounted in the mounting groove, a packaging outer cover is fixedly mounted at the top of the connecting frame, the packaging outer cover is pressed towards the inside of the mounting groove, a bottom inserting column is inserted into the inner part of a jack, when the packaging outer cover is pressed until the position of a limiting abutting block is opposite to the position of a limiting clamping hole, a spring rebounds and drives the limiting abutting block to be clamped into the limiting clamping hole, when the limiting abutting block extends to the outer side of the limiting clamping hole, a secondary limiting block is pressed until the limiting abutting block extends to the outer side of the top hole, and the secondary limiting abutting block clamped into the limiting clamping hole can be secondarily fixed by using the secondary limiting block and the elastic bottom block, thereby installing the link frame inside the mounting groove to package the LED chip.
Description
Technical Field
The invention relates to the technical field of LED packaging, in particular to a high-power-density ceramic eutectic LED packaging structure.
Background
The LED industry is one of the most notable industries in recent years, and LED products have been developed to date, which have the advantages of energy saving, power saving, high efficiency, fast reaction time, long life cycle time, no mercury, environmental protection, and the like.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a high-power-density ceramic eutectic LED packaging structure, and solves the problems.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: the high-power-density ceramic eutectic LED packaging structure comprises a ceramic substrate, wherein an LED chip is fixedly mounted at the top of the ceramic substrate, a fixed frame is fixedly mounted at the top of the ceramic substrate, a mounting groove is formed in the top of the fixed frame, a connecting frame is movably mounted in the mounting groove, a packaging outer cover is fixedly mounted at the top of the connecting frame, four limiting clamping holes are symmetrically formed in the outer wall of the fixed frame, four fixed sleeve blocks are fixedly mounted at positions, corresponding to the limiting clamping holes, of the outer wall of the fixed frame, a circular through hole is formed in the top of each fixed sleeve block, a secondary limiting block is movably mounted in the circular through hole in each fixed sleeve block, two rectangular grooves are symmetrically formed in the outer wall of the connecting frame, two sleeves are fixedly mounted in the rectangular grooves in the connecting frame, a limiting abutting block clamped with the limiting clamping holes is movably mounted in each sleeve, and is formed by combining two cylindrical blocks and two round platform blocks with elasticity, the outer wall of the limiting abutting block is provided with a top hole which is clamped with the secondary limiting block.
Preferably, four connecting sliding grooves are formed in the inner wall of the sleeve, a connecting sliding block movably connected with the sleeve is fixedly mounted on the outer wall of the limiting abutting block, and the connecting sliding block is a cross-shaped block.
Preferably, a spring is fixedly installed inside the sleeve, and the outer wall of the connecting sliding block is fixedly connected with one end of the spring.
Preferably, the four corners of the inside of the mounting groove are fixedly provided with bottom inserting columns, and the top of the connecting frame is provided with four insertion holes movably connected with the bottom inserting columns.
Preferably, the top of the secondary limiting block is fixedly provided with an elastic bottom block with elasticity, and the elastic bottom block is of a hemispherical structure.
Preferably, two heat dissipation holes are symmetrically formed in the outer wall of the connecting frame, an inner frame is movably mounted inside the heat dissipation holes, two connecting blocks are symmetrically and fixedly mounted on the outer wall of the inner frame, and the connecting blocks are connected with the connecting frame through bolts in a threaded mode.
Preferably, the inside movable mounting of inner frame has the dust guard, and the dust guard is the rectangular plate of downward sloping, and circular turn trough has been seted up to the inner wall symmetry of inner frame, and the outer wall fixed mounting of dust guard has the pivot together with the circular turn trough swing joint of inner frame inner wall.
Preferably, the outer wall of the dust guard is fixedly provided with two elastic pressing blocks with elasticity, and the elastic pressing blocks are of spherical structures.
Preferably, four elastic sealing gaskets are fixedly mounted on the outer wall of the connecting frame, the cross section of each sealing gasket is triangular, and the sealing gaskets are mutually pressed with the inner wall of the mounting groove.
(III) advantageous effects
Compared with the prior art, the invention provides a high-power-density ceramic eutectic LED packaging structure, which has the following beneficial effects:
1. the high-power-density ceramic eutectic LED packaging structure is characterized in that a limiting support block clamped with a limiting clamping hole is movably mounted inside a sleeve, when an LED chip is packaged, a packaging outer cover is pressed inside a mounting groove, a connecting frame at the bottom of the packaging outer cover slides into the mounting groove, a bottom plug column is inserted into the jack, the connecting frame is preliminarily limited, the limiting support block movably mounted inside the sleeve slides inside the sleeve under the extrusion of the inner wall of the mounting groove, a spring is compressed, when the packaging outer cover is pressed to the limiting support block and the position of the limiting clamping hole is opposite, the spring rebounds and drives the limiting support block to slide inside the limiting clamping hole to the inside of the clamping hole, the limiting support block is formed by combining two cylindrical blocks and two elastic circular truncated cone blocks, when the limiting support block is clamped inside the limiting clamping hole, two elastic circular truncated cones in the limiting support block deform and are pressed with the inner wall of the limiting clamping hole to clamp the limiting support block The supporting block plays a fixed role, when the limiting supporting block extends to the outer side of the limiting clamping hole, the position of the top hole is opposite to the position of the secondary limiting block, the elastic bottom block communicated with the top hole from the secondary limiting block to the secondary limiting block is pressed, the elastic bottom block is extended to the outer side of the top hole, the secondary fixing function is played to the limiting supporting block clamped in the limiting clamping hole by the aid of the secondary limiting block and the elastic bottom block, and the connecting frame is installed in the mounting groove to package the LED chip so as to avoid the problem that the packaging outer cover breaks away from due to insufficient bonding adhesiveness.
2. This high power density pottery eutectic LED packaging structure, there is the secondary stopper through the inside movable mounting of the circular through-hole on fixed nest of blocks, break down after the LED lamp uses for a long time and need maintain, the pulling card is at the inside secondary stopper of apical pore, the secondary stopper drives the inside that the elasticity bottom block breaks away from the apical pore, press the spacing piece of supporting of card at spacing downthehole portion this moment, spacing piece of supporting slides to the inside direction of sleeve, the spring is compressed, spacing piece of supporting breaks away from the inside in spacing card hole and returns the inside that the telescopic inside pulling link breaks away from the mounting groove of retraction is in order to dismantle the encapsulation dustcoat, thereby be convenient for maintain the LED chip.
3. This high power density pottery eutectic LED packaging structure, there are four sealed pads that have elasticity through the outer wall fixed mounting at the link, sealed cross section of filling up is triangle-shaped so that sealed inside that fills up the entering mounting groove, when the link is fixed in the inside of mounting groove, the mutual pressfitting of inner wall that has elastic sealed pad and mounting groove this moment, sealed the pad for having elastic rubber material, thereby utilize sealed pad also to play certain sealed effect when installing the link of mounting groove inside firm effect.
4. This high power density pottery eutectic LED packaging structure, there is the inside casing through the inside movable mounting of louvre at the link outer wall, the LED lamp is when using, the inside heat of encapsulation dustcoat passes through the louvre and flows to the external world, the inside movable mounting of inside casing has the dust guard simultaneously, the dust guard is the rectangular plate of downward sloping, when utilizing the louvre to be convenient for encapsulate the inside heat of dustcoat and flow to the external while, the dust guard of downward sloping can carry out certain interception in order to avoid the dust to pass through the inside casing and get into the inside of encapsulation dustcoat.
5. This high power density pottery eutectic LED packaging structure, there is the pivot together with the inside circular revolving groove swing joint of inside casing through the outer wall fixed mounting at the dust guard, after long-term use such as LED, probably the more dust of adhesion on the dust guard, rotatory bolt and pulling inside casing break away from the inside of louvre this moment, dismantle the inside casing after, upwards pull the inside casing inside can the pivoted dust guard, produce the clearance between the dust guard of mutual contact, utilize burnisher to clear up the dust of adhesion on the dust guard this moment, thereby be convenient for clear up the dust guard.
Drawings
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a schematic view of the present invention showing the structure of the present invention;
FIG. 3 is a partial schematic view of A in FIG. 2;
FIG. 4 is a partial schematic view of B in FIG. 2;
FIG. 5 is a partial schematic view of C of FIG. 2;
FIG. 6 is a schematic perspective view of a secondary stopper in the structure of the present invention;
FIG. 7 is a schematic semi-sectional perspective view of the inner frame of the present invention;
fig. 8 is a partial schematic view of C in fig. 7.
In the figure: 1. a ceramic substrate; 2. a fixing frame; 3. a connecting frame; 4. a packaging housing; 5. an LED chip; 6. mounting grooves; 7. a jack; 8. a gasket; 9. limiting clamp holes; 10. fixing the sleeve block; 11. a secondary limiting block; 12. a sleeve; 13. connecting the sliding chute; 14. a spring; 15. connecting the sliding block; 16. a limiting abutting block; 17. a top hole; 18. heat dissipation holes; 19. an inner frame; 20. a rotating shaft; 21. a dust-proof plate; 22. elastic pressing blocks; 23. an elastic bottom block; 24. connecting blocks; 25. and inserting the column at the bottom.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-8, a high power density ceramic eutectic LED package structure includes a ceramic substrate 1, the ceramic substrate 1 is a rectangular structure, two rectangular plates are symmetrically and fixedly mounted on an outer wall of the ceramic substrate 1, two circular threaded through holes are formed in tops of the rectangular plates, an LED chip 5 is fixedly mounted on a top of the ceramic substrate 1, a fixing frame 2 is fixedly mounted on a top of the ceramic substrate 1, the fixing frame 2 is a rectangular ring structure, a mounting groove 6 is formed in a top of the fixing frame 2, the mounting groove 6 is a rectangular ring groove, bottom inserting posts 25 are fixedly mounted at four corners inside the mounting groove 6, the bottom inserting posts 25 are cylindrical structures, a connecting frame 3 is movably mounted inside the mounting groove 6, the connecting frame 3 is a rectangular ring structure, four insertion holes 7 movably connected with the bottom inserting posts 25 are formed in a top of the connecting frame 3, the insertion holes 7 are circular through holes, the inner diameter of the jack 7 is the same as the outer diameter of the bottom plug-in post 25, four elastic sealing gaskets 8 are fixedly arranged on the outer wall of the connecting frame 3, the cross section of each sealing gasket 8 is triangular, each sealing gasket 8 is made of elastic rubber, the sealing gaskets 8 are mutually pressed with the inner wall of the mounting groove 6, a packaging outer cover 4 is fixedly arranged on the top of the connecting frame 3, the packaging outer cover 4 is of a rectangular hollow structure, four limiting clamping holes 9 are symmetrically formed in the outer wall of the fixing frame 2, each limiting clamping hole 9 is a circular through hole, the inner part of each limiting clamping hole 9 is mutually communicated with the inner part of the mounting groove 6, four fixing sleeve blocks 10 are fixedly arranged on the outer wall of the fixing frame 2 corresponding to the positions of the limiting clamping holes 9, each fixing sleeve block 10 is an arc-shaped block, each fixing sleeve block 10 is positioned at the upper side position of each limiting clamping hole 9, each circular through hole is formed in the top of each fixing sleeve block 10, and a secondary limiting block 11 is movably arranged in the circular through hole in each fixing sleeve block 10, the secondary limiting block 11 is formed by welding a cylindrical short rod and a cylindrical block, the external diameter of the cylindrical short rod in the secondary limiting block 11 is the same as the internal diameter of a circular through hole on the fixed sleeve block 10, the top of the secondary limiting block 11 is fixedly provided with an elastic bottom block 23, the elastic bottom block 23 is a hemispherical block, the elastic bottom block 23 is made of elastic rubber, the outer wall of the connecting frame 3 is symmetrically provided with two rectangular grooves, the inside of the rectangular groove on the connecting frame 3 is fixedly provided with two sleeves 12, the sleeves 12 are of a cylindrical hollow structure, the outer wall of the sleeves 12 is provided with a circular opening, the inside of the sleeves 12 is movably provided with a limiting abutting block 16 which is clamped with the limiting clamping hole 9, the limiting abutting block 16 is formed by combining two cylindrical blocks and two elastic circular truncated cone blocks, and the circular truncated cones in the limiting abutting block 16 are made of elastic rubber, the external diameter of a cylindrical block in a limiting abutting block 16 is the same as the internal diameter of a limiting clamping hole 9, the limiting abutting block 16 is communicated with the inside of the limiting clamping hole 9 and extends to the outside of the limiting clamping hole 9, the inner wall of a sleeve 12 is provided with four connecting sliding grooves 13, the connecting sliding grooves 13 are arc-shaped grooves, a spring 14 is fixedly arranged in the sleeve 12, the outer wall of the limiting abutting block 16 is fixedly provided with a connecting sliding block 15 movably connected with the sleeve 12, the connecting sliding block 15 is a cross-shaped block, the outer wall of the connecting sliding block 15 is fixedly connected with one end of the spring 14, the outer wall of the limiting abutting block 16 is provided with a top hole 17 clamped with a secondary limiting block 11, the position of the top hole 17 is opposite to the position of a circular through hole on a fixed sleeve block 10, the outer wall of a connecting frame 3 is symmetrically provided with two heat dissipation holes 18, the heat dissipation holes 18 are rectangular through holes, and the internal frame 19 is movably arranged in the interior of the limiting abutting block 18, inside casing 19 is rectangle frame column structure, inside casing 19's outer wall symmetry fixed mounting has two connecting blocks 24, connecting block 24 is the rectangular block, connecting block 24 passes through bolt and 3 threaded connection of link together, inside casing 19's inside movable mounting has dust guard 21, dust guard 21 is the rectangular plate of downward sloping, the quantity of dust guard 21 highly sets up according to inside casing 19's inner wall, circular turn trough has been seted up to inside casing 19's inner wall symmetry, dust guard 21's outer wall fixed mounting has the pivot 20 together with the circular turn trough movable connection of inside casing 19 inner wall, pivot 20 is cylindrical structure, dust guard 21's outer wall fixed mounting has two elastic pressing block 22 that have, elastic pressing block 22 is spherical structure, elastic pressing block 22 is for having elastic rubber material.
The working principle is as follows: through movably installing the limiting abutting block 16 clamped with the limiting clamping hole 9 in the sleeve 12, when the LED chip 5 is packaged, the packaging outer cover 4 is pressed towards the inside of the mounting groove 6, the connecting frame 3 at the bottom of the packaging outer cover 4 slides into the inside of the mounting groove 6, the bottom inserting column 25 is inserted into the inside of the jack 7, the connecting frame 3 is initially limited, at the moment, the limiting abutting block 16 movably installed in the sleeve 12 slides towards the inside of the sleeve 12 under the extrusion of the inner wall of the mounting groove 6, the spring 14 is compressed, when the position of the limiting abutting block 16 pressed by the packaging outer cover 4 is opposite to the position of the limiting clamping hole 9, at the moment, the spring 14 rebounds and drives the limiting abutting block 16 to slide towards the inside of the limiting clamping hole 9 to be clamped into the inside of the limiting clamping hole 9, the limiting abutting block 16 is formed by combining two cylinders and two round-truncated-cone-shaped blocks with elasticity, when the limiting abutting block 16 is clamped into the limiting clamping hole 9, two elastic truncated cone-shaped blocks in the limiting abutting blocks 16 deform and are pressed with the inner wall of the limiting clamping hole 9 to fix the limiting abutting blocks 16, when the limiting abutting blocks 16 extend to the outer side of the limiting clamping hole 9, the positions of the top holes 17 are opposite to the positions of the secondary limiting blocks 11, the elastic bottom blocks 23 from the secondary limiting blocks 11 to the bottoms of the secondary limiting blocks 11 are pressed to be communicated with the inside of the top holes 17 and extend to the outer side of the top holes 17, and the secondary limiting blocks 11 and the elastic bottom blocks 23 can be used for secondarily fixing the limiting abutting blocks 16 clamped into the limiting clamping holes 9, so that the connecting frame 3 is installed inside the mounting groove 6 to package the LED chips 5; the secondary limiting block 11 is movably arranged in the circular through hole in the fixed sleeve block 10, when an LED lamp breaks down after being used for a long time and needs to be maintained, the secondary limiting block 11 clamped in the top hole 17 is pulled, the secondary limiting block 11 drives the elastic bottom block 23 to be separated from the inside of the top hole 17, the limiting abutting block 16 clamped in the limiting clamping hole 9 is pressed at the moment, the limiting abutting block 16 slides towards the inside of the sleeve 12, the spring 14 is compressed, the limiting abutting block 16 is separated from the inside of the limiting clamping hole 9 and retracts into the inside of the sleeve 12 to pull the connecting frame 3 to be separated from the inside of the mounting groove 6 so as to detach the packaging outer cover 4, and therefore the LED chip 5 can be maintained conveniently; four elastic sealing gaskets 8 are fixedly arranged on the outer wall of the connecting frame 3, the cross sections of the sealing gaskets 8 are triangular, so that the sealing gaskets 8 can enter the mounting groove 6, when the connecting frame 3 is fixed in the mounting groove 6, the elastic sealing gaskets 8 are mutually pressed with the inner wall of the mounting groove 6, and the sealing gaskets 8 are made of elastic rubber materials, so that the sealing gaskets 8 can be used for stabilizing the connecting frame 3 arranged in the mounting groove 6 and simultaneously play a certain sealing role; an inner frame 19 is movably mounted inside a radiating hole 18 in the outer wall of the connecting frame 3, when the LED lamp is used, heat inside the packaging outer cover 4 flows to the outside through the radiating hole 18, meanwhile, a dustproof plate 21 is movably mounted inside the inner frame 19, the dustproof plate 21 is a downward-inclined rectangular plate, and when the radiating hole 18 is utilized to facilitate the heat inside the packaging outer cover 4 to flow to the outside, the downward-inclined dustproof plate 21 can intercept external dust to prevent the dust from entering the packaging outer cover 4 through the inner frame 19; through the outer wall fixed mounting at dust guard 21 have with inside the inside circular revolving groove swing joint of inside casing 19 pivot 20 together, after long-term use such as LED, may adhere more dust on the dust guard 21, rotatory bolt and pulling inside casing 19 break away from the inside of louvre 18 this moment, dismantle inside casing 19 back, upwards pull inside 19 inside can pivoted dust guard 21 of inside casing, produce the clearance between the dust guard 21 of mutual contact, utilize burnisher to clear up the dust of adhesion on the dust guard 21 this moment, thereby be convenient for clear up dust guard 21.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. High power density pottery eutectic LED packaging structure, including ceramic substrate (1), the top fixed mounting of ceramic substrate (1) has LED chip (5), and the top fixed mounting of ceramic substrate (1) has fixed frame (2), and mounting groove (6) have been seted up at the top of fixed frame (2), and the inside movable mounting of mounting groove (6) has link (3), and the top fixed mounting of link (3) has encapsulation dustcoat (4), its characterized in that: four spacing card holes (9) have been seted up to the outer wall symmetry of fixed frame (2), the outer wall of fixed frame (2) corresponds the fixed position of spacing card hole (9) and installs four fixed collets (10), circular through-hole has been seted up at the top of fixed collets (10), the inside movable mounting of the circular through-hole on fixed collets (10) has secondary stopper (11), two rectangle recesses have been seted up to the outer wall symmetry of link (3), the inside fixed mounting of the rectangle recess on link (3) has two sleeves (12), the inside movable mounting of sleeve (12) has spacing piece (16) of supporting with spacing card hole (9) joint together, spacing piece (16) of supporting is formed by two cylindrical shape pieces and two elastic round platform shape piece combinations, spacing outer wall of supporting piece (16) is seted up apical pore (17) with secondary stopper (11) joint together.
2. The high power density ceramic eutectic LED package structure of claim 1, wherein: four connecting sliding grooves (13) are formed in the inner wall of the sleeve (12), a connecting sliding block (15) movably connected with the sleeve (12) is fixedly mounted on the outer wall of the limiting abutting block (16), and the connecting sliding block (15) is a cross-shaped block.
3. The high power density ceramic eutectic LED package structure of claim 2, wherein: the spring (14) is fixedly installed in the sleeve (12), and the outer wall of the connecting sliding block (15) is fixedly connected with one end of the spring (14).
4. The high power density ceramic eutectic LED package structure of claim 1, wherein: the four corners of the inside of the mounting groove (6) are fixedly provided with bottom inserting columns (25), and the top of the connecting frame (3) is provided with four insertion holes (7) movably connected with the bottom inserting columns (25).
5. The high power density ceramic eutectic LED package structure of claim 1, wherein: the top of the secondary limiting block (11) is fixedly provided with an elastic bottom block (23), and the elastic bottom block (23) is of a hemispherical structure.
6. The high power density ceramic eutectic LED package structure of claim 1, wherein: two heat dissipation holes (18) are symmetrically formed in the outer wall of the connecting frame (3), an inner frame (19) is movably mounted inside the heat dissipation holes (18), two connecting blocks (24) are fixedly mounted on the outer wall of the inner frame (19) symmetrically, and the connecting blocks (24) are connected with the connecting frame (3) through bolts in a threaded mode.
7. The high power density ceramic eutectic LED package structure of claim 6, wherein: the inner frame (19) is internally and movably provided with a dust guard (21), the dust guard (21) is a rectangular plate inclined downwards, the inner wall of the inner frame (19) is symmetrically provided with a circular rotating groove, and the outer wall of the dust guard (21) is fixedly provided with a rotating shaft (20) which is movably connected with the circular rotating groove of the inner wall of the inner frame (19).
8. The high power density ceramic eutectic LED package structure of claim 7, wherein: the outer wall fixed mounting of dust guard (21) has two elastic pressing blocks (22), and elastic pressing block (22) are spherical structure.
9. The high power density ceramic eutectic LED package structure of claim 1, wherein: the outer wall fixed mounting of link (3) has four sealed pads (8) that have elasticity, and the cross section of sealed pad (8) is triangle-shaped, and the mutual pressfitting of the inner wall of sealed pad (8) and mounting groove (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110811025.XA CN113540053B (en) | 2021-07-19 | 2021-07-19 | High-power-density ceramic eutectic LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110811025.XA CN113540053B (en) | 2021-07-19 | 2021-07-19 | High-power-density ceramic eutectic LED packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113540053A true CN113540053A (en) | 2021-10-22 |
| CN113540053B CN113540053B (en) | 2023-08-25 |
Family
ID=78100041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110811025.XA Active CN113540053B (en) | 2021-07-19 | 2021-07-19 | High-power-density ceramic eutectic LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113540053B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0714652A (en) * | 1993-04-30 | 1995-01-17 | Chichibu Fuji:Kk | Socket for ic package |
| CN208806244U (en) * | 2018-09-30 | 2019-04-30 | 深圳市东丰尼科技有限公司 | A kind of chip-packaging structure |
| CN209266375U (en) * | 2019-01-15 | 2019-08-16 | 华芯智造微电子(重庆)股份有限公司 | A kind of chip angle means for correcting of LED encapsulation |
| CN111446350A (en) * | 2020-04-13 | 2020-07-24 | 合肥念萍电子商务有限公司 | Support assembly for packaging L ED chip |
| CN212542469U (en) * | 2020-06-22 | 2021-02-12 | 佛山市威鹏电子科技有限公司 | LED packaging device |
| JP2021026920A (en) * | 2019-08-06 | 2021-02-22 | 東莞嘉盛照明科技有限公司 | Ceiling light mounting structure |
| CN212648269U (en) * | 2020-08-25 | 2021-03-02 | 深圳市穗晶光电股份有限公司 | Ultra-bright backlight lamp bead packaging structure capable of unlocking finger marks under screen |
| CN212721471U (en) * | 2020-09-11 | 2021-03-16 | 山东大学 | Packaging device of optical fiber sensor |
| CN112563187A (en) * | 2020-11-18 | 2021-03-26 | 马鞍山安慧智电子科技有限公司 | LED packaging substrate and manufacturing process thereof |
| CN213576870U (en) * | 2020-11-06 | 2021-06-29 | 福建辉日照明电器有限公司 | Novel LED lamp |
-
2021
- 2021-07-19 CN CN202110811025.XA patent/CN113540053B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0714652A (en) * | 1993-04-30 | 1995-01-17 | Chichibu Fuji:Kk | Socket for ic package |
| CN208806244U (en) * | 2018-09-30 | 2019-04-30 | 深圳市东丰尼科技有限公司 | A kind of chip-packaging structure |
| CN209266375U (en) * | 2019-01-15 | 2019-08-16 | 华芯智造微电子(重庆)股份有限公司 | A kind of chip angle means for correcting of LED encapsulation |
| JP2021026920A (en) * | 2019-08-06 | 2021-02-22 | 東莞嘉盛照明科技有限公司 | Ceiling light mounting structure |
| CN111446350A (en) * | 2020-04-13 | 2020-07-24 | 合肥念萍电子商务有限公司 | Support assembly for packaging L ED chip |
| CN212542469U (en) * | 2020-06-22 | 2021-02-12 | 佛山市威鹏电子科技有限公司 | LED packaging device |
| CN212648269U (en) * | 2020-08-25 | 2021-03-02 | 深圳市穗晶光电股份有限公司 | Ultra-bright backlight lamp bead packaging structure capable of unlocking finger marks under screen |
| CN212721471U (en) * | 2020-09-11 | 2021-03-16 | 山东大学 | Packaging device of optical fiber sensor |
| CN213576870U (en) * | 2020-11-06 | 2021-06-29 | 福建辉日照明电器有限公司 | Novel LED lamp |
| CN112563187A (en) * | 2020-11-18 | 2021-03-26 | 马鞍山安慧智电子科技有限公司 | LED packaging substrate and manufacturing process thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113540053B (en) | 2023-08-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207230344U (en) | A kind of shot-light | |
| CN111446350B (en) | Support assembly for packaging LED chip | |
| CN113540053A (en) | High-power-density ceramic eutectic LED packaging structure | |
| CN101621092B (en) | Light-emitting diode | |
| CN209859974U (en) | Red light LED luminotron | |
| CN207883721U (en) | A kind of LED light bar with excellent heat dispersion performance | |
| CN108799924A (en) | A kind of public place is easily installed the LED lamp of maintenance | |
| CN215070032U (en) | Chip-scale packaging structure of low-loss white light LED | |
| CN217444417U (en) | LED base plate convenient to encapsulation | |
| CN214706578U (en) | Detachable packaging structure of semiconductor laser diode | |
| CN213576870U (en) | Novel LED lamp | |
| CN109659418A (en) | LED upside-down mounting integration packaging mould group | |
| CN216307471U (en) | Detachable structure of LED lamp | |
| CN212156740U (en) | LED lamp with assemble function fast | |
| CN109210404B (en) | LED lamp | |
| CN213577341U (en) | Clamping mounting structure of LED lamp shade | |
| CN101459212B (en) | Solid illuminating element | |
| CN215069940U (en) | Integrated circuit SIP packaging structure | |
| CN215982386U (en) | LED lamps and lanterns convenient to maintenance | |
| CN210107075U (en) | Purple light LED luminotron | |
| CN207584589U (en) | A kind of easy-dismount LED street lamp | |
| CN207471439U (en) | A kind of safety-type LED lamp cover | |
| CN215892007U (en) | Integrated high-power COB LED packaging light source | |
| CN215061540U (en) | Self-adaptive high-luminous-efficiency LED lamp | |
| CN212412082U (en) | Stable support structure for LED packaging |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |