CN215069940U

CN215069940U - Integrated circuit SIP packaging structure

Info

Publication number: CN215069940U
Application number: CN202120764628.4U
Authority: CN
Inventors: 郭晓东
Original assignee: Yantai Xiancheng Electronic Technology Co ltd
Current assignee: Shandong gangyue Information Technology Co.,Ltd.
Priority date: 2021-04-14
Filing date: 2021-04-14
Publication date: 2021-12-07
Anticipated expiration: 2031-04-14

Abstract

The utility model relates to the technical field of packaging, and discloses an integrated circuit SIP packaging structure, which comprises a packaging body, wherein a substrate is fixedly arranged in the packaging body through two rectangular supporting rods, a chip is fixedly arranged in the substrate, two wire cylinders are fixedly arranged on the outer wall of the substrate, a detachable packaging cover is arranged in the packaging body, in the process of pressing the packaging cover downwards, the limiting clamping block which can slide in the fixing groove slides towards the inside of the fixing groove under the extrusion of the inner wall of the packaging body, the elastic force of the spring drives the connecting sleeve frame to slide towards the outside direction of the fixing groove until the limiting clamping block is clamped into the clamping groove, the connecting shaft is stirred, the limiting clamping block clamped in the clamping groove can be extruded in the rotating process of the extruding block, the limiting clamping block is extruded by the extruding block to slide towards the inside of the fixing groove to be separated from the inside of the clamping groove, thereby being convenient for carry out dismouting so that overhaul the inside component of encapsulation body to the encapsulation lid.

Description

Integrated circuit SIP packaging structure

Technical Field

The utility model relates to a packaging technology field specifically is an integrated circuit SIP packaging structure.

Background

An integrated circuit is a microelectronic device or component. The transistor, resistor, capacitor and inductor elements and wiring required in a circuit are interconnected together by a certain process, and are manufactured on a small semiconductor wafer or a plurality of small semiconductor wafers or medium substrates, and then are packaged in a package to form the micro-structure with the required circuit function. The packaging means that a circuit pin on a silicon chip is connected and led to an external joint by a metal lead so as to be convenient for connecting other devices, and the chip has small volume and is very inconvenient to weld in the packaging and welding process.

According to the integrated circuit SIP packaging structure disclosed by Chinese patent (the publication number of the authorization is CN207993854U), the packaging body is provided with an open-ended cuboid hollow structure for the top, the vertical bracing piece that is provided with of the interior bottom of the packaging body, the bracing piece is provided with four altogether, and the top of four bracing pieces is connected with the base plate, the base plate runs through the cuboid structure that is provided with the recess for the top center, and the bottom of recess is provided with the heating panel, all transversely be provided with the tongue on the both sides inner wall of recess width direction. The utility model discloses in, the user makes the chip can be fixed to it when the interface welding, and it is more convenient to let the welding of interface.

However, when the package cover is used for packaging the inside of the package body, the package cover is used for sealing the package body by adopting a welding or bonding method by using bonding glue, the chip inside is inevitably failed after long-term use and needs to be maintained, and the package cover fixed by adopting the welding or bonding method by using the bonding glue causes the problem that the maintenance of internal elements is very inconvenient.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Not enough to prior art, the utility model provides an integrated circuit SIP packaging structure solves above-mentioned problem.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an integrated circuit SIP packaging structure, including the encapsulation body, there is the base plate inside the encapsulation body through two rectangle bracing piece fixed mounting, the inside fixed mounting of base plate has the chip, the outer wall fixed mounting of base plate has two line section of thick bamboo, the inside of encapsulation body is provided with the encapsulation lid that can dismantle, the outer wall fixed mounting of encapsulation lid has sealed the pad, the inner wall fixed mounting of encapsulation body has four card framves, two draw-in grooves have been seted up to the outer wall of encapsulation body, the inside of draw-in groove is provided with can pivoted connecting axle, the outer wall fixed mounting of connecting axle has the extrusion piece, two fixed slots have been seted up to the bottom of encapsulation lid, the inside fixed mounting of fixed slot has fixed nest block, the spring has been cup jointed to the outer wall of fixed nest block, the outer wall fixed mounting of fixed nest block has can gliding connecting nest frame, the outer wall fixed mounting of connecting nest frame has the spacing fixture block that can be in the same place with the draw-in groove joint.

Preferably, the cross section of the limiting clamping block is U-shaped.

Preferably, four elastic clamping blocks which can be clamped with the clamping frame are fixedly installed at the bottom of the packaging cover.

Preferably, the elastic fixture block is formed by combining a cylindrical short rod and two hemispherical blocks, and the outer diameter of the cylindrical short rod in the elastic fixture block is three quarters of the outer diameter of the hemispherical block.

Preferably, the outer wall of the limiting clamping block is fixedly provided with two elastic pressure pads, and the cross section of each pressure pad is triangular.

(III) advantageous effects

Compared with the prior art, the utility model provides an integrated circuit SIP packaging structure possesses following beneficial effect:

1. when the packaging body is packaged by using the packaging cover, the packaging cover is pressed towards the inside of the packaging body, in the process of pressing the packaging cover downwards, a limiting clamping block which can slide in the fixing groove slides towards the inside of the fixing groove under the extrusion of the inner wall of the packaging body, at the moment, a spring sleeved on the outer wall of the fixing sleeve block is compressed, when the packaging cover is pressed to the position of the limiting clamping block and the position of the clamping groove, the elastic force of the spring drives a connecting sleeve frame to slide towards the outer side direction of the fixing groove to the position of the limiting clamping block clamped in the clamping groove, at the moment, a sealing gasket on the outer wall of the packaging cover and the inner wall of the packaging body are pressed together to achieve a certain sealing effect, when elements in the packaging body need to be overhauled, a connecting shaft which can rotate in the clamping groove is stirred, an extruding block on the outer wall of the connecting shaft rotates, and the extruding block is of an arc-shaped structure, can extrude the spacing fixture block of card in the draw-in groove inside at extrusion piece pivoted in-process, spacing fixture block receives the extrusion of extrusion piece to the inside of sliding of fixed slot to breaking away from the draw-in groove, and the pulling encapsulation lid is in order to dismantle the encapsulation lid this moment to be convenient for carry out the dismouting so that overhaul the inside component of encapsulation body to the encapsulation lid.

2. This integrated circuit SIP packaging structure, through when pressing the encapsulation lid downwards, four elasticity fixture blocks of encapsulation lid bottom move down to the position that elasticity fixture block reachd the card frame along with the encapsulation lid, the elasticity fixture block is formed by a cylindrical quarter butt and two hemisphere piece combinations, the elasticity fixture block has certain elasticity, the inside that the card frame was advanced to the elasticity fixture block card is deformed to the elasticity fixture block this moment under the exogenic action to elasticity fixture block this moment, the outside diameter of the cylindrical quarter butt in the elasticity fixture block is three fourths of the outside diameter of hemisphere piece, play certain fixed anti-shake effect when the elasticity fixture block card advances the card frame inside can play secondary limiting displacement.

3. This integrated circuit SIP packaging structure, through when spacing fixture block slides to spacing fixture block card inside the draw-in groove outside the fixed slot under the elasticity of spring, have elastic spacing fixture block itself this moment and can produce certain deformation, elastic pressure pad produces deformation and with the mutual pressfitting of the inner wall of draw-in groove under the extrusion of draw-in groove inner wall simultaneously, the cross section of pressure pad is triangle-shaped can be convenient for the inside that the pressure pad slided into the draw-in groove, thereby utilize the pressure pad to play certain fixed action to spacing fixture block and avoid external dust to get into the inside of encapsulating the body through the draw-in groove.

Drawings

Fig. 1 is a schematic perspective view of an embodiment of the present invention;

fig. 2 is a schematic view of a three-dimensional split according to an embodiment of the present invention;

FIG. 3 is a partial schematic view of A in FIG. 2;

FIG. 4 is a partial perspective view of an embodiment of the present invention;

FIG. 5 is a schematic perspective view of a half-section of an embodiment of the present invention;

FIG. 6 is a partial schematic view of B of FIG. 5;

fig. 7 is a schematic three-dimensional view of the embodiment of the present invention.

In the figure: 1. a package body; 2. a package cover; 3. a substrate; 4. a chip; 5. a bobbin; 6. a card slot; 7. a connecting shaft; 8. a clamping frame; 9. extruding the block; 10. an elastic clamping block; 11. fixing grooves; 12. fixing the sleeve block; 13. a spring; 14. connecting a sleeve frame; 15. a limiting clamping block; 16. a pressure pad; 17. and a gasket.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The first embodiment is as follows: referring to fig. 1-6, an integrated circuit SIP package structure includes a package body 1, a substrate 3 is fixedly mounted inside the package body 1 through two rectangular support rods, a chip 4 is fixedly mounted inside the substrate 3, two wire drums 5 are fixedly mounted on an outer wall of the substrate 3, a detachable package cover 2 is disposed inside the package body 1, the package cover 2 is rectangular, a sealing gasket 17 is fixedly mounted on an outer wall of the package cover 2, the sealing gasket 17 is rectangular ring-shaped, the sealing gasket 17 is made of elastic rubber, outer walls of the sealing gasket 17 and an inner wall of the package body 1 are pressed together, four clamping frames 8 are fixedly mounted on an inner wall of the package body 1, two clamping grooves 6 are formed on an outer wall of the package body 1, the clamping grooves 6 are rectangular through holes, a rotatable connecting shaft 7 is disposed inside the clamping grooves 6, and the connecting shaft 7 is cylindrical, the outer wall of the connecting shaft 7 is fixedly provided with a rectangular block convenient for shifting, the outer wall of the connecting shaft 7 is fixedly provided with an extrusion block 9, the extrusion block 9 is of an arc structure, the bottom of the encapsulation cover 2 is provided with two fixing grooves 11, the fixing grooves 11 are arc grooves, the inside of the fixing grooves 11 is fixedly provided with a fixing sleeve block 12, the fixing sleeve block 12 is formed by welding a cylindrical rod and two cylindrical blocks, the outer walls of the two cylindrical blocks in the fixing sleeve block 12 are fixedly connected with the inner wall of the fixing grooves 11, the outer wall of the fixing sleeve block 12 is sleeved with a spring 13, one end of the spring 13 is fixedly connected with the outer wall of one cylindrical block in the fixing sleeve block 12, the outer wall of the fixing sleeve block 12 is sleeved with a connecting sleeve frame 14 capable of sliding, the connecting sleeve frame 14 is formed by welding two rectangular rods and a circular ring, the outer wall of the connecting sleeve frame 14 is fixedly connected with one end of the spring 13, two arc-shaped sliding grooves which can be connected with the connecting sleeve frame 14 in a clamped mode are formed in the inner wall of the fixing groove 11, a limiting clamping block 15 which can be connected with the clamping groove 6 in a clamped mode is fixedly installed on the outer wall of the connecting sleeve frame 14, the cross section of the limiting clamping block 15 is U-shaped, and the limiting clamping block 15 has certain elasticity.

The working principle is as follows: when the packaging body 1 is packaged by using the packaging cover 2, the packaging cover 2 is pressed towards the inside of the packaging body 1, in the process of pressing the packaging cover 2 downwards, the limiting clamping block 15 which can slide in the fixing groove 11 is extruded by the inner wall of the packaging body 1 to slide towards the inside of the fixing groove 11, at the moment, the spring 13 sleeved on the outer wall of the fixing sleeve block 12 is compressed, when the packaging cover 2 is pressed to the position of the limiting clamping block 15 and the position of the clamping groove 6 correspond to each other, the elastic force of the spring 13 drives the connecting sleeve frame 14 to slide towards the outer side direction of the fixing groove 11 until the limiting clamping block 15 is clamped into the clamping groove 6, at the moment, the sealing gasket 17 on the outer wall of the packaging cover 2 and the inner wall of the packaging body 1 are pressed together to achieve a certain sealing effect, when elements in the packaging body 1 need to be overhauled, the connecting shaft 7 which can rotate in the clamping groove 6 is stirred, and the extruding block 9 on the outer wall of the connecting shaft 7 rotates, extrusion piece 9 is the arc structure, can extrude the spacing fixture block 15 of card in draw-in groove 6 inside at extrusion piece 9 pivoted in-process, and spacing fixture block 15 receives extrusion piece 9's extrusion to the inside of 11 inside slides of fixed slots to breaking away from draw-in groove 6, and the pulling encapsulation lid 2 is in order to dismantle encapsulation lid 2 this moment to be convenient for carry out the dismouting so that overhaul the component of 1 inside of encapsulation body to encapsulation lid 2.

Example two: on the basis of the first embodiment, as shown in fig. 5, four elastic clamping blocks 10 capable of being clamped with the clamping frame 8 are fixedly installed at the bottom of the packaging cover 2, each elastic clamping block 10 is formed by combining a cylindrical short rod and two hemispherical blocks, the outer diameter of the cylindrical short rod in each elastic clamping block 10 is three quarters of the outer diameter of the hemispherical block, each elastic clamping block 10 has certain elasticity, and each elastic clamping block 10 is made of elastic rubber.

The working principle is as follows: when pressing encapsulation lid 2 downwards, four elasticity fixture blocks 10 of encapsulation lid 2 bottom move down to the position that elasticity fixture block 10 reachd card frame 8 along with encapsulation lid 2, elasticity fixture block 10 is formed by a cylindrical quarter butt and two hemisphere piece combinations, elasticity fixture block 10 has certain elasticity, elasticity fixture block 10 is deformed this moment under the exogenic action and is advanced the inside that card frame 8 was advanced to elasticity fixture block 10 card, the outside diameter of the cylindrical quarter butt in the elasticity fixture block 10 is three quarters of the outside diameter of hemisphere piece, play certain fixed anti-shake effect when elasticity fixture block 10 card advances inside the card frame 8 and can play secondary limiting displacement.

Example three: on the basis of the first embodiment, as shown in fig. 7, two elastic pressure pads 16 are fixedly installed on the outer wall of the limiting fixture block 15, the cross section of each pressure pad 16 is triangular, and each pressure pad 16 is made of elastic rubber.

The working principle is as follows: when spacing fixture block 15 slides to spacing fixture block 15 card in the inside of draw-in groove 6 outside fixed slot 11 under spring 13's elasticity, it can produce certain deformation to have elastic spacing fixture block 15 itself this moment, it produces deformation and pressfitting each other with the inner wall of draw-in groove 6 to have elastic pressure pad 16 simultaneously under the extrusion of draw-in groove 6 inner wall, the cross section of pressure pad 16 is triangle-shaped can be convenient for pressure pad 16 slides in the inside of draw-in groove 6, thereby utilize pressure pad 16 to avoid external dust to pass through draw-in groove 6 to get into the inside of encapsulation body 1 when playing certain fixed action to spacing fixture block 15.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an integrated circuit SIP packaging structure, includes packaging body (1), there are base plate (3) inside packaging body (1) through two rectangle bracing piece fixed mounting, and the inside fixed mounting of base plate (3) has chip (4), and the outer wall fixed mounting of base plate (3) has two line section of thick bamboo (5), and the inside of packaging body (1) is provided with encapsulation lid (2) that can dismantle, its characterized in that: the outer wall fixed mounting of encapsulation lid (2) has sealed pad (17), the inner wall fixed mounting of encapsulation body (1) has four card framves (8), two draw-in grooves (6) have been seted up to the outer wall of encapsulation body (1), the inside of draw-in groove (6) is provided with can pivoted connecting axle (7), the outer wall fixed mounting of connecting axle (7) has extrusion piece (9), two fixed slots (11) have been seted up to the bottom of encapsulation lid (2), the inside fixed mounting of fixed nest of blocks (11) has fixed nest of blocks (12), spring (13) have been cup jointed to the outer wall of fixed nest of blocks (12), the outer wall of fixed nest of blocks (12) has cup jointed connecting sleeve frame (14) that can slide, the outer wall fixed mounting of connecting sleeve frame (14) has spacing fixture block (15) that can be in the same place with draw-in groove (6) joint.

2. The integrated circuit SIP package structure of claim 1, wherein: the cross section of the limiting clamping block (15) is U-shaped.

3. The integrated circuit SIP package structure of claim 1, wherein: the bottom of the packaging cover (2) is fixedly provided with four elastic clamping blocks (10) which can be clamped with the clamping frame (8).

4. The integrated circuit SIP package structure of claim 3, wherein: the elastic fixture block (10) is formed by combining a cylindrical short rod and two hemispherical blocks, and the outer diameter of the cylindrical short rod in the elastic fixture block (10) is three quarters of the outer diameter of the hemispherical blocks.

5. The integrated circuit SIP package structure of claim 1, wherein: two elastic pressure pads (16) are fixedly mounted on the outer wall of the limiting clamping block (15), and the cross section of each pressure pad (16) is triangular.