CN219107987U

CN219107987U - Circuit board packaging structure

Info

Publication number: CN219107987U
Application number: CN202223165902.XU
Authority: CN
Inventors: 王新柱
Original assignee: Dalian Youhe Electronic Technology Co ltd
Current assignee: Dalian Youhe Electronic Technology Co ltd
Priority date: 2022-11-29
Filing date: 2022-11-29
Publication date: 2023-05-30
Anticipated expiration: 2032-11-29

Abstract

The utility model discloses a circuit board packaging structure which comprises a lower shell, an upper shell, a packaging assembly and a heat dissipation assembly, wherein the lower shell is made of insulating materials, the upper shell is arranged above the lower shell, and the packaging assembly is arranged between the upper shell and the lower shell. According to the utility model, the packaging assembly is arranged, the clamping strip can clamp the circuit board main body under the action of the first telescopic rod and the third spring, the limiting pin is inserted in the position of the limiting groove, the limiting block slides along the slope in the inserting process, the first spring is in a compressed state, and when the limiting block reaches the position of the limiting cavity, the limiting block springs into the limiting cavity, so that the upper shell and the lower shell are fixedly installed, the circuit board main body is packaged, when the circuit board main body needs to be disassembled, the limiting block can be extruded out of the limiting cavity by the extruding rod only by pressing the main extruding rod, the upper shell can be disassembled, and the extruding rod is reset after the disassembly is completed under the action of the second spring, so that the circuit board main body is convenient to use next time.

Description

Circuit board packaging structure

Technical Field

The utility model relates to the technical field related to circuit boards, in particular to a circuit board packaging structure.

Background

With the development of digitization, networking and intellectualization, the core industries of integrated circuits, software, new components and parts and the like are rapidly developed, and circuit boards are widely used, and the circuit boards need to be packaged in the production and processing processes, and the packaging is the process of assembling the integrated circuits into chip end products, so that a circuit board packaging structure is needed for completing the packaging.

The prior art has the following defects: most of the existing packaging structures adopt the modes of bolts and the like for fixing and packaging, when the existing packaging structures are installed or detached, the existing packaging structures are complicated, the bolts are required to be rotated and the strength is required to be controlled to a certain extent, the packaging structures are inconvenient to disassemble and assemble, and after the existing packaging structures are packaged, the circuit board is attached to the packaging structures, so that the heat dissipation effect of the circuit board is affected;

in the prior art, the 'circuit board packaging structure' with the publication number of CN208724254U is characterized in that the frame body and the circuit board main body are connected and fixed by using the fixing bolts, so that the disassembly and the assembly are inconvenient, and the heat dissipation effect of the circuit board is affected.

Disclosure of Invention

The present utility model is directed to a circuit board packaging structure, which solves the above-mentioned problems in the prior art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a circuit board packaging structure, includes casing, last casing, encapsulation subassembly and radiator unit down, the casing is made by insulating material down, go up the casing and install in lower casing top, the encapsulation subassembly is installed between last casing and lower casing, radiator unit installs between last casing and lower casing and is located encapsulation subassembly one side.

As the further preferred of this technical scheme, encapsulation subassembly includes two sets of spacing grooves, spacer pin, two sets of fixed plates, a spring, stopper, spacing chamber, extrusion portion and clamping portion, two sets of the spacing groove is seted up on lower casing top surface, the spacer pin is installed in last casing bottom, two sets of the fixed plate is installed in last casing bottom, a spring is installed in fixed plate one side, the stopper is installed in a spring one side, the inner wall of the lower casing is seted up in spacing chamber, extrusion portion installs in spacing intracavity, clamping portion installs in the inferior valve.

As the further preferred of this technical scheme, extrusion portion includes extrusion pole, push pedal and multiunit No. two springs, the extrusion pole wears to establish slidable mounting in lower casing both sides, the push pedal is installed in extrusion pole one end and is located spacing intracavity, multiunit No. two springs are installed respectively between extrusion pole and lower casing lateral wall, between push pedal and the spacing intracavity wall.

As a further preferable mode of the technical scheme, the clamping part comprises a plurality of groups of first telescopic rods, a plurality of groups of third springs and clamping strips, the plurality of groups of first telescopic rods are arranged on the inner wall of the lower shell, the plurality of groups of third springs are sleeved outside the first telescopic rods, and the clamping strips are arranged at one end of the first telescopic rods.

As a further preferable mode of the technical scheme, the limiting pin and the limiting groove are correspondingly arranged, the top end of the inner wall of the lower shell is obliquely arranged, and the extrusion rod is of a T-shaped structure.

As a further preferable mode of the technical scheme, the heat dissipation assembly comprises a plurality of groups of heat dissipation holes, a plurality of groups of support pins, a plurality of groups of second telescopic rods, a fourth spring and a circuit board main body, wherein a plurality of groups of heat dissipation holes are formed in the surfaces of the upper shell and the lower shell, a plurality of groups of support pins are arranged at the inner bottom end of the lower shell, a plurality of groups of second telescopic rods are arranged at the inner bottom end of the upper shell, the fourth spring is sleeved outside the second telescopic rods, and the circuit board main body is arranged between the support pins and the second telescopic rods.

As a further preferable mode of the technical scheme, the rubber insulation sleeve is sleeved at the top end of the supporting pin, and the electrostatic protection plate is arranged at one end of the second telescopic rod.

The utility model provides a circuit board packaging structure, which has the following beneficial effects:

(1) According to the utility model, the circuit board main body is placed above the supporting pin through the packaging component, the clamping strip can clamp the circuit board main body under the action of the first telescopic rod and the third spring, then the limiting pin is inserted in the position of the limiting groove, the limiting block slides along the slope in the inserting process, the first spring is in a compressed state, and when the first spring reaches the position of the limiting cavity, the limiting block can be sprung into the limiting cavity under the action of the first spring, so that the upper shell and the lower shell are mounted and fixed, the packaging of the circuit board main body is realized, when the circuit board main body needs to be disassembled, the limiting block can be extruded out of the limiting cavity by the extruding rod, the upper shell can be disassembled by the extruding rod, and the extruding rod is reset after the disassembly is completed under the action of the second spring, so that the circuit board main body is convenient to use next time.

(2) According to the utility model, the heat dissipation assembly is arranged, the supporting pin can be used for supporting the circuit board main body and reducing the contact area between the circuit board main body and the lower shell, the second telescopic rod and the fourth spring can be used for clamping the circuit board main body and reducing the contact area between the circuit board main body and the upper shell, and the heat dissipation of the circuit board main body is ensured under the cooperation of the heat dissipation holes, so that a good heat dissipation effect is realized.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic diagram of a package structure according to the present utility model;

FIG. 3 is a schematic view of a clamping portion according to the present utility model;

fig. 4 is a schematic structural diagram of a heat dissipating assembly according to the present utility model.

In the figure: 1. a lower housing; 2. an upper housing; 3. packaging the assembly; 4. a heat dissipation assembly; 5. a limit groove; 6. a limiting pin; 7. a fixing plate; 8. a first spring; 9. a limiting block; 10. a spacing cavity; 11. an extrusion part; 12. a clamping part; 13. an extrusion rod; 14. a push plate; 15. a second spring; 16. a first telescopic rod; 17. a third spring; 18. clamping strips; 19. a heat radiation hole; 20. a support pin; 21. a second telescopic rod; 22. a spring IV; 23. a circuit board body.

Detailed Description

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.

The utility model provides the technical scheme that: as shown in fig. 2 and 3, in the present embodiment, a circuit board packaging structure includes a lower case 1, an upper case 2, a packaging component 3, and a heat dissipating component 4, the lower case 1 is made of an insulating material, the upper case 2 is installed above the lower case 1, the packaging component 3 is installed between the upper case 2 and the lower case 1, the heat dissipating component 4 is installed between the upper case 2 and the lower case 1 and is located at one side of the packaging component 3, the packaging component 3 includes two sets of limiting grooves 5, limiting pins 6, two sets of fixing plates 7, a first spring 8, a limiting block 9, a limiting cavity 10, a pressing portion 11, and a clamping portion 12, the two sets of limiting grooves 5 are opened at a top end surface of the lower case 1, the limiting pins 6 are installed at a bottom end of the upper case 2, the two sets of fixing plates 7 are installed at a bottom end of the upper case 2, the first spring 8 is installed at one side of the fixing plates 7, the limiting block 9 is arranged at one side of the first spring 8, the limiting cavity 10 is arranged on the inner wall of the lower shell 1, the extruding part 11 is arranged in the limiting cavity 10, the clamping part 12 is arranged in the lower shell 1, the extruding part 11 comprises an extruding rod 13, a push plate 14 and a plurality of groups of second springs 15, the extruding rod 13 penetrates through and is arranged at two sides of the lower shell 1 in a sliding manner, the push plate 14 is arranged at one end of the extruding rod 13 and is positioned in the limiting cavity 10, a plurality of groups of second springs 15 are respectively arranged between the extruding rod 13 and the side wall of the lower shell 1 and between the push plate 14 and the inner wall of the limiting cavity 10, the clamping part 12 comprises a plurality of groups of first telescopic rods 16, a plurality of groups of third springs 17 and clamping strips 18, a plurality of groups of first telescopic rods 16 are arranged on the inner wall of the lower shell 1, a plurality of groups of third springs 17 are sleeved and are arranged outside the first telescopic rods 16, the clamping strips 18 are arranged at one end of the first telescopic rods 16, the limiting pin 6 is arranged corresponding to the limiting groove 5, the top end of the inner wall of the lower shell 1 is obliquely arranged, the extruding rod 13 is of a T-shaped structure, the circuit board main body 23 is placed above the supporting pin 20, the clamping strip 18 can clamp the circuit board main body 23 under the action of the first telescopic rod 16 and the third spring 17, then the limiting pin 6 is aligned to the position of the limiting groove 5, the limiting block 9 slides along a slope in the inserting process, the first spring 8 is in a compressed state, when the limiting block 9 reaches the position of the limiting cavity 10, the limiting block 9 can be sprung into the limiting cavity 10 under the action of the first spring 8, so that the upper shell 2 and the lower shell 1 are installed and fixed, when the upper shell 2 needs to be disassembled, the limiting block 9 can be extruded out of the limiting cavity 10 only by pressing the main extruding rod 13, the upper shell 2 can be disassembled under the action of the second spring 15, and the extruding rod 13 is reset after the disassembly is completed, and the next use is convenient.

As shown in fig. 1 and fig. 4, the heat dissipation assembly 4 includes a plurality of groups of heat dissipation holes 19, a plurality of groups of support pins 20, a plurality of groups of second telescopic rods 21, a fourth spring 22 and a circuit board main body 23, a plurality of groups of heat dissipation holes 19 are formed on the surfaces of the upper casing 2 and the lower casing 1, a plurality of groups of support pins 20 are mounted at the bottom end in the lower casing 1, a plurality of groups of second telescopic rods 21 are mounted at the bottom end in the upper casing 2, a fourth spring 22 is sleeved outside the second telescopic rods 21, the circuit board main body 23 is mounted between the support pins 20 and the second telescopic rods 21, a rubber insulation sleeve is sleeved at the top ends of the support pins 20, an electrostatic protection plate is mounted at one end of the second telescopic rods 21, the circuit board main body 23 can be supported by the support pins 20, the contact area between the circuit board main body 23 and the lower casing 1 is reduced, the circuit board main body 23 can be clamped by the second telescopic rods 21 and the fourth spring 22, the contact area between the circuit board main body 23 and the upper casing 2 is reduced, and good heat dissipation effect of the circuit board main body 23 is ensured under the cooperation of the holes 19.

The utility model provides a circuit board packaging structure, which has the following specific working principle:

the circuit board packaging structure is characterized in that the packaging assembly 3 is arranged, the circuit board main body 23 is placed above the supporting pin 20, the clamping strip 18 can clamp the circuit board main body 23 under the action of the first telescopic rod 16 and the third spring 17, then the limiting pin 6 is aligned to the position of the limiting groove 5 and inserted, the limiting block 9 slides along a slope in the inserting process, the first spring 8 is in a compressed state, when the position of the limiting cavity 10 is reached, the limiting block 9 can be sprung into the limiting cavity 10 under the action of the first spring 8, thereby the upper casing 2 and the lower casing 1 are fixed, the packaging of the circuit board main body 23 is realized, when the main extrusion rod 13 is needed to be disassembled, the limiting block 9 can be extruded out of the limiting cavity 10, the disassembly of the upper casing 2 can be completed, the post-disassembly extrusion rod 13 is reset under the action of the second spring 15, the next use is facilitated, the supporting pin 20 can be utilized to support the circuit board main body 23 and reduce the contact area between the circuit board main body 23 and the lower casing 1, the contact area between the second telescopic rod 21 and the fourth spring 23 can be reduced, and the heat dissipation area of the circuit board main body 23 can be well matched with the main body 23, and the heat dissipation area of the circuit board is reduced, and the contact area between the main body and the second casing 23 and the main body 23 is guaranteed.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a circuit board packaging structure, its characterized in that includes casing (1), last casing (2), encapsulation subassembly (3) and radiator unit (4) down, casing (1) are made by insulating material down, go up casing (2) and install in casing (1) top down, encapsulation subassembly (3) are installed between last casing (2) and casing (1) down, radiator unit (4) are installed between last casing (2) and casing (1) down and are located encapsulation subassembly (3) one side.

2. The circuit board packaging structure according to claim 1, wherein: the packaging assembly (3) comprises two groups of limiting grooves (5), limiting pins (6), two groups of fixing plates (7), a spring (8), limiting blocks (9), limiting cavities (10), extrusion parts (11) and clamping parts (12), wherein the two groups of limiting grooves (5) are formed in the top surface of the lower shell (1), the limiting pins (6) are arranged at the bottom end of the upper shell (2), the two groups of fixing plates (7) are arranged at the bottom end of the upper shell (2), the spring (8) is arranged on one side of the fixing plates (7), the limiting blocks (9) are arranged on one side of the spring (8), the limiting cavities (10) are formed in the inner wall of the lower shell (1), the extrusion parts (11) are arranged in the limiting cavities (10), and the clamping parts (12) are arranged in the lower shell (1).

3. The circuit board packaging structure according to claim 2, wherein: the extrusion part (11) comprises an extrusion rod (13), a push plate (14) and a plurality of groups of second springs (15), wherein the extrusion rod (13) is arranged on two sides of the lower shell (1) in a penetrating mode in a sliding mode, the push plate (14) is arranged at one end of the extrusion rod (13) and located in the limiting cavity (10), and the plurality of groups of second springs (15) are respectively arranged between the extrusion rod (13) and the side wall of the lower shell (1) and between the push plate (14) and the inner wall of the limiting cavity (10).

4. The circuit board packaging structure according to claim 2, wherein: the clamping part (12) comprises a plurality of groups of first telescopic rods (16), a plurality of groups of third springs (17) and clamping strips (18), wherein a plurality of groups of first telescopic rods (16) are arranged on the inner wall of the lower shell (1), a plurality of groups of third springs (17) are sleeved and arranged outside the first telescopic rods (16), and the clamping strips (18) are arranged at one end of the first telescopic rods (16).

5. A circuit board package structure according to claim 3, wherein: the limiting pin (6) is arranged corresponding to the limiting groove (5), the top end of the inner wall of the lower shell (1) is obliquely arranged, and the extrusion rod (13) is of a T-shaped structure.

6. The circuit board packaging structure according to claim 1, wherein: the heat dissipation assembly (4) comprises a plurality of groups of heat dissipation holes (19), a plurality of groups of support pins (20), a plurality of groups of No. two telescopic rods (21), a No. four spring (22) and a circuit board main body (23), wherein the plurality of groups of heat dissipation holes (19) are formed in the surfaces of the upper shell (2) and the lower shell (1), the plurality of groups of support pins (20) are arranged at the inner bottom end of the lower shell (1), the No. two telescopic rods (21) are arranged at the inner bottom end of the upper shell (2), the No. four spring (22) is sleeved and arranged outside the No. two telescopic rods (21), and the circuit board main body (23) is arranged between the support pins (20) and the No. two telescopic rods (21).

7. The circuit board packaging structure according to claim 6, wherein: the top of the supporting pin (20) is sleeved with a rubber insulating sleeve, and one end of the second telescopic rod (21) is provided with an electrostatic protection plate.