CN219876327U - PCB shaping jig - Google Patents
PCB shaping jig Download PDFInfo
- Publication number
- CN219876327U CN219876327U CN202223422792.0U CN202223422792U CN219876327U CN 219876327 U CN219876327 U CN 219876327U CN 202223422792 U CN202223422792 U CN 202223422792U CN 219876327 U CN219876327 U CN 219876327U
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- Prior art keywords
- heat dissipation
- pressing plate
- pcb
- fixing
- groove
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- 238000007493 shaping process Methods 0.000 title claims abstract description 25
- 230000017525 heat dissipation Effects 0.000 claims abstract description 78
- 238000000034 method Methods 0.000 abstract description 10
- 238000010438 heat treatment Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 7
- 238000004806 packaging method and process Methods 0.000 description 37
- 239000000758 substrate Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 239000011324 bead Substances 0.000 description 6
- 239000003292 glue Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a PCB shaping jig, which comprises a first pressing plate and a second pressing plate; the first pressing plate is provided with a protruding part protruding towards the arc-shaped surface of the second pressing plate, the second pressing plate is provided with a concave part matched with the protruding part, and a containing space for containing the PCB to be leveled is formed between the protruding part and the concave part; the back side of the protruding portion is provided with a first heat dissipation groove, and the back side of the recessed portion is provided with a second heat dissipation groove. Compared with the prior art, the PCB shaping jig is provided with the protruding part and the recessed part, and the PCB is reversely bent through the protruding part and the recessed part, so that the leveling effect of the PCB is improved; the first heat dissipation groove and the second heat dissipation groove are arranged, and the heating rate and the heat dissipation rate of the PCB in the leveling process are improved through the first heat dissipation groove and the second heat dissipation groove, so that the leveling efficiency of the PCB is improved.
Description
Technical Field
The utility model relates to the technical field of display, in particular to a PCB shaping jig.
Background
Mini LEDs are LED chips with the size of 100 mu m, and the size is between a small-pitch LED and a Micro LED, so that the small-pitch LED is further refined. The Mini LED has the advantages of high corresponding speed, low power consumption, long service life and the like, is an important development direction in the field of display screens, and can be widely applied to various displays. The packaging mode of the Mini LED comprises SMD packaging, IMD packaging and the like, wherein the SMD packaging is to take each lamp bead as a packaging unit, and the IMD packaging is to take a plurality of lamp beads as a packaging unit, so that in each IMD packaging unit, the lamp beads can share pins, the total number of the pins is reduced, the structure of a circuit is simplified, and the cost and the difficulty for packaging the IMD packaging unit to a PCB substrate are reduced.
In the process of packaging the IMD packaging unit of the Mini LED on the PCB substrate, the IMD packaging unit is required to be welded on the PCB substrate, the surface of the PCB substrate is provided with packaging glue for reinforcing the IMD packaging unit, the shrinkage rate of the packaging glue is inconsistent with that of the PCB substrate, the PCB subjected to plastic packaging is deformed, the deformed PCB has great influence on subsequent product processing, and meanwhile, the product quality in the subsequent processing process is seriously influenced.
Disclosure of Invention
Based on the above, the utility model aims to provide a PCB shaping jig so as to enable a packaged PCB substrate to be restored to be flat.
The PCB shaping jig comprises a first pressing plate and a second pressing plate; the first pressing plate is provided with a protruding part protruding towards the arc-shaped surface of the second pressing plate, the second pressing plate is provided with a concave part matched with the protruding part, and a containing space for containing the PCB to be leveled is formed between the protruding part and the concave part; the back side of the protruding portion is provided with a first heat dissipation groove, and the back side of the recessed portion is provided with a second heat dissipation groove.
Further, the first heat dissipation grooves comprise a plurality of first heat dissipation grooves, the bottom of each first heat dissipation groove is consistent with the radian of the surface of the corresponding protruding part, and the depth of the first heat dissipation groove corresponding to the highest position of the protruding part is larger than the depth of the first heat dissipation groove corresponding to two sides of the protruding part;
the second heat dissipation grooves comprise a plurality of second heat dissipation grooves, the bottom of each second heat dissipation groove is consistent with the surface radian of the corresponding concave part, and the depth of the second heat dissipation groove corresponding to the lowest position of the concave part is smaller than that of the second heat dissipation groove corresponding to the two side parts of the concave part.
Further, the edges of the first heat dissipation groove and the second heat dissipation groove are provided with round corners.
Further, the two ends of the first pressing plate are provided with first positioning parts, and the two ends of the second pressing plate are provided with second positioning parts matched with the first positioning parts.
Further, the device also comprises a bracket, wherein the bracket comprises a supporting rod and a fixing part, and the fixing part is arranged on the supporting rod; the fixing part comprises a plurality of fixing pieces connected with the supporting rods, the fixing pieces are distributed along the vertical direction, and mounting positions for mounting the combination body of the first pressing plate and the second pressing plate are formed between the adjacent fixing pieces.
Further, a first fixing groove is formed in one side of the first pressing plate where the first heat dissipation groove is located, the fixing piece is provided with a first clamping part, and the first clamping part is clamped into the first fixing groove;
the second pressing plate is provided with a second fixing groove at one side where the second heat dissipation groove is located, the fixing piece is further provided with a second clamping part, and the second clamping part is clamped into the second fixing groove.
Further, the fixing parts comprise two fixing parts which are respectively arranged on the supporting rods and are symmetrical along the supporting rods.
Further, the device further comprises a top plate and a side plate, wherein the top plate is arranged above the bracket, and the side plate is in butt joint with the end parts of the first pressing plate and the second pressing plate and is connected with the bottom plate and the top plate.
Further, a supporting bar is arranged on the side plate, and the lower part of the end part of the second pressing plate is in butt joint with the supporting bar.
Further, the top plate and the side plates are respectively provided with a heat dissipation hole.
Compared with the prior art, the utility model has the following beneficial effects:
1. the protruding part and the concave part are arranged, and the PCB is reversely bent through the protruding part and the concave part, so that the leveling effect of the PCB is improved;
2. the first heat dissipation groove and the second heat dissipation groove are arranged, and the heating rate and the heat dissipation rate of the PCB in the leveling process are improved through the first heat dissipation groove and the second heat dissipation groove, so that the leveling efficiency of the PCB is improved;
3. the depth of the first heat dissipation groove corresponding to the highest position of the protruding part is larger than that of the first heat dissipation groove of the groove corresponding to the two sides of the protruding part, and the depth of the second heat dissipation groove corresponding to the lowest position of the recessed part is smaller than that of the second heat dissipation groove corresponding to the two side parts of the recessed part, so that a temperature gradient is formed, the stress of the PCB is released better, and the leveling effect on the PCB is further improved.
Drawings
Fig. 1 is a schematic diagram of a combined structure of a first pressing plate and a second pressing plate of a PCB board shaping jig according to an embodiment of the present utility model;
fig. 2 is a schematic diagram of a first pressing plate of a PCB shaping jig according to an embodiment of the utility model;
fig. 3 is a schematic diagram of a first pressing plate of a PCB shaping jig according to an embodiment of the utility model;
fig. 4 is a schematic diagram of a second pressing plate of the PCB shaping jig according to an embodiment of the utility model;
fig. 5 is a schematic diagram of a second pressing plate of the PCB shaping jig according to an embodiment of the utility model;
FIG. 6 is a cross-sectional view taken along the direction A-A in FIG. 1;
fig. 7 is a schematic structural diagram of a supporting unit of a PCB board shaping jig according to an embodiment of the utility model;
fig. 8 is a schematic structural diagram of a PCB shaping jig according to an embodiment of the present utility model;
fig. 9 is a schematic structural diagram of a PCB shaping jig according to an embodiment of the present utility model.
In the figure: 10. a first platen; 11. a first cambered surface; 12. a first heat sink; 13. a first positioning portion; 14. a first fixing groove; 20. a second pressing plate; 21. a second cambered surface; 22. a second heat sink; 23. a second positioning portion; 24. a second fixing groove; 30. a supporting unit; 31. a bottom plate; 321. a support rod; 322. a fixing part; 33. a top plate; 34. a side plate; 341. and (5) supporting bars.
Detailed Description
The following are specific embodiments of the present utility model, and the technical solutions of the present utility model will be further described with reference to the accompanying drawings, but the present utility model is not limited to these embodiments.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Mini LEDs are LED chips with the size of 100 mu m, and the size is between a small-pitch LED and a Micro LED, so that the small-pitch LED is further refined. The Mini LED has the advantages of high corresponding speed, low power consumption, long service life and the like, is an important development direction in the field of display screens, and can be widely applied to various displays. The packaging mode of the Mini LED comprises SMD packaging, IMD packaging and the like, wherein the SMD packaging is to take each lamp bead as a packaging unit, and the IMD packaging is to take a plurality of lamp beads as a packaging unit, so that in each IMD packaging unit, the lamp beads can share pins, the total number of the pins is reduced, the structure of a circuit is simplified, and the cost and the difficulty for packaging the IMD packaging unit to a PCB substrate are reduced.
In the process of packaging the IMD packaging unit of the Mini LED on the PCB substrate, the IMD packaging unit is required to be welded on the PCB substrate, the surface of the PCB substrate is provided with packaging glue for reinforcing the IMD packaging unit, the shrinkage rate of the packaging glue is inconsistent with that of the PCB substrate, the PCB subjected to plastic packaging is deformed, the deformed PCB has great influence on subsequent product processing, and meanwhile, the product quality in the subsequent processing process is seriously influenced.
In order to solve the above technical problems, the present utility model provides a PCB shaping jig, as shown in fig. 1-5, which includes a first pressing plate 10 and a second pressing plate 20. The first pressing plate 10 is provided with a protruding part 11 protruding towards the second pressing plate 20 in an arc shape, the second pressing plate 20 is provided with a concave part 21 matched with the protruding part 11, and a containing space for containing the PCB to be leveled is formed between the protruding part 11 and the concave part 21; the back side of the protruding portion 11 is provided with a first heat dissipation groove 12, and the back side of the recessed portion 21 is provided with a second heat dissipation groove 22.
The process of leveling the PCB packaged by the IMD by using the PCB leveling jig is as follows:
firstly, arranging a PCB to be leveled in a containing space formed between a protruding part 11 of a first pressing plate 10 and a recessed part 21 of a second pressing plate 20, enabling an original protruding surface of the PCB to be leveled to be abutted against the protruding part 11, enabling an original recessed surface to be abutted against the recessed part 21, and reversely bending the PCB;
then, the combination of the first pressing plate 10 and the second pressing plate 20 provided with the PCB is put into heating equipment, the temperature is raised to 150 ℃, the combination is kept for a period of time at 150 ℃, and molecules of the packaging adhesive on the PCB are rearranged at high temperature, so that the packaging adhesive is stretched;
finally, the heating is stopped, the PCB is cooled, and the PCB is taken out from between the upper pressing plate 10 and the lower pressing plate 20 after the cooling is finished, so that the flat PCB can be obtained.
The protruding part 11 and the concave part 21 bend the PCB reversely, and the package glue is applied with a pulling force through bending, so that the leveling effect is improved; the first heat dissipation groove 12 and the second heat dissipation groove 22 improve the heat transfer rate of the first pressing plate 10 and the second pressing plate 20, can transfer heat to the PCB faster in the heating process, and can cool the PCB faster in the cooling process, thereby saving the leveling time of the PCB and improving the leveling efficiency of the PCB.
In order to form a temperature gradient, thereby better releasing the stress of the encapsulation adhesive to obtain a better leveling effect, in a preferred embodiment, as shown in fig. 6, the first heat dissipation grooves 12 include a plurality of first heat dissipation grooves 12, the bottom of each first heat dissipation groove 12 conforms to the radian of the surface of its corresponding protrusion 11, and the depth of the first heat dissipation groove 12 corresponding to the highest position of the protrusion 11 is greater than the depth of the first heat dissipation groove 12 corresponding to both sides of the protrusion 11; the second heat dissipation grooves 22 also include a plurality of second heat dissipation grooves 22, the bottom of each second heat dissipation groove 22 is in accordance with the surface radian of its corresponding recess 21, and the depth of the second heat dissipation groove 22 corresponding to the lowest position of the recess 21 is smaller than the depth of the second heat dissipation groove 22 corresponding to both side portions of the recess 21. The heat dissipation rates of the heat dissipation grooves with different depths are different, so that temperature gradients are formed on the surfaces of the two sides of the PCB, the heat dissipation rates of all areas on the PCB are different, and the stress of the packaging adhesive is better released. In a preferred embodiment, the height of the openings between the first heat sink grooves 12 are flush and the height of the openings between the second heat sink grooves 22 are flush.
The upper and lower platens 10 and 20 are used a plurality of times, thereby being subjected to a plurality of heating and cooling processes; in order to reduce the stress of the upper and lower platens 10 and 20 and to increase the service lives of the upper and lower platens 10 and 20, and also to prevent the edges of the first and second heat dissipation grooves 12 and 22 from injuring the operator, in a preferred embodiment, the edges of the first and second heat dissipation grooves 12 and 22 are each provided with rounded corners. In other alternative embodiments, chamfers may also be provided at the edges of the first and second heat sink 12, 22.
In order to enable the first and second pressing plates 10 and 20 to sufficiently press the PCB board, the first and second pressing plates 10 and 20 are prevented from being offset, in a preferred embodiment, as shown in fig. 3 and 5, the first and second pressing plates 10 and 20 are provided with first and second positioning portions at both ends thereof, and the relative positions between the protruding portions 11 and the recessed portions 21 are fixed by the first and second positioning portions, so that the first and second pressing plates 10 and 20 are prevented from being axially offset and sliding along the arc surfaces.
In a preferred embodiment, as shown in fig. 3, the first positioning part includes first positioning plates 13 provided at both end portions of the first pressing plate 10, and the height of the first positioning plates 13 is lower than the highest position of the protruding part 11; as shown in fig. 5, the second positioning part includes second positioning plates 23 provided at both end portions of the second pressing plate 20, and the second positioning plates 23 have a height higher than the lowest position of the recess part 21; thus, when the first platen 10 and the second platen 20 are combined, the first positioning plate 13 abuts against the corresponding second positioning plate 23, and both ends of the protruding portion 11 abut against the side portions of the second positioning plate 23, whereby the relative position between the first platen 10 and the second platen 20 is fixed.
In other alternative embodiments, pin holes may be provided on the first platen 10, pins corresponding to the pin holes on the first platen 10 may be provided on the second platen 20, and the relative positions between the first platen 10 and the second platen 20 may be fixed by the cooperation of the pin holes and the pins.
In order to enable the heating apparatus to accommodate more combinations of the first and second pressing plates 10 and 20 to improve the efficiency of leveling the PCB board, in a preferred embodiment, as shown in fig. 7 and 8, the heating apparatus further includes a bracket including a supporting portion 321 and a fixing portion, the fixing portion being disposed on the supporting bar 321; the fixing portion includes a plurality of fixing pieces 3221 connected to the support bar 321, each fixing piece 3221 is distributed in a vertical direction, and a mounting position for mounting the combination of the first and second pressing plates 10 and 20 is formed between adjacent fixing pieces 3221. In a preferred embodiment, to make the bracket 32 more stable, a bottom plate 31 is further included, and the support bar 321 of the bracket is disposed on the bottom plate 31.
In order to enable the combination of the first pressing plate 10 and the second pressing plate 20 to be more firmly arranged on the installation position and prevent the combination from falling from the installation position, in a preferred embodiment, the first pressing plate 10 is provided with a first fixing groove 14 on one side of the first heat dissipation groove 12, and the fixing piece 3221 is provided with a first clamping part which is clamped into the first fixing groove 14; the second pressing plate 20 is provided with a second fixing groove 24 at one side of the second heat dissipation groove 22; the fixing piece 3221 further has a second clamping portion, and the second clamping portion is clamped into the second fixing groove 24. In a specific embodiment, for each mount 3221, the first snap-fit portion is located below and the second snap-fit portion is located above, whereby the first platen 10 is located above the second platen 20 when the combination of the first platen 10 and the second platen 20 is mounted in place.
To accommodate more combinations of the first and second pressing plates 10 and 20 to improve the efficiency of the flattening of the PCB board, in a preferred embodiment, the fixing parts include two fixing parts respectively provided on the supporting bars 321 and symmetrical along the supporting bars 321; thus, both sides of the support bar 321 are provided with fixing portions, each of which includes a plurality of mounting positions for mounting the combination of the first and second pressing plates 10 and 20.
In order to improve the mounting stability of the combination of the first platen 10 and the second platen 20, in a preferred embodiment, as shown in fig. 9, a top plate 33 and a side plate 34 are further included, the top plate 33 is disposed above the bracket 32, and the side plate 34 abuts against the ends of the first platen 10 and the second platen 20 and is connected to the bottom plate 31 and the top plate 33. In an alternative embodiment, the top plate 33 is fixed to the bracket and the top plate 33 is fixed to the side plate 34 by pins; in other embodiments, the top plate 33 and the bracket, and the top plate 33 and the side plate 34 may be fixed by bolts.
To further improve the mounting stability of the combination of the first and second pressing plates 10 and 20, in a preferred embodiment, the side plates 34 are provided with supporting bars 341, and the lower part of the end of the second pressing plate 20 is abutted against the supporting bars 341; the supporting bars 341 provide supporting force to the first and second pressing plates 10 and 20 to reduce the load of the supporter 32.
In order to prevent the bottom plate 31, the top plate 33 and the side plates 34 from affecting the heat transfer of the first and second pressing plates 10 and 20, in a preferred embodiment, heat radiation holes are provided on the bottom plate 31, the top plate 33 and the side plates 34, respectively.
Compared with the prior art, the utility model has the following beneficial effects:
1. the protruding part and the concave part are arranged, and the PCB is reversely bent through the protruding part and the concave part, so that the leveling effect of the PCB is improved;
2. the first heat dissipation groove and the second heat dissipation groove are arranged, and the heating rate and the heat dissipation rate of the PCB in the leveling process are improved through the first heat dissipation groove and the second heat dissipation groove, so that the leveling efficiency of the PCB is improved;
3. the depth of the first heat dissipation groove corresponding to the highest position of the protruding part is larger than that of the first heat dissipation groove of the groove corresponding to the two sides of the protruding part, and the depth of the second heat dissipation groove corresponding to the lowest position of the recessed part is smaller than that of the second heat dissipation groove corresponding to the two side parts of the recessed part, so that a temperature gradient is formed, the stress of the PCB is released better, and the leveling effect on the PCB is further improved.
The foregoing examples illustrate only a few embodiments of the utility model and are described in detail herein without thereby limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model.
Claims (10)
1. PCB board plastic tool, its characterized in that:
comprises a first pressing plate (10) and a second pressing plate (20); the first pressing plate (10) is provided with a protruding part (11) protruding towards the arc-shaped surface of the second pressing plate (20), the second pressing plate (20) is provided with a concave part (21) matched with the protruding part (11), and a containing space for containing a PCB to be leveled is formed between the protruding part (11) and the concave part (21); the back side of the protruding part (11) is provided with a first heat dissipation groove (12), and the back side of the concave part (21) is provided with a second heat dissipation groove (22).
2. The PCB shaping jig of claim 1, wherein:
the first heat dissipation grooves (12) comprise a plurality of first heat dissipation grooves (12), the bottom of each first heat dissipation groove (12) is consistent with the radian of the surface of the corresponding protruding part (11), and the depth of the first heat dissipation groove (12) corresponding to the highest position of the protruding part (11) is larger than the depth of the first heat dissipation groove (12) corresponding to two sides of the protruding part (11);
the second heat dissipation grooves (22) comprise a plurality of second heat dissipation grooves (22), the bottom of each second heat dissipation groove (22) is consistent with the surface radian of the corresponding concave part (21), and the depth of the second heat dissipation groove (22) corresponding to the lowest position of the concave part (21) is smaller than the depth of the second heat dissipation groove (22) corresponding to the two side parts of the concave part (21).
3. The PCB shaping jig of claim 2, wherein:
the edges of the first radiating groove (12) and the second radiating groove (22) are provided with fillets.
4. The PCB shaping jig of claim 1, wherein:
the two ends of the first pressing plate (10) are provided with first positioning parts (13), and the two ends of the second pressing plate (20) are provided with second positioning parts (23) matched with the first positioning parts (13).
5. The PCB shaping jig of claim 1, wherein:
the device further comprises a bracket, wherein the bracket comprises a supporting rod (321) and a fixing part, and the fixing part is arranged on the supporting rod (321);
the fixing part comprises a plurality of fixing pieces (3221) connected with the supporting rods (321), wherein each fixing piece (3221) is distributed along the vertical direction, and a mounting position for mounting the combination body of the first pressing plate (10) and the second pressing plate (20) is formed between the adjacent fixing pieces (3221).
6. The PCB shaping jig of claim 5, wherein:
the first pressing plate (10) is provided with a first fixing groove (14) at one side where the first heat dissipation groove (12) is located, the fixing piece (3221) is provided with a first clamping part, and the first clamping part is clamped into the first fixing groove (14);
the second pressing plate (20) is provided with a second fixing groove (24) at one side where the second heat dissipation groove (22) is located, the fixing piece (3221) is further provided with a second clamping part, and the second clamping part is clamped into the second fixing groove (24).
7. The PCB shaping jig of claim 5, wherein:
the fixing parts comprise two fixing parts which are respectively arranged on the supporting rods (321) and are symmetrical along the supporting rods (321).
8. The PCB shaping jig of claim 5, wherein:
the novel pressing plate comprises a support (32), and is characterized by further comprising a top plate (33) and side plates (34), wherein the top plate (33) is arranged above the support (32), and the side plates (34) are abutted with the ends of the first pressing plate (10) and the second pressing plate (20) and are connected with the bottom plate (31) and the top plate (33).
9. The PCB shaping jig of claim 8, wherein:
the side plates (34) are provided with supporting bars (341), and the lower parts of the end parts of the second pressing plates (20) are abutted against the supporting bars (341).
10. The PCB shaping jig of claim 8, wherein:
and the top plate (33) and the side plate (34) are respectively provided with a heat dissipation hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223422792.0U CN219876327U (en) | 2022-12-16 | 2022-12-16 | PCB shaping jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223422792.0U CN219876327U (en) | 2022-12-16 | 2022-12-16 | PCB shaping jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219876327U true CN219876327U (en) | 2023-10-20 |
Family
ID=88341340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223422792.0U Active CN219876327U (en) | 2022-12-16 | 2022-12-16 | PCB shaping jig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219876327U (en) |
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2022
- 2022-12-16 CN CN202223422792.0U patent/CN219876327U/en active Active
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