CN220731501U - Multi-chip integrated circuit packaging structure - Google Patents

Abstract

The utility model provides a multi-chip integrated circuit packaging structure, which comprises a packaging cover plate and a packaging box body attached to the bottom of the packaging cover plate, wherein the bottom of the packaging box body is connected with a heat dissipation base, a chip is arranged at the center of the top of the heat dissipation base, and both sides of the inner wall of the packaging cover plate are connected with heat conducting rubber plates.

Description

Multi-chip integrated circuit packaging structure

Technical Field

The utility model belongs to the technical field of chip packaging, and particularly relates to a multi-chip integrated circuit packaging structure.

Background

In the industry of integrated circuit integrated production, the packaging of chips has been an important step. The packaging refers to a shell for mounting a semiconductor integrated circuit chip, which not only plays roles of placing, fixing, sealing, protecting the chip and enhancing heat conduction performance, but also is a bridge for communicating the world inside the chip with an external circuit, namely, a contact point on the chip is connected to a pin of the packaging shell by a wire, and the pin establishes a connection relationship with other devices by the wire on a printed board.

However, in the existing multi-chip integrated circuit packaging structure, the packaging shell and the chip are subjected to plane superposition through the heat dissipation glue, the plane superposition mode of connection by adopting the heat dissipation glue is easy to lose viscosity under the erosion of dust, so that the chip is not firmly placed, the chip is loose in the packaging shell to generate a shift phenomenon, the normal use of the whole circuit board is influenced, and in addition, the gluing mode is inconvenient for disassembling the chip in the later stage.

Accordingly, the present utility model has been made in view of the above-mentioned problems, and an object of the present utility model is to provide a multi-chip integrated circuit package structure with improved practical value.

Disclosure of Invention

In order to solve the technical problems, the utility model provides a multi-chip integrated circuit packaging structure, which aims to solve the problems that in the existing multi-chip integrated circuit packaging structure, a packaging shell and a chip are subjected to plane superposition through heat dissipation glue, the heat dissipation glue is easy to lose viscosity under the erosion of dust, so that the chip is placed unstably, the chip is loosened in the packaging shell to generate a shift phenomenon, the normal use of an integral circuit board is influenced, and in addition, the chip is inconvenient to detach in a later stage in a cementing mode.

The utility model discloses a multi-chip integrated circuit packaging structure, which is characterized by comprising the following specific technical means:

the utility model provides a multicore piece integrated circuit packaging structure, includes the encapsulation apron and the encapsulation box body of bottom laminating thereof, the bottom is connected with the heat dissipation base in the encapsulation box body, the top center department of heat dissipation base is equipped with the chip, encapsulation apron inner wall both sides all are connected with the heat conduction rubber slab, two the heat conduction rubber slab laminating is in the both sides of chip, the equal through connection in heat dissipation base both sides has L shape briquetting, two be connected through the spring between the L shape briquetting, two the equal laminating of L shape briquetting is in the top of chip, two the slot has all been seted up to the opposite one side of heat conduction rubber slab, two one side of L shape briquetting is all pegged graft inside corresponding slot, the center department is connected with the kicking block in the encapsulation box body, the bottom of kicking block contacts with the top center department of chip.

Further, one side of each L-shaped pressing block is connected with a first magnet block, each slot is internally connected with a second magnet block, and magnetism between the first magnet blocks and the second magnet blocks is attracted.

Further, the two L-shaped pressing blocks penetrate through the packaging cover plate and are connected with pushing blocks, and the pushing blocks are attached to and slide on the top surface of the packaging cover plate.

Further, the spout has all been seted up to encapsulation apron top both sides, every L shape briquetting is close to the top both sides and all is connected with folding rubber slab, two folding rubber slab's one end is connected in the spout both sides respectively.

Further, pins are inserted and installed on two sides of the packaging cover plate and the packaging box body, mounting grooves are formed in the other two sides of the packaging cover plate and the packaging box body, and radiating fins are connected in each mounting groove.

Further, the four corners corner of encapsulation apron and encapsulation box body is connected with locating piece and lower locating piece respectively, go up the laminating setting between locating piece and the lower locating piece, every the bottom of lower locating piece all is connected with the screw barrel, every all be equipped with the screw thread post on the last locating piece, every screw thread post all threaded connection is inside the screw barrel.

Furthermore, the packaging cover plate and the packaging box body are made of ceramic materials, and the heat dissipation base is made of resin materials.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the utility model, the heat-conducting rubber plates, the L-shaped pressing blocks, the springs and the top blocks are arranged for use in a matched manner, the top blocks position the top of the chip when the packaging cover plate is closed, the two heat-conducting rubber plates are matched with the packaging box body to fix the periphery of the chip, the two L-shaped pressing blocks are used for bonding and positioning four corners of the top of the chip, so that the movement of the chip is avoided, the structure is simple, the packaging is convenient, the chip is favorably prevented from being connected by using heat-dissipating glue, the chip is unstable to place due to the fact that dust is lost, and the chip is loose in the packaging shell to generate a shift phenomenon, meanwhile, the chip can be installed, and the subsequent disassembly and maintenance of the chip by workers are facilitated;

2. through setting up encapsulation apron, encapsulation box, go up locating piece, lower locating piece, screw thread section of thick bamboo and screw thread post cooperation and use, the screw thread post threaded connection in encapsulation box four corners is inside to install encapsulation apron and encapsulation box between the body, realize the encapsulation operation of chip, reduce with the help of a large amount of mounting tools, and the process of whole installation and maintenance is simple and convenient, reduces staff's encapsulation time.

Drawings

Fig. 1 is a schematic perspective view of the present utility model.

Fig. 2 is a schematic perspective view of a second embodiment of the present utility model.

Fig. 3 is a schematic view of a front sectional structure of the present utility model.

Fig. 4 is an enlarged schematic view of fig. 3 a in accordance with the present utility model.

In the figure, the correspondence between the component names and the drawing numbers is:

1. packaging the cover plate; 2. packaging the box body; 3. pins; 4. a heat dissipation base; 5. a chip; 6. a heat conductive rubber plate; 7. an L-shaped pressing block; 8. a slot; 9. a first magnet block; 10. a second magnet block; 11. a spring; 12. a chute; 13. folding the rubber plate; 14. a top block; 15. a mounting groove; 16. a heat radiation fin; 17. a pushing block; 18. an upper positioning block; 19. a lower positioning block; 20. a thread cylinder; 21. and (5) a threaded column.

Detailed Description

Embodiments of the present utility model are described in further detail below with reference to the accompanying drawings and examples. The following examples are illustrative of the utility model but are not intended to limit the scope of the utility model.

In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front," "rear," "head," "tail," and the like are used as an orientation or positional relationship based on that shown in the drawings, merely to facilitate description of the utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the utility model. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "connected," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Examples:

as shown in fig. 1 to 4:

the utility model provides a multi-chip integrated circuit packaging structure, which comprises a packaging cover plate 1 and a packaging box body 2 attached to the bottom of the packaging cover plate, wherein a heat dissipation base 4 is connected to the inner bottom of the packaging box body 2, a chip 5 is arranged at the center of the top of the heat dissipation base 4, two heat conduction rubber plates 6 are connected to the two sides of the chip 5 on the inner wall of the packaging cover plate 1, two L-shaped pressing blocks 7 are connected to the two sides of the heat dissipation base 4 in a penetrating way, the two L-shaped pressing blocks 7 are connected through springs 11, the two L-shaped pressing blocks 7 are attached to the top of the chip 5, slots 8 are formed in opposite sides of the two heat conduction rubber plates 6, one sides of the two L-shaped pressing blocks 7 are inserted into the corresponding slots 8, a top block 14 is connected to the center of the inner side of the packaging box body 2, and the bottom of the top block 14 is contacted with the center of the top of the chip 5.

In other embodiments, one side of each of the two L-shaped pressing blocks 7 is connected with a first magnet 9, the inside of each of the two slots 8 is connected with a second magnet 10, the first magnet 9 and the second magnet 10 are attracted by magnetism, and the compactness of the connection between the L-shaped pressing blocks 7 and the heat conducting rubber plate 6 is increased through the attraction of the magnetism between the first magnet 9 and the second magnet 10.

In other embodiments, two L-shaped pressing blocks 7 penetrate through the packaging cover plate 1 and are connected with pushing blocks 17, the pushing blocks 17 are attached to and slide on the top surface of the packaging cover plate 1, and the pushing blocks 17 can be pinched by hands and horizontally moved through the arrangement of the pushing blocks 17, so that the L-shaped pressing blocks 7 are driven to move.

In other embodiments, the two sides of the top of the packaging cover plate 1 are provided with the sliding grooves 12, each of the two sides of the L-shaped pressing blocks 7 close to the top is connected with the folding rubber plates 13, one ends of the two folding rubber plates 13 are respectively connected to the two sides in the sliding grooves 12, one folding rubber plate 13 in the two folding rubber plates 13 is unfolded in the moving process of the L-shaped pressing block 7, the other folding rubber plate 13 is folded, the sliding grooves 12 are always closed when the L-shaped pressing block 7 moves, and dust is prevented from entering the packaging cover plate 1 to pollute the chip 5.

In other embodiments, pins 3 are inserted and installed on two sides of the packaging cover plate 1 and the packaging box body 2, mounting grooves 15 are formed in the other two sides of the packaging cover plate 1 and the packaging box body 2, radiating fins 16 are connected in each mounting groove 15, the radiating fins 16 are in contact connection with the packaging cover plate 1 and the packaging box body 2, and the radiating fins 16 increase the contact area between the packaging cover plate 1 and the packaging box body 2 and air to realize rapid heat dissipation of the chip 5.

In other embodiments, the four corners of the packaging cover plate 1 and the packaging box body 2 are respectively connected with an upper positioning block 18 and a lower positioning block 19, the upper positioning block 18 and the lower positioning block 19 are in fit arrangement, the bottom of each lower positioning block 19 is connected with a threaded cylinder 20, each upper positioning block 18 is provided with a threaded column 21, each threaded column 21 is in threaded connection with the inside of the threaded cylinder 20, the threaded columns 21 at the four corners of the top of the packaging cover plate 1 are in threaded connection with the inside of the threaded cylinders 20 at the four corners of the packaging box body 2, so that the packaging cover plate 1 and the packaging box body 2 are mounted, the packaging operation of the chip 5 is realized, a large number of mounting tools are reduced, the whole mounting and maintaining process is simple and convenient, and the packaging time of workers is reduced.

In other embodiments, the package cover plate 1 and the package box body 2 are made of ceramic materials, the package cover plate 1 and the package box body 2 mainly play a role in sealing and protecting the chip 5, the heat conduction of the chip 5 is better due to the fact that the ceramic materials are used for manufacturing, the heat dissipation base 4 is made of resin materials, and the heat dissipation base 4 mainly comprises glass fiber reinforced epoxy resin heat dissipation bases 4 in resin and plays a role in fixing and supporting the chip 5.

Specific use and action of the embodiment:

in the utility model, when the chip 5 is required to be packaged, the chip 5 is placed in the packaging box body 2, so that the bottom of the chip 5 is attached to the heat dissipation base 4, the periphery of the chip 5 is attached to two heat conduction rubber plates 6 and two sides of the inner wall of the packaging box body 2, when the packaging cover plate 1 is closed, two push blocks 17 are pinched by hands, two L-shaped press blocks 7 are pushed to the middle, the spring 11 is compressed, when the packaging cover plate 1 is attached to the packaging box body 2, the top block 14 positions the top of the chip 5, at the moment, the two push blocks 17 are slowly released, the two L-shaped press blocks 7 are pushed to move to two sides by the resilience force of the spring 11 until the chip 5 is inserted into the slots 8 of the heat conduction rubber plates 6, and simultaneously, the first magnet blocks 9 and the second magnet blocks 10 are magnetically attracted, so that the chip 5 is tightly pressed and fixed, the movement of the chip 5 is avoided, the packaging cover plate 1 is simple in structure, the packaging is convenient, the chip 5 is prevented from being connected by heat dissipation rubber, the phenomenon that the dust is not firmly placed, the chip 5 is loose and the chip 5 is enabled to be in the packaging cover plate 1 and the packaging box body 2, and finally the four corners of the packaging box body is connected to the four corners of the packaging box body 2 by the screw thread, and the top of the packaging box 2 is realized, and the four corners of the packaging box is mounted by the packaging box 2, and the four corners of the packaging box 2 is arranged at the top, and the top of the packaging box is 20, and the packaging box is arranged;

when the chip 5 is disassembled, the four screw columns 21 are screwed out from the inside of the four screw cylinders 20, meanwhile, the two pushing blocks 17 are pinched by hands, the two L-shaped pressing blocks 7 are pushed to the middle, the springs 11 are compressed, the two L-shaped pressing blocks 7 are separated from the inside of the slots 8 of the heat conducting rubber plate 6, the first magnet block 9 and the second magnet block 10 are separated, and then the packaging cover plate 1 is taken down, so that the chip 5 can be taken out;

the chip 5 during operation produces heat to with heat transfer to encapsulation box body 2, heat dissipation base 4 and two heat conduction rubber slab 6, heat dissipation base 4 and heat conduction rubber slab 6 carry out the heat conduction, with heat transfer to on encapsulation apron 1 and the encapsulation box body 2, and heat dissipation fin 16 increase encapsulation apron 1 and encapsulation box body 2 and the area of contact of air realize dispelling the heat to chip 5 fast.

It should be noted that, the chip 5 is a device or apparatus existing in the prior art, or a device or apparatus that can be implemented in the prior art, and the power supply, the specific composition and the principle thereof are clear to those skilled in the art, and are common general knowledge in the art, so they will not be described in detail.

The embodiments of the utility model have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the utility model in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, and to enable others of ordinary skill in the art to understand the utility model for various embodiments with various modifications as are suited to the particular use contemplated.

Claims (7)

1. The utility model provides a multicore piece integrated circuit packaging structure, includes encapsulation apron (1) and encapsulation box body (2) of laminating of its bottom, its characterized in that: the packaging box comprises a packaging box body (2), wherein a heat dissipation base (4) is connected to the inner bottom of the packaging box body (2), a chip (5) is arranged at the center of the top of the heat dissipation base (4), heat conduction rubber plates (6) are connected to the two sides of the inner wall of the packaging cover plate (1), two heat conduction rubber plates (6) are attached to the two sides of the chip (5), L-shaped pressing blocks (7) are connected to the two sides of the heat dissipation base (4) in a penetrating manner, the two L-shaped pressing blocks (7) are connected through springs (11), the two L-shaped pressing blocks (7) are attached to the top of the chip (5), slots (8) are formed in opposite sides of the two heat conduction rubber plates (6), one sides of the L-shaped pressing blocks (7) are inserted into the corresponding slots (8), and a top block (14) is connected to the center of the inner bottom of the top block (14) and the center of the top of the chip (5).

2. The multi-chip integrated circuit package structure of claim 1, wherein: one side of each L-shaped pressing block (7) is connected with a first magnet block (9), the inside of each slot (8) is connected with a second magnet block (10), and magnetism between the first magnet blocks (9) and the second magnet blocks (10) is attracted.

3. The multi-chip integrated circuit package structure of claim 1, wherein: the two L-shaped pressing blocks (7) penetrate through the packaging cover plate (1) and are connected with pushing blocks (17), and the pushing blocks (17) are attached and slide on the top surface of the packaging cover plate (1).

4. The multi-chip integrated circuit package structure of claim 1, wherein: the packaging cover plate is characterized in that sliding grooves (12) are formed in two sides of the top of the packaging cover plate (1), each L-shaped pressing block (7) is connected with a folding rubber plate (13) close to two sides of the top, and one ends of the two folding rubber plates (13) are respectively connected to two sides in the sliding grooves (12).

5. The multi-chip integrated circuit package structure of claim 1, wherein: the packaging cover plate (1) and the packaging box body (2) are respectively provided with pins (3) in an inserted mode, the other two sides of the packaging cover plate (1) and the other two sides of the packaging box body (2) are respectively provided with a mounting groove (15), and each mounting groove (15) is internally connected with a radiating fin (16).

6. The multi-chip integrated circuit package structure of claim 1, wherein: the packaging cover plate (1) and the packaging box body (2) are respectively connected with an upper positioning block (18) and a lower positioning block (19) at four corners, the upper positioning blocks (18) and the lower positioning blocks (19) are arranged in a fitting mode, the bottoms of the lower positioning blocks (19) are respectively connected with a threaded cylinder (20), threaded columns (21) are respectively arranged on the upper positioning blocks (18), and the threaded columns (21) are respectively connected inside the threaded cylinders (20) in a threaded mode.

7. The multi-chip integrated circuit package structure of claim 1, wherein: the packaging cover plate (1) and the packaging box body (2) are made of ceramic materials, and the heat dissipation base (4) is made of resin materials.