CN210245470U - High-efficiency encapsulation moisture-proof integrated circuit device - Google Patents

High-efficiency encapsulation moisture-proof integrated circuit device Download PDF

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Publication number
CN210245470U
CN210245470U CN201921656457.2U CN201921656457U CN210245470U CN 210245470 U CN210245470 U CN 210245470U CN 201921656457 U CN201921656457 U CN 201921656457U CN 210245470 U CN210245470 U CN 210245470U
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CN
China
Prior art keywords
column
plate
end surface
cylinder
pressing
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Expired - Fee Related
Application number
CN201921656457.2U
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Chinese (zh)
Inventor
Lei Leng
冷磊
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Nanjing Derin Electronic Technology Co Ltd
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Nanjing Derin Electronic Technology Co Ltd
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Priority to CN201921656457.2U priority Critical patent/CN210245470U/en
Application granted granted Critical
Publication of CN210245470U publication Critical patent/CN210245470U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a high-efficiency encapsulation moisture-proof integrated circuit device, which comprises a base, a cylinder, a lifting column, a top plate, a connecting column, a pressing plate, a spring column, a pressing piece, a sliding sleeve, a sliding plate, a workbench, a bearing pad, a lower piece, an elastic piece and a supporting column, wherein the upper end surface of the base is provided with the cylinder, the upper end surface of the cylinder is provided with the lifting column, the upper end surface of the lifting column is provided with the top plate, the center of the top plate is provided with the connecting column, the lower end of the connecting column is provided with the pressing plate, the spring column is arranged between the upper end surface of the pressing plate and the top plate, the pressing piece is fixed on the lower end surface of the pressing plate, the sliding sleeve is arranged on the cylinder, the inner end of the sliding sleeve is provided with the sliding plate, the upper end surface of the sliding plate is provided with the workbench, the, the lower end of the supporting column is arranged on the upper end face of the base.

Description

High-efficiency encapsulation moisture-proof integrated circuit device
Technical Field
The utility model relates to an integrated circuit equipment technical field specifically is a dampproofing integrated circuit device is sealed to high efficiency.
Background
Integrated circuits, or microcircuits, microchips, chips/chips, are a way in electronics to miniaturize circuits (including primarily semiconductor devices, including passive components, etc.) and are often fabricated on semiconductor wafer surfaces.
In the traditional technology, the encapsulation of the moisture-proof integrated circuit is mostly encapsulated in a manual mode, so that the working efficiency is low, and the encapsulation quality is poor; the existing packaging device has poor shock absorption performance, and the machine is easy to shake in the packaging process, so that the packaging quality and the working efficiency are greatly influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a dampproofing integrated circuit device is sealed to high efficiency to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: an efficient encapsulation moisture-proof integrated circuit device comprises a base, a cylinder, a lifting column, a top plate, a connecting column, a pressing plate, a spring column, a pressing piece, a sliding sleeve, a sliding plate, a workbench, a bearing pad, a pressing piece, an elastic piece and a supporting column, the upper end surface of the base is provided with an air cylinder, the upper end surface of the air cylinder is provided with a lifting column, the upper end surface of the lifting column is provided with a top plate, a connecting post is arranged at the center of the top plate, a pressing plate is arranged at the lower end of the connecting post, a spring post is arranged between the upper end surface of the pressing plate and the top plate, the pressing piece is fixed on the lower end surface of the pressing plate, the sliding sleeve is arranged on the air cylinder, the inner end of the sliding sleeve is provided with a sliding plate, the upper end surface of the sliding plate is provided with a workbench, the bearing pad is arranged on the lower end surface of the sliding plate, the lower end surface of the bearing pad is provided with a lower pressing piece, the terminal surface is equipped with the bullet piece under the pushing down piece, the bullet piece sets up in the support column, the support column lower extreme sets up at the base up end.
As a further aspect of the present invention: the base up end is equipped with the standing groove, and the support column lower extreme sets up in the standing groove, is convenient for carry out the dismouting to the support column, and through support column, bullet piece, down the piece and accept the pad and can reach buffering cushioning effect effectively, can avoid the influence of rocking the quality and the efficiency production of encapsulating of machinery simultaneously.
As a further aspect of the present invention: the lower end face of the top plate is provided with a groove, the upper end of the lifting column is provided with a clamp spring, the clamp spring is arranged in the groove, the top plate, the connecting column, the pressing plate, the connecting column and the pressing piece are convenient to disassemble and assemble, and the operation is simple.
As a further aspect of the present invention: sliding sleeve center department is equipped with the round hole, and the sliding sleeve cup joints on the cylinder, can drive roof, spliced pole, clamp plate, spliced pole and pressfitting piece along the vertical direction motion under the effect of cylinder and lift post, when the pressfitting piece is sealed with the product on the workstation, can press and move working plate and slide motion, avoids the pressfitting piece to take place rigid collision and influence the quality of sealing with the workstation, and work efficiency is high.
As a further aspect of the present invention: the slide lower end face is equipped with the dead slot, and the pad of accepting is made for rubber material, and the pad of accepting sets up in the dead slot, is convenient for carry out the dismouting to accepting the board.
Compared with the prior art, the beneficial effects of the utility model are that: the center of the sliding sleeve is provided with a round hole, the sliding sleeve is sleeved on the cylinder, the top plate, the connecting column, the pressing plate, the connecting column and the pressing piece can be driven to move along the vertical direction under the action of the cylinder and the lifting column, when the pressing piece and a product on the workbench are encapsulated, the working plate and the sliding plate can be pressed to move, the pressing piece and the workbench are prevented from generating hard collision to influence the encapsulating quality, and the working efficiency is high; in the encapsulating process, the spring columns on the upper end surface of the pressing plate and the bearing pads, the lower pressing pieces, the elastic pieces and the supporting columns on the lower end surface of the sliding plate can effectively play a role in buffering and damping, and the influence of shaking on encapsulating quality and encapsulating efficiency is avoided.
Drawings
Fig. 1 is a schematic diagram of a structure of an efficient encapsulated moisture-proof integrated circuit device.
Fig. 2 is a front view of an efficient encapsulated moisture-tight integrated circuit device.
In the figure: the device comprises a base 1, a cylinder 2, a lifting column 3, a top plate 4, a connecting column 5, a pressing plate 6, a spring column 7, a pressing piece 8, a sliding sleeve 9, a sliding plate 10, a workbench 11, a receiving pad 12, a pressing piece 13, an elastic piece 14 and a supporting column 15.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1-2, in an embodiment of the present invention, a high-efficient encapsulation moisture-proof integrated circuit device, includes a base 1, a cylinder 2, a lifting column 3, a top plate 4, a connection column 5, a pressing plate 6, a spring column 7, a pressing member 8, a sliding sleeve 9, a sliding plate 10, a worktable 11, a receiving pad 12, a pressing member 13, a spring member 14 and a support column 15, wherein the cylinder 2 is disposed on the upper end surface of the base 1, the lifting column 3 is disposed on the upper end surface of the cylinder 2, the top plate 4 is disposed on the upper end surface of the lifting column 3, the connection column 5 is disposed at the center of the top plate 4, the pressing plate 6 is disposed at the lower end of the connection column 5, the spring column 7 is disposed between the upper end surface of the pressing plate 6 and the top plate 4, the pressing member 8 is fixed on the lower end surface of the pressing plate 6, a groove is disposed on the lower end surface of, The connecting column 7 and the pressing piece 8 are disassembled and assembled, the operation is simple, the sliding sleeve 9 is arranged on the cylinder 2, the sliding plate 10 is arranged at the inner end of the sliding sleeve 9, the workbench 11 is arranged on the upper end face of the sliding plate 10, the round hole is arranged at the center of the sliding sleeve 9, the sliding sleeve 9 is sleeved on the cylinder 2, the top plate 4, the connecting column 5, the pressing plate 6, the connecting column 7 and the pressing piece 8 can be driven to move along the vertical direction under the action of the cylinder 2 and the lifting column 3, when the pressing piece 8 and a product on the workbench 11 are encapsulated, the working plate 11 and the sliding plate 10 can be pressed to move, the hard collision between the pressing piece 8 and the workbench 11 is avoided, the encapsulating quality is prevented from being affected, the working efficiency is high, the bearing pad 12 is arranged on the lower end face of the sliding plate 10, the lower end face of the sliding plate 10 is provided with a hollow groove, the bearing, the terminal surface is equipped with down-pressure member 13 under the bearing pad 12, the terminal surface is equipped with bullet piece 14 under the down-pressure member 13, bullet piece 14 sets up in support column 15, the setting of support column 15 lower extreme is at 1 up end of base, 1 up end of base is equipped with the standing groove, the setting of support column 15 lower extreme is in the standing groove, be convenient for carry out the dismouting to support column 15, and through support column 15, bullet piece 14, down-pressure member 13 and bearing pad 12 can reach buffering cushioning effect effectively, can avoid mechanical the influence that rocks and produce quality and efficiency of encapsulating simultaneously, at the encapsulation in-process, the cushion 12 of accepting of terminal surface under the spring post 7 of clamp plate 6 up end and slide 10, down-pressure member 13, bullet piece 14 and support column 15 can play buffering absorbing effect effectively, avoid rocking the influence and encapsulate quality and encapsulate efficiency.
The utility model discloses a theory of operation is: the upper end face of the base 1 is provided with an air cylinder 2, the upper end face of the air cylinder 2 is provided with a lifting column 3, the upper end face of the lifting column 3 is provided with a top plate 4, the center of the top plate 4 is provided with a connecting column 5, the lower end of the connecting column 5 is provided with a pressing plate 6, a spring column 7 is arranged between the upper end face of the pressing plate 6 and the top plate 4, a pressing piece 8 is fixed on the lower end face of the pressing plate 6, the lower end face of the top plate 4 is provided with a groove, the upper end of the lifting column 3 is provided with a snap spring which is arranged in the groove, so that the top plate 4, the connecting column 5, the pressing plate 6, the connecting column 7 and the pressing piece 8 can be conveniently disassembled and assembled, the operation is simple, the sliding sleeve 9 is arranged on the air cylinder 2, the inner end of the sliding sleeve 9 is provided with a sliding plate 10, the upper end face of the sliding plate 10 is provided with a workbench 11, when the pressing piece 8 and a product on the workbench 11 are encapsulated, the working plate 11 and the sliding plate 10 can be pressed to move, the encapsulating quality is prevented from being influenced due to hard collision between the pressing piece 8 and the workbench 11, the working efficiency is high, the receiving pad 12 is arranged on the lower end face of the sliding plate 10, the lower end face of the sliding plate 10 is provided with a hollow groove, the receiving pad 12 is made of rubber, the receiving pad 12 is arranged in the hollow groove, the receiving plate 12 is convenient to disassemble and assemble, the lower end face of the receiving pad 12 is provided with the lower pressing piece 13, the lower end face of the lower pressing piece 13 is provided with the elastic piece 14, the elastic piece 14 is arranged in the supporting column 15, the lower end of the supporting column 15 is arranged on the upper end face of the base 1, the upper end face of the base 1 is provided with a placing groove, the lower end of the supporting column 15 is arranged in the placing groove, the supporting column 15 is convenient to disassemble and assemble, the cushioning effect can be effectively achieved through the, in the encapsulating process, the spring columns 7 on the upper end face of the pressing plate 6 and the bearing pads 12, the lower pressing pieces 13, the elastic pieces 14 and the supporting columns 15 on the lower end face of the sliding plate 10 can effectively play a role in buffering and damping, and the influence of shaking on encapsulating quality and encapsulating efficiency is avoided.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims (5)

1. An efficient packaging moisture-proof integrated circuit device comprises a base, a cylinder, a lifting column, a top plate, a connecting column, a pressing plate, a spring column, a pressing piece, a sliding sleeve, a sliding plate, a workbench, a bearing pad, a lower pressing piece, an elastic piece and a supporting column, and is characterized in that the upper end surface of the base is provided with the cylinder, the upper end surface of the cylinder is provided with the lifting column, the upper end surface of the lifting column is provided with the top plate, the center of the top plate is provided with the connecting column, the lower end of the connecting column is provided with the pressing plate, the spring column is arranged between the upper end surface of the pressing plate and the top plate, the pressing piece is fixed on the lower end surface of the pressing plate, the sliding sleeve is arranged on the cylinder, the inner end of the sliding sleeve is provided with the sliding plate, the upper end surface of the sliding plate is provided with the workbench, the bearing pad, the lower end of the supporting column is arranged on the upper end face of the base.
2. An efficient encapsulated moisture protected integrated circuit device as claimed in claim 1, wherein said base has a placement groove on its upper end, and the lower ends of said support posts are disposed in said placement groove.
3. An efficient encapsulated moisture-proof integrated circuit device as claimed in claim 1, wherein the lower end face of the top plate is provided with a groove, the upper end of the lifting column is provided with a clamp spring, and the clamp spring is arranged in the groove.
4. The device as claimed in claim 1, wherein the sliding sleeve has a circular hole at the center, and the sliding sleeve is sleeved on the cylinder.
5. A high efficiency moisture protected encapsulated IC device as claimed in claim 1, wherein said slider has a cavity on its lower end, said receiving pad is made of rubber material, and said receiving pad is disposed in said cavity.
CN201921656457.2U 2019-09-30 2019-09-30 High-efficiency encapsulation moisture-proof integrated circuit device Expired - Fee Related CN210245470U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921656457.2U CN210245470U (en) 2019-09-30 2019-09-30 High-efficiency encapsulation moisture-proof integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921656457.2U CN210245470U (en) 2019-09-30 2019-09-30 High-efficiency encapsulation moisture-proof integrated circuit device

Publications (1)

Publication Number Publication Date
CN210245470U true CN210245470U (en) 2020-04-03

Family

ID=69965656

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921656457.2U Expired - Fee Related CN210245470U (en) 2019-09-30 2019-09-30 High-efficiency encapsulation moisture-proof integrated circuit device

Country Status (1)

Country Link
CN (1) CN210245470U (en)

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Granted publication date: 20200403